TEXAS INSTRUMENTS MAX3237E Technical data

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1 2 3 4 5 6 7 8 9 10 11 12 13 14

28 27 26 25 24 23 22 21 20 19 18 17 16 15

C2+

GND

C2−

V− DOUT1 DOUT2 DOUT3

RIN1 RIN2

DOUT4

RIN3

DOUT5

EN

SHDN

C1+ V+ V

CC

C1− DIN1 DIN2 DIN3 ROUT1 ROUT2 DIN4 ROUT3 DIN5 ROUT1B MBAUD

DB, DW, OR PW PACKAGE

(TOP VIEW)

QFN PACKAGE

(TOP VIEW)

C1– DIN1 IN2 DIN3 ROUT1 ROUT2 DIN4 ROUT3

DOUT1 DOUT2 DOUT3

RIN1 RIN2

DOUT4

RIN3

NC

V−

C2–

GND

C2+

C1+V+VCCNC

DOUT5

EN

SHDN

MBAUD

NC

DIN5

NC

1 2 3 4 5 6 7 8

24 23 22 21 20 19 18 17

3132 30 29 28 27 26 25

109 111213 14 15 16

3-V TO 5.5-V MULTICHANNEL RS-232

1-MBit/s LINE DRIVER/RECEIVER

SLLS709A – MAY 2006 – REVISED OCTOBER 2006

FEATURES

• Meets or Exceeds the Requirements of • ESD Protection for RS-232 I/O Pins and Logic

TIA/EIA-232-F and ITU v.28 Standards Input pins

• Operates With 3-V to 5.5-V V

• Operates From 250 kbits/s to 1 Mbit/s – ± 8 kV – IEC61000-4-2, Contact Discharge

• Low Standby Current . . . 1 µ A Typical – ± 15 kV – IEC61000-4-2, Air-Gap Discharge

• External Capacitors . . . 4 × 0.1 µ F

• Accepts 5-V Logic Input With 3.3-V Supply

• Designed to Be Interchangeable With Maxim

MAX3237E

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

Supply – ± 15 kV – Human-Body Model (HBM)

CC

APPLICATIONS

• Battery-Powered, Hand-Held, and Portable

Equipment

• PDAs and Palmtop PCs

• Notebooks, Sub-Notebooks, and Laptops

• Digital Cameras

• Mobile Phones and Wireless Devices

MAX3237E

DESCRIPTION

The MAX3237E consists of five line drivers, three line receivers, and a dual charge-pump circuit with ± 15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to

5.5-V supply. This device operates at data signaling rates of 250 kbit/s in normal operating mode (MBAUD = GND) and 1Mbit/s when MBAUD = V

DESCRIPTION (CONTINUED)

The MAX3237E transmitters are disabled and the outputs are forced into high-impedance state when the device is in shutdown mode ( SHDN = GND) and the supply current falls to less than 1 µ A. Also, during shutdown, the onboard charge pump is disabled; V+ is lowered to V can be placed in the high-impedance state by setting enable ( EN) high. ROUT1B remains active all the time, regardless of the EN and SHDN condition.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

. The driver output slew rate is a maximum of 30 V/ µ s.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

CC

, and V– is raised toward GND. Receiver outputs also

CC

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MAX3237E 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER

SLLS709A – MAY 2006 – REVISED OCTOBER 2006

The MAX3237EC is characterized for operation from 0 ° C to 70 ° C. The MAX3237EI is characterized for operation from –40 ° C to 85 ° C.

AVAILABLE OPTIONS

T

A

0 ° C to 70 ° C

–40 ° C to 85 ° C

FUNCTION TABLE

INPUTS OUTPUTS

SHDN EN DOUT ROUT ROUT1B

0 0 Z 0 1 Z 1 0 Active Active Active 1 1 Active Z

PACKAGED DEVICES

MAX3237ECDBR

MAX3237ECPWR

MAX3237ECRHBR (QFN package)

MAX3237ECDWR

MAX3237EIDBR

MAX3237EIPWR

MAX3237EIRHBR (QFN package)

MAX3237EIDWR

(1) (1)

Active Active

(1)

Z

(1)

Active

(1) Z = high impedance (off)

2

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DIN3

DIN2

DIN1

DOUT3

DOUT2

DOUT1

RIN1

RIN2

RIN3

ROUT1

ROUT1B

ROUT2

ROUT3

24

23

22

21

16

20

18

5

6

7

8

9

11

DIN4

DOUT4

19 10

DIN5

DOUT5

17 12

13

EN

SHDN

14

MBAUD

15

LOGIC DIAGRAM (POSITIVE LOGIC)

MAX3237E

3-V TO 5.5-V MULTICHANNEL RS-232

1-MBit/s LINE DRIVER/RECEIVER

SLLS709A – MAY 2006 – REVISED OCTOBER 2006

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MAX3237E 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER

SLLS709A – MAY 2006 – REVISED OCTOBER 2006

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

V

CC

V+ Positive-output supply voltage range V– Negative-output supply voltage range V+ – V– Supply voltage difference

V

I

V

O

θ

JA

T

stg

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

(2) All voltages are with respect to network GND. (3) The package thermal impedance is calculated in accordance with JESD 51-7.

Supply voltage range

Input voltage range V

Output voltage range V

Short-circuit duration DOUT to GND Unlimited Package thermal impedance Lead temperature 1,6 mm (1/16 in) from case for 10 s 260 ° C Storage temperature range –65 150 ° C

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(1)

MIN MAX UNIT

(2)

–0.3 6 V –0.3 7 V

0.3 –7 V

Driver ( SHDN, MBAUD, EN) –0.3 6 Receiver –25 25 Driver –13.2 13.2 Receiver –0.3 V

(3)

CC

13 V

+ 0.3

62 ° C/W

Recommended Operating Conditions

(1)

See Figure 5

MIN NOM MAX UNIT

V

= 3.3 V 3 3.3 3.6

Supply voltage V

V

Driver and control high-level input voltage DIN, SHDN, MBAUD, EN V

IH

V

Driver and control low-level input voltage DIN, SHDN, MBAUD, EN 0 0.8 V

IL

V

Receiver input voltage –25 25 V

I

T

Operating free-air temperature ° C

A

(1) Test conditions are C1–C4 = 0.1 µ F at V

Electrical Characteristics

(1)

= 3 V to 5 V.

CC

V

= 5 V 4.5 5 5.5

CC

V

= 3.3 V 2 5.5

CC

V

= 5 V 2.4 5.5

CC

MAX3237EC 0 70 MAX3237EI –40 85

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5 )

PARAMETER TEST CONDITIONS MIN TYP

I

CC

Input leakage current DIN, SHDN, MBAUD, EN 9 18 µ A

Supply current SHDN = GND 1 10 µ A (T

= 25 ° C)

A

(1) Test conditions are C1–C4 = 0.1 µ F at V (2) All typical values are at V

= 3.3 V or V

CC

Shutdown supply current

= 3 V to 5 V.

CC

= 5 V, and TA= 25 ° C.

CC

No load, SHDN = V

SHDN = RIN = GND, DIN = GND or V

CC

(2)

MAX UNIT

0.5 2 mA

10 300 nA

4

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MAX3237E

3-V TO 5.5-V MULTICHANNEL RS-232

1-MBit/s LINE DRIVER/RECEIVER

SLLS709A – MAY 2006 – REVISED OCTOBER 2006

DRIVER SECTION

xxx

Electrical Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5 )

PARAMETER TEST CONDITIONS MIN TYP

V V I I I r

(1) Test conditions are C1–C4 = 0.1 µ F at V (2) All typical values are at V (3) Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one

High-level output voltage DOUT at RL= 3 k Ω to GND, DIN = GND 5 5.4 V

OH

Low-level output voltage DOUT at RL= 3 k Ω to GND, DIN = V

OL

High-level input current VI= V

IH

Low-level input current VIat GND ± 0.01 ± 1 µ A

IL

Short-circuit output current

OS

Output resistance VCC, V+, and V– = 0 V, VO= ± 2 V 300 50k Ω

o

output should be shorted at a time.

= 3.3 V or V

CC

(1)

(2)

MAX UNIT

CC

(3)

V

= 3.6 V or 3.3 V, VO= 0 V ± 60 mA

CC

= 3 V to 5 V.

CC

= 5 V, and TA= 25 ° C.

CC

–5 –5.4 V

± 0.01 ± 1 µ A

Switching Characteristics

(1)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5 )

PARAMETER TEST CONDITIONS MIN TYP

CL= 1000 pF, MBAUD = GND

CL= 1000 pF, Maximum data V rate MBAUD = V

= 4.5 V to 5.5 V, RL= 3 k Ω , 1 DIN switching, 1000

CC

See Figure 1

CL= 250 pF,

V

= 3 V to 4.5 V, 1000

CC

MBAUD = V

t

Pulse skew

sk(p)

(3)

Slew rate, V

SR(tr) transition region RL= 3 k Ω to 7 k Ω , MBAUD = V

CL= 150 pF to 2500 pF, RL= 3 k Ω to 7 k Ω ,

MBAUD = V

CC

(see Figure 1 ) TA= 25 ° C

(1) Test conditions are C1–C4 = 0.1 µ F at V (2) All typical values are at V (3) Pulse skew is defined as |t

= 3.3 V or V

CC

PLH

CC

or GND, See Figure 2

CC

= 3.3 V,

= 3 V to 5 V.

CC

= 5 V, and TA= 25 ° C.

– t

CC

| of each channel of the same device.

PHL

CL= 150 pF to 1000 pF

MBAUD = GND 6 30

CL= 150 pF to 2500 pF, MBAUD = GND 4 30

250

CC

24 150 V/ µ s

(2)

MAX UNIT

100 ns

kbit/s

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MAX3237E 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER

SLLS709A – MAY 2006 – REVISED OCTOBER 2006

RECEIVER SECTION

xxx

Electrical Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5 )

PARAMETER TEST CONDITIONS MIN TYP

V V

V

V I

oz

r

i

(1) Test conditions are C1–C4 = 0.1 mF at V (2) All typical values are at V

High-level output voltage IOH= –1 mA V

OH

Low-level output voltage IOL= 1 mA 0.4 V

OL

Positive-going input threshold voltage V

IT+

Negative-going input threshold voltage V

IT–

Input hysteresis (V

hys

Output leakage current EN = V Input resistance VI= ± 3 V to ± 25 V 3 5 7 k Ω

Switching Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER TEST CONDITIONS TYP

t

Propagation delay time, low- to high-level output CL= 150 pF, See Figure 3 150 ns

PLH

t

Propagation delay time, high- to low-level output CL= 150 pF, See Figure 3 150 ns

PHL

t

Output enable time CL= 150 pF, RL= 3 k Ω , See Figure 4 2.6 µ s

en

t

Output disable time CL= 150 pF, RL= 3 k Ω , See Figure 4 2.4 µ s

dis

t

Pulse skew

sk(p)

(1) Test conditions are C1–C4 = 0.1 µ F at V (2) All typical values are at V (3) Pulse skew is defined as |t

(3)

IT+

CC

PLH

(1)

(2)

– 0.6 V

CC

V

= 3.3 V 1.5 2.4

CC

V

= 5 V 2 2.4

CC

V

= 3.3 V 0.6 1.1

CC

V

= 5 V 0.8 1.5

CC

– V

) 0.5 V

IT–

CC

= 3 V to.5 V.

= 3.3 V or V

CC

= 5 V, and TA= 25 ° C.

CC

(1)

– 0.1 V

CC

± 0.05 ± 10 µ A

See Figure 3 50 ns

= 3 V to 5 V.

= 3.3 V or V

– t

CC

= 5 V, and TA= 25 ° C.

CC

| of each channel of the same device.

PHL

MAX UNIT

(2)

UNIT

ESD Protection

PIN TEST CONDITIONS TYP UNIT

HBM ± 15

DIN, RIN, ROUT IEC61000-4-2, Contact Discharge ± 8 kV

IEC61000-4-2, Air-Gap Discharge ± 15

6

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PARAMETER MEASUREMENT INFORMATION

50 Ω

TEST CIRCUIT VOLTAGE W AVEFORMS

−3 V

3 V

0 V

3 V

Output

Input

V

OL

V

OH

t

TLH

Generator

(see Note B)

R

L

RS-232 Output

t

THL

C

L

(see Note A)

SR(tr) +

6 V

t

THL

or t

TLH

NOTES: A. CL includes probe and jig capacitance.

B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.

3 V

SHDN = V

CC

50 Ω

TEST CIRCUIT VOLTAGE W AVEFORMS

0 V

3 V

Output

Input

V

OL

V

OH

t

PLH

Generator

(see Note B)

R

L

RS-232 Output

t

PHL

C

L

(see Note A)

NOTES: A. CL includes probe and jig capacitance.

B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.

50%

1.5 V

3 V

SHDN = V

CC

TEST CIRCUIT VOLTAGE WAVEFORMS

50 Ω

−3 V

3 V

Output

Input

V

OL

V

OH

t

PHL

Generator

(see Note B)

t

PLH

Output

C

L

(see Note A)

3 V or 0 V

EN = GND

NOTES: A. CL includes probe and jig capacitance.

B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.

3 V

EN = GND

1.5 V 1.5 V

50% 50%

Figure 1. Driver Slew Rate

MAX3237E

3-V TO 5.5-V MULTICHANNEL RS-232

1-MBit/s LINE DRIVER/RECEIVER

SLLS709A – MAY 2006 – REVISED OCTOBER 2006

Figure 2. Driver Pulse Skew

Figure 3. Receiver Propagation Delay Times

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TEST CIRCUIT VOLTAGE W AVEFORMS

50 Ω

Generator

(see Note B)

3 V or 0 V

Output

V

OL

V

OH

t

PZH

(S1 at GND)

3 V

−3 V

0.3 V

Output

Input

0.3 V

3 V or 0 V

EN

NOTES: A. CL includes probe and jig capacitance.

B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. C. t

PLZ

and t

PHZ

are the same as t

dis

.

D. t

PZL

and t

PZH

are the same as ten.

1.5 V 1.5 V

50%

t

PHZ

(S1 at GND)

t

PLZ

(S1 at VCC)

50%

t

PZL

(S1 at VCC)

R

L

S1

V

CC

GND

C

L

(see Note A)

Output

MAX3237E 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER

SLLS709A – MAY 2006 – REVISED OCTOBER 2006

PARAMETER MEASUREMENT INFORMATION (continued)

8

Figure 4. Receiver Enable and Disable Times

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V

CC

C1 C2, C3, and C4

3.3 V ± 0.15 V

3.3 V ± 0.3 V 5 V ± 0.5 V

3 V to 5.5 V

0.1 µF

0.22 µF

0.047 µF

0.22 µF

0.1 µF

0.22 µF

0.33 µF 1 µF

V

CC

vs CAPACITOR VALUES

+

−

+

−

+

−

+

−

+

−

4

5

6

7

8

9

10

11

12

13 14

3

1

2

28 27

26

24

25

23

22

21

20

19

18

17

16

15

C2

C

BYPASS

= 0.1 µF

C1

C4

C2+

GND

C2− V−

C1+

V+

V

CC

C1−

DIN1

DIN2

DIN3

ROUT1

ROUT2

DIN4

ROUT3

DIN5

ROUT1B

MBAUD

DOUT1

DOUT2

DOUT3

RIN1

RIN2

DOUT4

RIN3

DOUT5

EN

SHDN

5 kΩ

†

C3 can be connected to VCC or GND.

NOTES: A. Resistor values shown are nominal.

B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or

electrolytic capacitors are used, they should be connected as shown.

C3

†

Logic I/Os

RS-232 Port

5 kΩ

MAX3237E

3-V TO 5.5-V MULTICHANNEL RS-232

1-MBit/s LINE DRIVER/RECEIVER

SLLS709A – MAY 2006 – REVISED OCTOBER 2006

APPLICATION INFORMATION

Figure 5. Typical Operating Circuit and Capacitor Values

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PACKAGE OPTION ADDENDUM

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PACKAGING INFORMATION

Orderable Device Status

MAX3237ECDB ACTIVE SSOP DB 28 50 Green (RoHS &

MAX3237ECDBG4 ACTIVE SSOP DB 28 50 Green (RoHS &

MAX3237ECDBR ACTIVE SSOP DB 28 2000 Green (RoHS &

MAX3237ECDBRG4 ACTIVE SSOP DB 28 2000 Green (RoHS &

MAX3237ECDW ACTIVE SOIC DW 28 20 Green (RoHS &

MAX3237ECDWG4 ACTIVE SOIC DW 28 20 Green (RoHS &

MAX3237ECDWR ACTIVE SOIC DW 28 1000 Green (RoHS &

MAX3237ECDWRG4 ACTIVE SOIC DW 28 1000 Green (RoHS &

MAX3237ECPW ACTIVE TSSOP PW 28 50 Green (RoHS &

MAX3237ECPWG4 ACTIVE TSSOP PW 28 50 Green (RoHS &

MAX3237ECPWR ACTIVE TSSOP PW 28 2000 Green (RoHS &

MAX3237ECPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS &

MAX3237EIDB ACTIVE SSOP DB 28 50 Green (RoHS &

MAX3237EIDBG4 ACTIVE SSOP DB 28 50 Green (RoHS &

MAX3237EIDBR ACTIVE SSOP DB 28 2000 Green (RoHS &

MAX3237EIDBRG4 ACTIVE SSOP DB 28 2000 Green (RoHS &

MAX3237EIDW ACTIVE SOIC DW 28 20 Green (RoHS &

MAX3237EIDWG4 ACTIVE SOIC DW 28 20 Green (RoHS &

MAX3237EIDWR ACTIVE SOIC DW 28 1000 Green (RoHS &

MAX3237EIDWRG4 ACTIVE SOIC DW 28 1000 Green (RoHS &

MAX3237EIPW ACTIVE TSSOP PW 28 50 Green (RoHS &

MAX3237EIPWG4 ACTIVE TSSOP PW 28 50 Green (RoHS &

MAX3237EIPWR ACTIVE TSSOP PW 28 2000 Green (RoHS &

MAX3237EIPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS &

(1)

The marketing status values are defined as follows:

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

no Sb/Br)

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

6-Dec-2006

(3)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

6-Dec-2006

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

28 PINS SHOWN

0,65

28

1

2,00 MAX

0,38 0,22

15

14

A

0,05 MIN

0,15

5,60 5,00

M

8,20 7,40

Seating Plane

0,10

0,25 0,09

0°–ā8°

Gage Plane

0,25

0,95 0,55

PINS **

DIM

A MAX

A MIN

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150

14

6,50

5,905,90

2016

7,50

6,90

24

8,50

28

10,50

9,907,90

30

10,50

9,90

38

12,90

12,30

4040065 /E 12/01

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,65

1,20 MAX

14

0,30 0,19

8

4,50 4,30

PINS **

7

Seating Plane

0,15

0,05

8

1

A

DIM

14

0,10

6,60 6,20

M

0,10

0,15 NOM

0°–8°

2016

Gage Plane

24

0,25

0,75 0,50

28

A MAX

A MIN

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

7,70

9,80

9,60

4040064/F 01/97

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

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TEXAS INSTRUMENTS MAX3237E Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual