TEXAS INSTRUMENTS MAX3237E Technical data

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1 2 3 4 5 6 7 8 9 10 11 12 13 14
28 27 26 25 24 23 22 21 20 19 18 17 16 15
C2+
GND
C2−
V− DOUT1 DOUT2 DOUT3
RIN1 RIN2
DOUT4
RIN3
DOUT5
EN
SHDN
C1+ V+ V
CC
C1− DIN1 DIN2 DIN3 ROUT1 ROUT2 DIN4 ROUT3 DIN5 ROUT1B MBAUD
DB, DW, OR PW PACKAGE
(TOP VIEW)
QFN PACKAGE
(TOP VIEW)
C1– DIN1 IN2 DIN3 ROUT1 ROUT2 DIN4 ROUT3
DOUT1 DOUT2 DOUT3
RIN1 RIN2
DOUT4
RIN3
NC
V−
C2–
GND
C2+
C1+V+VCCNC
DOUT5
EN
SHDN
MBAUD
NC
DIN5
NC
1 2 3 4 5 6 7 8
24 23 22 21 20 19 18 17
3132 30 29 28 27 26 25
109 111213 14 15 16
3-V TO 5.5-V MULTICHANNEL RS-232
1-MBit/s LINE DRIVER/RECEIVER
SLLS709A – MAY 2006 – REVISED OCTOBER 2006
FEATURES
Meets or Exceeds the Requirements of ESD Protection for RS-232 I/O Pins and Logic
TIA/EIA-232-F and ITU v.28 Standards Input pins
Operates With 3-V to 5.5-V V
Operates From 250 kbits/s to 1 Mbit/s ± 8 kV IEC61000-4-2, Contact Discharge
Low Standby Current . . . 1 µ A Typical ± 15 kV IEC61000-4-2, Air-Gap Discharge
External Capacitors . . . 4 × 0.1 µ F
Accepts 5-V Logic Input With 3.3-V Supply
Designed to Be Interchangeable With Maxim
MAX3237E
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Supply ± 15 kV Human-Body Model (HBM)
CC
APPLICATIONS
Battery-Powered, Hand-Held, and Portable
Equipment
PDAs and Palmtop PCs
Notebooks, Sub-Notebooks, and Laptops
Digital Cameras
Mobile Phones and Wireless Devices
MAX3237E
DESCRIPTION
The MAX3237E consists of five line drivers, three line receivers, and a dual charge-pump circuit with ± 15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to
5.5-V supply. This device operates at data signaling rates of 250 kbit/s in normal operating mode (MBAUD = GND) and 1Mbit/s when MBAUD = V
DESCRIPTION (CONTINUED)
The MAX3237E transmitters are disabled and the outputs are forced into high-impedance state when the device is in shutdown mode ( SHDN = GND) and the supply current falls to less than 1 µ A. Also, during shutdown, the onboard charge pump is disabled; V+ is lowered to V can be placed in the high-impedance state by setting enable ( EN) high. ROUT1B remains active all the time, regardless of the EN and SHDN condition.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
. The driver output slew rate is a maximum of 30 V/ µ s.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
CC
, and V– is raised toward GND. Receiver outputs also
CC
Copyright © 2006, Texas Instruments Incorporated
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MAX3237E 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER
SLLS709A – MAY 2006 – REVISED OCTOBER 2006
The MAX3237EC is characterized for operation from 0 ° C to 70 ° C. The MAX3237EI is characterized for operation from –40 ° C to 85 ° C.
AVAILABLE OPTIONS
T
A
0 ° C to 70 ° C
–40 ° C to 85 ° C
FUNCTION TABLE
INPUTS OUTPUTS
SHDN EN DOUT ROUT ROUT1B
0 0 Z 0 1 Z 1 0 Active Active Active 1 1 Active Z
PACKAGED DEVICES
MAX3237ECDBR
MAX3237ECPWR
MAX3237ECRHBR (QFN package)
MAX3237ECDWR
MAX3237EIDBR
MAX3237EIPWR
MAX3237EIRHBR (QFN package)
MAX3237EIDWR
(1) (1)
Active Active
(1)
Z
(1)
Active
Active
(1) Z = high impedance (off)
2
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DIN3
DIN2
DIN1
DOUT3
DOUT2
DOUT1
RIN1
RIN2
RIN3
ROUT1
ROUT1B
ROUT2
ROUT3
24
23
22
21
16
20
18
5
6
7
8
9
DIN4
DOUT4
19 10
DIN5
DOUT5
17 12
13
EN
SHDN
14
MBAUD
15
LOGIC DIAGRAM (POSITIVE LOGIC)
MAX3237E
3-V TO 5.5-V MULTICHANNEL RS-232
1-MBit/s LINE DRIVER/RECEIVER
SLLS709A – MAY 2006 – REVISED OCTOBER 2006
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MAX3237E 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER
SLLS709A – MAY 2006 – REVISED OCTOBER 2006
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
V
CC
V+ Positive-output supply voltage range V– Negative-output supply voltage range V+ V– Supply voltage difference
V
I
V
O
θ
JA
T
stg
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
(2) All voltages are with respect to network GND. (3) The package thermal impedance is calculated in accordance with JESD 51-7.
Supply voltage range
Input voltage range V
Output voltage range V
Short-circuit duration DOUT to GND Unlimited Package thermal impedance Lead temperature 1,6 mm (1/16 in) from case for 10 s 260 ° C Storage temperature range –65 150 ° C
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(1)
MIN MAX UNIT
(2)
(2)
(2)
(2)
–0.3 6 V –0.3 7 V
0.3 –7 V
Driver ( SHDN, MBAUD, EN) –0.3 6 Receiver –25 25 Driver –13.2 13.2 Receiver –0.3 V
(3)
CC
13 V
+ 0.3
62 ° C/W
Recommended Operating Conditions
(1)
See Figure 5
MIN NOM MAX UNIT
V
= 3.3 V 3 3.3 3.6
Supply voltage V
V
Driver and control high-level input voltage DIN, SHDN, MBAUD, EN V
IH
V
Driver and control low-level input voltage DIN, SHDN, MBAUD, EN 0 0.8 V
IL
V
Receiver input voltage –25 25 V
I
T
Operating free-air temperature ° C
A
(1) Test conditions are C1–C4 = 0.1 µ F at V
Electrical Characteristics
(1)
= 3 V to 5 V.
CC
CC
V
= 5 V 4.5 5 5.5
CC
V
= 3.3 V 2 5.5
CC
V
= 5 V 2.4 5.5
CC
MAX3237EC 0 70 MAX3237EI –40 85
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5 )
PARAMETER TEST CONDITIONS MIN TYP
I
I
I
CC
Input leakage current DIN, SHDN, MBAUD, EN 9 18 µ A
Supply current SHDN = GND 1 10 µ A (T
= 25 ° C)
A
(1) Test conditions are C1–C4 = 0.1 µ F at V (2) All typical values are at V
= 3.3 V or V
CC
Shutdown supply current
= 3 V to 5 V.
CC
= 5 V, and TA= 25 ° C.
CC
No load, SHDN = V
SHDN = RIN = GND, DIN = GND or V
CC
CC
(2)
MAX UNIT
0.5 2 mA
10 300 nA
4
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MAX3237E
3-V TO 5.5-V MULTICHANNEL RS-232
1-MBit/s LINE DRIVER/RECEIVER
SLLS709A – MAY 2006 – REVISED OCTOBER 2006
DRIVER SECTION
xxx
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5 )
PARAMETER TEST CONDITIONS MIN TYP
V V I I I r
(1) Test conditions are C1–C4 = 0.1 µ F at V (2) All typical values are at V (3) Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one
High-level output voltage DOUT at RL= 3 k to GND, DIN = GND 5 5.4 V
OH
Low-level output voltage DOUT at RL= 3 k to GND, DIN = V
OL
High-level input current VI= V
IH
Low-level input current VIat GND ± 0.01 ± 1 µ A
IL
Short-circuit output current
OS
Output resistance VCC, V+, and V– = 0 V, VO= ± 2 V 300 50k
o
output should be shorted at a time.
= 3.3 V or V
CC
(1)
(2)
MAX UNIT
CC
CC
(3)
V
= 3.6 V or 3.3 V, VO= 0 V ± 60 mA
CC
= 3 V to 5 V.
CC
= 5 V, and TA= 25 ° C.
CC
–5 –5.4 V
± 0.01 ± 1 µ A
Switching Characteristics
(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5 )
PARAMETER TEST CONDITIONS MIN TYP
CL= 1000 pF, MBAUD = GND
CL= 1000 pF, Maximum data V rate MBAUD = V
= 4.5 V to 5.5 V, RL= 3 k , 1 DIN switching, 1000
CC
CC
See Figure 1
CL= 250 pF,
V
= 3 V to 4.5 V, 1000
CC
MBAUD = V
t
Pulse skew
sk(p)
(3)
Slew rate, V
SR(tr) transition region RL= 3 k to 7 k , MBAUD = V
CL= 150 pF to 2500 pF, RL= 3 k to 7 k ,
MBAUD = V
CC
(see Figure 1 ) TA= 25 ° C
(1) Test conditions are C1–C4 = 0.1 µ F at V (2) All typical values are at V (3) Pulse skew is defined as |t
= 3.3 V or V
CC
PLH
CC
or GND, See Figure 2
CC
= 3.3 V,
= 3 V to 5 V.
CC
= 5 V, and TA= 25 ° C.
t
CC
| of each channel of the same device.
PHL
CL= 150 pF to 1000 pF
MBAUD = GND 6 30
CL= 150 pF to 2500 pF, MBAUD = GND 4 30
250
CC
24 150 V/ µ s
(2)
MAX UNIT
100 ns
kbit/s
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MAX3237E 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER
SLLS709A – MAY 2006 – REVISED OCTOBER 2006
RECEIVER SECTION
xxx
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5 )
PARAMETER TEST CONDITIONS MIN TYP
V V
V
V
V I
oz
r
i
(1) Test conditions are C1–C4 = 0.1 mF at V (2) All typical values are at V
High-level output voltage IOH= –1 mA V
OH
Low-level output voltage IOL= 1 mA 0.4 V
OL
Positive-going input threshold voltage V
IT+
Negative-going input threshold voltage V
IT–
Input hysteresis (V
hys
Output leakage current EN = V Input resistance VI= ± 3 V to ± 25 V 3 5 7 k
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS TYP
t
Propagation delay time, low- to high-level output CL= 150 pF, See Figure 3 150 ns
PLH
t
Propagation delay time, high- to low-level output CL= 150 pF, See Figure 3 150 ns
PHL
t
Output enable time CL= 150 pF, RL= 3 k , See Figure 4 2.6 µ s
en
t
Output disable time CL= 150 pF, RL= 3 k , See Figure 4 2.4 µ s
dis
t
Pulse skew
sk(p)
(1) Test conditions are C1–C4 = 0.1 µ F at V (2) All typical values are at V (3) Pulse skew is defined as |t
(3)
IT+
CC
CC
PLH
(1)
(2)
0.6 V
CC
V
= 3.3 V 1.5 2.4
CC
V
= 5 V 2 2.4
CC
V
= 3.3 V 0.6 1.1
CC
V
= 5 V 0.8 1.5
CC
V
) 0.5 V
IT–
CC
= 3 V to.5 V.
= 3.3 V or V
CC
= 5 V, and TA= 25 ° C.
CC
(1)
0.1 V
CC
± 0.05 ± 10 µ A
See Figure 3 50 ns
= 3 V to 5 V.
= 3.3 V or V
t
CC
= 5 V, and TA= 25 ° C.
CC
| of each channel of the same device.
PHL
MAX UNIT
(2)
UNIT
ESD Protection
PIN TEST CONDITIONS TYP UNIT
HBM ± 15
DIN, RIN, ROUT IEC61000-4-2, Contact Discharge ± 8 kV
IEC61000-4-2, Air-Gap Discharge ± 15
6
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PARAMETER MEASUREMENT INFORMATION
50
TEST CIRCUIT VOLTAGE W AVEFORMS
−3 V
−3 V
3 V
3 V
0 V
3 V
Output
Input
V
OL
V
OH
t
TLH
Generator
(see Note B)
R
L
RS-232 Output
t
THL
C
L
(see Note A)
SR(tr) +
6 V
t
THL
or t
TLH
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.
3 V
SHDN = V
CC
50
TEST CIRCUIT VOLTAGE W AVEFORMS
0 V
3 V
Output
Input
V
OL
V
OH
t
PLH
Generator
(see Note B)
R
L
RS-232 Output
t
PHL
C
L
(see Note A)
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.
50%
50%
1.5 V
1.5 V
3 V
SHDN = V
CC
TEST CIRCUIT VOLTAGE WAVEFORMS
50
−3 V
3 V
Output
Input
V
OL
V
OH
t
PHL
Generator
(see Note B)
t
PLH
Output
C
L
(see Note A)
3 V or 0 V
EN = GND
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.
3 V
EN = GND
1.5 V 1.5 V
50% 50%
Figure 1. Driver Slew Rate
MAX3237E
3-V TO 5.5-V MULTICHANNEL RS-232
1-MBit/s LINE DRIVER/RECEIVER
SLLS709A – MAY 2006 – REVISED OCTOBER 2006
Figure 2. Driver Pulse Skew
Figure 3. Receiver Propagation Delay Times
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TEST CIRCUIT VOLTAGE W AVEFORMS
50
Generator
(see Note B)
3 V or 0 V
Output
V
OL
V
OH
t
PZH
(S1 at GND)
3 V
−3 V
0.3 V
Output
Input
0.3 V
3 V or 0 V
EN
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns. C. t
PLZ
and t
PHZ
are the same as t
dis
.
D. t
PZL
and t
PZH
are the same as ten.
1.5 V 1.5 V
50%
t
PHZ
(S1 at GND)
t
PLZ
(S1 at VCC)
50%
t
PZL
(S1 at VCC)
R
L
S1
V
CC
GND
C
L
(see Note A)
Output
MAX3237E 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER
SLLS709A – MAY 2006 – REVISED OCTOBER 2006
PARAMETER MEASUREMENT INFORMATION (continued)
8
Figure 4. Receiver Enable and Disable Times
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V
CC
C1 C2, C3, and C4
3.3 V ± 0.15 V
3.3 V ± 0.3 V 5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.22 µF
0.047 µF
0.22 µF
0.1 µF
0.22 µF
0.33 µF 1 µF
V
CC
vs CAPACITOR VALUES
+
+
+
+
+
4
5
6
7
8
9
10
12
13 14
3
1
2
28 27
26
24
25
23
22
21
20
19
18
17
16
15
C2
C
BYPASS
= 0.1 µF
C1
C4
C2+
GND
C2− V−
C1+
V+
V
CC
C1−
DIN1
DIN2
DIN3
ROUT1
ROUT2
DIN4
ROUT3
DIN5
ROUT1B
MBAUD
DOUT1
DOUT2
DOUT3
RIN1
RIN2
DOUT4
RIN3
DOUT5
EN
SHDN
5 k
5 k
C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or
electrolytic capacitors are used, they should be connected as shown.
C3
Logic I/Os
RS-232 Port
5 k
MAX3237E
3-V TO 5.5-V MULTICHANNEL RS-232
1-MBit/s LINE DRIVER/RECEIVER
SLLS709A – MAY 2006 – REVISED OCTOBER 2006
APPLICATION INFORMATION
Figure 5. Typical Operating Circuit and Capacitor Values
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PACKAGE OPTION ADDENDUM
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PACKAGING INFORMATION
Orderable Device Status
MAX3237ECDB ACTIVE SSOP DB 28 50 Green (RoHS &
MAX3237ECDBG4 ACTIVE SSOP DB 28 50 Green (RoHS &
MAX3237ECDBR ACTIVE SSOP DB 28 2000 Green (RoHS &
MAX3237ECDBRG4 ACTIVE SSOP DB 28 2000 Green (RoHS &
MAX3237ECDW ACTIVE SOIC DW 28 20 Green (RoHS &
MAX3237ECDWG4 ACTIVE SOIC DW 28 20 Green (RoHS &
MAX3237ECDWR ACTIVE SOIC DW 28 1000 Green (RoHS &
MAX3237ECDWRG4 ACTIVE SOIC DW 28 1000 Green (RoHS &
MAX3237ECPW ACTIVE TSSOP PW 28 50 Green (RoHS &
MAX3237ECPWG4 ACTIVE TSSOP PW 28 50 Green (RoHS &
MAX3237ECPWR ACTIVE TSSOP PW 28 2000 Green (RoHS &
MAX3237ECPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS &
MAX3237EIDB ACTIVE SSOP DB 28 50 Green (RoHS &
MAX3237EIDBG4 ACTIVE SSOP DB 28 50 Green (RoHS &
MAX3237EIDBR ACTIVE SSOP DB 28 2000 Green (RoHS &
MAX3237EIDBRG4 ACTIVE SSOP DB 28 2000 Green (RoHS &
MAX3237EIDW ACTIVE SOIC DW 28 20 Green (RoHS &
MAX3237EIDWG4 ACTIVE SOIC DW 28 20 Green (RoHS &
MAX3237EIDWR ACTIVE SOIC DW 28 1000 Green (RoHS &
MAX3237EIDWRG4 ACTIVE SOIC DW 28 1000 Green (RoHS &
MAX3237EIPW ACTIVE TSSOP PW 28 50 Green (RoHS &
MAX3237EIPWG4 ACTIVE TSSOP PW 28 50 Green (RoHS &
MAX3237EIPWR ACTIVE TSSOP PW 28 2000 Green (RoHS &
MAX3237EIPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS &
(1)
The marketing status values are defined as follows:
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
6-Dec-2006
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
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ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
6-Dec-2006
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,65
28
1
2,00 MAX
0,38 0,22
15
14
A
0,05 MIN
0,15
5,60 5,00
M
8,20 7,40
Seating Plane
0,10
0,25 0,09
0°ā8°
Gage Plane
0,25
0,95 0,55
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150
14
6,50
6,50
5,905,90
2016
7,50
6,90
24
8,50
28
10,50
9,907,90
30
10,50
9,90
38
12,90
12,30
4040065 /E 12/01
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30 0,19
8
4,50 4,30
PINS **
7
Seating Plane
0,15
0,05
8
1
A
DIM
14
0,10
6,60 6,20
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75 0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
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