www.ti.com
查询ONET2591TA供应商
2.5-Gbps Transimpedance Amplifier With AGC and RSSI
FEATURES APPLICATIONS
• 1.8-GHz Bandwidth
• 2.6-k Ω Differential Transimpedance
• Automatic Gain Control (AGC)
• 6.6-pA/ √ Hz Typical Input Referred Noise
• 2-mA
• Received Signal Strength Indication (RSSI)
• CML Data Outputs With On-Chip 50- Ω
Back-Termination
• On-Chip Supply Filter Capacitor
• Single 3.3-V Supply
• Die Size: 0,78 mm × 1,18 mm
Maximum Input Current
p-p
ONET2591TA
SLLS669 – SEPTEMBER 2005
• SONET/SDH Transmission Systems at OC24
and OC48
• 2.125-Gbps and 1.0625-Gbps Fibre-Channel
Receivers
• Gigabit Ethernet Receivers
• PIN Preamplifier-Receivers
DESCRIPTION
The ONET2591TA is a high-speed transimpedance amplifier used in optical receivers with data rates up to 2.5
Gbps.
It features a low input referred noise, 1.8-GHz bandwidth, automatic gain control (AGC), 2.6-k Ω transimpedance,
and received signal strength indication (RSSI).
The ONET2591TA is available in die form and is optimized for use in a TO can.
The ONET2591TA requires a single 3.3-V supply, and its power-efficient design typically dissipates less than 53
mW. The device is characterized for operation from –40 ° C to 85 ° C ambient temperature.
AVAILABLE OPTIONS
T
A
–40 ° C to 85 ° C ONET2591TAY
DIE
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005, Texas Instruments Incorporated
www.ti.com
B0066-01
OUT+
OUT–
RSSI
V
CC
FILTER
220 W
200 pF
275 pF
DC Input Current
Cancellation,
AGC, and RSSI
Band-Gap Voltage
Reference and
Bias Current
Generation
GND
R
F
IN
Voltage Amplifier
CML Output BufferTransimpedance Amplifier
ONET2591TA
SLLS669 – SEPTEMBER 2005
BLOCK DIAGRAM
The ONET2591TA is a high-performance, 2.5-Gbps transimpedance amplifier consisting of the signal path,
supply filter, a control block for dc input current cancellation, automatic gain control (AGC), received signal
strength indication (RSSI), and a band-gap voltage reference and bias current generation block.
The signal path comprises a transimpedance amplifier stage, a voltage amplifier, and a CML output buffer.
The on-chip filter circuit provides filtered V
input current cancellation and AGC use internal low-pass filters to cancel the dc current on the input and to
adjust the transimpedance amplifier gain. Furthermore, circuitry to monitor the received signal strength is
provided.
A simplified block diagram of the ONET2591TA is shown in Figure 1 .
for the photodiode and for the transimpedance amplifier. The dc
CC
Figure 1. Simplified Block Diagram of the ONET2591TA
SIGNAL PATH
The first stage of the signal path is a transimpedance amplifier that takes the photodiode current and converts it
into a voltage signal.
If the input signal current exceeds a certain value, the transimpedance gain is reduced by means of AGC
circuitry.
The second stage is a voltage amplifier that provides additional gain and converts its single-ended input voltage
into a differential data signal.
The third signal-path stage is the output buffer, which provides CML outputs with on-chip, 50- Ω back-termination
to V
.
CC
2
Submit Documentation Feedback
www.ti.com
ONET2591TA
SLLS669 – SEPTEMBER 2005
FILTER CIRCUITRY
The filter pin provides filtered V
implemented using a filter resistor of 220 Ω and an internal 200-pF capacitor. The corresponding corner
frequency is below 4 MHz.
If a lower cutoff frequency is required for the intended application, an external capacitor can be connected to one
of the FILTER pins.
The supply voltage for the whole amplifier is filtered by means of an on-chip, 275-pF capacitor as well, thus
avoiding the necessity to use an external supply-filter capacitor.
DC INPUT CURRENT CANCELLATION, AGC, AND RSSI
The voltage drop across the internal photodiode supply-filter resistor is monitored by means of a dc input current
cancellation, AGC, and RSSI control circuit block.
If the dc input current exceeds a certain level, it is partially cancelled by means of a controlled current source.
This measure keeps the transimpedance amplifier stage within sufficient operating point limits for optimum
performance. Furthermore, disabling the dc input cancellation at low input currents leads to superior noise
performance.
The AGC circuitry lowers the effective transimpedance feedback resistor R
acting as a controlled shunt. This prevents the transimpedance amplifier from being overdriven at high input
currents, which leads to improved jitter behavior within the complete input-current dynamic range. Because the
voltage drop across the supply-filter resistor is sensed and used by the AGC circuit, the photodiode must be
connected to a FILTER pad for the AGC to function correctly.
Finally, this circuit block senses the current through the filter resistor and generates a mirrored current, which is
proportional to the input signal strength. The mirrored current is available at the RSSI output and must be sunk to
ground (GND) using an external resistor. The RSSI gain can be adjusted by choosing the external resistor;
however, for proper operation, ensure that the voltage at the RSSI pad never exceeds V
for the photodiode bias. The on-chip, low-pass filter for the photodiode V
CC
by means of a MOSFET device
F
– 0.65 V.
CC
is
CC
BAND-GAP VOLTAGE AND BIAS GENERATION
The ONET2591TA transimpedance amplifier is supplied by a single, 3.3-V supply voltage connected to the V
pad. This voltage is referred to GND.
On-chip band-gap voltage circuitry generates a supply-voltage-independent reference from which all other
internally required voltages and bias currents are derived.
CC
Submit Documentation Feedback
3
www.ti.com
7
11
9
8
10
2
3
1
2591TA
4
6
5
M0033-01
GND GND
GND
OUT–
RSSI
GND
OUT+
V
CC
FILTER
FILTER
IN
ONET2591TA
SLLS669 – SEPTEMBER 2005
BOND PAD ASSIGNMENT
The ONET2591TA is available as a bare die. The locations of the bond pads are shown in the following figure.
PAD
NAME NO.
FILTER 5, 6 Analog
GND 1, 2, 10, 11 Supply
IN 7 Analog input Data input to TIA (photodiode anode)
OUT+ 3 Analog output Non-inverted data output. On-chip 50- Ω back-terminated to VCC.
OUT– 9 Analog output Inverted data output. On-chip 50- Ω back-terminated to VCC.
RSSI 8 Analog output gain can be adjusted by choosing the external resistor; however, for proper operation, ensure
V
CC
4 Supply 3.3-V, +10%/–12% supply voltage
BOND PAD DESCRIPTION
TYPE DESCRIPTION
Bias voltage for photodiode (cathode). These pads connect through an internal 220- Ω resistor to
V
and a 200-pF filter capacitor to ground (GND). Both FILTER pads are connected on-chip.
CC
For additional photodiode supply filtering, connect an external capacitor from one of the FILTER
pads to GND. The FILTER pad(s) must be connected to the photodiode for the AGC to function.
Circuit ground. All GND pads are connected on die. Bonding all pads is optional; however, for
optimum performance a good ground connection is mandatory.
Analog output current proportional to the input data amplitude. Indicates the strength of the
received signal (RSSI). Must be sunk through an external resistor to ground (GND). The RSSI
that the voltage at the RSSI pad never exceeds V
this pad must be bonded to ground (GND) to ensure proper operation.
– 0.65 V. If the RSSI feature is not used,
CC
4
Submit Documentation Feedback
www.ti.com
ONET2591TA
SLLS669 – SEPTEMBER 2005
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
V
CC
V
, V
OUT–
, V
OUT+
OUT–
FILTER
V
RSSI
I
IN
I
FILTER
I
, I
OUT+
ESD
T
J,max
T
stg
T
A
Supply voltage
, Voltage at FILTER, OUT+, OUT–, RSSI
Current into IN –0.7 mA to 2.5 mA
Current into FILTER – 8 mA to 8 mA
Continuous current at outputs – 8 mA to 8 mA
ESD rating at all pins except IN
ESD rating at IN
Maximum junction temperature 125 ° C
Storage temperature range –65 ° C to 85 ° C
Operating free-air temperature range –40 ° C to 85 ° C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) For optimum high-frequency performance, the input pin has reduced ESD protection.
(2)
(3)
(3)
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
V
CC
T
A
L
FILTER
L
IN
Supply voltage 2.9 3.3 3.6 V
Operating free-air temperature –40 85 ° C
, Wire-bond inductor at pins FILTER and IN 0.8 nH
(1)
–0.3 V to 4 V
(2)
–0.3 V to 4 V
1.5 kV (HBM)
900 V (HBM)
MIN NOM MAX UNIT
DC ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted). Typical values are at V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
CC
I
VCC
V
IN
R
OUT
R
FILTER
Supply voltage 2.9 3.3 3.6 V
Average photodiode current IPD= 0 10 14 20
Supply current mA
mA
Average photodiode current IPD= 1 13 17 23
mA
Input bias voltage 0.85 1.05 V
Output resistance Single-ended to V
CC
Photodiode filter resistance 220 Ω
= 3.3 V and TA= 25 ° C.
CC
40 50 60 Ω
Submit Documentation Feedback
5
www.ti.com
0
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
2400
Average Input Current − µA
Input Referred Noise Current − nA
RMS
10 100 1k
G001
TA − Ambient Temperature − °C
0
100
200
300
400
500
600
700
800
−40−30−20−10 0 10 20 30 40 50 60 70 80 90
Input Referred Noise Current − nA
RMS
G002
ONET2591TA
SLLS669 – SEPTEMBER 2005
AC ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted). Typical values are at V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
i
IN-OVL
A
RSSI
Z
21
f
H,3dB
f
L,3dB
f
H,3dB,RSSI
i
N-IN
DJ Deterministic jitter ps
V
OUT,D,MAX
(1) The RSSI output is a current output, which requires a resistive load to ground (GND). The voltage gain can be adjusted for the intended
application by choosing the external resistor. However, for proper operation of the ONET2591TA, ensure that the voltage at RSSI never
exceeds V
(2) The minimum small-signal bandwidth is specified over process corners, temperature, and supply voltage variation. The assumed
photodiode capacitance is 0.6 pF. The bond-wire inductance is 0.8 nH. The small-signal bandwidth strongly depends on environmental
parasitics. Careful attention to layout parasitics and external components is necessary to achieve optimal performance.
(3) Input referred RMS noise is (RMS output noise)/(gain @ 100 MHz). The maximum input referred noise is specified over process
corners, temperature, and supply voltage variation.
AC input overload current 2 mA
RSSI gain Resistive load to GND
(1)
RSSI output offset current (no light) 10 40 µ A
Small-signal transimpedance Differential output; input current iIN= 2000 2600 3200 Ω
50 µ A
p-p
Small-signal bandwidth C
= 0.6 pF, iIN= 50 µ A
PD
Low-frequency, –3-dB bandwidth – 3 dB, input current iIN< 50 µ A
(2)
p-p
p-p
RSSI bandwidth 3.5 MHz
Input referred RMS noise C
Input referred noise current density C
= 0.6 pF, 50 kHz–2.5 GHz
PD
= 0. 6 pF 6.6 pA/ √ Hz
PD
iIN= 50 µ A
iIN= 100 µ A
iIN= 1 mA
iIN= 2 mA
(K28.5 pattern) 8 16
p-p
p-p
(K28.5 pattern) 3 10
p-p
(K28.5 pattern) 4 14
p-p
Maximum differential output voltage Input current iIN= 1 mA
– 0.65 V.
CC
(K28.5 pattern) 8.5 20
(3)
p-p
= 3.3 V and TA= 25 ° C.
CC
0.95 1 1.05 A/A
1.8 GHz
40 70 kHz
280 345 nA
140 200 310 mV
p-p
p-p
p-p
UNFILTERED INPUT REFERRED NOISE UNFILTERED INPUT REFERRED NOISE
AVERAGE INPUT CURRENT AMBIENT TEMPERATURE
6
TYPICAL CHARACTERISTICS
Typical operating condition is at V
vs vs
Figure 2. Figure 3.
Submit Documentation Feedback
= 3.3 V and TA= 25 ° C.
CC
www.ti.com
TA − Ambient Temperature − °C
1000
1500
2000
2500
3000
3500
4000
−40−30−20−10 0 10 20 30 40 50 60 70 80 90
Transimpedance − Ω
G003
Average Input Current − µA
0
500
1000
1500
2000
2500
3000
0 100 200 300 400 500 600 700 800 900 1000
Transimpedance − Ω
G004
TA − Ambient Temperature − °C
1.50
1.55
1.60
1.65
1.70
1.75
1.80
1.85
1.90
1.95
2.00
−40−30−20−10 0 10 20 30 40 50 60 70 80 90
Bandwidth − GHz
G005
60
61
62
63
64
65
66
67
68
69
70
f − Frequency − MHz
Transimpedance − dBΩ
100 1k 5k
G006
200 500 2k
Typical operating condition is at V
TYPICAL CHARACTERISTICS (continued)
= 3.3 V and TA= 25 ° C.
CC
ONET2591TA
SLLS669 – SEPTEMBER 2005
SMALL-SIGNAL TRANSIMPEDANCE TRANSIMPEDANCE
vs vs
AMBIENT TEMPERATURE AVERAGE INPUT CURRENT
Figure 4. Figure 5.
SMALL-SIGNAL BANDWIDTH SMALL-SIGNAL TRANSFER CHARACTERISTICS
vs
AMBIENT TEMPERATURE
Figure 6. Figure 7.
Submit Documentation Feedback
7
www.ti.com
Input Current − µA
P−P
0
1
2
3
4
5
6
7
8
9
10
0 400 800 1200 1600 2000
Deterministic Jitter − ps
G008
Average Input Current − µA
0
200
400
600
800
1000
1200
0 200 400 600 800 1000 1200
RSSI Output Current − µA
G007
Time − 100ps/Div
Differential Output Voltage − 5mV/Div
G009
Time − 100ps/Div
Differential Output Voltage − 50mV/Div
G010
ONET2591TA
SLLS669 – SEPTEMBER 2005
Typical operating condition is at V
TYPICAL CHARACTERISTICS (continued)
= 3.3 V and TA= 25 ° C.
CC
RSSI OUTPUT CURRENT DETERMINISTIC JITTER
vs vs
AVERAGE INPUT CURRENT INPUT CURRENT
Figure 8. Figure 9.
OUTPUT EYE DIAGRAM AT 2.5 GBPS AND 10- µ A
CURRENT INPUT CURRENT
INPUT OUTPUT EYE DIAGRAM AT 2.5 GBPS AND 100- µ A
p-p
p-p
8
Figure 10. Figure 11.
Submit Documentation Feedback
www.ti.com
Time − 100ps/Div
Differential Output Voltage − 50mV/Div
G011
Time − 100ps/Div
Differential Output Voltage − 50mV/Div
G012
Typical operating condition is at V
TYPICAL CHARACTERISTICS (continued)
= 3.3 V and TA= 25 ° C.
CC
ONET2591TA
SLLS669 – SEPTEMBER 2005
OUTPUT EYE DIAGRAM AT 2.5 GBPS AND 1-mA
CURRENT CURRENT
Figure 12. Figure 13.
INPUT OUTPUT EYE DIAGRAM AT 2.5 GBPS AND 2-mA
p-p
INPUT
p-p
Submit Documentation Feedback
9
www.ti.com
S0097-01
7
11
98 10
23 1
4
6
5
V
CC
GND
OUT–
OUT+
RSSI
ONET
2591TA
PAD#1
220 W
200 pF 275 pF
C
Optional
FILTER
C
0 to 2 pF
Optional
NBW
C
0.1 F2m
C
0.1 F1m
ONET2591TA
SLLS669 – SEPTEMBER 2005
APPLICATION INFORMATION
Figure 14 shows an application circuit for an ONET2591TA being used in a typical fiber-optic receiver. The
ONET2591TA converts the electrical current generated by the PIN photodiode into a differential output voltage.
The FILTER input provides a dc bias voltage for the PIN that is low-pass filtered by the combination of the
internal 220- Ω resistor and 200-pF capacitor. For additional power-supply filtering, use an external capacitor,
C
photodiode must be connected to a FILTER pad for the AGC to function correctly.
The RSSI output is used to mirror the photodiode average current and must be connected via a resistor to GND.
The voltage gain can be adjusted for the intended application by choosing the external resistor. However, for
proper operation of the ONET2591TA, ensure that the voltage at RSSI never exceeds V
output is not used, it must be grounded.
The OUT+ and OUT– pads are internally terminated by 50- Ω pullup resistors to V
ac-coupled (e.g., using C1 = C2 = 0.1 µ F) to the succeeding device. An additional capacitor, C
differentially connected between the two output pins OUT+ and OUT–, can be used to limit the noise bandwidth
and thus optimize the noise performance.
. Because the voltage drop across the 220- Ω resistor is sensed and used by the AGC circuit, the
FILTER
– 0.65 V. If the RSSI
CC
. The outputs must be
CC
NBW
, which is
Figure 14. Basic Application Circuit
ASSEMBLY RECOMMENDATIONS
When packaging the ONET2591TA, careful attention to parasitics and external components is necessary to
achieve optimal performance. Recommendations that optimize performance include:
1. Minimize total capacitance on the IN pad by using a low-capacitance photodiode and paying attention to
can be used to improve photodiode supply filtering.
FILTER
can be used to limit the noise bandwidth.
NBW
Submit Documentation Feedback
and GND. Supply-voltage filtering is provided
CC
stray capacitances. Place the photodiode close to the ONET2591TA die to minimize the bond wire length
and thus the parasitic inductance.
2. An external filter capacitance C
3. Use identical termination and symmetrical transmission lines at the ac-coupled differential output pins OUT+
and OUT–. A differential capacitor C
4. Use short bond-wire connections for the supply terminals V
on-chip. Filtering can be improved by using an additional external capacitor.
10
www.ti.com
7
11
9
8
10
2
3
1
2591TA
4
6
5
M0033-02
x
y
780 mm
1180 mm
Origin
0,0
M0033-03
x
y
780 mm
1180 mm
Origin
0,0
ONET2591TA
SLLS669 – SEPTEMBER 2005
CHIP DIMENSIONS AND PAD LOCATIONS
Overall chip dimensions and depiction of the bond-pad locations are given in Figure 15 . Layout of the chip
componentry is shown in Figure 16 .
Figure 15. Chip Dimensions and Pad Locations
Figure 16. Chip Layout
Submit Documentation Feedback
11
www.ti.com
M0034-01
VCC
OUT+
GND
RSSI
OUT–
2.54 mm
ONET2591TA
SLLS669 – SEPTEMBER 2005
Pad Locations and Descriptions for the ONET2591TA
PAD SYMBOL TYPE DESCRIPTION
1 100 1063 GND Supply Circuit ground
2 100 938 GND Supply Circuit ground
3 100 570 OUT+ Analog output Non-inverted data output
4 90 127 V
5 265 127 FILTER Analog Bias voltage for photodiode
6 390 127 FILTER Analog Bias voltage for photodiode
7 515 127 IN Analog input Data input to TIA
8 690 127 RSSI Analog output RSSI output signal
9 680 570 OUT– Analog output Inverted data output
10 680 938 GND Supply Circuit ground
11 680 1063 GND Supply Circuit ground
DIE INFORMATION
Die size: 1180 µ m × 780 µ m
Die thickness: 8 mils (203 µ m)
Pad metallization: 99.5% Al, 0.5% Cu
Pad size: octagonal pads, 120 µ m × 100 µ m
Passivation composition: 6000 Å silicon nitride
Backside contact: none
Die ID: 2591TA
COORDINATES
x ( µ m) y ( µ m)
CC
Supply 3.3-V supply voltage
TO46 LAYOUT EXAMPLES
Examples for layouts (top view) in 5-pin and 4-pin TO46 headers are given in Figure 17 and Figure 18 ,
respectively.
12
Figure 17. TO46 5-Pin Layout Example Using the ONET2591TA
Submit Documentation Feedback
www.ti.com
VCC
OUT–
GND
OUT+
M0034-02
2.54 mm
ONET2591TA
SLLS669 – SEPTEMBER 2005
Figure 18. TO46 4-Pin Layout Example Using the ONET2591TA
Submit Documentation Feedback
13
PACKAGE OPTION ADDENDUM
www.ti.com
2-Feb-2006
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
ONET2591TAY ACTIVE XCEPT Y 11 1 Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(2)
Lead/Ball Finish MSL Peak Temp
Call TI N / A for Pkg Type
(3)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Interface interface.ti.com Digital Control www.ti.com/digitalcontrol
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
Telephony www.ti.com/telephony
Video & Imaging www.ti.com/video
Wireless www.ti.com/wireless
Mailing Address: Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2006, Texas Instruments Incorporated
Loading...