Texas Instruments SMJ320C30KGDM40B Datasheet
SMJ320C30KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIE
SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998
1
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
D
Military Operating Temperature Range
–55°C to 125°C, QML Processing
D
Fast Instruction Cycle Time of 50 ns and
40 ns
D
Two 1K-Word × 32-Bit Single-Cycle
Dual-Access On-Chip RAM Blocks
D
32-Bit Instruction and Data Words,
24-Bit Addresses
D
Integer, Floating-Point, and Logical
Operations
D
40- or 32-Bit Floating-Point/Integer
Multiplier and Arithmetic Logic Unit (ALU)
D
24 × 24-Bit Integer Multiplier, 32-Bit Product
D
32 × 32-Bit Floating-Point Multiplier,
40-Bit Product
D
Parallel ALU and Multiplier Execution in a
Single Cycle
D
32-Bit Barrel Shifter
D
Eight Extended-Precision Registers
(Accumulators)
D
Circular and Bit-Reversed Addressing
Capabilities
D
Two Independent Bidirectional Serial Ports
With Support for 8-, 16-, 24-, or 32-Bit
Transfers
D
Two 32-Bit Timers With Control and
Counter Registers
D
Validated Ada Compiler
D
64-Word × 32-Bit Instruction Cache
D
On-Chip Direct Memory Access (DMA)
Controller for Concurrent I/O and CPU
Operation
D
One 4K × 32-Bit Single-Cycle Dual-Access
On-Chip ROM Block
D
Two 32-Bit External Ports (24- and 13-Bit
Addresses)
D
T wo Address Generators With Eight
Auxiliary Registers and Two Auxiliary
Register Arithmetic Units (ARAUs)
D
Zero-Overhead Loops With Single-Cycle
Branches
D
Interlocked Instructions for
Multiprocessing Support
D
Two- and Three-Operand Instructions
D
Conditional Calls and Returns
D
Block-Repeat Capability
D
Fabricated Using 0.72-µm Enhanced
Performance Implanted CMOS (EPIC)
Technology by Texas Instruments
description
The SMJ320C30KGDB digital signal processor (DSP) is a high-performance, 32-bit floating-point processor
manufactured in 0.72-µm, double-level metal CMOS technology.
The SMJ320C30KGDB internal busing and special digital-signal-processing instruction set have the speed and
flexibility to execute up to 50 million floating-point operations per second (MFLOPS). The SMJ320C30KGDB
optimizes speed by implementing functions in hardware that other processors implement through software or
microcode. This hardware-intensive approach provides performance previously unavailable on a single chip.
The SMJ320C30KGDB can perform parallel multiply and ALU operations on integer or floating-point data in a
single cycle. Each processor also possesses a general-purpose register file, a program cache, dedicated
ARAUs, internal dual-access memories, one DMA channel supporting concurrent I/O, and a short
machine-cycle time. High performance and ease of use are results of these features.
The large address space, multiprocessor interface, internally and externally generated wait states, two external
interface ports, two timers, two serial ports, and multiple interrupt structure enhanced general-purpose
applications. The SMJ320C30KGDB supports a wide variety of system applications from host processor to
dedicated coprocessor.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 1998, Texas Instruments Incorporated
EPIC is a trademark of Texas Instruments Incorporated.
SMJ320C30KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIE
SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998
2
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
description (Continued)
High-level language support is easily implemented through a register-based architecture, large address space,
powerful addressing modes, flexible instruction set, and well-supported floating-point arithmetic.
known good die (KGD) technology
KGD options are available for use in multichip modules and chip-on-board (COB) applications. The current
verification technology that supports KGD requirements for the SMJ320C30KGDB is a hot chuck probe
process. This process uses standard probed product that is tested in wafer form at speed and elevated
temperature to full data sheet specifications. Each individual die is then sawed, inspected, and packaged for
shipment.
electrical specifications
For electrical and timing specifications, see the
SMJ320C30 Digital Signal Processor
data sheet, literature
number SGUS014.
SMJ 320 C 30 KGD M 40
PREFIX
SMJ = MIL-PRF-38535
DEVICE FAMILY
320 = DSP Family
TECHNOLOGY
C = CMOS
DEVICE
30 = Floating-Point DSP
SPEED RANGE
40 = 40 MHz
50 = 50 MHz
PACKAGE TYPE
KGD = Known Good Die
TEMPERATURE RANGE
M = – 55°C to125°C
L= 0°Cto 70°C
B
DIE REVISION
’C30
B = Revision 7.4
Figure 1. SMJ320C30KGDB Device Nomenclature
SMJ320C30KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIE
SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998
3
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
JEDEC STANDARD
D
Die thickness is approximately 15 mils "1 mil.
D
Backside surface finish is silicon.
D
Maximum allowable die junction operating temperature is 175°C.
D
Glassivation material is compressive nitride.
D
Bond pad metal is composed of copper-doped aluminum.
D
Percent defective allowed for burned-in die is 5%.
D
Life test data is available.
D
Configuration control notification
D
Group A attribute summary is available (SMJ only).
D
Suggested die-attach material is Silverglass (QMI 3555).
D
Suggested bond wire size is 1.25 mil.
D
ESD rating is Class II.
D
Minimum allowable peak process temperature for die attach is 325°C (for QMI 3555).
D
Saw kerf is dependent on blade size used.
D
Die backside potential is grounded.
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