SMJ320C30KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIE
SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998
1
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
D
Military Operating Temperature Range
–55°C to 125°C, QML Processing
D
Fast Instruction Cycle Time of 50 ns and
40 ns
D
Two 1K-Word × 32-Bit Single-Cycle
Dual-Access On-Chip RAM Blocks
D
32-Bit Instruction and Data Words,
24-Bit Addresses
D
Integer, Floating-Point, and Logical
Operations
D
40- or 32-Bit Floating-Point/Integer
Multiplier and Arithmetic Logic Unit (ALU)
D
24 × 24-Bit Integer Multiplier, 32-Bit Product
D
32 × 32-Bit Floating-Point Multiplier,
40-Bit Product
D
Parallel ALU and Multiplier Execution in a
Single Cycle
D
32-Bit Barrel Shifter
D
Eight Extended-Precision Registers
(Accumulators)
D
Circular and Bit-Reversed Addressing
Capabilities
D
Two Independent Bidirectional Serial Ports
With Support for 8-, 16-, 24-, or 32-Bit
Transfers
D
Two 32-Bit Timers With Control and
Counter Registers
D
Validated Ada Compiler
D
64-Word × 32-Bit Instruction Cache
D
On-Chip Direct Memory Access (DMA)
Controller for Concurrent I/O and CPU
Operation
D
One 4K × 32-Bit Single-Cycle Dual-Access
On-Chip ROM Block
D
Two 32-Bit External Ports (24- and 13-Bit
Addresses)
D
T wo Address Generators With Eight
Auxiliary Registers and Two Auxiliary
Register Arithmetic Units (ARAUs)
D
Zero-Overhead Loops With Single-Cycle
Branches
D
Interlocked Instructions for
Multiprocessing Support
D
Two- and Three-Operand Instructions
D
Conditional Calls and Returns
D
Block-Repeat Capability
D
Fabricated Using 0.72-µm Enhanced
Performance Implanted CMOS (EPIC)
Technology by Texas Instruments
description
The SMJ320C30KGDB digital signal processor (DSP) is a high-performance, 32-bit floating-point processor
manufactured in 0.72-µm, double-level metal CMOS technology.
The SMJ320C30KGDB internal busing and special digital-signal-processing instruction set have the speed and
flexibility to execute up to 50 million floating-point operations per second (MFLOPS). The SMJ320C30KGDB
optimizes speed by implementing functions in hardware that other processors implement through software or
microcode. This hardware-intensive approach provides performance previously unavailable on a single chip.
The SMJ320C30KGDB can perform parallel multiply and ALU operations on integer or floating-point data in a
single cycle. Each processor also possesses a general-purpose register file, a program cache, dedicated
ARAUs, internal dual-access memories, one DMA channel supporting concurrent I/O, and a short
machine-cycle time. High performance and ease of use are results of these features.
The large address space, multiprocessor interface, internally and externally generated wait states, two external
interface ports, two timers, two serial ports, and multiple interrupt structure enhanced general-purpose
applications. The SMJ320C30KGDB supports a wide variety of system applications from host processor to
dedicated coprocessor.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 1998, Texas Instruments Incorporated
EPIC is a trademark of Texas Instruments Incorporated.
SMJ320C30KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIE
SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998
2
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
description (Continued)
High-level language support is easily implemented through a register-based architecture, large address space,
powerful addressing modes, flexible instruction set, and well-supported floating-point arithmetic.
known good die (KGD) technology
KGD options are available for use in multichip modules and chip-on-board (COB) applications. The current
verification technology that supports KGD requirements for the SMJ320C30KGDB is a hot chuck probe
process. This process uses standard probed product that is tested in wafer form at speed and elevated
temperature to full data sheet specifications. Each individual die is then sawed, inspected, and packaged for
shipment.
electrical specifications
For electrical and timing specifications, see the
SMJ320C30 Digital Signal Processor
data sheet, literature
number SGUS014.
SMJ 320 C 30 KGD M 40
PREFIX
SMJ = MIL-PRF-38535
DEVICE FAMILY
320 = DSP Family
TECHNOLOGY
C = CMOS
DEVICE
30 = Floating-Point DSP
SPEED RANGE
40 = 40 MHz
50 = 50 MHz
PACKAGE TYPE
KGD = Known Good Die
TEMPERATURE RANGE
M = – 55°C to125°C
L= 0°Cto 70°C
B
DIE REVISION
’C30
B = Revision 7.4
Figure 1. SMJ320C30KGDB Device Nomenclature
SMJ320C30KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIE
SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998
3
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
JEDEC STANDARD
D
Die thickness is approximately 15 mils "1 mil.
D
Backside surface finish is silicon.
D
Maximum allowable die junction operating temperature is 175°C.
D
Glassivation material is compressive nitride.
D
Bond pad metal is composed of copper-doped aluminum.
D
Percent defective allowed for burned-in die is 5%.
D
Life test data is available.
D
Configuration control notification
D
Group A attribute summary is available (SMJ only).
D
Suggested die-attach material is Silverglass (QMI 3555).
D
Suggested bond wire size is 1.25 mil.
D
ESD rating is Class II.
D
Minimum allowable peak process temperature for die attach is 325°C (for QMI 3555).
D
Saw kerf is dependent on blade size used.
D
Die backside potential is grounded.
SMJ320C30KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIE
SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998
4
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
SMJ320C30KGDB (rev 7.x) known good die pad information
Figure 2 shows the SMJ320C30KGDB die-numbering format. See Table 1 for SMJ320C30KGDB die pad
information.
204
155
Die Side Number 4
Zero-Zero
(origin)
52 103Die Side Number 2
Die Side Number 3
Die Designator
TMS320C30FW
51
Pad Number One
Die Side Number 1
154
104
1
Figure 2. ’320C30KGD Die-Numbering Format
(See Table 1)
Table 1 provides a reference for the following:
D
The ’C30 signal identities in relation to the pad numbers
D
The ’C30 X,Y coordinates, where bond pad 52 serves as the origin (0,0)
In addition, significant specifications include:
D
X,Y coordinate data is in microns.
D
Coordinate origin is at (0,0) (center of bond pad 52).
D
The active silicon dimensions are 7779.60 µm × 9453.10 µm (306.28 mils × 372.17 mils).
D
The die size is approximately 7950.20 µm × 9779.00 µm (313.00 mils × 385.00 mils).
D
Bond pad dimensions are 103.50 µm × 103.50 µm (4.07 mils × 4.07 mils).
SMJ320C30KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIE
SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998
5
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
Table 1. ’320C30KGD Die Pad Information : rev 7.4 (0,72 µm)
DIE SIDE #1
’C30 DIE BOND PAD
LOCATIONS
DIE/TAB BOND PAD
IDENTITY
X-COORDINATE OF
THE DIE BOND PAD
Y-COORDINATE OF
THE DIE BOND PAD
PITCH OF LEAD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
PDV
DD
PDV
DD
DR0
FSR0
CLKR0
CLKX0
FSX0
DX0
TCLK0
TCLK1
PADTOG
IOD0
IOD1
IOD2
IODV
DD
IODV
DD
IOD3
IOD4
IOD5
IOD6
IOD7
IOD8
IOD9
IOD10
V
DDL
V
DDL
DV
SS
V
SSL
CV
SS
IOD11
IOD12
IOD13
IOD14
IOD15
IOD16
IOD17
IOD18
IOD19
IOD20
IOD21
IOD22
IOD23
IOD24
IOD25
IOD26
IOD27
IOD28
IOD29
IOD30
IODV
DD
IODV
DD
– 614.16
7165.35
7029.99
6895.42
6760.42
6625.42
6490.42
6355.42
6220.42
6085.42
5950.42
5815.42
5673.22
5538.22
5403.22
5268.22
5133.22
4998.22
4863.22
4728.22
4593.22
4458.22
4323.22
4188.22
4053.22
3918.22
3783.22
3644.08
3504.04
3369.04
3234.04
3099.04
2964.04
2829.04
2694.04
2559.04
2424.04
2289.04
2154.04
2019.04
1884.04
1749.04
1614.04
1479.04
1344.04
1209.04
1074.04
939.04
804.04
669.04
529.54
394.56
135.36
134.57
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
142.20
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
139.14
140.04
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
139.50
134.98
SMJ320C30KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIE
SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998
6
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
Table 1. ’320C30KGD Die Pad Information : rev 7.4 (0,72 µm) (Continued)
DIE SIDE #2
’C30 DIE BOND PAD
LOCATIONS
DIE/TAB BOND PAD
IDENTITY
X-COORDINATE OF
THE DIE BOND PAD
Y-COORDINATE OF
THE DIE BOND PAD
PITCH OF LEAD
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
DV
SS
V
SSL
IV
SS
CV
SS
IOD31
A23
A22
A21
A20
A19
A18
A17
A16
A15
A14
ADV
DD
ADV
DD
A13
A12
A11
A10
A9
A8
A7
A6
V
DDL
V
DDL
DV
SS
CV
SS
A5
A4
A3
A2
A1
A0
EMU0
EMU1
EMU2
EMU3
EMU4
MC/MP
IOA12
IOA11
IOA10
IOA9
IOA8
IOA7
IOA6
CV
SS
IV
SS
V
SSL
DV
SS
0.00
139.68
274.68
409.68
609.48
773.28
944.28
1093.68
1343.88
1478.88
1613.88
1784.63
1919.63
2054.63
2225.63
2360.63
2495.63
2688.23
2837.63
2987.03
3136.43
3285.83
3435.23
3599.03
3734.03
3897.83
4032.83
4177.37
4321.91
4480.85
4637.63
4794.23
4950.83
5107.43
5264.03
5443.85
5646.89
5849.93
6029.75
6209.57
6412.61
6570.83
6720.23
6869.63
7019.03
7168.43
7317.83
7467.23
7710.23
7859.63
8009.03
8158.79
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.18
0.18
0.18
0.18
0.18
0.18
0.18
0.18
0.18
0.18
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
139.68
135.00
135.00
199.80
163.80
171.00
149.40
250.20
135.00
135.00
170.75
135.00
135.00
171.00
135.00
135.00
192.60
149.40
149.40
149.40
149.40
149.40
163.80
135.00
163.80
135.00
144.54
144.54
158.94
156.78
156.60
156.60
156.60
156.60
179.82
203.04
203.04
179.82
179.82
203.04
158.22
149.40
149.40
149.40
149.40
149.40
149.40
243.00
149.40
149.40
149.76
SMJ320C30KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIE
SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998
7
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
Table 1. ’320C30KGD Die Pad Information : rev 7.4 (0,72 µm) (Continued)
DIE SIDE #3
’C30 DIE BOND PAD
LOCATIONS
DIE/TAB BOND PAD
IDENTITY
X-COORDINATE OF
THE DIE BOND PAD
Y-COORDINATE OF
THE DIE BOND PAD
PITCH OF LEAD
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
ADV
DD
ADV
DD
IOA5
IOA4
IOA3
IOA2
IOA1
IOA0
D31
D30
D29
D28
D27
D26
DDV
DD
DDV
DD
D25
D24
D23
D22
D21
D20
D19
D18
V
DDL
V
DDL
DV
SS
CV
SS
V
SSL
D17
D16
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
H1
H3
DDV
DD
DDV
DD
8618.31
394.56
529.54
664.54
799.54
934.54
1069.54
1204.54
1339.54
1481.74
1616.74
1751.74
1886.74
2021.74
2156.74
2291.74
2426.74
2561.74
2696.74
2831.74
2966.74
3101.74
3236.74
3371.74
3506.74
3641.74
3776.74
3913.00
4055.74
4190.74
4325.74
4460.74
4595.74
4730.74
4865.74
5000.74
5135.74
5270.74
5405.74
5540.74
5675.74
5810.74
5945.74
6080.74
6215.74
6350.74
6485.74
6620.74
6755.74
6890.56
7025.67
7160.31
134.98
135.00
135.00
135.00
135.00
135.00
135.00
142.20
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
136.26
142.74
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
134.82
135.11
134.64
SMJ320C30KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIE
SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998
8
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
Table 1. ’320C30KGD Die Pad Information : rev 7.4 (0,72 µm) (Continued)
DIE SIDE #4
’C30 DIE BOND PAD
LOCATIONS
DIE/TAB BOND PAD
IDENTITY
X-COORDINATE OF
THE DIE BOND PAD
Y-COORDINATE OF
THE DIE BOND PAD
PITCH OF LEAD
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
DV
SS
V
SSL
IV
SS
CV
SS
X2/CLKIN
X1
V
SUBS
EMU5
IORDY
MSTRB
IOSTRB
IOR/W
HOLDA
HOLD
MDV
DD
MDV
DD
RDY
STRB
R/W
RESET
XF1
XF0
IACK
INT0
V
8167.43
8020.73
7877.63
7742.63
7582.07
7412.51
7176.53
6404.15
6245.93
6087.71
5952.71
5817.71
5682.71
5524.49
5366.27
5231.27
5073.05
4914.83
4779.83
4621.61
4463.39
4328.39
4193.39
4035.17
3876.95
146.70
143.10
135.00
160.56
169.56
235.98
772.38
158.22
158.22
135.00
135.00
135.00
158.22
158.22
135.00
158.22
158.22
135.00
158.22
158.22
135.00
135.00
158.22
158.22
135.00
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
DDL
V
DDL
V
SSL
IV
SS
INT1
INT2
INT3
RSV0
RSV1
RSV2
RSV3
RSV4
RSV5
RSV6
RSV7
RSV8
RSV9
RSV10
DR1
FSR1
CLKR1
CLKX1
FSX1
DX1
CV
SS
DV
SS
3741.95
3602.27
3458.09
3297.53
3124.55
2943.11
2770.49
2597.87
2425.25
2252.63
2080.01
1914.59
1779.59
1644.84
1509.84
1374.84
1239.84
1104.84
969.84
654.84
498.24
341.64
185.04
28.44
–128.16
7558.83
139.68
144.18
160.56
172.98
181.44
172.62
172.62
172.62
172.62
172.62
165.42
135.00
134.75
135.00
135.00
135.00
135.00
135.00
315.00
156.60
156.60
156.60
156.60
156.60
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