TEXAS INSTRUMENTS PTH08T210W Technical data

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PTH08T210W

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SLTS262B–OCTOBER 2005 – REVISED NOVEMBER 2005

30-A, 5.5-V to 14-V INPUT, NON-ISOLATED,

WIDE OUTPUT ADJUST, POWER MODULE w/TurboTrans™

FEATURES

• Up to 30-A Output Current • TurboTrans™ Technology

• 5.5-V to 14-V Input Voltage • Designed to meet Ultra-Fast Transient

• Wide-Output Voltage Adjust (0.7 V to 3.6 V)

• Efficiencies up to 96%

•±1.5% Total Output Voltage Variation

• On/Off Inhibit

• Differential Output Voltage Remote Sense

• Adjustable Undervoltage Lockout

• Output Overcurrent Protection

(Nonlatching, Auto-Reset)

• Operating Temperature: –40°Cto85°C

• Safety Agency Approvals:

– UL 1950, CSA 22.2 950, EN60950 VDE

(Pending)

Requirements up to 300 A/µs

• Auto-Track™ Sequencing

• Multi-Phase, Switch-Mode Topology

APPLICATIONS

• Complex Multi-Voltage Systems

• Microprocessors

• Bus Drivers

DESCRIPTION

The PTH08T210W is a high-performance 30-A rated, non-isolated power module which utilizes a multi-phase, switch-mode topology. This module represents the 2nd generation of the PTH series power modules which include a reduced footprint and improved features.

Operating from an input voltage range of 5.5 V to 14 V, the PTH08T210W requires a single resistor to set the output voltage to any value over the range, 0.7 V to 3.6 V. The wide input voltage range makes the PTH08T210W particularly suitable for advanced computing and server applications that uses a loosely regulated 8-V to 12-V intermediate distribution bus. The module uses double-sided surface mount construction to provide a low profile and compact footprint. Package options include both through-hole and surface mount configurations that are lead (Pb) – free and RoHS compatible.

A new feature included in this 2nd generation of PTH and PTV modules is TurboTrans™ technology (patent pending). TurboTrans allows the transient response of the regulator to be optimized externally, resulting in a reduction of output voltage deviation following a load transient and a reduction in required output capacitance. This feature also offers enhanced stability when used with ultra-low ESR output capacitors.

The PTH08T210W incorporates a comprehensive list of standard features. They include on/off inhibit, a differential remote output voltage sense which ensures tight load regulation, and an output overcurrent and overtemperature shutdown to protect against load faults. A programmable undervoltage lockout allows the turn-on voltage threshold to be customized. AutoTrack™ sequencing is a feature which simplifies the simultaneous power-up and power-down of multiple modules in a power system by allowing the outputs to track a common voltage.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

TurboTrans, AutoTrack, TMS320 are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

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PTH08T210W

SLTS262B–OCTOBER 2005 – REVISED NOVEMBER 2005

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

Track

TurboTranst

R 1%

0.05 W

Inhibit

GND

A. R

2,6

Track

PTH08T210W

INH/UVLO

UVLO

0.05 W (Opional)

is required to set the output voltage higher than 0.7 V. See the Electrical Characteristics table.

SET

470 µF (Required)

GND

7,83,4

VOAdj

+Sense

−Sense

SET

0.05 W (Required)

5, 9

(Optional)

470 µF (Required)

+Sense

−Sense

GND

UDG−05097

L O A D

ORDERING INFORMATION

For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see the TI website at www.ti.com.

ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS

(Voltages are with respect to GND)

UNIT UNIT

Signal input voltage Track control (pin 14) –0.3 to VI+0.3 V

(1) During reflow of surface mount package version do not elevate peak temperature of the module, pins or internal components above the

Operating temperature range Over VIrange –40 to 85

Wave soldering temperature PTH08T210WAD 260

wave

Solder reflow temperature

reflow

Storage temperature –40 to 125

stg

Surface temperature of module body or pins (20 seconds)

PTH08T210WAS 235

PTH08T210WAZ 260

(1)

Mechanical shock Per Mil-STD-883D, Method 2002.3 1 msec, ½ sine, mounted 250

Mechanical vibration Mil-STD-883D, Method 2007.2 20-2000 Hz 15

Weight 8.5 grams

Flammability Meets UL94V-O

stated maximum.

°C

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ELECTRICAL CHARACTERISTICS

TA=25°C, VI=12V,VO= 3.3 V, CI= 470 µF, CO= 470 µF OS-CON, and IO=IOmax (unless otherwise stated)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Output current A

Input voltage range Over IOrange 5.5 14 V

Output adjust range Over I

range 0.7 3.6 V

Set-point voltage tolerance ±1

Temperature variation –40°C<TA<85°C ±0.3 %V

Line regulation Over VIrange ±4mV

Load regulation Over I

range ±7mV

Total output variation Includes set-point, line, load, –40°C ≤ T

=5.5Vto14V

η Efficiency R

Ripple (peak-to-peak) 20-MHz bandwidth 25 mV

LIM

∆V

trTT

∆V

UVLO

Overcurrent threshold Reset, followed by auto-recovery 55 A

Transient response

trTT

Track input current (pin 14) Pin to GND –130

/dt Track slew rate capability CO≤ CO(max) 1V/ms

track

Adjustable Undervoltage

ADJ

lockout (pin 1)

Inhibit control (pin 1) Input low voltage (V

Input standby current Inhibit (pin 1) to GND, Track (pin 14) open 3 mA

Switching frequency Over VIand IOranges 480 kHz

External input capacitance 470

=26A

w/o TurboTrans Recovery time 50 µs

=470 µF

1 A/µs load step 50 to 100% IOmax

w/o TurboTrans Recovery time 50 µs C

=940 µF, Type C

w/ TurboTrans Recovery time 50 µs

=940 µF, Type C

Pin 1 open V

Input high voltage (V

Input low current (I

)-0.20.6

)125µA

(1) The set-point voltage tolerance is affected by the tolerance and stability of R

tolerance of 1% with 100 ppm/°C or better temperature stability.

(2) A low-leakage (<100 nA), open-drain device, such as MOSFET or voltage supervisor IC, is recommended to control pin 14. The

open-circuit voltage is less than 8 Vdc.

(3) This control pin has an internal pullup to the input voltage VI. If it is left open-circuit, the module operates when input power is applied. A

small, low-leakage (<100 nA) MOSFET is recommended for control. For additional information, see the related application note.

(4) A 470 µF electrolytic input capacitor is required for proper operation. The capacitor must be rated for a minimum of 500 mA rms of ripple

current.

25°C, natural convection 0 25

60°C, 200 LFM 0 30

≤ 85°C ±1.5

=1.62kΩ,VO= 3.3 V 93%

SET

=5.23kΩ,VO= 2.5 V 91%

SET

= 12.7 kΩ,VO= 1.8 V 89%

SET

= 19.6 kΩ,VO= 1.5 V 89%

SET

= 35.7 kΩ,VO= 1.2 V 87%

SET

= 63.4 kΩ,VO= 1.0 V 84%

SET

Open, V

= 0.7 V 80%

VOover/undershoot 150 mV

VOover/undershoot 125 mV

VOover/undershoot 85 mV

increasing 5 5.5

decreasing 4.1

– 0.5 Open

(4)

. The stated limit is unconditionally met if R

SET

(1)

(2)

(3)

SET

has a

µA

µF

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PTH08T210W

SLTS262B–OCTOBER 2005 – REVISED NOVEMBER 2005

ELECTRICAL CHARACTERISTICS (continued)

TA=25°C, VI=12V,VO= 3.3 V, CI= 470 µF, CO= 470 µF OS-CON, and IO=IOmax (unless otherwise stated)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Capacitance (6)

w/out TurboTrans

MTBF Reliability Per Bellcore TR-332, 50% stress, TA=40°C, ground benign 3.6

External output Equivalent series resistance (nonceramic) 3 capacitance

w/ TurboTrans

Value

Capacitance Value µF

Capacitance × ESR product (C

Nonceramic 470

Ceramic 5000

× ESR) µF × mΩ

(5)

(7)

See TT 12,000

(8) (9)

chart

(5) A minimum value of external output capacitor is required for proper operation. Adding additional capacitance at the load further improves

transient response. See the Capacitor Application Information section for more guidance.

(6) This is the calculated maximum. This value includes both ceramic and non-ceramic capacitors. The minimum ESR requirement often

results in a lower value. See the related Application Information for more guidance.

(7) This is the minimum ESR for all the electrolytic (nonceramic) capacitance. Use 5 mΩ as the minimum when using manufacturer's

max-ESR values to calculate.

(8) Minimum capacitance will be determined by your transient deviation requirement. A corresponding resistor, RTTis required for proper

operation. See the TurboTrans Selection section for guidance in selecting the capacitance and RTTvalue. (9) This is the calculated maximum. This value includes both ceramic and non-ceramic capacitors. (10) When calculating the Capacitance × ESR product use the capacitance and ESR values of a single capacitor. For an output capacitor

bank of several capacitor types and values, calculate the C × ESR product using the values of the capacitor that makes up the majority

of the capacitance.

12,000

10,000

(10)

µF

mΩ

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PTH08T210W

(TOP VIEW)

432

5 6 7 8 9 10

TERMINAL FUNCTIONS

TERMINAL

NAME NO.

GND

(1)

Inhibit

UVLO adjust

VoAdjust 12 range for the output voltage is from 0.7 V to 3.6 V. If left open circuit, the output voltage will default to its lowest

+ Sense 10

– Sense 11

Track 14

TurboTrans™ 13

(1) Denotes negative logic: Open = Normal operation, Ground = Function active

DESCRIPTION

2, 6 The positive input voltage power node to the module, which is referenced to common GND.

5, 9 The regulated positive power output with respect to the GND.

3, 4 This is the common ground connection for the VIand VOpower connections. It is also the 0 Vdcreference for the 7, 8 control inputs.

The Inhibit pin is an open-collector/drain, negative logic input that is referenced to GND. Applying a low level ground signal to this input disables the module’s output and turns off the output voltage. When the Inhibit control is active, the input current drawn by the regulator is significantly reduced. If the Inhibit pin is left open-circuit, the module produces an output whenever a valid input source is applied. This input is not compatible with TTL logic

devices and should not be tied to VIor any other voltage.

This pin is also used for input undervoltage lockout (UVLO) programming. Connecting a resistor from this pin to GND (pin 3) allows the ON threshold of the UVLO to be adjusted higher than the default value. For more information, see the Application Information section.

A 0.1 W 1% resistor must be directly connected between this pin and pin 8 (GND) to set the output voltage to a value higher than 0.7 V. The temperature stability of the resistor should be 100 ppm/°C (or better). The setpoint

value. For further information, on output voltage adjustment see the related application note. The specification table gives the preferred resistor values for a number of standard output voltages.

The sense input allows the regulation circuit to compensate for voltage drop between the module and the load. For optimal voltage accuracy, +Sense must be connected to VO, very close to the load.

The sense input allows the regulation circuit to compensate for voltage drop between the module and the load. For optimal voltage accuracy, –Sense must be connected to GND (pin 8), very close to the load.

This is an analog control input that enables the output voltage to follow an external voltage. This pin becomes active typically 20 ms after the input voltage has been applied, and allows direct control of the output voltage from 0 V up to the nominal set-point voltage. Within this range the module's output voltage follows the voltage at the Track pin on a volt-for-volt basis. When the control voltage is raised above this range, the module regulates at its set-point voltage. The feature allows the output voltage to rise simultaneously with other modules powered from the same input bus. If unused, this input should be connected to VI.

NOTE: Due to the undervoltage lockout feature, the output of the module cannot follow its own input voltage during power up. For more information, see the related application note.

This input pin adjusts the transient response of the regulator. To activate the TurboTrans™ feature, a 1%, 50 mW resistor must be connected between this pin and pin 10 (+Sense) very close to the module. For a given value of output capacitance, a reduction in peak output voltage deviation is achieved by using this feature. If unused, this pin must be left open-circuit. External capacitance must never be connected to this pin. The resistance requirement can be selected from the TurboTrans™ resistor table in the Application Information section.

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0 5 10 15 20 25 30

VO = 1.5 V

VO = 1.2 V

VO = 0.7 V

− Output Current − A

VO = 2.5 V

VO = 1.8 V

VO = 3.3 V

− Power Dissipation − W

0 5 10 15 20 25 30

− Ambient Temperature − C

IO− Output Current − A

VO= 1.2 V

400 LFM

200 LFM

100 LFM

Nat Conv

PTH08T210W

SLTS262B–OCTOBER 2005 – REVISED NOVEMBER 2005

TYPICAL CHARACTERISTICS

CHARACTERISTIC DATA ( VI=12V)

EFFICIENCY OUTPUT RIPPLE POWER DISSIPATION

vs vs vs

LOAD CURRENT LOAD CURRENT LOAD CURRENT

100

Efficiency − %

0 5 10 15 20 25 30

VO = 1.5 V

VO = 0.7 V

IO − Output Current − A

Figure 1. Figure 2. Figure 3.

VO = 1.8 V

VO = 2.5 V

VO = 3.3 V

VO = 1.2 V

− Output Voltage Ripple − V

VO = 3.3 V

VO = 1.5 V

VO = 1.2 V

0 5 10 15 20 25 30

IO − Output Current − A

VO = 2.5 V

VO = 1.8 V

VO = 0.7 V

(1)(2)

AMBIENT CURRENT AMBIENT TEMPERATURE

vs vs

OUTPUT CURRENT OUTPUT CURRENT

− Ambient Temperature − C A

Nat Conv

0 5 10 15 20 25 30

100 LFM

200 LFM

400 LFM

VO= 3.3 V

IO− Output Current − A

Figure 4. Figure 5.

(1) The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the

converter. Applies to Figure 1, Figure 2, and Figure 3.

(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum

operating temperatures. Derating limits apply to modules soldered directly to a 100 mm × 100 mm double-sided PCB with 2 oz. copper. Applies to Figure 5 and Figure 4.

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0 5 10 15 20 25 30

VO = 1.5 V

VO = 1.2 V

VO = 0.7 V

IO − Output Current − A

VO = 2.5 V

VO = 1.8 V

VO = 3.3 V

− Power Dissipation − W

0 5 10 15 20 25 30

400 LFM

200 LFM

Nat Conv

− Ambient Temperature − C

IO− Output Current − A

VO= 1.2 V

100 LFM

PTH08T210W

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TYPICAL CHARACTERISTICS

CHARACTERISTIC DATA ( VI=8V)

EFFICIENCY OUTPUT RIPPLE POWER DISSIPATION

vs vs vs

LOAD CURRENT LOAD CURRENT LOAD CURRENT

100

Efficiency − %

VO = 1.2 V

VO = 1.5 V

VO = 0.7 V

0 5 10 15 20 25 30

− Output Current − A

Figure 6. Figure 7. Figure 8.

VO = 3.3 V

VO = 2.5 V

VO = 1.8 V

AMBIENT TEMPERATURE AMBIENT TEMPERATURE

vs vs

OUTPUT CURRENT OUTPUT CURRENT

VO = 1.5 V

− Output Voltage Ripple − V O

0 5 10 15 20 25 30

VO = 1.8 V

VO = 0.7 V

IO − Output Current − A

VO = 3.3 V

VO = 2.5 V

VO = 1.2 V

SLTS262B–OCTOBER 2005 – REVISED NOVEMBER 2005

(1)(2)

(1) The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the

converter. Applies to Figure 6, Figure 7, and Figure 8.

(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum

operating temperatures. Derating limits apply to modules soldered directly to a 100 mm × 100 mm double-sided PCB with 2 oz. copper. Applies to Figure 9 and Figure 10.

− Ambient Temperature − C A

0 5 10 15 20 25 30

Nat Conv

100 LFM

200 LFM

400 LFM

VO= 3.3 V

IO− Output Current − A

Figure 9. Figure 10.

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APPLICATION INFORMATION

CAPACITOR RECOMMENDATIONS FOR THE PTH08T210W POWER MODULE

Input Capacitor (Required)

The size and value of the input capacitor is determined by the converter’s transient performance capability. The minimum amount of required input capacitance is 470 µF, with an RMS ripple current rating of 500 mA. This minimum value assumes that the converter is supplied with a responsive, low inductance input source. This source should have ample capacitive decoupling, and be distributed to the converter via PCB power and ground planes.

For high-performance/transient applications, or wherever the input source performance is degraded, 1000 µF of input capacitance is recommended. The additional input capacitance above the minimum level insures an optimized performance.

Ripple current (rms) rating, less than 100 mΩ of equivalent series resistance (ESR), and temperature are the main considerations when selecting input capacitors. The ripple current reflected from the input of the PTH08T210W module is moderate to low. Therefore any good quality, computer-grade electrolytic capacitor will have an adequate ripple current rating.

Regular tantalum capacitors are not recommended for the input bus. These capacitors require a recommended minimum voltage rating of 2 × (maximum dc voltage + ac ripple). This is standard practice to ensure reliability. No tantalum capacitors were found with a sufficient voltage rating to meet this requirement. When the operating temperature is below 0°C, the ESR of aluminum electrolytic capacitors increases. For these applications, Os-Con, poly-aluminum, and polymer-tantalum types should be considered. Adding one or two ceramic capacitors to the input attenuates high-frequency reflected ripple current.

TurboTrans Output Capacitor

The PTH08T210W requires a minimum output capacitance of 470 µF. The required capacitance above 470µF will be determined by actual transient deviation requirements.

TurboTrans allows the designer to optimize the capacitance load according to the system transient design requirement. High quality, ultra-low ESR capacitors are required to maximize TurboTrans effectiveness. Capacitors with a capacitance (µF) × ESR (mΩ) product of ≤ 10,000 mΩ×µF are required.

Working Example:

A bank of 6 identical capacitors, each with a capacitance of 680 µF and 5 mΩ ESR, has a C × ESR product of 3400 µFxmΩ (680 µF × 5 mΩ).

Using TurboTrans in conjunction with the high quality capacitors (capacitance (µF) × ESR (mΩ)) reduces the overall capacitance requirement while meeting the minimum transient amplitude level.

Table 1 includes a preferred list of capacitors by type and vendor. See the Output Bus / TurboTrans column.

Note: See the TurboTrans Technology Application Notes within this document for selection of specific capacitance.

Non-TurboTrans Output Capacitor

The PTH08T210W requires a minimum output capacitance of 470 µF. Non-TurboTrans applications must observe minimum output capacitance ESR limits.

A combination of 200 µF of ceramic capacitors plus low ESR (15 mΩ to 30 mΩ) Os-Con electrolytic/tantalum type capacitors can be used. When using Polymer tantalum types, tantalum type, or Oscon types only, the capacitor ESR bank limit is 3 mΩ to 5 mΩ. (Note: no ceramic capacitors are required). This is necessary for the stable operation of the regulator. Additional capacitance can be added to improve the module's performance to load transients. High quality computer-grade electrolytic capacitors are recommended. Aluminum electrolytic capacitors provide adequate decoupling over the frequency range, 2 kHz to 150 kHz, and are suitable when ambient temperatures are above -20°C. For operation below -20°C, tantalum, ceramic, or Os-Con type capacitors are necessary.

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APPLICATION INFORMATION (continued)

When using a combination of one or more non-ceramic capacitors, the calculated equivalent ESR should be no lower than 2 mΩ (4 mΩ when calculating using the manufacturer’s maximum ESR values). A list of preferred low-ESR type capacitors, are identified in Table 1.

Ceramic Capacitors

Above 150 kHz the performance of aluminum electrolytic capacitors is less effective. Multilayer ceramic capacitors have very low ESR and a resonant frequency higher than the bandwidth of the regulator. They can be used to reduce the reflected ripple current at the input as well as improve the transient response of the output.

When used on the output their combined ESR is not critical as long as the total value of ceramic capacitors, with values between 10 µF and 100 µF, does not exceed 5000 µF (non-TurboTrans). In TurboTrans applications, when ceramic capacitors are used on the output bus, total capacitance including bulk and ceramic types is not to exceed 12,000 µF.

Tantalum, Polymer-Tantalum Capacitors

Tantalum type capacitors are only used on the output bus, and are recommended for applications where the ambient operating temperature is less than 0°C. The AVX TPS series and Kemet capacitor series are suggested over many other tantalum types due to their higher rated surge, power dissipation, and ripple current capability. As a caution, many general-purpose tantalum capacitors have higher ESR, reduced power dissipation, and lower ripple current capability. These capacitors are also less reliable due to their reduced power dissipation and surge current ratings. Tantalum capacitors that have no stated ESR or surge current rating are not recommended for power applications.

Capacitor Table

Table 1 identifies the characteristics of capacitors from a number of vendors with acceptable ESR and ripple

current (rms) ratings. The recommended number of capacitors required at both the input and output buses is identified for each capacitor type.

This is not an extensive capacitor list. Capacitors from other vendors are available with comparable specifications. Those listed are for guidance. The RMS ripple current rating and ESR (at 100 kHz) are critical parameters necessary to ensure both optimum regulator performance and long capacitor life.

Designing for Fast Load Transients

The transient response of the dc/dc converter has been characterized using a load transient with a di/dt of

2.5 A/µs. The typical voltage deviation for this load transient is given in the Electrical Characteristics table using the minimum required value of output capacitance. As the di/dt of a transient is increased, the response of a converter’s regulation circuit ultimately depends on its output capacitor decoupling network. This is an inherent limitation with any dc/dc converter once the speed of the transient exceeds its bandwidth capability.

If the target application specifies a higher di/dt or lower voltage deviation, the requirement can only be met with additional low ESR ceramic capacitor decoupling. Generally, with 50% load steps at > 100 A/µs, adding multiple 10 µF ceramic capacitors, 3225 case size, plus 10 × 1 µF, including numerous high frequency ceramics (≤ 0.1 µF) are all that is required to soften the transient higher frequency edges. Special attention is essential with regards to location, types, and position of higher frequency ceramic and lower ESR bulk capacitors. DSP, FPGA and ASIC vendors identify types, location and capacitance required for optimum performance of the high frequency devices. The details regarding the PCB layout and capacitor/component placement are important at these high frequencies. Low impedance buses and unbroken PCB copper planes with components located as close to the high frequency processor are essential for optimizing transient performance. In many instances additional capacitors may be required to insure and minimize transient aberrations.

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APPLICATION INFORMATION (continued)

Table 1. Input/Output Capacitors

Capacitor Characteristics Quantity

Capacitor Vendor,

Type Series (Style)

Working Value ESR Physical Input

Voltage (µF) at 100 Size (mm) Bus

Max.

kHz

Panasonic 25 V 1000 0.043Ω >1690 mA 16 × 15 1 ≥ 2

FC (Radial) 25 V 1800 0.029Ω 2205 mA 16 × 20 1 ≥ 1

FC(SMD) 25 V 2200 0.028Ω >2490 mA 18 × 21,5 1 ≥ 1

FK(SMD) 25 V 1000 0.060Ω 1100 mA 12,5×13,5 1 ≥ 2

United Chemi-Con

PTB(SMD) Polymer 6.3 V 470 0.025Ω 2600 mA 7,3x 4,3x N/R Tantalum 2.8

LXZ, Aluminum (Radial) 25 V 680 0.068Ω 1050 mA 10 × 16 1 ≥ 1~≤ 3

PS, 16 V 330 0.014Ω 5060 mA 10 × 12,5 2 ≥ 2~≤ 3B≥ 2 Poly-Aluminum(Radial)

PXA, Poly-Aluminum 16 V 330 0.014Ω 5050 mA 10 × 12,2 2 ≥ 2~≤ 3B≥ 2 (SMD)

PS, 6.3 V 680 0.010Ω 5500 mA 10 × 12,5 N/R Poly-Aluminum(Radial)

PXA, 6.3 V 470 0.012Ω 4770 mA 8 × 12,2 N/R Poly-Aluminum(Radial)

Nichicon, Aluminum 25 V 470 0.070Ω 985 mA 12,5 × 15 1 ≥ 2

HD (Radial) 25 V 470 0.038Ω 1430 mA 10 × 16 1 ≥ 2

PM (Radial) 35 V 560 0.048Ω 1360 mA 16 × 15 1 ≥ 2

Panasonic, 7,3 L×4,3 Poly-Aluminum: 2.0 V 390 0.005Ω 4000 mA W ×4,2H N/R

(1) Capacitor Supplier Verification

Please verify availability of capacitors identified in this table. Capacitor suppliers may recommend alternative part numbers because of limited availability or obsolete products. In some instances, the capacitor product life cycle may be in decline and have short-term consideration for obsolescence.

RoHS, Lead-free and Material Details

See the capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process requirements. Component designators or part number deviations can occur when material composition or soldering requirements are updated.

(2) Required capacitors with TurboTrans. See the TransTrans Application information for Capacitor Selection

Capacitor Type Groups by ESR (Equivalent Series Resistance) :

• Type A = (100 < capacitance × ESR ≤ 1000)

• Type B = (1,000 < capacitance × ESR ≤ 5,000)

• Type C = (5,001 < capacitance × ESR ≤ 10,000)

(3) Total bulk nonceramic capacitors on the output bus with ESR of ≥ 15mΩ to ≤ 30mΩ requires an additional ≥ 200 µF of ceramic

capacitor.

(4) Aluminum Electrolytic capacitor not recommended for the TurboTrans due to higher ESR × capacitance products. Aluminum and higher

ESR capacitors can be used in conjunction with lower ESR capacitance. (5) Output bulk capacitor's maximum ESR is ≥ 30 mΩ. Additional ceramic capacitance of ≥ 200 µF is required. (6) N/R – Not recommended. The voltage rating does not meet the minimum operating limits. (7) The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 80% of the working voltage.

Max Output Bus

Ripple

Current at Vendor Part No.

85°C

(Irms)

(6)

(1)

TurboTrans

≥ 2~≤ 4

TurboTrans

(3)

(5)

(3)

≥ 1~≤ 2C≥ 1

(3)

(6)

N/R

(Cap

Type)

N/R

C ≥ 2

N/R

B ≥ 2

(2)

(4)

EEUFC1E102S

(4)

EEUFC1E182

(4)

EEVFC1E222N

(4)

EEVFK1V102Q

(2)

6PTB477MD8TER

(4)

LXZ25VB681M10X20LL

(2)

16PS330MJ12

(2)

PXA16VC331MJ12TP

(2)

6PS680MJ12

(2)

PXA6.3VC471MH12TP

(4)

UPM1E471MHH6

(4)

UHD1E471MHR

(4)

UPM1V561MHH6

(2)

EEFSE0J391R(VO≤1.6V)

(7)

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APPLICATION INFORMATION (continued)

Table 1. Input/Output Capacitors (continued)

Capacitor Characteristics Quantity

Capacitor Vendor,

Type Series (Style)

Working Value ESR Physical Input

Voltage (µF) at 100 Size (mm) Bus

Max.

kHz

Sanyo

TPE, Poscap (SMD) 6.3 V 470 0.018Ω 3500 mA 7,3 × 4,3 N/R

TPE Poscap(SMD) 2.5 V 470 0.007Ω 4400 mA 7,3 × 4,3 N/R

TPD Poscap (SMD) 2.5 V 1000 0.005Ω 6100 mA 7,3 × 4,3 N/R

SA, Os-Con (Radial) 16 V 470 0.020Ω >6080 mA 16 × 23 1 ≥ 1~≤ 4N/R

SP Oscon ( Radial) 10 V 470 0.015 >4500 mA 10 × 11,5 N/R

SEPC, Os-Con (Radial) 16 V 470 0.010Ω >4700 mA 10 × 13 1 ≥ 1~≤ 2B≥ 1

SVPA, Os-Con (SMD) 6.3 V 470 0.020Ω 4700mA 10 × 10,3 N/R

AVX, Tantalum, Series III 6.3 V 680 0.035Ω >2400 mA 7,3 L N/R TPM Multianode 6.3 V 470 0.018Ω >3800 mA × 4,3 W N/R

TPS Series III (SMD) 4 V 1000 0.035Ω 2405 7,3 L ×5,7 N/R

Kemet, Poly-Tantalum 6.3 V 470 0.018Ω 2700 mA 4,3 W N/R

T520 (SMD) 6.3 V 470 0.010Ω >5200 mA × 7,3 L N/R

T530 (SMD) 6.3 V 470 0.005Ω 7300 mA × 4H N/R

T530 (SMD) 2.5 V 1000 0.005Ω 7300 mA 4,3 w × N/R

Vishay-Sprague

594D, Tantalum (SMD) 6.3 V 1000 0.030Ω 2890 mA 7,2L ×5,7 N/R

94SA, Os-con (Radial) 16 V 1000 0.015Ω 9740 mA 16 × 25 1 ≥ 1~≤ 3N/R

94SVP Os-Con(SMD) 16 V 330 0.017Ω >4500 mA 10 × 12,7 2 ≥ 2~≤ 3C≥ 1

Kemet, Ceramic X5R 16 V 10 0.002Ω – 3225 1 ≥ 1 (SMD)

6.3 V 47 0.002Ω N/R

Murata, Ceramic X5R 6.3 V 100 0.002Ω – 3225 N/R (SMD)

6.3 V 47 N/R

25 V 22 1 ≥ 1

16 V 10 1 ≥ 1

TDK, Ceramic X5R (SMD) 6.3 V 100 0.002Ω – 3225 N/R

6.3 V 47 N/R

16 V 10 1 ≥ 1

16 V 22 1 ≥ 1

(8) N/R – Not recommended. The voltage rating does not meet the minimum operating limits. (9) Required capacitors with TurboTrans. See the TransTrans Application information for Capacitor Selection

Capacitor Type Groups by ESR (Equivalent Series Resistance) :

• Type A = (100 < capacitance × ESR ≤ 1000)

• Type B = (1,000 < capacitance × ESR ≤ 5,000)

• Type C = (5,001 < capacitance × ESR ≤ 10,000)

(10) The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 80% of the working voltage. (11) Aluminum Electrolytic capacitor not recommended for the TurboTrans due to higher ESR × capacitance products. Aluminum and higher

ESR capacitors can be used in conjunction with lower ESR capacitance. (12) Total bulk nonceramic capacitors on the output bus with ESR of ≥ 15mΩ to ≤ 30mΩ requires an additional ≥ 200 µF of ceramic

capacitor. (13) Maximum ceramic capacitance on the output bus is ≤ 3000 µF. Any combination of the ceramic capacitor values is limited to 3000 µF

for non-TurboTrans applications. The total capacitance is limited to 14,000 µF which includes all ceramic and non-ceramic types.

Max Output Bus

Ripple

Current at Vendor Part No.

85°C

(Irms)

(8)

TurboTrans

≥ 1~≤ 3C≥ 1

≥ 1 ≤ 2B≥ 2

≤ 1B≥ 1

≥ 1~≤ 3C≥ 2

≥ 1~≤ 4

≥ 2~≤ 7 ≥ 2~≤ 3

(12)

TurboTrans

(Cap

(2)

Type)

(9)

(11)

(9)

(9)(12)

C ≥ 1

(11)

N/R

(9)(12)

C ≥ 2

6TPE470MI

2R5TPE470M7(VO≤ 1.8 V)

2R5TPD1000M5(VO≤ 1.8 V)

16SA470M

10SP470M

16SEPC470M

6SVPA470M

TPSE477M010R0045 TPME687M006#0018

× 4,1 H

W(V

(8)

7,3 L (V

(8)

(12)

≥ 2~≤ 7

(12)

≥ 1~≤ 3

≥ 1~≤2B≥ 1

≤ 1B≥ 1

≥ 1~≤ 6N/R

N/R

C ≥ 2

(11)

(9)

(11)

TPSV108K004R0035

≤ 2.2 V)

(10)

T520X477M06ASE018

T530X477M006ASE010

T530X477M006ASE005

T530X108M2R5ASE005

≤ 2.0 V)

(10)

594D108X06R3R2TR2T

W ×4,1H

(11)

94SA108X0016HBP

(9)

94SVP827X06R3F12

(13)

(8)

≥ 1

(13)

(9)

C1210C106M4PAC

(9)

C1210C476K9PAC

(9)

GRM32ER60J107M

(9)

GRM32ER60J476M

(9)

GRM32ER61E226K

(9)

GRM32DR61C106K

(9)

C3225X5R0J107MT

(9)

C3225X5R0J476MT

(9)

C3225X5R1C106MT0

(9)

C3225X5R1C226MT

(10)

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PTH08T210W

SLTS262B–OCTOBER 2005 – REVISED NOVEMBER 2005

TurboTrans™ Technology

TurboTrans technology is a feature introduced in the T2 generation of the PTH/PTV family of power modules. TurboTrans optimizes the transient response of the regulator with added external capacitance using a single external resistor. The, benefits of this technology include: reduced output capacitance, minimized output voltage deviation following a load transient, and enhanced stability when using ultra-low ESR output capacitors. The amount of output capacitance required to meet a target output voltage deviation, is reduced with TurboTrans activated. Likewise, for a given amount of output capacitance, with TurboTrans engaged, the amplitude of the voltage deviation following a load transient will be reduced. Applications requiring tight transient voltage tolerances and minimized capacitor footprint area benefit from this technology.

TurboTrans™ Selection

Utilizing TurboTrans requires connecting a resistor, RTT, between the +Sense pin (pin 10) and the TurboTrans pin (pin 13). The value of the resistor directly corresponds to the amount of output capacitance required. All T2 products require a minimum value of output capacitance whether or not TurboTrans is used. For the PTH08T210W, the minimum required capacitance is 470 µF. When using TurboTrans, capacitors with a capacitance × ESR product below 10,000 µF × mΩ are required. (Multiply the capacitance (in µF) by the ESR (in mΩ) to determine the capacitance × ESR product.) See the Capacitor Selection section of the datasheet for a variety of capacitors that meet this criteria.

Figure 11 through Figure 16, show the amount of output capacitance required to meet a desired transient voltage

deviation with and without TurboTrans for several capacitor types; Type A (e.g. ceramic), Type B (e.g. polymer-tantalum), and Type C (e.g. OS-CON). To calculate the proper value of RTT, first determine the required transient voltage deviation limits and magnitude of the transient load step. Next, determine what type of output capacitors to be used. (If more than one type of output capacitor is used, select the capacitor type that makes up the majority of the total output capacitance.) Knowing this information, use the chart in Figure 11 through Figure 16 that corresponds to the capacitor type selected. To use the chart, begin by dividing the maximum voltage deviation limit (in mV) by the magnitude of the load step (in Amps). This gives a mV/A value. Find this value on the Y-axis of the appropriate chart. Read across the graph to the 'With TurboTrans' plot. From this point, read down to the X-axis which lists the minimum required capacitance, CO, to meet the transient voltage deviation. The required RTTresistor value can then be calculated using Equation 1 or selected from the TurboTrans table. The TurboTrans tables include both the required output capacitance and the corresponding RTTvalues to meet several values of transient voltage deviation for 25% (7.5 A), 50% (15 A), and 75% (22.5 A) output load steps.

The chart can also be used to determine the achievable transient voltage deviation for a given amount of output capacitance. Selecting the amount of output capacitance along the X-axis, reading up to the 'With TurboTrans' curve, and then over to the Y-axis, gives the transient voltage deviation limit for that value of output capacitance. The required RTTresistor value can be calculated using Equation 1 or selected from the TurboTrans table.

As an example, let's look at a 12-V application requiring a 75 mV deviation during a 15 A, 50% load transient. A majority of 330 µF, 10 mΩ output capacitors will be used. Use the 12 V, Type B capacitor chart, Figure 13. Dividing 75 mV by 15 A gives 5 mV/A transient voltage deviation per amp of transient load step. Select 5 mV/A on the Y-axis and read across to the 'With TurboTrans' plot. Following this point down to the X-axis gives us a minimum required output capacitance of approximately 1300 µF. The required RTTresistor value for 1300 µFcan then be calculated or selected from Figure 13. The required RTTresistor is approximately 10.2 kΩ.

To see the benefit of TurboTrans, follow the 5 mV/A marking across to the 'Without TurboTrans' plot. Following that point down shows that a minimum of 8200 µF of output capacitance is required to meet the same transient deviation limit. This is the benefit of TurboTrans. A typical TurboTrans application schematic is shown in

Figure 17.

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SLTS262B–OCTOBER 2005 – REVISED NOVEMBER 2005

Type A Capacitor Type A Capacitor

12 V Input 8 V Input

Transient - mV/A

Without Turbo Trans

9 8 7

6 5

With Turbo Trans

V = 12 V

400

500

600

700

800

900

1000

C - Capacitance - Fm

2000

3000

4000

5000

6000

7000

8000

9000

10000

Transient - mV/A

Without Turbo Trans

9 8 7

6 5

400

With Turbo Trans

V =8V

500

600

700

800

900

1000

C - Capacitance - Fm

2000

3000

Figure 11. Cap Type A, 100 ≤ C(µF)xESR(mΩ) ≤ 1000 Figure 12. Cap Type A, 100 ≤ C(µF)xESR(mΩ) ≤ 1000

(e.g. Ceramic) (e.g. Ceramic)

4000

5000

6000

7000

8000

9000

10000

Table 2. Type A TurboTrans COValues & Required RTTSelection Table

Transient Voltage Deviation (mV) 12 V Input 8 V Input

25% 50% 75% C

Load Step Load Step Load Step Minimum Required Required Minimum Required Required

(7.5 A) (15 A) (22.5 A) Output TurboTrans Output TurboTrans

Capacitance Resistor (Ω) Capacitance Resistor (Ω)

(µF) (µF)

130 260 390 470 open 580 127 k

120 240 360 520 294 k 640 80.6 k

110 220 330 580 127 k 710 54.9 k

100 200 300 650 76.8 k 800 37.4 k

90 180 270 740 47.5 k 900 26.7 k

80 160 240 850 31.6 k 1050 17.8 k

70 140 210 1000 20.5 k 1250 11.3 k

60 120 180 1200 12.7 k 1500 6.65 k

50 100 150 1500 6.65 k 1900 2.55 k

40 80 120 2000 1.82 k 2600 0

30 60 90 4000 0 7800 0

RTTResistor Selection

The TurboTrans resistor value, RTTcan be determined from the TurboTrans programming equation, see

Equation 1.

R=40

5 x (C / 2350) - 1

(1)

1 - (C / 2350)

Where COis the total output capacitance in µF. COvalues greater than or equal to 2350 µF require RTTto be a short, 0Ω.(Equation 1 will result in a negative value for RTTwhen CO ≥ 2350 µF.)

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PTH08T210W

SLTS262B–OCTOBER 2005 – REVISED NOVEMBER 2005

Type B Capacitor Type B Capacitor

12 V Input 8 V Input

Without Turbo Trans

900

1000

2000

C - Capacitance - Fm

3000

4000

5000

6000

Transient - mV/A

9 8

V = 12 V

400

With Turbo Trans

500

600

700

800

Without Turbo Trans

900

1000

2000

C - Capacitance - Fm

3000

4000

5000

6000

7000

8000

9000

10000

Transient - mV/A

9 8

400

With Turbo Trans

V =8V

500

600

700

800

Figure 13. Cap Type B, 1000 ≤ C(µF)xESR(mΩ) ≤ 5000 Figure 14. Cap Type B, 1000 ≤ C(µF)xESR(mΩ) ≤ 5000

(e.g. Polymer-Tantalum) (e.g. Polymer-Tantalum)

Table 3. Type B TurboTrans COValues & Required RTTSelection Table

Transient Voltage Deviation (mV) 12 V Input 8 V Input

25% 50% 75% C

Load Step Load Step Load Step Minimum Required Required Minimum Required Required

(7.5 A) (15 A) (22.5 A) Output Capacitance TurboTrans Output Capacitance TurboTrans

(µF) Resistor (Ω)(µF) Resistor (Ω)

100 200 300 470 open 540 205 k

90 180 270 500 499 k 620 93.1 k

80 160 240 580 127 k 720 52.3 k

70 140 210 680 63.4 k 840 32.4 k

60 120 180 800 37.4 k 1000 20.5 k

50 100 150 1000 20.5 k 1300 10.2 k

40 80 120 1300 10.2 k 1700 4.22 k

30 60 90 1800 3.32 k 2300 221

25 50 75 2200 698 4900 0

20 40 60 5400 0 14000 0

7000

8000

9000

10000

RTTResistor Selection

The TurboTrans resistor value, RTTcan be determined from the TurboTrans programming equation, see

Equation 1.

COvalues greater than or equal to 2350 µF require RTTto be a short, 0Ω.(Equation 1 will result in a negative value for RTTwhen CO≥ 2350 µF.)

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SLTS262B–OCTOBER 2005 – REVISED NOVEMBER 2005

Type C Capacitor Type C Capacitor

12 V Input 8 V Input

Transient - mV/A

9 8

V = 12 V

400

With Turbo Trans

500

600

700

800

Without Turbo Trans

900

1000

2000

C - Capacitance - Fm

3000

4000

5000

6000

7000

8000

9000

10000

Transient - mV/A

9 8

V =8V

400

With Turbo Trans

500

600

700

800

Without Turbo Trans

900

1000

2000

C - Capacitance - Fm

3000

4000

5000

Figure 15. Cap Type C, 5000 ≤ C(µF)xESR(mΩ) ≤ 10,000 Figure 16. Cap Type C, 5000 ≤ C(µF)xESR(mΩ) ≤ 10,000

(e.g. Os-Con) (e.g. Os-Con)

6000

7000

8000

9000

10000

Table 4. Type C TurboTrans COValues & Required RTTSelection Table

Transient Voltage Deviation (mV) 12 V Input 8 V Input

25% 50% 75% C

Load Step Load Step Load Step Minimum Required Required TurboTrans Minimum Required Required TurboTrans

(7.5 A) (15 A) (22.5 A) Output Capacitance Resistor (Ω) Output Capacitance Resistor (Ω)

(µF) (µF)

80 160 240 470 open 520 294 k

70 140 210 560 158 k 620 93.1 k

60 120 180 680 63.4 k 750 45.3 k

50 100 150 850 31.6 k 940 24.3 k

40 80 120 1100 15.8 k 1300 10.2 k

35 70 105 1300 10.2 k 1500 6.65 k

30 60 90 1600 5.36 k 1800 3.32 k

25 50 75 2000 1.82 k 2200 698

20 40 60 4000 0 5400 0

RTTResistor Selection

The TurboTrans resistor value, RTTcan be determined from the TurboTrans programming equation, see

Equation 1.

values greater than or equal to 2350 µF require RTTto be a short, 0Ω.(Equation 1 will result in a negative

value for RTTwhen CO ≥ 2350 µF.)

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PTH08T210W

SLTS262B–OCTOBER 2005 – REVISED NOVEMBER 2005

14 13

TurboTransAutoTrack

PTH08T210W

TurboTrans

+Sense

3.32 kW

+Sense

R 1%

SET

470 mF (Required)

Inhibit/ Prog UVLO

GND GND

34 7 8

−Sense

VOAdj

0.05 W

Figure 17. Typical TurboTrans Application Schematic

OTT

1800 mF (Required)

L O A D

−Sense

GNDGND

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SLTS262B–OCTOBER 2005 – REVISED NOVEMBER 2005

ADJUSTING THE OUTPUT VOLTAGE OF THE PTH08T210W WIDE-OUTPUT ADJUST POWER MODULE

The VOAdjust control (pin 12) sets the output voltage of the PTH08T210W. The adjustment range of the PTH08T210W is 0.7 V to 3.6 V. The adjustment method requires the addition of a single external resistor, R that must be connected directly between the VoAdjust and GND pins. Table 5 gives the preferred value of the external resistor for a number of standard voltages, along with the actual output voltage that this resistance value provides.

For other output voltages, the value of the required resistor can either be calculated using the following formula, or simply selected from the range of values given in Table 6. Figure 18 shows the placement of the required resistor.

+ 30.1 kW

SET

0.7

VO* 0.7

Table 5. Preferred Values of R

VO(Standard) (V) R

* 6.49 kW

for Standard Output Voltages

SET

(Preferred Value) (Ω)V

SET

3.3 1.62 k 3.309

2.5 5.23 k 2.502

29.76k2.010

1.8 12.7 k 1.803

1.5 19.6 k 1.504

1.2 35.7 k 1.202

1 63.4 k 1.005

0.7 Open 0.700

(Actual) (V)

SET

(2)

+Sense

PTH08T210W

−Sense

GND GND

3 4 7 8

(1) Use a 0.1 W resistor. The tolerance should be 1%, with temperature stability of 100 ppm/°C (or better). Place the

resistor as close to the regulator as possible. Connect the resistor directly between pins 4 and 7 using dedicated PCB traces.

(2) Never connect capacitors from VOAdjust to either GND or V

the stability of the regulator.

VOAdj

SET

0.05 W

. Any capacitance added to the VOAdjust pin affects

out

+Sense

−Sense

GND

Figure 18. VOAdjust Resistor Placement

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PTH08T210W

SLTS262B–OCTOBER 2005 – REVISED NOVEMBER 2005

Table 6. Output Voltage Set-Point Resistor Values

VaRequired R

0.70 Open 2.10 8.66

0.75 412 2.20 7.50

0.80 205 2.30 6.65

0.85 133 2.40 5.90

0.90 97.6 2.50 5.23

0.95 78.7 2.60 4.64

1.00 63.4 2.70 4.02

1.10 46.4 2.80 3.57

1.20 35.7 2.90 3.09

1.30 28.7 3.00 2.67

1.40 23.7 3.10 2.26

1.50 19.6 3.20 1.96

1.60 16.9 3.30 1.62

1.70 14.7 3.40 1.30

1.80 12.7 3.50 1.02

1.90 11.0 3.60 .768

2.00 9.76

(kΩ)V

SET

Required R

SET

(kΩ)

ADJUSTING THE UNDERVOLTAGE LOCKOUT (UVLO) OF THE PTH08T210W POWER MODULES

The PTH08T210W power modules incorporate an input undervoltage lockout (UVLO). The UVLO feature prevents the operation of the module until there is sufficient input voltage to produce a valid output voltage. This enables the module to provide a clean, monotonic powerup for the load circuit, and also limits the magnitude of current drawn from the regulator’s input source during the power-up sequence.

The UVLO characteristic is defined by the ON threshold (V

) voltage. Below the ON threshold, the Inhibit

THD

control is overridden, and the module does not produce an output. The hysterisis voltage, which is the difference between the ON and OFF threshold voltages, is nominally set at 900 mV. The hysterisis prevents start-up oscillations, which can occur if the input voltage droops slightly when the module begins drawing current from the input source.

UVLO Adjustment

The UVLO feature of the PTH08T210W module allows for limited adjustment of the ON threshold voltage. The adjustment is made via the Inhbit/UVLO Prog control pin (pin 1). When pin 1 is left open circuit, the ON threshold voltage is internally set to its default value. The ON threshold has a nominal voltage of 5.0 V, and the hysterisis 900 mV. This ensures that the module produces a regulated output when the minimum input voltage is applied (see specifications).

The ON threshold might need to be increased if the module is powered from a tightly regulated 12-V bus. This allows the ON threshold voltage to be set for a specified input voltage. Adjusting the threshold voltage prevents the module from operating if the input bus fails to completely rise to its specified regulation voltage.

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Adjustment Diagram

GND

UVLO

PTH08T210W

Inhibit/ UVLO Prog

Figure 19. UVLO Program Resistor Placement

SLTS262B–OCTOBER 2005 – REVISED NOVEMBER 2005

GND

UVLO Adjust

Equation 3 determines the value of R

may only be adjusted to a higher value.

UVLO

2590 - (24.9 x (V - 1))

24.9 x (V - 1) - 100

required to adjust V

THD

to a new value. The default value is 5 V, and it

THD

(3)

Calculated Values

Table 7 shows a chart of standard resistor values for R

voltage. For most applications, only the on-threshold voltage should need to be adjusted. In this case select only a value for R

from right-hand column.

UVLO

Table 7. Calculated Values of R

THD

6.5 V 66.5 kΩ

7.0 V 49.9 kΩ

7.5 V 39.2 kΩ

8.0 V 32.4 kΩ

8.5 V 27.4 kΩ

9.0 V 24.3 kΩ

9.5 V 21.5 kΩ

10.0 V 19.1 kΩ

10.5 V 17.4 kΩ

for different options of the on-threshold (V

UVLO

for Various Values of V

UVLO

THD

)

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PTH08T210W

SLTS262B–OCTOBER 2005 – REVISED NOVEMBER 2005

FEATURES OF THE PTH/PTV FAMILY OF NONISOLATED WIDE OUTPUT ADJUST POWER MODULES

Soft-Start Power Up

The Auto-Track feature allows the power-up of multiple PTH/PTV modules to be directly controlled from the Track pin. However in a stand-alone configuration, or when the Auto-Track feature is not being used, the Track pin should be directly connected to the input voltage, VI. (see Figure 20)

Track

2, 6

PTH08T210W

GND

3,4 7,8

GND

Figure 20. Power-Up Application Circuit

When the Track pin is connected to the input voltage the Auto-Track function is permanently disengaged. This allows the module to power up entirely under the control of its internal soft-start circuitry. When power up is under soft-start control, the output voltage rises to the set-point at a quicker and more linear rate.

From the moment a valid input voltage is applied, the soft-start control introduces a short time delay (typically 8 ms–15 ms) before allowing the output voltage to rise.

V (5 V/div)

VO(2 V/div)

II(5 A/div)

t − Time − 10 ms/div

Figure 21. Power-Up Waveform

The output then progressively rises to the module’s setpoint voltage. Figure 21 shows the soft-start power-up characteristic of the PTH08T210W operating from a 12-V input bus and configured for a 3.3-V output. The waveforms were measured with a 20-A constant current load and the Auto-Track feature disabled. The initial rise in input current when the input voltage first starts to rise is the charge current drawn by the input capacitors. Power-up is complete within 25 ms.

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Overcurrent Protection

For protection against load faults, all modules incorporate output overcurrent protection. Applying a load that exceeds the regulator's overcurrent threshold causes the regulated output to shut down. Following shutdown, a module periodically attempts to recover by initiating a soft-start power-up. This is described as a hiccup mode of operation, whereby the module continues in a cycle of successive shutdown and power up until the load fault is removed. During this period, the average current flowing into the fault is significantly reduced. Once the fault is removed, the module automatically recovers and returns to normal operation.

Overtemperature Protection (OTP)

A thermal shutdown mechanism protects the module’s internal circuitry against excessively high temperatures. A rise in the internal temperature may be the result of a drop in airflow, or a high ambient temperature. If the internal temperature exceeds the OTP threshold, the module’s Inhibit control is internally pulled low. This turns the output off. The output voltage drops as the external output capacitors are discharged by the load circuit. The recovery is automatic, and begins with a soft-start power up. It occurs when the sensed temperature decreases by about 10°C below the trip point.

The overtemperature protection is a last resort mechanism to prevent thermal stress to the regulator. Operation at or close to the thermal shutdown temperature is not recommended and reduces the long-term reliability of the module. Always operate the regulator within the specified safe operating area (SOA) limits for the worst-case conditions of ambient temperature and airflow.

Output On/Off Inhibit

For applications requiring output voltage on/off control, the PTH08T210W incorporates an output Inhibit control pin. The inhibit feature can be used wherever there is a requirement for the output voltage from the regulator to be turned off.

The power modules function normally when the Inhibit pin is left open-circuit, providing a regulated output whenever a valid source voltage is connected to VIwith respect to GND.

Figure 22 shows the typical application of the inhibit function. Note the discrete transistor (Q1). The Inhibit input

has its own internal pull-up to a potential of 5 V. The input is not compatible with TTL logic devices and should not be tied to VI. An open-collector (or open-drain) discrete transistor is recommended for control.

1 = Inhibit

GND

2, 6

Q1 BSS 138

Inhibit/ UVLO

PTH08T210W

GND

3,4 7,8

Figure 22. On/Off Inhibit Control Circuit

Turning Q1 on applies a low voltage to the Inhibit control pin and disables the output of the module. If Q1 is then turned off, the module executes a soft-start power-up sequence. A regulated output voltage is produced within 25 ms. Figure 23 shows the typical rise in both the output voltage and input current, following the turn-off of Q1. The turn off of Q1 corresponds to the rise in the waveform, Q1 VDS. The waveforms were measured with a 20-A constant current load.

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PTH08T210W

SLTS262B–OCTOBER 2005 – REVISED NOVEMBER 2005

VO(2 V/div)

(5 A/div)

(2 V/div)

INH

t − Time − 10 ms/div

Figure 23. Power-Up Response from Inhibit Control

Remote Sense

Products with this feature incorporate one or two remote sense pins. Remote sensing improves the load regulation performance of the module by allowing it to compensate for any IR voltage drop between its output and the load. An IR drop is caused by the high output current flowing through the small amount of pin and trace resistance.

To use this feature simply connect the Sense pins to the corresponding output voltage node, close to the load circuit. If a sense pin is left open-circuit, an internal low-value resistor (15-Ω or less) connected between the pin and the output node, ensures the output remains in regulation.

With the sense pin connected, the difference between the voltage measured directly between the VOand GND pins, and that measured at the Sense pins, is the amount of IR drop being compensated by the regulator. This should be limited to a maximum of 0.3 V.

The remote sense feature is not designed to compensate for the forward drop of nonlinear or frequency dependent components that may be placed in series with the converter output. Examples include OR-ing diodes, filter inductors, ferrite beads, and fuses. When these components are enclosed by the remote sense connection they are effectively placed inside the regulation control loop, which can adversely affect the stability of the regulator.

Auto-Track™ Function

The Auto-Track function is unique to the PTH/PTV family, and is available with all POLA products. Auto-Track was designed to simplify the amount of circuitry required to make the output voltage from each module power up and power down in sequence. The sequencing of two or more supply voltages during power up is a common requirement for complex mixed-signal applications that use dual-voltage VLSI ICs such as the TMS320™ DSP family, microprocessors, and ASICs.

How Auto-Track™ Works

Auto-Track works by forcing the module output voltage to follow a voltage presented at the Track control pin This control range is limited to between 0 V and the module set-point voltage. Once the track-pin voltage is raised above the set-point voltage, the module output remains at its set-point

(2)

. As an example, if the Track pin

(1)

of a 2.5-V regulator is at 1 V, the regulated output is 1 V. If the voltage at the Track pin rises to 3 V, the regulated output does not go higher than 2.5 V.

When under Auto-Track control, the regulated output from the module follows the voltage at its Track pin on a volt-for-volt basis. By connecting the Track pin of a number of these modules together, the output voltages follow a common signal during power up and power down. The control signal can be an externally generated master ramp waveform, or the output voltage from another power supply circuit

(3)

. For convenience, the Track input incorporates an internal RC-charge circuit. This operates off the module input voltage to produce a suitable rising waveform at power up.

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Typical Application

The basic implementation of Auto-Track allows for simultaneous voltage sequencing of a number of Auto-Track compliant modules. Connecting the Track inputs of two or more modules forces their track input to follow the same collective RC-ramp waveform, and allows their power-up sequence to be coordinated from a common Track control signal. This can be an open-collector (or open-drain) device, such as a power-up reset voltage supervisor IC. See U3 in Figure 24.

To coordinate a power-up sequence, the Track control must first be pulled to ground potential. This should be done at or before input power is applied to the modules. The ground signal should be maintained for at least 20 ms after input power has been applied. This brief period gives the modules time to complete their internal soft-start initialization

(4)

, enabling them to produce an output voltage. A low-cost supply voltage supervisor IC, that includes a built-in time delay, is an ideal component for automatically controlling the Track inputs at power up.

Figure 24 shows how the TL7712A supply voltage supervisor IC (U3) can be used to coordinate the sequenced

power up of PTH08T210W modules. The output of the TL7712A supervisor becomes active above an input voltage of 3.6 V, enabling it to assert a ground signal to the common track control well before the input voltage has reached the module's undervoltage lockout threshold. The ground signal is maintained until approximately 28 ms after the input voltage has risen above U3's voltage threshold, which is 10.95 V. The 28-ms time period is controlled by the capacitor C3. The value of 2.2 µF provides sufficient time delay for the modules to complete their internal soft-start initialization. The output voltage of each module remains at zero until the track control voltage is allowed to rise. When U3 removes the ground signal, the track control voltage automatically rises. This causes the output voltage of each module to rise simultaneously with the other modules, until each reaches its respective set-point voltage.

Figure 25 shows the output voltage waveforms after input voltage is applied to the circuit. The waveforms, VO1

and VO2, represent the output voltages from the two power modules, U1 (3.3 V) and U2 (1.8 V), respectively. V

TRK,VO

1, and VO2 are shown rising together to produce the desired simultaneous power-up characteristic.

The same circuit also provides a power-down sequence. When the input voltage falls below U3's voltage threshold, the ground signal is re-applied to the common track control. This pulls the track inputs to zero volts, forcing the output of each module to follow, as shown in Figure 26. Power down is normally complete before the input voltage has fallen below the modules' undervoltage lockout. This is an important constraint. Once the modules recognize that an input voltage is no longer present, their outputs can no longer follow the voltage applied at their track input. During a power-down sequence, the fall in the output voltage from the modules is limited by the Auto-Track slew rate capability.

Notes on Use of Auto-Track™

1. The Track pin voltage must be allowed to rise above the module set-point voltage before the module regulates at its adjusted set-point voltage.

2. The Auto-Track function tracks almost any voltage ramp during power up, and is compatible with ramp speeds of up to 1 V/ms.

3. The absolute maximum voltage that may be applied to the Track pin is the input voltage VI.

4. The module cannot follow a voltage at its track control input until it has completed its soft-start initialization. This takes about 20 ms from the time that a valid voltage has been applied to its input. During this period, it is recommended that the Track pin be held at ground potential.

5. The Auto-Track function is disabled by connecting the Track pin to the input voltage (VI). When Auto-Track is disabled, the output voltage rises at a quicker and more linear rate after input power has been applied.

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PTH08T210W

SLTS262B–OCTOBER 2005 – REVISED NOVEMBER 2005

=12V

REF

0.1 Fm

2.2 Fm

SENSE

RESIN

TL7712A

REF

GND

RESET

RST

10 kW

AutoTrack

TurboTrans

+Sense

Inhibit/ UVLO Prog

PTH08T210W

GND

1.62 kW

AutoTrack

Smart

Sync

Inhibit/ UVLO Prog

TurboTrans

PTH08T220W

GND

SET

Adj

−Sense

Adj

+Sense

−Sense

1 = 3.3 V

VO2 = 1.8 V

SET

4.75 kW

Figure 24. Sequenced Power Up and Power Down Using Auto-Track

(1 V/div)

TRK

1 (1 V/div)

2 (1 V/div)

t − Time − 20 s/divm

Figure 25. Simultaneous Power Up Figure 26. Simultaneous Power Down

With Auto-Track Control With Auto-Track Control

TRK

(1 V/div)

1 (1 V/div)

2 (1 V/div)

t − Time − 400 s/divm

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PACKAGE OPTION ADDENDUM

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10-Mar-2006

PACKAGING INFORMATION

Orderable Device Status

PTH08T210WAD ACTIVE DIP MOD

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

ECP 14 35 Pb-Free

ULE

PTH08T210WAH ACTIVE DIP MOD

ECP 14 35 TBD Call TI N / A for Pkg Type

ULE

PTH08T210WAS ACTIVE DIP MOD

ECQ 14 35 TBD Call TI Level-1-235C-UNLIM

ULE

PTH08T210WAST ACTIVE DIP MOD

ECQ 14 250 TBD Call TI Level-1-235C-UNLIM

ULE

PTH08T210WAZ ACTIVE DIP MOD

ECQ 14 35 Pb-Free

ULE

PTH08T210WAZT ACTIVE DIP MOD

ECQ 14 250 Pb-Free

ULE

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(RoHS)

(2)

Lead/Ball Finish MSL Peak Temp

Call TI N / A for Pkg Type

Call TI Level-3-260C-168 HR

(3)

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

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TEXAS INSTRUMENTS PTH08T210W Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual