SN28846
SERIAL DRIVER
SOCS024B – FEBRUARY 1991
Copyright 1991, Texas Instruments Incorporated
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
• TTL-Compatible Inputs
• CCD-Compatible Outputs
• Full-Frame Operation
• Frame-Transfer Operation
• Solid-State Reliability
• Adjustable Clock Levels
description
The SN28846 serial driver is a monolithic CMOS
integrated circuit designed to drive the serial-register gate (SRGn) and transfer-gate (TRG) inputs
of the T exas Instruments (TI) virtual-phase CCD
image sensors. The SN28846 interfaces a
user-defined timing generator to the CCD image
sensor; it receives TTL signals from the timing generator and outputs level-shifted signals to the image sensor.
The SN28846 contains three noninverting serial-gate drivers and one noninverting transfer-gate driver.
The voltage levels on SRG1OUT , SRG2OUT , SRG3OUT , and TRGOUT are controlled by the levels on V
SS
and
V
CC
. The propagation delays for these outputs are controlled by SEL0 and SEL1. The PD, SRG1IN, SRG2IN,
SRG3IN, and TRGIN are TTL compatible.
A high level on PD
allows the SN28846 to operate normally with the level-shifted outputs following the inputs.
When PD
is low, the device is in a low power-consumption mode and all outputs are at VCC.
The SN28846 is available in a 20-pin surface-mount package and is characterized for operation from –20°C
to 45°C.
This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields. These
circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according to MIL-STD-883C,
Method 3015; however, precautions should be taken to avoid application of any voltage higher than maximum-rated voltages to these
high-impedance circuits. During storage or handling, the device leads should be shorted together or the device should be placed in
conductive foam. In a circuit, unused inputs should always be connected to an appropriated logic voltage level, preferably either VCC or ground.
Specific guidelines for handling devices of this type are contained in the publication
Guidelines for Handling Electrostatic-Discharge-Sensitive
(ESDS) Devices and Assemblies
available from Texas Instruments.
TI is a trademark of Texas Instruments Incorporated.
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
SEL0OUT
GND
PD
SRG3IN
SRG2IN
SRG1IN
TRGIN
NC
SEL1OUT
V
SS
V
SS
SEL0
NC
V
CC
SRG3OUT
SRG2OUT
SRG1OUT
TRGOUT
V
CC
SEL1
DW PACKAGE
(TOP VIEW)
NC – No internal connection
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
SN28846
SERIAL DRIVER
SOCS024B – FEBRUARY 1991
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic symbol
†
6
19
14
3
5
7
15
16
13
11
4
SEL0
SEL1
PD
SRG1IN
SRG2IN
SRG3IN
TRGIN
SRG1OUT
SRG2OUT
SRG3OUT
TRGOUT
Φ
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Terminal Functions
TERMINAL
NAME NO.
I/O
DESCRIPTION
GND 2 Ground
NC
‡
8 No connect
NC
‡
18 No connect
PD 3 I Power down
SEL0 19 I Propagation delay mode select
SEL1 11 I Propagation delay mode select
SEL0OUT 1 O Test pin (factory use only)
SEL1OUT 9 O Test pin (factory use only)
SRG1IN 6 I Serial-register gate 1 in
SRG2IN 5 I Serial-register gate 2 in
SRG3IN 4 I Serial-register gate 3 in
SRG1OUT 14 O Serial-register gate 1 out
SRG2OUT 15 O Serial-register gate 2 out
SRG3OUT 16 O Serial-register gate 3 out
TRGIN 7 I Transfer gate in
TRGOUT 13 O Transfer gate out
V
CC
‡
12 I Positive supply voltage
V
CC
‡
17 I Positive supply voltage
V
SS
‡
10 I Negative supply voltage
V
SS
‡
20 I Negative supply voltage
‡
All terminals of the same name should be connected together externally.
SN28846
SERIAL DRIVER
SOCS024B – FEBRUARY 1991
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
†
Positive supply voltage, V
CC
(see Note 1) 4 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Negative supply voltage, V
SS
(see Note 2) –11.1 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range: SEL0 and SEL1 V
SS
to V
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Other inputs 0 to 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation at (or below) T
A
≤ 25°C: Unmounted device (see Figure 1) 825 mW. . .
Mounted device (see Figure 1) 1150 mW. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, T
A
–20°C to 45°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
STG
–55°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to the GND terminal.
2. The algebraic convention, in which the least positive (most negative) value is designated minimum, is used in this data sheet for
voltage levels only.
0 10203040506070
0
500
1000
1500
P
D
– Power Dissipation – mW
TA – Free-Air Temperature – °C
Mounted Device
(see Note A)
Unmounted Device
POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
100
200
300
400
600
700
800
900
1100
1200
1300
1400
Figure 1
NOTE A: The mounted-device derating curve of Figure 1 is obtained under the following conditions:
The board is 50 mm by 50 mm by 1.6 mm thick.
The board material is glass epoxy.
The copper thickness of all the etch runs is 35 microns.
Etch run dimensions – All 20 etch runs are 0.4 mm by 22 mm.
Each chip is soldered to the board.
An aluminum cooling fin 10 mm by 10 mm by 1 mm thick is coupled to the chip with thermal paste.
SN28846
SERIAL DRIVER
SOCS024B – FEBRUARY 1991
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions
MIN NOM MAX UNIT
Positive supply voltage, V
CC
0 1.5 3
Negative supply voltage, VSS (see Note 2)
–11.1 –10.4 –9.7
V
SRG1IN, SRG2IN, SRG3IN, TRGIN 2 5
High-level input voltage, V
IH
SEL0, SEL1 V
CC
V
PD 4 5
SRG1IN, SRG2IN, SRG3IN, TRGIN 0 0.8
Low-level input voltage, V
IL
SEL0, SEL1 V
SS
V
PD 0 0.4
p
SRG1OUT, SRG2OUT, SRG3OUT 200
p
Capacitance load
TRGOUT 350
pF
Operating free-air temperature, T
A
–20 45 °C
NOTE 2: The algebraic convention, in which the least positive (most negative) value is designated minimum, is used in this data sheet for voltage
levels only.
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN MAX UNIT
p
SRG1OUT, SRG2OUT,
SRG3OUT
f = 4.8 MHz,
See Figure 2
tw = 70 ns,
VOHHigh-level out ut voltage
TRGOUT
f = 3.6 MHz,
See Figure 2
tw = 140 ns,
V
CC
–0.
5
VCC+0.5
V
p
SRG1OUT, SRG2OUT,
SRG3OUT
f = 4.8 MHz,
See Figure 2
tw = 70 ns,
VOLLow-level out ut voltage
TRGOUT
f = 3.6 MHz,
See Figure 2
tw = 140 ns,
V
SS
–0.
8
VSS+0.8
V
V
N(PP)
Peak-to-peak output
noise voltage
SRG1OUT, SRG2OUT,
SRG3OUT
See Figure 2 300 mV
I
IH
High-level input current
SRG1IN, SRG2IN,
SRG3IN, TRGIN,
SEL0, SEL1
VI = 5.5 V 50 µA
I
IL
Low-level input current VI = 0 ± 10 µA
pp
No load, PD at 0 V , TA = 25°C
–0.5
ISSSupply current
See Note 3 –25
mA
f
max
Maximum frequency
SRG1OUT, SRG2OUT,
SRG3OUT
CL = 200 pF 10
MHz
max
of oscillation
TRGOUT
CL = 350 pF
1
NOTE 3: SRG1OUT, SRG2OUT, and SRG3OUT are loaded with 80-pF capacitive loads; TRGOUT is loaded with a 180-pF load. The SN28846
driver is clocked by the SN28835 timer. SEL0 and SEL1 are both held at –11.1 V.
SN28846
SERIAL DRIVER
SOCS024B – FEBRUARY 1991
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics for SRG1OUT, SRG2OUT, and SRG3OUT, VCC = 2.3 V, VSS = –10.3 V,
T
A
= 25°C (unless otherwise noted) (see Figure 2)
†
PARAMETER
SELECT
MODE
‡
TEST CONDITIONS MIN TYP MAX UNIT
0 28
Propagation delay time,
1
36
t
PLH
gy
low-to-high-level output
2
t
w
=
70 ns
,
f
= 4.8 MHz
42
ns
3 48
0 25
Propagation delay time,
1
24
t
PHL
gy
high-to-low-level output
2
t
w
= 70 ns,
f
= 4.8 MHz
23
ns
3 23
∆t
PLH
(see Note 4) ±5
∆t
PHL
(see Note 4)
°
°
±5
An
y
T
A
= –
20°C to 55°C
5
ns
t
sk(o)
Skew time (see Note 5)
5
0 63 68 73
1
54 59 64
twPulse duration
2
t
w
= 70 ns,
f
= 4.8 MHz
47
52 57
ns
3 40 45 50
t
w(n)
– t
w(m)
Pulse duration differential
(see Note 6)
Any tw = 70 ns, f = 4.8 MHz 5 ns
t
r
Rise time
10 14 18
t
f
Fall time
An
y
t
w
= 70 ns,
f
= 4.8 MHz
6 10 13
ns
†
The load is a Texas Instruments CCD image sensor.
‡
The select mode is determined by the voltage levels applied to the SEL1 and SEL0 inputs as follows:
SELECT MODE
SEL1 SEL0
0VSSV
SS
1VSSV
CC
2VCCV
SS
3VCCV
CC
NOTES: 4. For a given channel, ∆t
PLH
and ∆t
PHL
are the changes in t
PLH
and t
PHL
, respectively, when the device is operated over the
temperature range –20°C to 55°C rather than at 25°C.
5. This is the maximum absolute difference in propagation delay time, either t
PLH
or t
PHL
, through the three channels at any given
temperature within the specified range.
6. This is the maximum difference in the pulse duration through the three channels.
SN28846
SERIAL DRIVER
SOCS024B – FEBRUARY 1991
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics for TRGOUT , VCC = 2.3 V , VSS = –10.3 V , TA = 25°C (unless otherwise noted)
(see Figure 2)
†
PARAMETER
SELECT
MODE
‡
TEST CONDITIONS MIN TYP MAX UNIT
0 24
Propagation delay time,
1
33
t
PLH
gy
low-to-high-level output
2
t
w
=
140 ns
,
f
= 3.6 MHz
39
ns
3 47
0 24
Propagation delay time,
1
23
t
PHL
gy
high-to-low-level output
2
t
w
=
140 ns
,
f
= 3.6 MHz
22
ns
3 22
∆t
PLH
(see Note 7)
°
°
20
∆t
PHL
(see Note 7)
An
y
T
A
= –
20°C to 55°C
20
ns
t
w
Pulse duration 100 140 180
t
r
Rise time Any tw = 140 ns, f = 3.6 MHz 17 ns
t
f
Fall time
10
†
The load is a Texas Instruments CCD image sensor.
‡
The select mode is determined by the voltage levels applied to SEL1 and SEL0 as follows:
SELECT MODE
SEL1 SEL0
0VSSV
SS
1VSSV
CC
2VCCV
SS
3VCCV
CC
NOTE 7: ∆t
PLH
and ∆t
PHL
are the changes in t
PLH
and t
PHL
, respectively, when the device is operated over the temperature range –20°C to 55°C
rather than at 25°C.
SN28846
SERIAL DRIVER
SOCS024B – FEBRUARY 1991
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
50%
50%
10%
90%
10%
90%
0% + 2 V
100% – 2 V
t
f
t
r
t
PLH
t
PHL
SRG1OUT, SRG2OUT,
SRG3OUT, or TRGOUT
SRG1IN, SRG2IN,
SRG3IN, or TRGIN
SRG1OUT, SRG2OUT,
SRG3OUT, or TRGOUT
SRG1OUT, SRG2OUT,
or SRG3OUT
SRG1OUT, SRG2OUT,
or SRG3OUT
VCC + 0.5 V
V
CC
VCC – 0.5 V
(worst case)
VSS + 0.8 V
VSS – 0.6 V
V
SS
VSS + 0.15 V
VSS – 0.15 V
t
w
PULSE DURATION AND RISE AND FALL TIMES
PROPAGATION DELAYS
SRG1OUT, SRG2OUT,
or SRG3OUT
SRG1OUT, SRG2OUT,
or SRG3OUT
VCC + 0.5 V
V
CC
VCC – 0.5 V
(typical)
VSS + 0.8 V
VSS + 0.15 V
VSS – 0.15 V
VSS – 0.6 V
V
SS
TYPICAL AND WORST-CASE OUTPUT NOISE
51 Ω
CL = 80 pF
(see Note A)
From Output
Under Test
NOTE A: CL Includes probe and jig capacitance.
Figure 2. Load Circuit and Voltage Waveforms
SN28846
SERIAL DRIVER
SOCS024B – FEBRUARY 1991
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
DW/R-PDSO-G** PLASTIC WIDE-BODY SMALL-OUTLINE PACKAGE
20 PIN SHOWN
0.419 (10,65)
0.400 (10,15)
0.293 (7,45)
0.299 (7,59)
0.093 (2,35)
0.104 (2,65)
0.012 (0,30)
0.004 (0,10)
0.009 (0,23)
0.012 (0,30)
0.050 (1,27)
0.016 (0,40)
0.020 (0,51)
0.014 (0,35)
16
0.400
(10,16)
A MIN
A MAX
(10,41)
0.410
0.510
(12,95)
(12,70)
0.500
20
0.610
(15,49)
(15,24)
0.600
24
0.710
(18,03)
(17,78)
0.700
28
DIM
PINS**
4040000/A–10/93
20 11
1
10
0.338 (8,58)
0.364 (9,24)
A
Seating Plane
0.004 (0,10)
0°–8°
M
0.010 (0,25)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICA TIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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