Texas Instruments SN28846DW, SN28846KL Datasheet
SN28846
SERIAL DRIVER
SOCS024B – FEBRUARY 1991
Copyright 1991, Texas Instruments Incorporated
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
• TTL-Compatible Inputs
• CCD-Compatible Outputs
• Full-Frame Operation
• Frame-Transfer Operation
• Solid-State Reliability
• Adjustable Clock Levels
description
The SN28846 serial driver is a monolithic CMOS
integrated circuit designed to drive the serial-register gate (SRGn) and transfer-gate (TRG) inputs
of the T exas Instruments (TI) virtual-phase CCD
image sensors. The SN28846 interfaces a
user-defined timing generator to the CCD image
sensor; it receives TTL signals from the timing generator and outputs level-shifted signals to the image sensor.
The SN28846 contains three noninverting serial-gate drivers and one noninverting transfer-gate driver.
The voltage levels on SRG1OUT , SRG2OUT , SRG3OUT , and TRGOUT are controlled by the levels on V
SS
and
V
CC
. The propagation delays for these outputs are controlled by SEL0 and SEL1. The PD, SRG1IN, SRG2IN,
SRG3IN, and TRGIN are TTL compatible.
A high level on PD
allows the SN28846 to operate normally with the level-shifted outputs following the inputs.
When PD
is low, the device is in a low power-consumption mode and all outputs are at VCC.
The SN28846 is available in a 20-pin surface-mount package and is characterized for operation from –20°C
to 45°C.
This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields. These
circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according to MIL-STD-883C,
Method 3015; however, precautions should be taken to avoid application of any voltage higher than maximum-rated voltages to these
high-impedance circuits. During storage or handling, the device leads should be shorted together or the device should be placed in
conductive foam. In a circuit, unused inputs should always be connected to an appropriated logic voltage level, preferably either VCC or ground.
Specific guidelines for handling devices of this type are contained in the publication
Guidelines for Handling Electrostatic-Discharge-Sensitive
(ESDS) Devices and Assemblies
available from Texas Instruments.
TI is a trademark of Texas Instruments Incorporated.
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
SEL0OUT
GND
PD
SRG3IN
SRG2IN
SRG1IN
TRGIN
NC
SEL1OUT
V
SS
V
SS
SEL0
NC
V
CC
SRG3OUT
SRG2OUT
SRG1OUT
TRGOUT
V
CC
SEL1
DW PACKAGE
(TOP VIEW)
NC – No internal connection
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
SN28846
SERIAL DRIVER
SOCS024B – FEBRUARY 1991
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic symbol
†
6
19
14
3
5
7
15
16
13
11
4
SEL0
SEL1
PD
SRG1IN
SRG2IN
SRG3IN
TRGIN
SRG1OUT
SRG2OUT
SRG3OUT
TRGOUT
Φ
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Terminal Functions
TERMINAL
NAME NO.
I/O
DESCRIPTION
GND 2 Ground
NC
‡
8 No connect
NC
‡
18 No connect
PD 3 I Power down
SEL0 19 I Propagation delay mode select
SEL1 11 I Propagation delay mode select
SEL0OUT 1 O Test pin (factory use only)
SEL1OUT 9 O Test pin (factory use only)
SRG1IN 6 I Serial-register gate 1 in
SRG2IN 5 I Serial-register gate 2 in
SRG3IN 4 I Serial-register gate 3 in
SRG1OUT 14 O Serial-register gate 1 out
SRG2OUT 15 O Serial-register gate 2 out
SRG3OUT 16 O Serial-register gate 3 out
TRGIN 7 I Transfer gate in
TRGOUT 13 O Transfer gate out
V
CC
‡
12 I Positive supply voltage
V
CC
‡
17 I Positive supply voltage
V
SS
‡
10 I Negative supply voltage
V
SS
‡
20 I Negative supply voltage
‡
All terminals of the same name should be connected together externally.
SN28846
SERIAL DRIVER
SOCS024B – FEBRUARY 1991
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
†
Positive supply voltage, V
CC
(see Note 1) 4 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Negative supply voltage, V
SS
(see Note 2) –11.1 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range: SEL0 and SEL1 V
SS
to V
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Other inputs 0 to 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation at (or below) T
A
≤ 25°C: Unmounted device (see Figure 1) 825 mW. . .
Mounted device (see Figure 1) 1150 mW. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, T
A
–20°C to 45°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
STG
–55°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to the GND terminal.
2. The algebraic convention, in which the least positive (most negative) value is designated minimum, is used in this data sheet for
voltage levels only.
0 10203040506070
0
500
1000
1500
P
D
– Power Dissipation – mW
TA – Free-Air Temperature – °C
Mounted Device
(see Note A)
Unmounted Device
POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
100
200
300
400
600
700
800
900
1100
1200
1300
1400
Figure 1
NOTE A: The mounted-device derating curve of Figure 1 is obtained under the following conditions:
The board is 50 mm by 50 mm by 1.6 mm thick.
The board material is glass epoxy.
The copper thickness of all the etch runs is 35 microns.
Etch run dimensions – All 20 etch runs are 0.4 mm by 22 mm.
Each chip is soldered to the board.
An aluminum cooling fin 10 mm by 10 mm by 1 mm thick is coupled to the chip with thermal paste.
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