TEXAS INSTRUMENTS ONET2591TA Technical data

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2.5-Gbps Transimpedance Amplifier With AGC and RSSI
FEATURES APPLICATIONS
2.6-k Differential Transimpedance
Automatic Gain Control (AGC)
6.6-pA/ Hz Typical Input Referred Noise
2-mA
Received Signal Strength Indication (RSSI)
CML Data Outputs With On-Chip 50-
Back-Termination
On-Chip Supply Filter Capacitor
Single 3.3-V Supply
Die Size: 0,78 mm × 1,18 mm
Maximum Input Current
p-p
ONET2591TA
SLLS669 – SEPTEMBER 2005
SONET/SDH Transmission Systems at OC24
and OC48
2.125-Gbps and 1.0625-Gbps Fibre-Channel
Receivers
Gigabit Ethernet Receivers
PIN Preamplifier-Receivers
DESCRIPTION
The ONET2591TA is a high-speed transimpedance amplifier used in optical receivers with data rates up to 2.5 Gbps.
It features a low input referred noise, 1.8-GHz bandwidth, automatic gain control (AGC), 2.6-k transimpedance, and received signal strength indication (RSSI).
The ONET2591TA is available in die form and is optimized for use in a TO can. The ONET2591TA requires a single 3.3-V supply, and its power-efficient design typically dissipates less than 53
mW. The device is characterized for operation from –40 ° C to 85 ° C ambient temperature.
AVAILABLE OPTIONS
T
A
–40 ° C to 85 ° C ONET2591TAY
DIE
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright © 2005, Texas Instruments Incorporated
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B0066-01
OUT+
OUT–
RSSI
V
CC
FILTER
220 W
200 pF
275 pF
DC Input Current
Cancellation,
AGC, and RSSI
Band-Gap Voltage
Reference and
Bias Current
Generation
GND
R
F
IN
Voltage Amplifier
CML Output BufferTransimpedance Amplifier
ONET2591TA
SLLS669 – SEPTEMBER 2005
BLOCK DIAGRAM
The ONET2591TA is a high-performance, 2.5-Gbps transimpedance amplifier consisting of the signal path, supply filter, a control block for dc input current cancellation, automatic gain control (AGC), received signal strength indication (RSSI), and a band-gap voltage reference and bias current generation block.
The signal path comprises a transimpedance amplifier stage, a voltage amplifier, and a CML output buffer. The on-chip filter circuit provides filtered V
input current cancellation and AGC use internal low-pass filters to cancel the dc current on the input and to adjust the transimpedance amplifier gain. Furthermore, circuitry to monitor the received signal strength is provided.
A simplified block diagram of the ONET2591TA is shown in Figure 1 .
for the photodiode and for the transimpedance amplifier. The dc
CC
Figure 1. Simplified Block Diagram of the ONET2591TA
SIGNAL PATH
The first stage of the signal path is a transimpedance amplifier that takes the photodiode current and converts it into a voltage signal.
If the input signal current exceeds a certain value, the transimpedance gain is reduced by means of AGC circuitry.
The second stage is a voltage amplifier that provides additional gain and converts its single-ended input voltage into a differential data signal.
The third signal-path stage is the output buffer, which provides CML outputs with on-chip, 50- back-termination to V
.
CC
2
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ONET2591TA
SLLS669 – SEPTEMBER 2005
FILTER CIRCUITRY
The filter pin provides filtered V implemented using a filter resistor of 220 and an internal 200-pF capacitor. The corresponding corner frequency is below 4 MHz.
If a lower cutoff frequency is required for the intended application, an external capacitor can be connected to one of the FILTER pins.
The supply voltage for the whole amplifier is filtered by means of an on-chip, 275-pF capacitor as well, thus avoiding the necessity to use an external supply-filter capacitor.
DC INPUT CURRENT CANCELLATION, AGC, AND RSSI
The voltage drop across the internal photodiode supply-filter resistor is monitored by means of a dc input current cancellation, AGC, and RSSI control circuit block.
If the dc input current exceeds a certain level, it is partially cancelled by means of a controlled current source. This measure keeps the transimpedance amplifier stage within sufficient operating point limits for optimum performance. Furthermore, disabling the dc input cancellation at low input currents leads to superior noise performance.
The AGC circuitry lowers the effective transimpedance feedback resistor R acting as a controlled shunt. This prevents the transimpedance amplifier from being overdriven at high input currents, which leads to improved jitter behavior within the complete input-current dynamic range. Because the voltage drop across the supply-filter resistor is sensed and used by the AGC circuit, the photodiode must be connected to a FILTER pad for the AGC to function correctly.
Finally, this circuit block senses the current through the filter resistor and generates a mirrored current, which is proportional to the input signal strength. The mirrored current is available at the RSSI output and must be sunk to ground (GND) using an external resistor. The RSSI gain can be adjusted by choosing the external resistor; however, for proper operation, ensure that the voltage at the RSSI pad never exceeds V
for the photodiode bias. The on-chip, low-pass filter for the photodiode V
CC
by means of a MOSFET device
F
0.65 V.
CC
is
CC
BAND-GAP VOLTAGE AND BIAS GENERATION
The ONET2591TA transimpedance amplifier is supplied by a single, 3.3-V supply voltage connected to the V pad. This voltage is referred to GND.
On-chip band-gap voltage circuitry generates a supply-voltage-independent reference from which all other internally required voltages and bias currents are derived.
CC
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7
11
9
8
10
2
3
1
2591TA
4
6
5
M0033-01
GND GND
GND
OUT–
RSSI
GND
OUT+
V
CC
FILTER
FILTER
IN
ONET2591TA
SLLS669 – SEPTEMBER 2005
BOND PAD ASSIGNMENT
The ONET2591TA is available as a bare die. The locations of the bond pads are shown in the following figure.
PAD
NAME NO.
FILTER 5, 6 Analog
GND 1, 2, 10, 11 Supply IN 7 Analog input Data input to TIA (photodiode anode)
OUT+ 3 Analog output Non-inverted data output. On-chip 50- back-terminated to VCC. OUT– 9 Analog output Inverted data output. On-chip 50- back-terminated to VCC.
RSSI 8 Analog output gain can be adjusted by choosing the external resistor; however, for proper operation, ensure
V
CC
4 Supply 3.3-V, +10%/–12% supply voltage
BOND PAD DESCRIPTION
TYPE DESCRIPTION
Bias voltage for photodiode (cathode). These pads connect through an internal 220- resistor to V
and a 200-pF filter capacitor to ground (GND). Both FILTER pads are connected on-chip.
CC
For additional photodiode supply filtering, connect an external capacitor from one of the FILTER pads to GND. The FILTER pad(s) must be connected to the photodiode for the AGC to function.
Circuit ground. All GND pads are connected on die. Bonding all pads is optional; however, for optimum performance a good ground connection is mandatory.
Analog output current proportional to the input data amplitude. Indicates the strength of the received signal (RSSI). Must be sunk through an external resistor to ground (GND). The RSSI
that the voltage at the RSSI pad never exceeds V this pad must be bonded to ground (GND) to ensure proper operation.
0.65 V. If the RSSI feature is not used,
CC
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ONET2591TA
SLLS669 – SEPTEMBER 2005
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
V
CC
V
, V
OUT–
, V
OUT+
OUT–
FILTER
V
RSSI
I
IN
I
FILTER
I
, I
OUT+
ESD
T
J,max
T
stg
T
A
Supply voltage
, Voltage at FILTER, OUT+, OUT–, RSSI
Current into IN –0.7 mA to 2.5 mA Current into FILTER 8 mA to 8 mA Continuous current at outputs 8 mA to 8 mA ESD rating at all pins except IN ESD rating at IN Maximum junction temperature 125 ° C Storage temperature range –65 ° C to 85 ° C Operating free-air temperature range –40 ° C to 85 ° C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. (3) For optimum high-frequency performance, the input pin has reduced ESD protection.
(2)
(3)
(3)
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
V
CC
T
A
L
FILTER
L
IN
Supply voltage 2.9 3.3 3.6 V Operating free-air temperature –40 85 ° C
, Wire-bond inductor at pins FILTER and IN 0.8 nH
(1)
–0.3 V to 4 V
(2)
–0.3 V to 4 V
1.5 kV (HBM) 900 V (HBM)
MIN NOM MAX UNIT
DC ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted). Typical values are at V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
CC
I
VCC
V
IN
R
OUT
R
FILTER
Supply voltage 2.9 3.3 3.6 V
Average photodiode current IPD= 0 10 14 20
Supply current mA
mA Average photodiode current IPD= 1 13 17 23
mA Input bias voltage 0.85 1.05 V Output resistance Single-ended to V
CC
Photodiode filter resistance 220
= 3.3 V and TA= 25 ° C.
CC
40 50 60
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