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Related Documentation From Texas Instruments
J
TI Plug-N-Play Audio Amplifier Evaluation Platform (literature
number SLOU011) provides detailed information on the evaluation
platform and its use with TI audio evaluation modules.
J
TPA311 350-mW Low-Voltage Audio Power Amplifier (literature
number SLOS207) This is the data sheet for the TPA311 audio
amplifier integrated circuit.
FCC Warning
This equipment is intended for use in a laboratory test environment only. It
generates, uses, and can radiate radio frequency energy and has not been
tested for compliance with the limits of computing devices pursuant to subpart
J of part 15 of FCC rules, which are designed to provide reasonable protection
against radio frequency interference. Operation of this equipment in other
environments may cause interference with radio communications, in which
case the user at his own expense will be required to take whatever measures
may be required to correct this interference.
Preface
Trademarks
TI is a trademark of Texas Instruments Incorporated.
This chapter provides an overview of the Texas Instruments (TI) TPA311
MSOP audio amplifier evaluation module (SLOP123). It includes a list of EVM
features, a brief description of the module illustrated with a pictorial diagram,
and a list of EVM specifications.
The TI TPA311 MSOP audio amplifier evaluation module and the TI
plug-n-play audio amplifier evaluation platform include the following features:
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TPA311 Low-Voltage Audio Power Amplifier Evaluation Module
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Quick and Easy Configuration With the TI Plug-N-Play Audio Amplifier
Evaluation Platform
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Single channel, bridge-tied load (BTL) or single-ended operation
3.3-V and 5-V operation
350 mW output power into 8 Ω at 5 V, BTL
Ultra-low current consumption in shutdown/mute mode
Internal thermal and short-circuit protection
Module gain adjustable between approximately 2 and 22
Evaluation module is designed to simply plug into the platform, automatically making all signal, control, and power connections
Platform provides flexible power options
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Jumpers on the platform select power and module control options
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Switches on the platform route signals
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Platform provides quick and easy audio input and output connections
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Platform Power Options
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Onboard 9-V battery
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External 5-V – 15-V (VCC) supply inputs
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External regulated VDD supply input
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Socket for onboard 5 V/3.3 V VDD voltage regulator EVM
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Onboard overvoltage and reverse polarity power protection
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Platform Audio Input and Output Connections
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Left and right RCA phono jack inputs
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Miniature stereo phone jack input
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Left and right RCA phono jack outputs
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Left and right compression speaker terminal outputs
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Miniature stereo headphone jack output
1-2
Introduction
1.2Description
The TPA311 MSOP audio power amplifier evaluation module is a complete,
low-power single-channel audio power amplifier. It consists of the TI TPA31 1
350-mW low-voltage audio power amplifier IC in a very small MSOP package,
along with a small number of other parts mounted on a circuit board that is
approximately one and a quarter inches square (Figure 1–1).
Figure 1–1.The TI TPA311 Audio Amplifier Evaluation Module
Vdd GND
Shutdown
C5
S1
R1
C2
R2
R4
C1
SE\BTL*
IN+
GND
TPA311 MSOP EVM
+
†
U1
C3
R3
C4
TEXAS
INSTRUMENTS
SLOP123
OUT–
GND
OUT+
Description
†
Due to the very small size of the MSOP IC package, the standard part number TPA311 is replaced with the code TIAAB
Single in-line header pins are mounted to the underside of the module circuit
board to allow the EVM to be plugged into the TI plug-n-play audio amplifier
evaluation platform, or to be wired directly into existing circuits and equipment
when used stand-alone.
The platform has room for a pair of TP A31 1 MSOP evaluation modules and is
a convenient vehicle for demonstrating TI’s audio power amplifier and related
evaluation modules. The EVMs simply plug into the platform, which automatically provides power to the modules, interconnects them correctly, and
connects them to a versatile array of standard audio input and output jacks and
connectors. Easy-to-use configuration controls allow the platform and EVMs
to quickly model many possible end-equipment configurations.
There is nothing to build, nothing to solder, and nothing but the speakers
included with the platform to “hook up.”