No External Programming Voltage Needed
Programmable Code Protection by Security
Fuse
DFamily Members Include:
-- MSP430F2416:
92KB+256B Flash Memory, 4KB RAM
-- MSP430F2417:
92KB+256B Flash Memory, 8KB RAM
-- MSP430F2418:
116KB+256B Flash Memory, 8KB RAM
-- MSP430F2419:
120KB+256B Flash Memory, 4KB RAM
-- MSP430F2616:
92KB+256B Flash Memory, 4KB RAM
-- MSP430F2617:
92KB+256B Flash Memory, 8KB RAM
-- MSP430F2618:
116KB+256B Flash Memory, 8KB RAM
-- MSP430F2619:
120KB+256B Flash Memory, 4KB RAM
DAvailablein80-PinQuadFlatPack(QFP)
and 64-Pin QFP (See Available Options)
DFor Complete Module Descriptions, See the
MSP430x2xx Family User’s Guide,
Literature Number SLAU144
†
The MSP430F241x devices are identical to the MSP430F261x
devices, with the exception that the DAC12 modules and the DMA
controller are not implemented.
The Texas Instruments MSP430 family of ultralow-power microcontrollers consists of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with five low-power
modes is optimized to achieve extended battery life in por table measurement applications. The device features
a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code
efficiency. The calibrated digitally controlled oscillator (DCO) allows wake-up from low-power modes to active
mode in less than 1 μs.
The MSP430F261x/241x series are microcontroller configurations with two built-in 16-bit timers, a fast 12-bit
A/D converter, a comparator, dual 12-bit D/A converters, four universal serial communication interface (USCI)
modules, DMA, and up to 64 I/O pins. The MSP430F241x devices are identical to the MSP430F261x devices,
with the exception that the DAC12 and the DMA modules are not implemented.
Typical applications include sensor systems, industrial control applications, hand-held meters, etc.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
I2C is a registered trademark of Philips Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
General-purpose digital I/O pin/switch all PWM digital output ports to high impedance -- Timer_B
TB0 to TB6/SVS comparator output
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I/ODESCRIPTIO
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Terminal Functions (Continued)
TERMINAL
NO.
NAME
P8.466I/OGeneral-purpose digital I/O pin
P8.567I/OGeneral-purpose digital I/O pin
P8.6/XT2OUT68OGeneral-purpose digital I/O pin/Output terminal of crystal oscillator XT2
P8.7/XT2IN69I
XT2OUT52OOutput terminal of crystal oscillator XT2
XT2IN53IInput port for crystal oscillator XT2
RST/NMI5874IReset input, nonmaskable interrupt input port, or bootstrap loader start (in flash devices).
TCK5773ITest clock (JTAG). TCK is the clock input port for device programming test and bootstrap loader start.
TDI/TCLK5571ITest data input or test clock input. The device protection fuse is connected to TDI/TCLK.
TDO/TDI5470I/OTest data output port. TDO/TDI data output or programming data input terminal.
TMS5672ITest mode select. TMS is used as an input port for device programming and test.
Ve
/DAC0
REF+
V
REF+
V
/Ve
REF--
REF--
XIN88IInput port for crystal oscillator XT1. Standard or watch crystals can be connected.
XOUT99OOutput port for crystal oscillator XT1. Standard or watch crystals can be connected.
†
MSP430F261x devices only
64
PIN80PIN
General-purpose digital I/O pin/Input port for crystal oscillator XT2. Only standard crystals can be
connected.
†
1010IInput for an external reference voltage/DAC12.0 output
77OOutput of positive terminal of the reference voltage in the ADC12
1111I
Negative terminal for the reference voltage for both sources, the internal reference voltage, or an
external applied reference voltage
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short-form description
CPU
The MSP430 CPU has a 16-bit RISC architecture
that is highly transparent to the application. All
operations, other than program-flow instructions,
areperformedasregisteroperationsin
conjunction with seven addressing modes for
source operand and four addressing modes for
destination operand.
The CPU is integrated with 16 registers that
provide reduced instruction execution time. The
register-to-register operation execution time is
one cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as
program counter, stack pointer, status register,
andconstantgenerator,respectively. The
remainingregistersaregeneral-purpose
registers.
Peripherals are connected to the CPU using data,
address, and control buses, and can be handled
with all instructions.
instruction set
The instruction set consists of 51 instructions with
three formats and seven address modes. Each
instruction can operate on word and byte data.
Table 1 shows examples of the three types of
instruction formats; the address modes are listed
in Table 2.
The MSP430 has one active mode and five software selectable low-power modes of operation. An interrupt
event can wake up the device from any of the five low-power modes, service the request, and restore back to
the low-power mode on return from the interrupt program.
The following six operating modes can be configured by software:
DActive mode (AM)
--All clocks are active.
DLow-power mode 0 (LPM0)
--CPU is disabled.
ACLK and SMCLK remain active. MCLK is disabled.
DLow-power mode 1 (LPM1)
--CPU is disabled.
ACLK and SMCLK remain active. MCLK is disabled.
DCO’s dc-generator is disabled if DCO not used in active mode.
DLow-power mode 2 (LPM2)
--CPU is disabled.
MCLK and SMCLK are disabled.
DCO’s dc-generator remains enabled.
ACLK remains active.
DLow-power mode 3 (LPM3)
--CPU is disabled.
MCLK and SMCLK are disabled.
DCO’s dc-generator is disabled.
ACLK remains active.
DLow-power mode 4 (LPM4)
--CPU is disabled.
ACLK is disabled.
MCLK and SMCLK are disabled.
DCO’s dc-generator is disabled.
Crystal oscillator is stopped.
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0x0FFDAto1
3to0
Reserved(seeNotes7and8)Reserved
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interrupt vector addresses
The interrupt vectors and the power-up starting address are located in the address range 0x0FFFF to 0x0FFC0.
The vector contains the 16-bit address of the appropriate interrupt-handler instruction sequence. If the reset
vector (0x0FFFE) contains 0xFFFF (e.g., flash is not programmed), the CPU enters LPM4 after power-up.
Timer_A3TACCR0 CCIFG (see Note 3)Maskable0x0FFF225
Timer_A3
USCI_A0/USCI_B0 receive
USCI_B0 I2C status
USCI_A0/USCI_B0 transmit
USCI_B0 I2C receive/transmit
ADC12ADC12IFG (see Notes 2 and 3)Maskable0x0FFEA21
I/O port P2 (eight flags)P2IFG.0 to P2IFG.7 (see Notes 2 and 3)Maskable0x0FFE619
I/O port P1 (eight flags)P1IFG.0 to P1IFG.7 (see Notes 2 and 3)Maskable0x0FFE418
USCI_A0/USCI_B1 receive
USCI_B1 I2C status
USCI_A1/USCI_B1 transmit
USCI_B1 I2C receive/transmit
DMA
DAC12
NOTES: 1. A reset is executed if the CPU tries to fetch instructions from within the module register memory address range (0x00000 to 0x001FF)
or from within unused address ranges.
2. Multiple source flags.
3. Interrupt flags are located in the module.
4. In SPI mode: UCB0RXIFG. In I2C mode: UCALIFG, UCNACKIFG, ICSTTIFG, UCSTPIFG.
5. In UART/SPI mode: UCB0TXIFG. In I2C mode: UCB0RXIFG, UCB0TXIFG.
6. (Non)maskable: The individual interrupt-enable bit can disable an interrupt event, but the general-interrupt enable cannot.
7. The address 0x0FFBE is used as bootstrap loader security key (BSLSKEY).
A 0x0AA55 at this location disables the BSL completely.
A zero disables the erasure of the flash if an invalid password is supplied.
8. The interrupt vectors at addresses 0x0FFDA to 0x0FFC0 are not used in this device and can be used for regular program code if
necessary.
ACCVIFG (see Notes 2 and 6)
TBCCR1 to TBCCR6 CCIFGs, TBIFG
TAIFG (see Notes 2 and 3)
UCA0RXIFG, UCB0RXIFG
UCA0TXIFG, UCB0TXIFG
UCA1RXIFG, UCB1RXIFG
UCA1TXIFG, UCB1TXIFG
DMA0IFG, DMA1IFG, DMA2IFG
DAC12_0IFG, DAC12_1IFG
PORIFG
WDTIFG
RSTIFG
KEYV (see Note 2)
NMIIFG
OFIFG
TBCCR0 CCIFG
(see Note 3)
(see Notes 2 and 3)
TACCR1 CCIFG
TACCR2 CCIFG
(see Notes 2 and 4)
(see Note 2 and 4)
(see Notes 2 and 4)
(see Notes 2 and 5)
(see Notes 2 and 3)
(see Notes 2 and 3)
Reset0x0FFFE31, highest
(Non)maskable
(Non)maskable
(Non)maskable
Maskable0x0FFFA29
Maskable0x0FFF828
Maskable0x0FFF024
Maskable0x0FFEE23
Maskable0x0FFEC22
Maskable0x0FFE217
Maskable0x0FFE016
Maskable0x0FFDE15
Maskable0x0FFDC14
0x0FFFC30
0x0FFE820
0x0FFC0lowest
,
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special function registers
Most interrupt enable bits are collected in the lowest address space. Special-function register bits not allocated
to a functional purpose are not physically present in the device. This arrangement provides simple software
access.
interrupt enable 1 and 2
Address76543210
00h
WDTIEWatchdog timer interrupt enable. Inactive if watchdog mode is selected.
Active if watchdog timer is configured as general-purpose timer.
The MSP430 BSL enables users to program the flash memory or RAM using a UART serial interface. Access
to the MSP430 memory via the BSL is protected by a user-defined password. For complete description of the
features of the BSL and its implementation, see the application report Features of the MSP430 BootstrapLoader, literature number SLAA089.
BSL FunctionPM, RTD Package Pins
Data Transmit13 - P1.1
Data Receive22 - P2.2
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flash memory
The flash memory can be programmed via the JTAG port, the bootstrap loader, or in-system by the CPU. The
CPU can perform single-byte and single-word writes to the flash memory. Features of the flash memory include:
DFlash memory has n segments of main memory and four segments of information memory (A to D) of 64
bytes each. Each segment in main memory is 512 bytes in size.
DSegments 0 to n may be erased in one step, or each segment may be individually erased.
DSegments A to D can be erased individually, or as a group with segments 0 to n.
Segments A to D are also called information memory.
DSegment A contains calibration data. After reset, segment A is protected against programming or erasing.
It can be unlocked, but care should be taken not to erase this segment if the calibration data is required.
DFlash content integrity check with marginal read modes
peripherals
Peripherals are connected to the CPU through data, address, and control buses and can be handled using all
instructions. For complete module descriptions, see the MSP430x2xx Family User’s Guide, literature number
SLAU144.
DMA controller
The DMA controller allows movement of data from one memory address to another without CPU intervention.
For example, the DMA controller can be used to move data from the ADC12 conversion memory to RAM. Using
the DMA controller can increase the throughput of peripheral modules. The DMA controller reduces system
power consumption by allowing the CPU to remain in sleep mode without having to awaken to move data to
or from a peripheral.
oscillator and system clock
The clock system in the MSP430x241x and MSP43x261x family of devices is supported by the basic clock
module that includes support for a 32768-Hz watch crystal oscillator, an internal very low power, low frequency
oscillator,an internal digitally-controlled oscillator (DCO) and a high frequency crystal oscillator. The basic clock
module is designed to meet the requirements of both low system cost and low-power consumption. The internal
DCO provides a fast turn-on clock source and stabilizes in less than 1 μs. The basic clock module provides the
following clock signals:
DAuxiliary clock (ACLK), sourced from a 32768-Hz watch crystal, a high frequency crystal, or a very
low-power LF oscillator
DMain clock (MCLK), the system clock used by the CPU
DSub-Main clock (SMCLK), the subsystem clock used by the peripheral modules
The DCO settings to calibrate the DCO output frequency are stored in the information memory segment A.
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calibration data stored in information memory segment A
Calibration data is stored for the DCO and for the ADC12. It is organized in a tag-length-value (TLV) structure.
TAGS USED BY THE ADC CALIBRATION TAGS
NAMEADDRESSVALU EDESCRIPTION
TAG_DCO_300x10F60x01DCO frequency calibration at VCC = 3 V and TA=25°C at calibration
TAG_ADC12_10x10DA0x10ADC12_1 calibration tag
TAG_EMPTY--0xFEIdentifier for empty memory areas
LABELS USED BY THE ADC CALIBRATION TAGS
LABELCONDITION AT CALIBRATION / DESCRIPTIONSIZEADDRESS OFFSET
The brownout circuit is implemented to provide the proper internal reset signal to the device during power on
and power off. The SVS circuitry detects if the supply voltage drops below a user selectable level and supports
both supply voltage supervision (the device is automatically reset) and supply voltage monitoring (SVM, the
device is not automatically reset).
The CPU begins code execution after the brownout circuit releases the device reset. However, V
have ramped to V
reaches V
V
CC
CC(min)
CC(min)
at that time. The user must ensure that the default DCO settings are not changed until
. If desired, the SVS circuit can be used to determine when VCCreaches V
may not
CC
CC(min)
.
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digital I/O
There are up to eight 8-bit I/O ports implemented—ports P1 through P8:
DAll individual I/O bits are independently programmable.
DAny combination of input, output, and interrupt conditions is possible.
DEdge-selectable interrupt input capability for all eight bits of ports P1 and P2.
DRead/write access to port-control registers is supported by all instructions.
DEach I/O has an individually programmable pullup/pulldown r esistor.
DPorts P7/P8 can be accessed word wise.
watchdog timer+ (WDT+)
The primary function of the WDT+ module is to perform a controlled system restart after a software problem
occurs. If the selected time interval expires, a system reset is generated. If the watchdog function is not needed
in an application, the module can be configured as an interval timer and can generate interrupts at selected time
intervals.
hardware multiplier
The multiplication operation is supported by a dedicated peripheral module. The module performs 16×16,
16×8, 8×16, and 8×8 bit operations. The module is capable of supporting signed and unsigned multiplication
as well as signed and unsigned multiply and accumulate operations. The result of an operation can be accessed
immediately after the operands have been loaded into the peripheral registers. No additional clock cycles are
required.
universal serial communication interface (USCI)
The USCI modules are used for serial data communication. The USCI module supports synchronous
communication protocols such as SPI (3 pin or 4 pin) or I
UART, enhanced UART with automatic baudrate detection (LIN), and IrDA.
The USCI A module provides support for SPI (3 pin or 4 pin), UART, enhanced UART, and IrDA.
The USCI B module provides support for SPI (3 pin or 4 pin) and I
2
C, and asynchronous combination protocols such as
2
C.
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timer_A3
Timer_A3 is a 16-bit timer/counter with three capture/compare registers. Timer_A3 can support multiple
capture/compares, PWM outputs, and interval timing. Timer_A3 also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare
registers.
TIMER_A3 SIGNAL CONNECTIONS
INPUT PIN
NUMBER
12 - P1.0TACLKTACL K
21 - P2.1TAINCLKINCLK
13 - P1.1TA 0CCI0A
22 - P2.2TA 0CCI0B
14 - P1.2TA 1CCI1A
15 - P1.3TA 2CCI2A
DEVICE INPUT
SIGNAL
ACLKACLK
SMCLKSMCLK
DV
SS
DV
CC
CAOUT (internal)CCI1B
DV
SS
DV
CC
ACLK (internal)CCI2B
DV
SS
DV
CC
MODULE INPUT
NAME
GND
V
CC
GND
V
CC
GND
V
CC
MODULE
BLOCK
TimerN
CCR0TA0
CCR1
CCR2TA2
MODULE OUTPUT
SIGNAL
TA1
OUTPUT PIN NUMBER
13 - P1.1
17 - P1.5
27 - P2.7
14 - P1.2
18 - P1.6
23 - P2.3
ADC12 (internal)
DAC12_0 (internal)
DAC12_1 (internal)
15 - P1.3
19 - P1.7
24 - P2.4
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timer_B7
Timer_B7 is a 16-bit timer/counter with seven capture/compare registers. Timer_B7 can support multiple
capture/compares, PWM outputs, and interval timing. Timer_B7 also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare
registers.
TIMER_B3/B7 SIGNAL CONNECTIONS
INPUT PIN
NUMBER
DEVICE INPUT
SIGNAL
MODULE INPUT
NAME
43 - P4.7TBCLKTBCLK
ACLKACLK
SMCLKSMCLK
43 - P4.7TBCLKINCLK
36 - P4.0TB0CCI0A
36 - P4.0TB0CCI0B
DV
DV
SS
CC
GND
V
CC
37 - P4.1TB1CCI1A
37 - P4.1TB1CCI1B
DV
DV
SS
CC
GND
V
CC
38 - P4.2TB2CCI2A
38 - P4.2TB2CCI2B
DV
DV
SS
CC
GND
V
CC
39 - P4.3TB3CCI3A
39 - P4.3TB3CCI3B
DV
DV
SS
CC
GND
V
CC
40 - P4.4TB4CCI4A
40 - P4.4TB4CCI4B
DV
DV
SS
CC
GND
V
CC
41 - P4.5TB5CCI5A
41 - P4.5TB5CCI5B
DV
DV
SS
CC
GND
V
CC
42 - P4.6TB6CCI6A
ACLK (internal)CCI6B
DV
DV
SS
CC
GND
V
CC
†
MODULE
BLOCK
MODULE OUTPUT
SIGNAL
TimerN
CCR0TB0
CCR1TB1
CCR2TB2
CCR3TB3
CCR4TB4
CCR5TB5
CCR6TB6
OUTPUT PIN NUMBER
36 - P4.0
ADC12 (internal)
37 - P4.1
ADC12 (internal)
38 - P4.2
DAC_0(internal)
DAC_1(internal)
39 - P4.3
40 - P4.4
41 - P4.5
42 - P4.6
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comparator_A+
The primary function of the comparator_A+ module is to support precision slope analog-to-digital conversions,
battery-voltage supervision, and monitoring of external analog signals.
ADC12
The ADC12 module supports fast, 12-bit analog-to-digital conversions. The module implements a 12-bit SAR
core, sample select control, reference generator, and a 16-word conversion-and-control buffer. The
conversion-and-control buffer allows up to 16 independent ADC samples to be converted and stored without
any CPU intervention.
DAC12
The DAC12 module is a 12-bit, R-ladder, voltage output DAC. The DAC12 may be used in 8-bit or 12-bit mode
and may be used in conjunction with the DMA controller. When multiple DAC12 modules are present, they may
be grouped together for synchronous operation.
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peripheral file map
†
DMA
†
DAC12
ADC12
†
MSP430F261x devices only
DMA channel 2 transfer sizeDMA2SZ0x01F2
DMA channel 2 destination addressDMA2DA0x01EE
DMA channel 2 source addressDMA2SA0x01EA
DMA channel 2 controlDMA2CTL0x01E8
DMA channel 1 transfer sizeDMA1SZ0x01E6
DMA channel 1 destination addressDMA1DA0x01E2
DMA channel 1 source addressDMA1SA0x01DE
DMA channel 1 controlDMA1CTL0x01DC
DMA channel 0 transfer sizeDMA0SZ0x01DA
DMA channel 0 destination addressDMA0DA0x01D6
DMA channel 0 source addressDMA0SA0x01D2
DMA channel 0 controlDMA0CTL0x01D0
DMA module interrupt vector wordDMAIV0x0126
DMA module control 1DMACTL10x0124
DMA module control 0DMACTL00x0122
DAC12_1 dataDAC12_1DAT0x01CA
DAC12_1 controlDAC12_1CTL0x01C2
DAC12_0 dataDAC12_0DAT0x01C8
DAC12_0 controlDAC12_0CTL0x01C0
Interrupt-vector-word registerADC12IV0x01A8
Inerrupt-enable registerADC12IE0x01A6
Inerrupt-flag registerADC12IFG0x01A4
Control register 1ADC12CTL10x01A2
Control register 0ADC12CTL00x01A0
Conversion memory 15ADC12MEM150x015E
Conversion memory 14ADC12MEM140x015C
Conversion memory 13ADC12MEM130x015A
Conversion memory 12ADC12MEM120x0158
Conversion memory 11ADC12MEM110x0156
Conversion memory 10ADC12MEM100x0154
Conversion memory 9ADC12MEM90x0152
Conversion memory 8ADC12MEM80x0150
Conversion memory 7ADC12MEM70x014E
Conversion memory 6ADC12MEM60x014C
Conversion memory 5ADC12MEM50x014A
Conversion memory 4ADC12MEM40x0148
Conversion memory 3ADC12MEM30x0146
Conversion memory 2ADC12MEM20x0144
Conversion memory 1ADC12MEM10x0142
Conversion memory 0ADC12MEM00x0140
PERIPHERAL FILE MAP
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(continued)
Timer_B7
Timer_A3
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PERIPHERAL FILE MAP (CONTINUED)
ADC memory-control register15ADC12MCTL15 0x008F
ADC memory-control register14ADC12MCTL14 0x008E
ADC memory-control register13ADC12MCTL13 0x008D
ADC memory-control register12ADC12MCTL12 0x008C
ADC memory-control register11ADC12MCTL11 0x008B
ADC memory-control register10ADC12MCTL10 0x008A
ADC memory-control register9ADC12MCTL90x0089
ADC memory-control register8ADC12MCTL80x0088
ADC memory-control register7ADC12MCTL70x0087
ADC memory-control register6ADC12MCTL60x0086
ADC memory-control register5ADC12MCTL50x0085
ADC memory-control register4ADC12MCTL40x0084
ADC memory-control register3ADC12MCTL30x0083
ADC memory-control register2ADC12MCTL20x0082
ADC memory-control register1ADC12MCTL10x0081
ADC memory-control register0ADC12MCTL00x0080
Capture/compare register 6TBCCR60x019E
Capture/compare register 5TBCCR50x019C
Capture/compare register 4TBCCR40x019A
Capture/compare register 3TBCCR30x0198
Capture/compare register 2TBCCR20x0196
Capture/compare register 1TBCCR10x0194
Capture/compare register 0TBCCR00x0192
Timer_B registerTBR0x0190
Capture/compare control 6TBCCTL60x018E
Capture/compare control 5TBCCTL50x018C
Capture/compare control 4TBCCTL40x018A
Capture/compare control 3TBCCTL30x0188
Capture/compare control 2TBCCTL20x0186
Capture/compare control 1TBCCTL10x0184
Capture/compare control 0TBCCTL00x0182
Timer_B controlTBCTL0x0180
Timer_B interrupt vectorTBIV0x011E
Capture/compare register 2TACCR20x0176
Capture/compare register 1TACCR10x0174
Capture/compare register 0TACCR00x0172
Timer_A registerTAR0x0170
Reserved0x016E
Reserved0x016C
Reserved0x016A
Reserved0x0168
Capture/compare control 2TACCTL20x0166
Capture/compare control 1TACCTL10x0164
Capture/compare control 0TACCTL00x0162
Timer_A controlTAC T L0x0160
Timer_A interrupt vectorTAIV0x012E
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25
MSP430x241x, MSP430x261x
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010-62245566 13810019655
MIXED SIGNAL MICROCONTROLLER
SLAS541A -- JUNE 2007 -- REVISED OCTOBER 2007
PERIPHERAL FILE MAP (CONTINUED)
Hardware
Multiplier
Flash
WatchdogWatchdog Timer controlWDTCTL0x0120
USCI A0/B0
USCI A1/B1
Sum extendSUMEXT0x013E
Result high wordRESHI0x013C
Result low wordRESLO0x013A
Second operandOP20x0138
Multiply signed +accumulate/operand1MACS0x0136
Multiply+accumulate/operand1MAC0x0134
Multiply signed/operand1MPYS0x0132
Multiply unsigned/operand1MPY0x0130
Flash control 4FCTL40x01BE
Flash control 3FCTL30x012C
Flash control 2FCTL20x012A
Flash control 1FCTL10x0128
USCI A0 auto baud rate controlUCA0ABCTL0x005D
USCI A0 transmit bufferUCA0TXBUF0x0067
USCI A0 receive bufferUCA0RXBUF0x0066
USCI A0 statusUCA0STAT0x0065
USCI A0 modulation controlUCA0MCTL0x0064
USCI A0 baud rate control 1UCA0BR10x0063
USCI A0 baud rate control 0UCA0BR00x0062
USCI A0 control 1UCA0CTL10x0061
USCI A0 control 0UCA0CTL00x0060
USCI A0 IrDA receive controlUCA0IRRCTL0x005F
USCI A0 IrDA transmit controlUCA0IRTCLT0x005E
USCI B0 transmit bufferUCB0TXBUF0x006F
USCI B0 receive bufferUCB0RXBUF0x006E
USCI B0 statusUCB0STAT0x006D
USCI B0 I2C Interrupt enableUCB0CIE0x006C
USCI B0 baud rate control 1UCB0BR10x006B
USCI B0 baud rate control 0UCB0BR00x006A
USCI B0 control 1UCB0CTL10x0069
USCI B0 control 0UCB0CTL00x0068
USCI B0 I2C slave addressUCB0SA0x011A
USCI B0 I2C own addressUCB0OA0x0118
USCI A1 auto baud rate controlUCA1ABCTL0x00CD
USCI A1 transmit bufferUCA1TXBUF0x00D7
USCI A1 receive bufferUCA1RXBUF0x00D6
USCI A1 statusUCA1STAT0x00D5
USCI A1 modulation controlUCA1MCTL0x00D4
USCI A1 baud rate control 1UCA1BR10x00D3
USCI A1 baud rate control 0UCA1BR00x00D2
USCI A1 control 1UCA1CTL10x00D1
USCI A1 control 0UCA1CTL00x00D0
USCI A1 IrDA receive controlUCA1IRRCTL0x00CF
USCI A1 IrDA transmit controlUCA1IRTCLT0x00CE
26
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MSP430x241x, MSP430x261x
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MIXED SIGNAL MICROCONTROLLER
SLAS541A -- JUNE 2007 -- REVISED OCTOBER 2007
PERIPHERAL FILE MAP (CONTINUED)
USCI A1/B1
(continued)
Comparator_A+
Basic Clock
Brownout, SVSSVS control register (reset by brownout signal) SVSCTL0x0055
†
Port PA
†
Port P8
†
Port P7
Port P6
Port P5
†
80-pin devices only
USCI B1 transmit bufferUCB1TXBUF0x00DF
USCI B1 receive bufferUCB1RXBUF0x00DE
USCI B1 statusUCB1STAT0x00DD
USCI B1 I2C Interrupt enableUCB1CIE0x00DC
USCI B1 baud rate control 1UCB1BR10x00DB
USCI B1 baud rate control 0UCB1BR00x00DA
USCI B1 control 1UCB1CTL10x00D9
USCI B1 control 0UCB1CTL00x00D8
USCI B1 I2C slave addressUCB1SA0x017E
USCI B1 I2C own addressUCB1OA0x017C
USCI A1/B1 interrupt enableUC1IE0x0006
USCI A1/B1 interrupt flagUC1IFG0x0007
Comparator_A port disableCAPD0x005B
Comparator_A control2CACTL20x005A
Comparator_A control1CACTL10x0059
Basic clock system control3BCSCTL30x0053
Basic clock system control2BCSCTL20x0058
Basic clock system control1BCSCTL10x0057
DCO clock frequency controlDCOCTL0x0056
Port PA resistor enablePAREN0x0014
Port PA selectionPASEL0x003E
Port PA directionPAD I R0x003C
Port PA outputPAO U T0x003A
Port PA inputPAI N0x0038
Port P8 resistor enableP8REN0x0015
Port P8 selectionP8SEL0x003F
Port P8 directionP8DIR0x003D
Port P8 outputP8OUT0x003B
Port P8 inputP8IN0x0039
Port P7 resistor enableP7REN0x0014
Port P7 selectionP7SEL0x003E
Port P7 directionP7DIR0x003C
Port P7 outputP7OUT0x003A
Port P7 inputP7IN0x0038
Port P6 resistor enableP6REN0x0013
Port P6 selectionP6SEL0x0037
Port P6 directionP6DIR0x0036
Port P6 outputP6OUT0x0035
Port P6 inputP6IN0x0034
Port P5 resistor enableP5REN0x0012
Port P5 selectionP5SEL0x0033
Port P5 directionP5DIR0x0032
Port P5 outputP5OUT0x0031
Port P5 inputP5IN0x0030
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
27
MSP430x241x, MSP430x261x
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010-62245566 13810019655
MIXED SIGNAL MICROCONTROLLER
SLAS541A -- JUNE 2007 -- REVISED OCTOBER 2007
PERIPHERAL FILE MAP (CONTINUED)
Port P4
Port P3
Port P2
Port P1
Special Functions
Port P4 selectionP4SEL0x001F
Port P4 resistor enableP4REN0x0011
Port P4 directionP4DIR0x001E
Port P4 outputP4OUT0x001D
Port P4 inputP4IN0x001C
Port P3 resistor enableP3REN0x0010
Port P3 selectionP3SEL0x001B
Port P3 directionP3DIR0x001A
Port P3 outputP3OUT0x0019
Port P3 inputP3IN0x0018
Port P2 resistor enableP2REN0x002F
Port P2 selectionP2SEL0x002E
Port P2 interrupt enableP2IE0x002D
Port P2 interrupt -edge selectP2IES0x002C
Port P2 interrupt flagP2IFG0x002B
Port P2 directionP2DIR0x002A
Port P2 outputP2OUT0x0029
Port P2 inputP2IN0x0028
Port P1 resistor enableP1REN0x0027
Port P1 selectionP1SEL0x0026
Port P1 interrupt enableP1IE0x0025
Port P1 interrupt -edge selectP1IES0x0024
Port P1 interrupt flagP1IFG0x0023
Port P1 directionP1DIR0x0022
Port P1 outputP1OUT0x0021
Port P1 inputP1IN0x0020
SFR interrupt flag2IFG20x0003
SFR interrupt flag1IFG10x0002
SFR interrupt enable2IE20x0001
SFR interrupt enable1IE10x0000
28
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MSP430x241x, MSP430x261x
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MIXED SIGNAL MICROCONTROLLER
SLAS541A -- JUNE 2007 -- REVISED OCTOBER 2007
absolute maximum ratings (see Note 1)
Voltage applied at VCCto V
SS
Voltage applied to any pin (see Note 2)--0.3 V to V
Diode current at any device terminal .±2mA......................................................
Storage temperature: Unprogrammed device (see Note 3)--55°C to 150°C..........................
Programmed device (see Note 3)--40°C to 105°C.............................
NOTES: 1. Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended
operating conditions” is not implied. Expos ure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
2. All voltages referenced to VSS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The v oltage
is applied to the TDI/TCLK pin when blowing the JTAG fuse.
3. Higher temperature may be applied during board soldering process according to the current JEDEC J-STD-020 specification, with
peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels.
recommended operating conditions
PARAMETERMINMAXUNIT
Supply voltage during program execution, V
Supply voltage during flash memory programming, V
Supply voltage, V
Operatingfree-air temperature, T
Processor frequency f
(see Notes 2 and 3 and Figure 1)
NOTES: 1. It is recommended to power AVCCand DVCCfrom the s ame source. A maximum difference of 0.3 V between AVCCand DVCCcan
2. The MSP430 CPU is clocked directly with MCLK.
3. Modules might have a different maximum input clock specification. See the specification of the respective module in this data sheet.
SS
A
SYSYTEM
be tolerated during power-up.
Both the high and low phase of MCLK must not exceed the pulse width of the specified maximum frequency.
(maximum MCLK frequency)
CC
CC
AVCC=DVCC=VCC(see Note 1)1.83.6V
AVCC=DVCC=VCC(see Note 1)2.23.6V
AVSS=DVSS=V
I version-- 4 085
T v ersion-- 4 0105
VCC=1.8V,
Duty cycle = 50% ± 10%
VCC=2.7V,
Duty cycle = 50% ± 10%
VCC≥ 3.3 V,
Duty cycle = 50% ± 10%
SS
--0.3 V to 4.1 V......................................................
+0.3V.......................................
CC
0.00.0V
dc4.15
dc12
dc16
MHz
°C
16 MHz
12 MHz
7.5 MHz
System Frequency -- MHz
4.15 MHz
1.8 V2.2 V2.7 V3.3 V 3.6 V
NOTE: Minimum processor frequency is defined by system clock. Flash program or erase operations require a minimum VCCof 2.2 V.
Supply Voltage -- V
Legend:
Supply voltage range
during flash memory
programming
Supply voltage range
during program execution
Figure 1. Operating Area
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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MSP430x241x, MSP430x261x
A
(
AM)
f
3
2,768
H
V
Activemode(AM
)
A
A
_
V
A
(
AM)
f
3
2,768
H
V
Activemode(AM
)
A
A
_
V
f
,
A
(
AM)
f
A
CLK
=32,768Hz/8=4,096Hz
g
V
Activemode(AM
)
Programexecutesinflas
h
ADIVMxDIVSxDIVAx11,
V
A
(
AM)
f
f
V
Activemode(AM
)
Programexecutesinflas
h
A
V
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electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
active mode supply current into VCCexcluding external current (see Notes 1 and 2)
PARAMETERTEST CONDITIONST
f
DCO=fMCLK=fSMCLK
=
ACLK
I
AM, 1MHz
I
AM, 1MHz
I
AM, 4kHz
I
AM,100kHz
NOTES: 1. All inputs are tied to 0 V or VCC. Outputs do not source or sink any current.
ctive mode
current (1 MHz)
ctive mode
current (1 MHz)
ctive mode
current (4 kHz)
ctive mode
current (100 kHz)
2. The currents are characterized with a micro crystal CC4V-T1A SMD crystal with a load capacitance of 9 pF. The internal and external
load capacitance is chosen to closely match the required 9 pF.
Program executes from flash,
BCSCTL1 = C
DCOCTL = CALDCO_1MHZ,
CPUOFF = 0, SCG0 = 0, SCG1 = 0,
OSCOFF = 0
f
DCO=fMCLK=fSMCLK
=
ACLK
Program executes in RAM,
BCSCTL1 = C
DCOCTL = CALDCO_1MHZ,
CPUOFF = 0, SCG0 = 0, SCG1 = 0,
OSCOFF = 0