Open-Collector Drivers for Indicator Lamps
and Relays
D
Inputs Fully Compatible With Most TTL
Circuits
description
These TTL hex inverter buffers/drivers feature
high-voltage open-collector outputs for interfacing
with high-level circuits (such as MOS) or for
driving high-current loads (such as lamps or
relays), and also are characterized for use as
inverter buffers for driving TTL inputs. The
SN5406 and SN7406 have minimum breakdown
voltages of 30 V . The SN5416 and SN7416 have
minimum breakdown voltages of 15 V. The
maximum sink current is 30 mA for the SN5406
and SN5416, and 40 mA for the SN7406 and
SN7416.
SN5406, SN5416 ...J OR W PACKAGE
SN7406 . . . D, N, OR NS PACKAGE
SN7416 ...D OR N PACKAGE
2A
NC
2Y
NC
3A
(TOP VIEW)
1A
1
1Y
2
2A
3
2Y
4
3A
5
3Y
6
GND
SN5406 . . . FK PACKAGE
7
(TOP VIEW)
1Y1ANC6A6A
3212019
4
5
6
7
8
910111213
14
13
12
11
10
V
9
8
CC
18
17
16
15
14
V
6A
6Y
5A
5Y
4A
4Y
CC
6Y
NC
5A
NC
5Y
GND
NC
4Y
3Y
NC – No internal connection
ORDERING INFORMATION
T
A
0°C to 70°C
SOP – NSTape and reelSN7406NSRSN7406
–55°C to 125°C
LCCC – FKTubeSNJ5406FKSNJ5406FK
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
PACKAGE
–
–
–
–
†
TubeSN7406D
Tape and reelSN7406DR
TubeSN7416D
Tape and reelSN7416DR
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 2001, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Voltage values are with respect to network ground terminal.
2. This is the maximum voltage which should be applied to any output when it is in the off state.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
B. In the examples above, the phase relationships between inputs and outputs have been chosen arbitrarily.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 7 ns, tf≤ 7 ns.
D. The outputs are measured one at a time with one input transition per measurement.
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device willbe discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-NC-NC-NC
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-NC-NC-NC
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
(3)
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
28-Feb-2005
Addendum-Page 2
IMPORTANT NOTICE
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enhancements, improvements, and other changes to its products and services at any time and to discontinue
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty . Except where mandated by government requirements, testing of all
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