Latch-Up Performance Exceeds 500 mA Per
JEDEC Standard JESD-17
D
T ypical V
at V
D
High-Impedance State During Power Up
= 5 V, TA = 25°C
CC
(Output Ground Bounce) < 1 V
OLP
and Power Down
D
High-Drive Outputs (–32-mA IOH, 64-mA IOL)
D
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, Ceramic Chip Carriers (FK),
Ceramic Flat (W) Package, and Plastic (N)
and Ceramic (J) DIPs
description
The SN54ABT541 and SN74ABT541B octal
buffers and line drivers are ideal for driving bus
lines or buffering memory address registers. The
devices feature inputs and outputs on opposite
sides of the package to facilitate printed circuit
board layout.
The 3-state control gate is a two-input AND gate
with active-low inputs so that if either
output-enable (OE1
outputs are in the high-impedance state.
or OE2) input is high, all eight
SN54ABT541 ...J OR W PACKAGE
SN74ABT541B . . . DB, DW, N, OR PW PACKAGE
SN54ABT541 . . . FK PACKAGE
A3
A4
A5
A6
A7
(TOP VIEW)
OE1
A1
A2
A3
A4
A5
A6
A7
A8
GND
(TOP VIEW)
3 2 1 20 19
4
5
6
7
8
910111213
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
A2A1OE1
A8
V
Y8
GND
CC
Y7
V
CC
OE2
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
18
17
16
15
14
Y6OE2
Y1
Y2
Y3
Y4
Y5
When V
However, to ensure the high-impedance state above 2.1 V, OE
is between 0 and 2.1 V , the device is in the high-impedance state during power up or power down.
CC
should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54ABT541 is characterized for operation over the full military temperature range of –55°C to 125°C.
The SN74ABT541B is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
OE1OE2A
LLLL
LLH H
HXX Z
XHX Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC-ΙΙB is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
INPUTS
OUTPUT
Y
Copyright 1998, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
SN54ABT541, SN74ABT541B
UNIT
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS093K – JANUARY 1991 – REVISED OCTOBER 1998
1
19
2
3
4
5
6
7
8
9
†
&
EN
1
18
17
16
15
14
13
12
11
logic symbol
OE1
OE2
A1
A2
A3
A4
A5
A6
A7
A8
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and
IEC Publication 617-12.
logic diagram (positive logic)
OE1
OE2
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
1
19
218
A1
Y1
To Seven Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Input voltage range, V
Voltage range applied to any output in the high or power-off state, V
Current into any output in the low state, I
Input clamp current, I
Output clamp current, I
Package thermal impedance, θ
Storage temperature range, T
‡
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace
length of zero.
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
2
Supply voltage4.55.54.55.5V
CC
High-level input voltage22V
IH
Low-level input voltage0.80.8V
IL
High-level output current–24–32mA
Low-level output current4864mA
Operating free-air temperature–55125–4085° C
A
Implications of Slow or Floating CMOS Inputs
, literature number SCBA004.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER
TEST CONDITIONS
UNIT
V
V
V
4.5 V
V
V
V
V
V
I
V
CC
GND
§
V
CC
CC
A
Y
ns
OE
Y
ns
OE
Y
ns
SN54ABT541, SN74ABT541B
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS093K – JANUARY 1991 – REVISED OCTOBER 1998
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
TA = 25°CSN54ABT541SN74ABT541B
MINTYP†MAXMINMAXMINMAX
V
IK
OH
OL
V
hys
I
I
I
OZPU
I
OZPD
I
OZH
I
OZL
I
off
I
CEX
‡
I
O
I
CC
∆I
CC
C
i
C
o
* On products compliant to MIL-PRF-38535, this parameter does not apply.
** On products compliant to MIL-PRF-38535, this parameter is not production tested.
†
All typical values are at VCC = 5 V.
‡
Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
§
This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, C
PARAMETER
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
= 50 pF (unless otherwise noted) (see Figure 1)
L
FROM
(INPUT)
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TO
(OUTPUT)
SN54ABT541
VCC = 5 V,
TA = 25°C
MINTYPMAX
12.64.114.6
12.94.214.7
1.13.14.81.15.4
2.14.45.92.17
2.15.16.62.17.5
1.74.76.21.76.7
MINMAX
UNIT
3
SN54ABT541, SN74ABT541B
A
Y
ns
OE
Y
ns
OE
Y
ns
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS093K – JANUARY 1991 – REVISED OCTOBER 1998
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, C
PARAMETER
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
sk(o)
†
Skew between any two outputs of the same package switching in the same direction
= 50 pF (unless otherwise noted) (see Figure 1)
L
FROM
(INPUT)
†
TO
(OUTPUT)
SN74ABT541B
VCC = 5 V,
TA = 25°C
MINTYPMAX
123.213.6
12.63.513.9
23.54.524
1.945.11.95.9
2.24.45.42.25.8
1.5341.54.4
MINMAX
0.50.5ns
UNIT
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54ABT541, SN74ABT541B
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS093K – JANUARY 1991 – REVISED OCTOBER 1998
PARAMETER MEASUREMENT INFORMATION
500 Ω
t
w
1.5 V
500 Ω
1.5 V
1.5 V
1.5 V1.5 V
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
Input
Input
Output
Output
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω , tr ≤ 2.5 ns, tf≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-2-260C-1YEAR
CU NIPDAULevel-2-250C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-2-250C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-2-250C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-2-250C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-NC-NC-NC
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-1-250C-UNLIM
CU NIPDAULevel-1-250C-UNLIM
CU NIPDAULevel-1-250C-UNLIM
CU NIPDAULevel-1-250C-UNLIM
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
8-Jun-2005
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A SQ
B SQ
19
20
21
22
23
24
25
1282627
12
131415161817
0.020 (0,51)
0.010 (0,25)
MIN
0.342
(8,69)
0.442
0.640
0.739
0.938
1.141
A
0.358
(9,09)
0.458
(11,63)
0.660
(16,76)
0.761
(19,32)(18,78)
0.962
(24,43)
1.165
(29,59)
(10,31)
(12,58)
(12,58)
NO. OF
TERMINALS
**
11
10
9
8
7
6
5
432
20
28
44
52
68
84
0.020 (0,51)
0.010 (0,25)
(11,23)
(16,26)
(23,83)
(28,99)
MINMAX
0.307
(7,80)
0.406
0.495
0.495
0.850
(21,6)
1.047
(26,6)
0.080 (2,03)
0.064 (1,63)
B
MAX
0.358
(9,09)
0.458
(11,63)
0.560
(14,22)
0.560
(14,22)
0.858
(21,8)
1.063
(27,0)
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
4040140/D 10/96
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,65
28
1
2,00 MAX
0,38
0,22
15
14
A
0,05 MIN
0,15
5,60
5,00
M
8,20
7,40
Seating Plane
0,10
0,25
0,09
0°–ā8°
Gage Plane
0,25
0,95
0,55
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
14
6,50
6,50
5,905,90
2016
7,50
6,90
24
8,50
28
10,50
9,907,90
30
10,50
9,90
38
12,90
12,30
4040065 /E 12/01
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30
0,19
8
4,50
4,30
PINS **
7
Seating Plane
0,15
0,05
8
1
A
DIM
6,60
6,20
14
0,10
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75
0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty . Except where mandated by government requirements, testing of all
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TI assumes no liability for applications assistance or customer product design. Customers are responsible for
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