PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device Status
JM38510/07006BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/07006BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/07006BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30007B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30007B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30007BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30007BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30007BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30007BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30007SCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30007SCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30007SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30007SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SN5420J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN5420J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN54LS20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54LS20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54S20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54S20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN7420N OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7420N OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS20D ACTIVE SOIC D 14 50 Green (RoHS &
SN74LS20D ACTIVE SOIC D 14 50 Green (RoHS &
SN74LS20DE4 ACTIVE SOIC D 14 50 Green (RoHS &
SN74LS20DE4 ACTIVE SOIC D 14 50 Green (RoHS &
SN74LS20DG4 ACTIVE SOIC D 14 50 Green (RoHS &
SN74LS20DG4 ACTIVE SOIC D 14 50 Green (RoHS &
SN74LS20DR ACTIVE SOIC D 14 2500 Green (RoHS &
SN74LS20DR ACTIVE SOIC D 14 2500 Green (RoHS &
SN74LS20DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
SN74LS20DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
SN74LS20DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
SN74LS20DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
SN74LS20J OBSOLETE CDIP J 14 TBD Call TI Call TI
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
4-Jun-2007
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
SN74LS20J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74LS20N ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74LS20N ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74LS20N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS20N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS20NE4 ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74LS20NE4 ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74LS20NSR ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS20NSR ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS20NSRE4 ACTIVE SO NS 14 2000 Green(RoHS&
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS20NSRE4 ACTIVE SO NS 14 2000 Green(RoHS&
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS20NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS20NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S20D ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S20D ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S20DE4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S20DE4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S20DG4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S20DG4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S20DR OBSOLETE SOIC D 0 TBD Call TI Call TI
SN74S20DR OBSOLETE SOIC D 0 TBD Call TI Call TI
SN74S20N ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74S20N ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74S20N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S20N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S20NE4 ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74S20NE4 ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SNJ5420J OBSOLETE CDIP J 14 TBD Call TI Call TI
SNJ5420J OBSOLETE CDIP J 14 TBD Call TI Call TI
SNJ5420W OBSOLETE CFP W 14 TBD Call TI Call TI
4-Jun-2007
(3)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
4-Jun-2007
(3)
SNJ5420W OBSOLETE CFP W 14 TBD Call TI Call TI
SNJ5420WA OBSOLETE CFP WA 14 TBD Call TI Call TI
SNJ5420WA OBSOLETE CFP WA 14 TBD Call TI Call TI
SNJ54LS20FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS20FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54LS20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54LS20W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54LS20W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54S20FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S20FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54S20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54S20W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54S20W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device Package Pins Site Reel
Diameter
(mm)
SN74LS20DR D 14 MLA 330 16 6.5 9.0 2.1 8 16 Q1
SN74LS20NSR NS 14 MLA 330 16 8.2 10.5 2.5 12 16 Q1
Reel
Width
(mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
19-May-2007
Pin1
Quadrant
TAPE AND REEL BOX INFORMATION
Device Package Pins Site Length (mm) Width (mm) Height (mm)
SN74LS20DR D 14 MLA 342.9 336.6 28.58
SN74LS20NSR NS 14 MLA 342.9 336.6 28.58
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A SQ
B SQ
19
20
21
22
23
24
25
12826 27
12
1314151618 17
0.020 (0,51)
0.010 (0,25)
MIN
0.342
(8,69)
0.442
0.640
0.739
0.938
1.141
A
(11,63)
(16,76)
(19,32)(18,78)
(24,43)
(29,59)
0.358
(9,09)
0.458
(10,31)
0.660
(12,58)
0.761
(12,58)
0.962
1.165
NO. OF
TERMINALS
**
11
10
9
8
7
6
5
432
20
28
44
52
68
84
0.020 (0,51)
0.010 (0,25)
(11,23)
(16,26)
(23,83)
(28,99)
MINMAX
0.307
(7,80)
0.406
0.495
0.495
0.850
(21,6)
1.047
(26,6)
0.080 (2,03)
0.064 (1,63)
B
MAX
0.358
(9,09)
0.458
(11,63)
0.560
(14,22)
0.560
(14,22)
0.858
(21,8)
1.063
(27,0)
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
4040140/D 10/96
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device Status
JM38510/07006BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/07006BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/07006BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30007B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30007B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30007BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30007BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30007BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30007BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30007SCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30007SCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30007SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30007SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SN5420J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN5420J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN54LS20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54LS20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54S20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54S20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN7420N OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7420N OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS20D ACTIVE SOIC D 14 50 Green (RoHS &
SN74LS20D ACTIVE SOIC D 14 50 Green (RoHS &
SN74LS20DE4 ACTIVE SOIC D 14 50 Green (RoHS &
SN74LS20DE4 ACTIVE SOIC D 14 50 Green (RoHS &
SN74LS20DG4 ACTIVE SOIC D 14 50 Green (RoHS &
SN74LS20DG4 ACTIVE SOIC D 14 50 Green (RoHS &
SN74LS20DR ACTIVE SOIC D 14 2500 Green (RoHS &
SN74LS20DR ACTIVE SOIC D 14 2500 Green (RoHS &
SN74LS20DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
SN74LS20DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
SN74LS20DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
SN74LS20DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
SN74LS20J OBSOLETE CDIP J 14 TBD Call TI Call TI
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
9-Oct-2007
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
SN74LS20J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74LS20N ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74LS20N ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74LS20N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS20N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS20NE4 ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74LS20NE4 ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74LS20NSR ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS20NSR ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS20NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS20NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS20NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS20NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S20D ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S20D ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S20DE4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S20DE4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S20DG4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S20DG4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S20DR OBSOLETE SOIC D 0 TBD Call TI Call TI
SN74S20DR OBSOLETE SOIC D 0 TBD Call TI Call TI
SN74S20N ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74S20N ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74S20N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S20N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S20NE4 ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74S20NE4 ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SNJ5420J OBSOLETE CDIP J 14 TBD Call TI Call TI
SNJ5420J OBSOLETE CDIP J 14 TBD Call TI Call TI
SNJ5420W OBSOLETE CFP W 14 TBD Call TI Call TI
9-Oct-2007
(3)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
9-Oct-2007
(3)
SNJ5420W OBSOLETE CFP W 14 TBD Call TI Call TI
SNJ5420WA OBSOLETE CFP WA 14 TBD Call TI Call TI
SNJ5420WA OBSOLETE CFP WA 14 TBD Call TI Call TI
SNJ54LS20FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS20FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54LS20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54LS20W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54LS20W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54S20FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S20FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54S20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54S20W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54S20W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
TAPE AND REEL INFORMATION
11-Mar-2008
*All dimensions are nominal
Device Package
SN74LS20DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74LS20NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS20DR SOIC D 14 2500 346.0 346.0 33.0
SN74LS20NSR SO NS 14 2000 346.0 346.0 33.0
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A SQ
B SQ
19
20
21
22
23
24
25
12826 27
12
1314151618 17
0.020 (0,51)
0.010 (0,25)
MIN
0.342
(8,69)
0.442
0.640
0.739
0.938
1.141
A
(11,63)
(16,76)
(19,32)(18,78)
(24,43)
(29,59)
0.358
(9,09)
0.458
(10,31)
0.660
(12,58)
0.761
(12,58)
0.962
1.165
NO. OF
TERMINALS
**
11
10
9
8
7
6
5
432
20
28
44
52
68
84
0.020 (0,51)
0.010 (0,25)
(11,23)
(16,26)
(23,83)
(28,99)
MINMAX
0.307
(7,80)
0.406
0.495
0.495
0.850
(21,6)
1.047
(26,6)
0.080 (2,03)
0.064 (1,63)
B
MAX
0.358
(9,09)
0.458
(11,63)
0.560
(14,22)
0.560
(14,22)
0.858
(21,8)
1.063
(27,0)
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
4040140/D 10/96
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