Datasheet PTH03010Y Datasheet (TEXAS INSTRUMENTS)

(34,8 mm x 15,75 mm)

1.37 in x 0.62 in

Nominal Size

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PTH03010Y
PTH05010Y
PTH12010Y

SLTS223A–MARCH 2004 – REVISED OCTOBER 2005

15-A NON-ISOLATED DDR/QDR

MEMORY BUS TERMINATION MODULES

FEATURES

• VTTBus Termination Output
(Output Tracks the System V

• 15 A Output Current (12 A for 12-V Input)

• 3.3-V, 5-V or 12-V Input Voltage

• DDR and QDR Compatible

REF

)

• Efficiencies up to 91%

• Output Overcurrent Protection

(Nonlatching, Auto-Reset)

• 62 W/in3Power Density

• Safety Agency Approvals

UL/cUL60950, EN60950, VDE

• On/Off Inhibit (for VTTStandby) • Point-of-Load Alliance (POLA™) Compatible

• Undervoltage Lockout

• Operating Temperature: –40°Cto85°C

DESCRIPTION

The PTHxx010Y are a series of ready-to-use switching regulator modules from Texas Instruments designed
specifically for bus termination in DDR and QDR memory applications. Operating from either a 3.3-V, 5-V or 12-V
input, the modules generate a VTToutput that will source or sink up to 15 A of current (12 A for 12-V input) to
accurately track their V
voltage for the memory and chipset bus receiver comparators. V
voltage.

Both the PTHxx010Y series employs an actively switched synchronous rectifier output to provide state-of-the-art
stepdown switching conversion. The products are small in size (1.37 in × 0.62 in), and are an ideal choice where
space, performance, and high efficiency are desired, along with the convenience of a ready-to-use module.

Operating features include an on/off inhibit and output over-current protection (source mode only). The on/off
inhibit feature allows the VTTbus to be turned off to save power in a standby mode of operation. To ensure tight
load regulation, an output remote sense is also provided. Package options include both throughhole and surface
mount configurations.

input. VTTis the required bus termination supply voltage, and V

REF

is usually set to half the V

REF

is the reference

REF

power supply

DDQ

V

IN

V

DDQ

1 k
1 %

1 k
1 %

C

IN

(Required)

Q

1

GND

BSS138
(Optional)

Standby

CIN = Required Capacitor; 470 µF (3.3 ± 5 V Input), 560 µF (12 V Input).
Co1 = Required Low-ESR Electrolyitic Capacitor; 470 µF (3.3 ± 5 V Input), 940 µF (12 V Input).
Co2 = Ceramic Capacitance for Optimum Response to a 3 A (± 1.5 A) Load Transient; 200 µF (3.3 ± 5 V Input), 400 µF (12 V Input).
Con = Distributed hf-Ceramic Decoupling Capacitors for VTT bus; as Recommended for DDR Memory Applications.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

POLA is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

STANDARD APPLICATION

10 9 8

1

PTHxx010Y

(Top View)

2

54

3

7

6

Co

1

Low−ESR
(Required)

Co

2

Ceramic
(Optional)

V

REF

V

TT

Co

n

hf−Ceramic

V

TT

Termination Island

SSTL−2

Bus

Copyright © 2004–2005, Texas Instruments Incorporated

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PTH03010Y
PTH05010Y
PTH12010Y

SLTS223A–MARCH 2004 – REVISED OCTOBER 2005

ORDERING INFORMATION

PTHXX010Y (Base Part Number)

Input Voltage Part Number

PTH03010YAH Horizontal T/H Yes

3.3 V PTH03010YAS Standard SMD No

PTH03010YAZ Optional SMD Yes

PTH05010YAH Horizontal T/H Yes

5 V PTH05010YAS Standard SMD No

PTH05010YAZ Optional SMD Yes

PTH12010YAH Horizontal T/H Yes

12 V PTH12010YAS Standard SMD No

PTH12010YAZ Optional SMD Yes

(1) Add T to end of part number for tape and reel on SMD packages only.
(2) Reference the applicable package reference drawing for the dimensions and PC board layout.
(3) Lead (Pb) –free option specifies Sn/Ag pin solder material.
(4) Standard option specifies 63/37, Sn/Pb pin solder material.

(1)

DESCRIPTION Pb – free and Mechanical Package

RoHS

(2)

(3)

(4)

(3)

(3)

(4)

(3)

(3)

(4)

(3)

EUH

EUJ

EUJ

EUH

EUJ

EUJ

EUH

EUJ

EUJ

ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS

voltages are with respect to GND

UNIT

V

T

T

T

T

(1) For operation below 0°C the external capacitors must bave stable characteristics, use either a low ESR tantalum, Os-Con, or ceramic

(2) During soldering of package version, do not elevate peak temperature of the module, pins or internal components above the stated

Control input voltage –0.3 V to Vin+03 V

REF

Operating temperature Over VINrange –40°Cto85°C

A

range

Wave solder temperature Surface temperature of module body or pins PTHXX010YAH 260°C

wave

Solder reflow temperature Surface temperature of module body or pins

reflow

Storage temperature –40°C to 125°C

s

(5 seconds)

PTHXX010YAS 235°C

PTHXX010YAZ 260°C

Mechanical shock Per Mil-STD-883D, Method 2002.3 1 msec, 1/2 Sine, mounted 500 G

Mechanical vibration Mil-STD-883D, Method 2007.2 20-2000 Hz 20 G

Weight 3.7 grams

Flammability Meets UL 94V-O

capacitor.

maximum.

(1)

(2)

(2)

(2)

2

PTH03010Y
PTH05010Y

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SLTS223A–MARCH 2004 – REVISED OCTOBER 2005

ELECTRICAL SPECIFICATIONS

TA=25°C; nominal VIN;V

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

I

O

V

IN

∆V

REF

|V

TT–VREF

η Efficiency I

V

r

trip Overcurrent threshold A

I

o

t

tr

V

tr

UVLO Under-voltage lockout

V

IH

V

IL

I

inhibit Pin to GND 130 µA

IL

inh Input standby current Inhibit (pin 3) to GND 10 mA

I

IN

f

s

C

IN

CO1, CO2 External output capacitance PTH03010Y/PTH05010Y 200

MTBF Reliability Per Bellcore TR-332 50 % stress, T

Output current Over ∆V

Input voltage range Over IOrange PTH05010Y 4.5 5.5 V

Tracking range for V

| Tracking tolerance to V

VoRipple (pk-pk) 20 MHz bandwidth 20 mVpp

Load transient response

Inhibit control (pin 4) V
Input high voltage

Inhibit control (pin 4) –0.2 0.6
Input low voltage

Inhibit control (pin 4)
Input low curent

Switching frequency Over VINand IOranges kHz

External input capacitance µF

=1.25V;CIN,CO1, and CO2 = typical values; and IO=IOmax (unless otherwise stated)

REF

REF

range

PTH03010Y/PTH05010Y 0 ±15

PTH12010Y ±12

PTH03010Y 2.95 3.65

PTH12010Y 10.8 13.2

REF

REF

Over line, load and temperature –10 10 mV

0.55 1.8 V

PTH03010Y 88%

= 10 A PTH05010Y 88%

o

PTH12010Y 85%

Reset, followed by auto recovery PTH03010Y/PTH05010Y 27.5

PTH12010Y 20

15 A/µs load step, from –1.5 A to

1.5 A

Recovery time 30 µsec

VOover/undershoot 30 40 mV

PTH03010Y 2.45 2.8

Increasing PTH05010Y 4.3 4.45 V

V

IN

PTH12010Y 9.5 10.4

PTH03010Y 2.0 2.40

Dncreasing PTH05010Y 3.4 3.7 V

V

IN

PTH12010Y 8.8 9

–0.5 Open

IN

Referenced to GND

PTH03010Y/PTH05010Y 250 300 350

PTH12010Y 200 250 300

PTH03010Y/PTH05010Y 470

PTH12010Y 560

Capacitance value: Nonceramic µF

Capacitance value: Ceramic µF

PTH03010Y/PTH05010Y 470

PTH12010Y 940

PTH12010Y 400

Equiv. series resistance (non-ceramic) 4

=40°C, ground benign 6

A

(3)

(3)

(4)

(4)

(6)

PTH12010Y

(1)

(1)

(2)

(5)

8200

(5)

6600

(4)

300

(4)

600

A

V

V

mΩ

6

10

Hrs

(1) Rating is conditional on the module being directly soldered to a 4-layer PCB with 1 oz. copper. See the SOA curves or contact the

factory for appropriate derating.

(2) This control pin has an internal pull-up to the input voltage V

applied. A small low-leakage (<100 nA) MOSFET is recommended for control. For further information, consult the related application

. If it is left open-circuit the module will operate when input power is

IN

note.

(3) An input capacitor is required for proper operation. The capacitor must be rated for a minimum a minimum of 500 mA rms( 750 mA rms

for 12-V input) of ripple current.

(4) The minimum value of external output capacitance value ensures that VTTmeets the specified transient performance requirements for

the memory bus terminations. Lower values of capacitance may be possible when the measured peak change in output current is
consistently less than 3 A.

(5) This is the calculated maximum. The minimum ESR limitation will often result in a lower value. Consult the application notes for further

guidance.

(6) This is the typcial ESR for all the electrolytic (non-ceramic) output capacitance. Use 7 mΩ as the minimum when using max-ESR values

to calculate.

3

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PTH03010Y
PTH05010Y
PTH12010Y

SLTS223A–MARCH 2004 – REVISED OCTOBER 2005

TERMINAL

NAME NO.

V

IN

GND 1, 7

V

REF

V

TT

VoSense 5

Inhibit 3

N/C 4, 9, 10 No connection

DESCRIPTION

2 The positive input voltage power node to the module, which is referenced to common GND.

This is the common ground connection for the VINand VTTpower connections. It is also the 0-VDC reference
for the control inputs.

The module senses the voltage at this input to regulate the output voltage, VTT. The voltage at V
the reference voltage for the system bus receiver comparators. It is normally set to precisely half the bus

8 driver supply voltage (V

V

pin should not exceed 500 Ω. See the Typical DDR Application Diagram in the Application Information

REF

section for reference.

This is the regulated power output from the module with respect to the GND node, and the tracking
termination supply for the application data and address buses. It is precisely regulated to the voltage applied

6

to the module's V
module. Once active it will track the voltage applied at V

The sense input allows the regulation circuit to compensate for voltage drop between the module and the
load. For optimal voltage accuracy VoSense should be connected to VTT.

The Inhibit pin is an open-collector/drain negative logic input that is referenced to GND. Applying a low-level
ground signal to this input turns off the output voltage, VTT. Although the module is inhibited, a voltage, V
will be present at the output terminals, fed through the DDR memory. When the Inhibit is active, the input
current drawn by the regulator is significantly reduced. If the Inhibit pin is left open circuit, the module will
produce an output whenever a valid input source is applied. See the Typical DDR Application Diagram in the
Application Information section for reference.

Terminal Functions

÷ 2), using a resistor divider. The Thevenin impedance of the network driving the

DDQ

input, and is active active about 20 ms after a valid input source is applied to the

REF

REF

.

REF

is also

DDQ

1

2

10 9 8

PTHXX010

(Top View)

7

6

543

4

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20

30

40

50

60

70

80

90

400 LFM

200 LFM

100 LFM

Nat Conv

234 80

I

L

− Load Current − A

106

VIN = 12 V

T

A

− Ambient Temperature −

5

C

10 0

90

80

70

Efficiency − %

60

SLTS223A–MARCH 2004 – REVISED OCTOBER 2005

TYPICAL CHARACTERISTICS (V

=1.25V)

REF

(1)(2)

EFFICIENCY OUTPUT RIPPLE POWER DISSIPATION

vs vs vs

LOAD CURRENT LOAD CURRENT LOAD CURRENT

VIN = 3.3 V

VIN = 5 V

VIN = 12 V

Output Ripple − mV

60

50

40

30

20

10

VIN = 3.3 V

VIN = 12 V

VIN = 5 V

5

4

3

2

− Power Dissipation − W
D

P

VIN = 5 V

1

PTH03010Y
PTH05010Y
PTH12010Y

VIN = 12 V

VIN = 3.3 V

50

36912150

IL − Load Current − A

0

36912150

I

− Load Current − A

L

0

3692150

IL − Load Current − A

Figure 1. Figure 2. Figure 3.

PTH03010Y/PTH05010Y AT PTH12010Y ONLY; VIN=12V

NOMINAL V

TEMPERATURE DERATING vs LOAD CURRENT

IN

TEMPERATURE DERATING

vs LOAD CURRENT

90

80

C

5

− Ambient Temperature −
T

Nat Cinv

70

60

50

40

A

30

20

100 LFM

200 LFM

3 6912150

I

− Load Current − A

L

400 LFM

Figure 4. Figure 5.

(1) The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the

converter. Applies to Figure 1, Figure 2, and Figure 3.

(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum

operating temperatures. Derating limits apply to modules soldered directly to a 4 in x 4 in double-sided PCB with 1 oz. copper. For
surface mount packages (AS and AZ suffix), multiple vias (plated through holes) are required to add thermal paths around the power
pins. Please refer to the mechanical specification for more information. Applies to Figure 4, and Figure 5.

5

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PTH03010Y
PTH05010Y
PTH12010Y

SLTS223A–MARCH 2004 – REVISED OCTOBER 2005

TYPICAL CHARACTERISTICS

TRANSIENT PERFORMANCE FOR ∆3-A LOAD CHANGE

PTH03010Y/PTH05010Y: SOURCE-SINK-SOURCE PTH12010Y: SOURCE-SINK-SOURCE TRANSIENT

TRANSIENT

VTT − V

(50 mV/div)

(2A/div)

I

TT

REF

100 ms/div

VTT − V

(50 mV/div)

(2A/div)

I

TT

REF

100 ms/div

Figure 6. Figure 7.

6

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Typical DDR Application Diagram

PTH03010Y
PTH05010Y
PTH12010Y

SLTS223A–MARCH 2004 – REVISED OCTOBER 2005

APPLICATION INFORMATION

5.51 kΩ

+SenseMargin ±

V

= 1.8 V

DDQ

DDRII/

QDRII

VTT= 0.9 V

UDG−05096

+V

+V

V

ADJ

V

REF

O

2 ×

330 µF

TT

2 ×

330 µF

2 ×

22 µF

2 ×

22 µF

1 kΩ

1 kΩ

V

= 5V

I

470 µF

+

220 µF

Auto-Track

V

I

Inhibit ++

47 µF

V

I

Inhibit +

47 µF

PTH05010W

VDDQ I/O Memory

PTH05050Y

DDR Termination

CAPACITOR RECOMMENDATIONS FOR THE PTH03010Y AND PTH05010Y DDR POWER
MODULES
(3.3-V/5-V OPTION)

Input Capacitor

The recommended input capacitor(s) is determined by the 470 µF minimum capacitance and 500 mArms
minimum ripple current rating.

Ripple current, less than 160 mΩ equivalent series resistance (ESR), and temperature are the major
considerations when selecting input capacitors. Unlike polymer tantalum, regular tantalum capacitors have a
recommended minimum voltage rating of 2 × (maximum dc voltage + ac ripple). This is standard practice to
ensure reliability.

For improved ripple reduction on the input bus, ceramic capacitors may used to complement electrolytic types to
achieve the minimum required capacitance.

Output Capacitors

For applications with load transients (sudden changes in load current), regulator response benefits from external
output capacitance. The recommended output capacitance of 470 µF will allow the modue to meet its transieint
response specification. (See Electrical Specifications table). For most applications, a high quality computer-grade
aluminum electrolytic capacitor is adequate. These capacitors provide decoupling over the frequency range,
2 kHz to 150 kHz, and are suitable for ambient temperatures above 0°C. Below 0°C, tantalum, ceramic or
Os-Con type capacitors are recommended. When using one or more nonceramic capacitors, the calculated
equivalent ESR should be no lower than 4 mΩ (7 mΩ using the manufacturer’s maximum ESR for a single
capacitor).

A list of preferred low-ESR type capacitors are identified in Table 1. In addition to electrolytic capacitance, adding
a 10-µF to 22-µF X5R/X7R ceramic capacitor to the output reduces the output ripple voltage and improve the
regulator’s transient response. The measurement of both the output ripple and transient response is also best
achieved across a 10-µF ceramic capacitor.

7

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PTH03010Y
PTH05010Y
PTH12010Y

SLTS223A–MARCH 2004 – REVISED OCTOBER 2005

APPLICATION INFORMATION (continued)

Ceramic Capacitors

Above 150 kHz the performance of aluminum electrolytic capacitors becomes less effective. To further improve
the reflected input ripple current or the output transient response, multilayer ceramic capacitors can be added.
Ceramic capacitors have very low ESR and their resonant frequency is higher than the bandwidth of the
regulator. When used on the output their combined ESR is not critical as long as the total value of ceramic
capacitance does not exceed 300 µF. Also, to prevent the formation of local resonances, do not place more than
five identical ceramic capacitors in parallel with values of 10 µF or greater.

Tantalum Capacitors

Tantalum type capacitors can be used at both the input and output, and are recommended for applications where
the ambient operating temperature can be less than 0°C. The AVX TPS, Sprague 593D/594/595, and Kemet
T495/T510 capacitor series are suggested over many other tantalum types due to their higher rated surge, power
dissipation, and ripple current capability. As a caution, many general-purpose tantalum capacitors have
considerably higher ESR, reduced power dissipation and lower ripple current capability. These capacitors are
also less reliable as they have lower power dissipation and surge current ratings. Tantalum capacitors that do not
have a stated ESR or surge current rating are not recommended for power applications.

When specifying Os-Con and polymer tantalum capacitors for the output, the minimum ESR limit is encountered
before the maximum capacitance value is reached.

Capacitor Table

Table 1 identifies the characteristics of capacitors from a number of vendors with acceptable ESR and ripple

current (rms) ratings. The recommended number of capacitors required at both the input and output buses is
identified for each capacitor type.

This is not an extensive capacitor list. Capacitors f rom other vendors are available with comparable
specifications. Those listed are for guidance. The RMS ripple current rating and ESR (at 100 kHz) are critical
parameters necessary to ensure both optimum regulator performance and long capacitor life.

Table 1. Input/Output Capacitors

Capacitor Characteristics Quantity

Capacitor Vendor, Vendor

Type/Series (Style) Part Number

Panasonic, Aluminum

FC (Radial) 10 470 0.117 555 8 × 11,5 1 1 EEUFC1A471

FC (SMD) 10 470 0.150 670 10 × 10,2 1 1 EEUFC1A471P

FK (SMD) 10 470 0.160 600 8× 10,2 1 1 EEVFK1A471P

United Chemi-Con

PXA, Poly-Aluminum (SMD) 6.3 470 0.020 4130 10 × 7,7 1 ≤2 PXA6.3VC471MJ80TP

PS, Poly-Aluminum (Radial) 10 470 0.012 5300 10 × 12,5 1 ≤1 10PS470MJ12

LXZ, Aluminum (Radial) 16 470 0.120 555 8 × 12 1 1 LXZ10VB471M8X12LL

Nichicon Aluminum

WG(SMD) 10 470 0.150 670 mA 10 × 10 1 1 UWG1A471MNR1GS

HD (Radial) 10 470 0.072 760 8 × 11,5 1 1 UHD1A471MPR

PM (Radial) 10 470 0.130 600 10 × 12,5 1 1 UPM1A471MPH6

(1) Capacitor Supplier Verification

Please verify availability of capacitors identified in this table. Capacitor suppliers may recommend alternative part numbers because of
limited availability or obsolete products. In some instances, the capacitor product life cycle may be in decline and have short-term
consideration for obsolescence.

RoHS, Lead-free and Material Details

Please consult capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process
requirements. Component designators or part number deviations can occur when material composition or soldering requirements are
updated.

Working Max ESR Physical

Voltage at 100 kHz Size

(V) (Ω) (mm)

Value Current Input Output

(µF) at 85°CBusBus

Max Ripple

(Irms) (mA)

(1)

8

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PTH05010Y

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SLTS223A–MARCH 2004 – REVISED OCTOBER 2005

APPLICATION INFORMATION (continued)

Table 1. Input/Output Capacitors (continued)

Capacitor Characteristics Quantity

Capacitor Vendor, Vendor

Type/Series (Style) Part Number

Panasonic, Poly-Aluminum:

S/SE (SMD) 6.3 180 0.005 4000 7,3 × 4,3 × 2

Sanyo

SEPC, Os-con (Radial) 6.3 470 0.008 5700 10 × 13 1 ≤1 6SEPC470M

SVP, (SMD) 6.3 470 0.015 4200 11 × 11,9 1 ≤2 6SVP470M

TPE, Poscap (SMD) 6.3 470 0.018 3500 7,3 × 4,3 1 ≤2 6TPE470MI

AVX, Tantalum TPS (SMD) 10 470 0.045 1723 7,3 L × 5,7 W 1 ≤5 TPSE477M010R0045

Kemet, Poly-Tantalum

T520, (SMD) 10 330 0.040 1800 2 ≤5 T520X337M010AS

T530, (SMD) 10 330 0.010 5200 × 4H 2 ≤1 T530X337M010ASE010

Vishay-Sprague

595D, Tantalum (SMD) 10 470 0.100 1440 7,2 L × 6W 1 ≤5 595D477x0010r2t

94SP, Poly Aluminum (Radial) 10 470 0.015 4510 10 × 10 1 ≤2 94SP477X0010FBP

94SVP, Poly-Aluminum (SMD) 6.3 470 0.017 3960 8 × 12 1 ≤3 94SVP477X06R3E12

Kemet, Ceramic X5R (SMD) 16 10 0.002 – 3225 mm 1 ≤5 C1210C106M4PAC

Murata, Ceramic X5R (SMD) 6.3 100 0.002 – 3225 mm 1

TDK, Ceramic X5R (SMD) 6.3 100 0.002 – 3225 mm 1

Working Max ESR Physical

Voltage at 100 kHz Size

(V) (Ω) (mm)

6.3 47 3225 mm 1 ≤5 C1210C476K9PAC

6.3 47 3225 mm 1

6.3 47 3225 mm 1

Value Current Input Output

(µF) at 85°CBusBus

10 470 0.060 1826 1 ≤5 TPSV477M010R0060

16 22 1

16 10 1

16 22 1

16 10 1

(2) A total capacitance of 360 µF is acceptable based on the combined ripple current rating.
(3) N/R –Not recommended. The capacitor voltage rating does not meet the minimum derated operating limits.
(4) A ceramic capacitor is recoommended to compliment electrolytic types at the input to further reduce high-frequency ripple current.

Max Ripple

(Irms) (mA)

4,2

× 4,1 H

4,3 W × 7,3 L

(2)

(4)

(4)

(4)

(4)

(4)

(4)

(4)

(4)

(3)

N/R

EEFSE0J181R

≤3 GRM32ER60J107M

≤5 GRM32ER60J476M

≤5 GRM32ER61C226K

≤5 GRM32DR61C106K

≤3 C3225X5R0J107MT

≤5 C3225X5R0J476MT

≤5 C3225X5R1C226MT

≤5 C3225X5R1C106MT

PTH12010Y

Designing for Very Fast Load Transients

The transient response of the dc/dc converter has been characterized using a load transient with a di/dt of
1A/µs. The typical voltage deviation for this load transient is given in the data sheet specification table using the
optional value of output capacitance. As the di/dt of a transient is increased, the response of a converter's
regulation circuit ultimately depends on its output capacitor decoupling network. This is an inherent limitation with
any dc/dc converter once the speed of the transient exceeds its bandwidth capability. If the target application
specifies a higher di/dt or lower voltage deviation, the requirement can only be met with additional output
capacitor decoupling. In these cases special attention must be paid to the type, value and ESR of the capacitors
selected.

If the transient performance requirements exceed that specified in the data sheet, or the total amount of load
capacitance is above 8200 µF, the selection of output capacitors becomes more important.

9

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PTH03010Y
PTH05010Y
PTH12010Y

SLTS223A–MARCH 2004 – REVISED OCTOBER 2005

CAPACITOR RECOMMENDATIONS FOR THE PTH12010Y DDR POWER MODULES
(12-V OPTION)

INPUT CAPACITOR

The recommended input capacitance is determined by the 560 µF minimum capacitance and 750 mArms
minimum ripple current rating. A 10-µF X5R/X7R ceramic capacitor may also be added to reduce the reflected
input ripple current. The ceramic capacitor should be located between the input electrolytic and the module.

Ripple current, less than 100 mΩ equivalent series resistance (ESR) and temperature are major considerations
when selecting input capacitors. Unlike polymer-tantalum capacitors, regular tantalum capacitors have a
recommended minimum voltage rating of 2 × (max dc voltage + ac ripple). This is standard practice to ensure
reliability. No tantalum capacitors were found with sufficient voltage rating to meet this requirement. At
temperatures below 0°C, the ESR of aluminum electrolytic capacitors increases. For these applications, Os-Con,
polymer-tantalum, and polymer-aluminum types should be considered.

OUTPUT CAPACITORS

For applications with load transients (sudden changes in load current), regulator response benefits from external
output capacitance. The recommended output capacitance of 940 µF will allow the modue to meet its transieint
response specification. (See Electrical Specifications table). For most applications, a high quality computer-grade
aluminum electrolytic capacitor is adequate. These capacitors provide decoupling over the frequency range,
2 kHz to 150 kHz, and are suitable for ambient temperatures above 0°C. Below 0°C, tantalum, ceramic or
Os-Con type capacitors are recommended. When using one or more nonceramic capacitors, the calculated
equivalent ESR should be no lower than 4 mΩ (7 mΩ using the manufacturer’s maximum ESR for a single
capacitor).

A list of preferred low-ESR type capacitors are identified in Table 2.

In addition to electrolytic capacitance, adding a 10-µF to 22-µF X5R/X7R ceramic capacitor to the output reduces
the output ripple voltage and improve the regulator’s transient response. The measurement of both the output
ripple and transient response is also best achieved across a 10-µF ceramic capacitor.

CERAMIC CAPACITORS

Above 150 kHz the performance of aluminum electrolytic capacitors is less effective. Multilayer ceramic
capacitors have very low ESR and a resonant frequency higher than the bandwidth of the regulator. They can be
used to reduce the reflected ripple current at the input as well as improve the transient response of the output.
When used on the output, their combined ESR is not critical as long as the total value of ceramic capacitance
does not exceed 300 µF. Also, to prevent the formation of local resonances, do not place more than five identical
ceramic capacitors in parallel with values of 10 µF or greater.

TANTALUM CAPACITORS

Tantalum type capacitors are most suited for use on the output bus, and are recommended for applications
where the ambient operating temperature can be less than 0°C. The AVX TPS, Sprague 593D/594/595 and
Kemet T495/T510 capacitor series are suggested over other tantalum types due to their higher rated surge,
power dissipation, and ripple current capability. As a caution, many general purpose tantalum capacitors have
considerably higher ESR, reduced power dissipation and lower ripple current capability. These capacitors are
also less reliable as they have lower power dissipation and surge current ratings. Tantalum capacitors that do not
have a stated ESR or surge current rating are not recommended for power applications.

When specifying Os-con and polymer tantalum capacitors for the output, the minimum ESR limit are encountered
well before the maximum capacitance value is reached.

CAPACITOR TABLE

Table 2 identifies the characteristics of capacitors from a number of vendors with acceptable ESR and ripple

current (rms) ratings. The recommended number of capacitors required at both the input and output buses is
identified for each capacitor type.

This is not an extensive capacitor list. Capacitors f rom other vendors are available with comparable
specifications. Those listed are for guidance. The RMS ripple current rating and ESR (at 100 kHz) are critical
parameters necessary to insure both optimum regulator performance and long capacitor life.

10

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Table 2. Input/Output Capacitors

SLTS223A–MARCH 2004 – REVISED OCTOBER 2005

(1)

CAPACITOR CHARACTERISTICS QUANTITY

CAPACITOR VENDOR,
TYPE/SERIES, (STYLE)

WORKING VALUE MAX. ESR MAX RIPPLE PHYSICAL INPUT OPTIONAL VENDOR PART
VOLTAGE (µF) AT 100 kHz CURRENT AT SIZE (mm) BUS OUTPUT NUMBER

85°C (lrms) BUS

Panasonic, Aluminum (FC) 25 V 560 0.065 Ω 1205 mA 12,5 x 15 1 1 EEUFC1E561S

FC, Radial 25 V 1000 0.060 Ω 1100 mA 12,5 x 13,5 1 1 EEVFK1E102Q

FK, (SMD) 35 V 680 0.060 Ω 1100 mA 12,5 x 13,5 1 1 EEVFK1V681Q

United Chemi-Con

PS, Poly-Aluminum (Radial) 16 V 330 0.014 Ω 5050 mA 10 x 12,5 2 ≤2 16PS330MJ12

LXZ, Aluminium (Radial) 16 V 680 0.068 Ω 1050 mA 10 x 16 1 1 LXZ16VB681M10X16LL

PXA, Poly-Aluminum (SMD) 16 V 330 0.014 Ω 5050 mA 10 x 12,2 2 ≤2 PXA16VC331MJ12TP

Nichicon, Aluminum (PM) 25 V 560 0.060 Ω 1060 mA 12,5 x 15 1 1 UPM1E561MHH6

HD, (Radial) 16 V 680 0.038 Ω 1430 mA 10 x 16 1 1 UHD1C681MPR

PM, (Radial) 35 V 560 0.048 Ω 1360 mA 16 x 15 1 1 UPM1V561MHH6

Sanyo
TPE Poscap (SMD) 10 V 330 0.025 Ω 3000 mA 7,3 L x 5,7 W N/R

(2)

≤3 10TPE330M

SEQP, Os-Con (Radial) 16 V 330 0.016 Ω >4720 mA 10 x 13 2 ≤2 16SEQP330M

SVP, Os-Con (SMD) 16 V 330 0.016 Ω 4700 mA 11 x 12 2 ≤2 16SVP330M

AVX, Tantalum Series III TPSE477M010R0045
TPS (SMD) 10 V 470 0.045 Ω >1723 mA 7,3L x 5,7W N/R

10 V 330 0.045 Ω >1723 mA x 4,1H N/R

(2)

(2)

(3)

≤5

(3)

≤5

TPSE377M010R0045

Kemet

T520, Poly-Tantalum (SMD) 10 V 330 0.040 Ω 1800 mA 7,3 L N/R

T530, Poly-Tant/Organic 10 V 330 0.010 Ω >3800 mA x 4,3 W N/R

6.3 V 470 0.005 Ω 4200 mA x 4 H N/R

Vishay-Sprague 7,2L x 6W x 595D477X0010R2T
595D, Tantalum (SMD) 10 V 470 0.100 Ω 1440 mA 4,1H N/R

(2)

(2)

(2)

(2)

≤5 T520X337M010AS

≤1 T530X337M010ASE010

(3)

≤1

≤5

T530X477M006AS E005

(3)

94SA, Os-con (Radial) 16 V 1000 0.015Ω 9750 mA 16 x 25 1 ≤2 94SA108X0016HBP

94SVP, Os-CON(SMD) 16V 330 0.017Ω 4580 mA 10 x 12,7 2

Kemet, Ceramic X5R 16 V 10 0.002 Ω - 3225 mm 1

(4)

(5)

≤2 94SVP337X0016F12

≤5 C1210C106M4PAC

(SMD)

6.3 V 47 0.002 Ω 3225 mm N/R

Murata, Ceramic X5R 6.3 V 100 0.002 Ω - 3225 mm N/R

(2)

(2)

≤5 C1210C476K9PAC

≤3 GRM32ER60J107M

(SMD)

16 V 47 3225 mm 1

16 V 22 1

16 V 10 1

TDK, Ceramic X5R (SMD) 6.3 V 100 0.002 Ω - 3225 mm N/R

6.3 V 47 3225 mm N/R

16 V 22 1

16 V 10 1

(5)

(5)

(5)

(2)

(2)

(5)

(5)

≤5 GRM32ER61CJ476K

≤5 GRM32ER61C226K

≤5 GRM32DR61C106K

≤3 C3225X5R0J107MT

≤5 C3225X5R0J476MT

≤5 C3225X5R1C226MT

≤5 C3225X5R1C106MT

(1) Capacitor Supplier Verification

Please verify availability of capacitors identified in this table. Capacitor suppliers may recommend alternative part numbers because of
limited availability or obsolete products. In some instances, the capacitor product life cycle may be in decline and have short-term
consideration for obsolescence.

RoHS, Lead-free and Material Details

Please consult capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process
requirements. Component designators or part number deviations can occur when material composition or soldering requirements are

updated.
(2) N/R –Not recommended. The capacitor voltage rating does not meet the minimum derated operating limits.
(3) The voltage rating of this capacitor only allows it to be used for output voltages that are equal to or less than 5.1 V.
(4) A total capacitance of 540 µF is acceptable based on the combined ripple current rating.
(5) A ceramic capacitor can be used to complement electrolytic types at the input further reduce high-frequency ripple current.

PTH12010Y

11

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PTH03010Y
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SLTS223A–MARCH 2004 – REVISED OCTOBER 2005

DESIGNING FOR VERY FAST LOAD TRANSIENTS

The transient response of the DC/DC converter has been characterized using a load transient with a di/dt of
1 A/µs. The typical voltage deviation for this load transient is given in the data sheet specification table using the
optional value of output capacitance. As the di/dt of a transient is increased, the response of a converter’s
regulation circuit ultimately depends on its output capacitor decoupling network. This is an inherent limitation with
any dc/dc converter once the speed of the transient exceeds its bandwidth capability. If the target application
specifies a higher di/dt or lower voltage deviation, the requirement can only be met with additional output
capacitor decoupling. In these cases special attention must be paid to the type, value and ESR of the capacitors
selected.

If the transient performance requirements exceed that specified in the data sheet, or the total amount of load
capacitance is above 6600 µF, the selection of output capacitors becomes more important.

12

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PTH03010Y
PTH05010Y
PTH12010Y

SLTS223A–MARCH 2004 – REVISED OCTOBER 2005

TAPE AND REEL SPECIFICATION

TRAY SPECIFICATION

13

PACKAGE OPTION ADDENDUM

www.ti.com

12-Jan-2006

PACKAGING INFORMATION

Orderable Device Status

PTH03010YAD ACTIVE DIP MOD

(1)

Package

Type

Package
Drawing

Pins Package

Qty

Eco Plan

EUH 10 25 Pb-Free

ULE

PTH03010YAH ACTIVE DIP MOD

EUH 10 25 Pb-Free

ULE

PTH03010YAS ACTIVE DIP MOD

EUJ 10 25 TBD Call TI Level-1-235C-UNLIM

ULE

PTH03010YAST ACTIVE DIP MOD

EUJ 10 250 TBD Call TI Level-1-235C-UNLIM

ULE

PTH03010YAZ ACTIVE DIP MOD

EUJ 10 25 Pb-Free

ULE

PTH03010YAZT ACTIVE DIP MOD

EUJ 10 250 Pb-Free

ULE

PTH05010YAH ACTIVE DIP MOD

EUH 10 25 Pb-Free

ULE

PTH05010YAS ACTIVE DIP MOD

EUJ 10 25 TBD Call TI Level-1-235C-UNLIM

ULE

PTH05010YAST ACTIVE DIP MOD

EUJ 10 250 TBD Call TI Level-1-235C-UNLIM

ULE

PTH05010YAZ ACTIVE DIP MOD

EUJ 10 25 Pb-Free

ULE

PTH05010YAZT ACTIVE DIP MOD

EUJ 10 250 Pb-Free

ULE

PTH12010YAH ACTIVE DIP MOD

EUH 10 25 Pb-Free

ULE

PTH12010YAS ACTIVE DIP MOD

EUJ 10 25 TBD Call TI Level-1-235C-UNLIM

ULE

PTH12010YAST ACTIVE DIP MOD

EUJ 10 250 TBD Call TI Level-1-235C-UNLIM

ULE

PTH12010YAZ ACTIVE DIP MOD

EUJ 10 25 Pb-Free

ULE

PTH12010YAZT ACTIVE DIP MOD

EUJ 10 250 Pb-Free

ULE

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(RoHS)

(RoHS)

(RoHS)

(RoHS)

(RoHS)

(RoHS)

(RoHS)

(RoHS)

(RoHS)

(RoHS)

(2)

Lead/Ball Finish MSL Peak Temp

Call TI N / A for Pkg Type

Call TI N / A for Pkg Type

Call TI Level-3-260C-168 HR

Call TI Level-3-260C-168 HR

Call TI N / A for Pkg Type

Call TI Level-3-260C-168 HR

Call TI Level-3-260C-168 HR

Call TI N / A for Pkg Type

Call TI Level-3-260C-168 HR

Call TI Level-3-260C-168 HR

(3)

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

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12-Jan-2006

Addendum-Page 2

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