TEXAS INSTRUMENTS MAX3232E Technical data

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D, DB, DW, OR PW PACKAGE

(TOP VIEW)

1 2 3 4 5 6 7 8

16 15 14 13 12 11 10

9

C1+

V+ C1− C2+ C2−

V−

DOUT2

RIN2

V

CC

GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2

3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER

FEATURES APPLICATIONS

• ESD Protection for RS-232 Bus Pins – ± 15 kV (HBM) – ± 8 kV (IEC61000-4-2, Contact Discharge) – ± 15 kV (IEC61000-4-2, Air-Gap Discharge)

• Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards

• Operates With 3-V to 5.5-V V

• Operates up to 250 kbit/s

• Two Drivers and Two Receivers

• Low Supply Current . . . 300 µ A Typ

• External Capacitors . . . 4 × 0.1 µ F

• Accepts 5-V Logic Input With 3.3-V Supply

• Pin Compatible to Alternative High-Speed

Device (1 Mbit/s) – SNx5C3232

Supply

CC

MAX3232E

WITH ± 15-kV IEC ESD PROTECTION

SLLS664A – AUGUST 2005 – REVISED APRIL 2007

• Battery-Powered Systems

• PDAs

• Notebooks

• Laptops

• Palmtop PCs

• Hand-Held Equipment

DESCRIPTION/ORDERING INFORMATION

ORDERING INFORMATION

T

A

SOIC – D MAX3232EC

SOIC – DW MAX3232EC

–0 ° C to 70 ° C

SSOP – DB MP232EC

TSSOP – PW MP232EC

SOIC – D MAX3232EI

SOIC – DW MAX3232EI

–40 ° C to 85 ° C

SSOP – DB MP232EI

TSSOP – PW MP232EI

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com .

PACKAGE

(1) (2)

Tube of 40 MAX3232ECD Reel of 2500 MAX3232ECDR Tube of 40 MAX3232ECDW Reel of 2000 MAX3232ECDWR Tube of 80 MAX3232ECDB Reel of 2000 MAX3232ECDBR Tube of 90 MAX3232ECPW Reel of 2000 MAX3232ECPWR Tube of 40 MAX3232EID Reel of 2500 MAX3232EIDR Tube of 40 MAX3232EIDW Reel of 2000 MAX3232EIDWR Tube of 80 MAX3232EIDB Reel of 2000 MAX3232EIDBR Tube of 90 MAX3232EIPW Reel of 2000 MAX3232EIPWR

ORDERABLE PART NUMBER TOP-SIDE MARKING

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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DIN1

DOUT1

RIN1ROUT1

DIN2

DOUT2

RIN2ROUT2

11

10

12

9

14

7

13

8

MAX3232E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ± 15-kV IEC ESD PROTECTION

SLLS664A – AUGUST 2005 – REVISED APRIL 2007

DESCRIPTION/ORDERING INFORMATION (CONTINUED)

The MAX3232E device consists of two line drivers, two line receivers, and a dual charge-pump circuit with ± 15-kV IEC ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/ µ s driver output slew rate.

FUNCTION TABLES

ABC

EACH DRIVER

INPUT OUTPUT

DIN DOUT

L H H L

(1) H = high level, L = low level

(1)

EACH RECEIVER

INPUT OUTPUT

RIN ROUT

L H H L

Open H

(1) H = high level, L = low level,

Open = input disconnected or connected driver off

LOGIC DIAGRAM (POSITIVE LOGIC)

(1)

2

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3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER

WITH ± 15-kV IEC ESD PROTECTION

SLLS664A – AUGUST 2005 – REVISED APRIL 2007

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

V

CC

V

+

Supply voltage range

Positive output supply voltage range V– Negative output supply voltage range V+ – Supply voltage difference

V–

V

I

V

O

θ

JA

T

J

T

stg

Input voltage range

Output voltage range

Package thermal impedance

Operating virtual junction temperature 150 ° C

Storage temperature range –65 150 ° C

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network GND. (3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD= (TJ(max) – TA)/ θJA. Operating at the absolute maximum TJof 150 ° C can affect reliability. (4) The package thermal impedance is calculated in accordance with JESD 51-7.

(2)

(1)

MIN MAX UNIT

–0.3 6 V

(2)

–0.3 7 V

0.3 –7 V

Drivers –0.3 6 V Receivers –25 25 V Drivers –13.2 13.2 V Receivers –0.3 V

+ 0.3 V

CC

D package 73

(3) (4)

DB package 82 DW package 57 PW package 108

MAX3232E

13 V

° C/W

Recommended Operating Conditions

(1)

See Figure 4

MIN NO MAX UNIT

V

= 3.3 V 3 3.3 3.6

Supply voltage V

V

Driver high-level input voltage DIN V

IH

V

Driver low-level input voltage DIN 0 0.8 V

IL

V

Receiver input voltage –25 25 V

I

T

Operating free-air temperature ° C

A

(1) Test conditions are C1–C4 = 0.1 µ F at V

Electrical Characteristics

(1)

= 3.3 V ± 0.3 V; C1 = 0.047 µ F, C2–C4 = 0.33 µ F at V

CC

V

= 5 V 4.5 5 5.5

CC

V

= 3.3 V 2 5.5

CC

V

= 5 V 2.4 5.5

CC

MAX3232EC 0 70 MAX3232EI –40 85

= 5 V ± 0.5 V.

CC

M

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4 )

PARAMETER TEST CONDITIONS MIN TYP

I

Supply current No load, V

CC

(1) Test conditions are C1–C4 = 0.1 µ F at V (2) All typical values are at V

= 3.3 V or V

CC

CC CC

= 3.3 V or 5 V 0.3 1 mA

CC

= 3.3 V ± 0.3 V; C1 = 0.047 µ F, C2–C4 = 0.33 µ F at V = 5 V, and TA= 25 ° C.

= 5 V ± 0.5 V.

CC

(2)

MAX UNIT

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MAX3232E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ± 15-kV IEC ESD PROTECTION

SLLS664A – AUGUST 2005 – REVISED APRIL 2007

DRIVER SECTION Electrical Characteristics

(1)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4 )

PARAMETER TEST CONDITIONS MIN TYP

V

High-level output voltage DOUT at RL= 3 k Ω to GND, DIN = GND 5 5.4 V

OH

V

Low-level output voltage DOUT at RL= 3 k Ω to GND, DIN = V

OL

I

High-level input current VI= V

IH

I

Low-level input current VIat GND ± 0.01 ± 1 µ A

IL

(3)

I

Short-circuit output current ± 35 ± 60 mA

OS

r

Output resistance VCC, V+, and V– = 0 V, VO= ± 2 V 300 10M Ω

O

(1) Test conditions are C1–C4 = 0.1 µ F at V (2) All typical values are at V (3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one

= 3.3 V or V

CC

V

= 3.6 V, VO= 0 V

CC

V

= 5.5 V, VO= 0 V

CC

= 3.3 V ± 0.3 V; C1 = 0.047 µ F, C2–C4 = 0.33 µ F at V

CC

= 5 V, and TA= 25 ° C.

CC

–5 –5.4 V

= 5 V ± 0.5 V.

CC

output should be shorted at a time.

Switching Characteristics

(1)

(2)

MAX UNIT

± 0.01 ± 1 µ A

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4 )

PARAMETER TEST CONDITIONS MIN TYP

Maximum data rate 150 250 kbit/s

t

Pulse skew

sk(p)

Slew rate, transition region RL= 3 k Ω to 7 k Ω ,

SR(tr) V/ µ s

(see Figure 1) V

(3)

CL= 1000 pF, RL= 3 k Ω , One DOUT switching, See Figure 1

CL= 150 pF to 2500 pF, RL= 3 k Ω to 7 k Ω , See Figure 2

CL= 150 pF to 1000 pF 6 30

= 3.3 V

CC

CL= 150 pF to 2500 pF 4 30

(2)

MAX UNIT

300 ns

(1) Test conditions are C1–C4 = 0.1 µ F at V (2) All typical values are at V (3) Pulse skew is defined as |t

= 3.3 V or V

CC

PLH

– t

PHL

= 3.3 V ± 0.3 V; C1 = 0.047 µ F, C2–C4 = 0.33 µ F at V

CC

= 5 V, and TA= 25 ° C.

CC

| of each channel of the same device.

= 5 V ± 0.5 V.

CC

4

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RECEIVER SECTION

MAX3232E

3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER

WITH ± 15-kV IEC ESD PROTECTION

SLLS664A – AUGUST 2005 – REVISED APRIL 2007

Electrical Characteristics

(1)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4 )

PARAMETER TEST CONDITIONS MIN TYP

V

OH

V

OL

V

IT+

V

IT–

V

hys

r

i

High-level output voltage IOH= –1 mA V Low-level output voltage IOL= 1.6 mA 0.4 V

Positive-going input threshold voltage V

Negative-going input threshold voltage V

Input hysteresis (V

– V

IT+

) 0.3 V

IT–

Input resistance VI= ± 3 V to ± 25 V 3 5 7 k Ω

(1) Test conditions are C1–C4 = 0.1 µ F at V (2) All typical values are at V

Switching Characteristics

= 3.3 V or V

CC

(1)

V

= 3.3 V 1.5 2.4

CC

V

= 5 V 1.8 2.4

CC

V

= 3.3 V 0.6 1.2

CC

V

= 5 V 0.8 1.5

CC

= 3.3 V ± 0.3 V; C1 = 0.047 µ F, C2–C4 = 0.33 µ F at V

CC

= 5 V, and TA= 25 ° C.

CC

– 0.6 V

CC

= 5 V ± 0.5 V.

(2)

MAX UNIT

– 0.1 V

CC

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 3 )

PARAMETER TEST CONDITIONS TYP

t

Propagation delay time, low- to high-level output 300 ns

PLH

t

Propagation delay time, high- to low-level output 300 ns

PHL

t

Pulse skew

sk(p)

(3)

(1) Test conditions are C1–C4 = 0.1 µ F at V (2) All typical values are at V (3) Pulse skew is defined as |t

= 3.3 V or V

CC

PLH

– t

PHL

= 3.3 V ± 0.3 V; C1 = 0.047 µ F, C2–C4 = 0.33 µ F at V

CC

= 5 V, and TA= 25 ° C.

CC

| of each channel of the same device.

CL= 150 pF

= 5 V ± 0.5 V.

CC

(2)

300 ns

UNIT

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50 Ω

TEST CIRCUIT VOLTAGE W AVEFORMS

0 V

3 V

Output

Input

V

OL

V

OH

t

TLH

Generator

(see Note B)

R

L

RS-232 Output

t

THL

C

L

(see Note A)

SR(tr) +

6 V

t

THL

or t

TLH

NOTES: A. CL includes probe and jig capacitance.

B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.

1.5 V 1.5 V

3 V

−3 V

3 V

−3 V

TEST CIRCUIT VOLTAGE W AVEFORMS

0 V

3 V

Output

Input

V

OL

V

OH

t

PLH

t

PHL

50%

NOTES: A. CL includes probe and jig capacitance.

B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.

1.5 V 1.5 V

50 Ω

Generator

(see Note B)

R

L

RS-232 Output

C

L

(see Note A)

TEST CIRCUIT VOLTAGE W AVEFORMS

50 Ω

50%

−3 V

3 V

1.5 V

Output

Input

V

OL

V

OH

t

PHL

Generator

(see Note B)

t

PLH

Output

C

L

(see Note A)

NOTES: A. CL includes probe and jig capacitance.

B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.

MAX3232E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ± 15-kV IEC ESD PROTECTION

SLLS664A – AUGUST 2005 – REVISED APRIL 2007

PARAMETER MEASUREMENT INFORMATION

Figure 1. Driver Slew Rate

6

Figure 2. Driver Pulse Skew

Figure 3. Receiver Propagation Delay Times

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11

10

8

1

2

3

4

7

ROUT2

DIN2

9

RIN1

16

13

12

15

14

DIN1

5

6

+

−

C3

V

CC

C2+

C1

C2

C1+

GND

C1−

ROUT1

C2−

+

−

C

BYPASS

= 0.1µF

V+

+

−

+

−

RIN2

C4

+

−

V

CC

C1

C2, C3, C4

3.3 V ± 0.3 V 5 V ± 0.5 V

3 V to 5.5 V

0.1 µF

0.047 µF

0.1 µF

0.33 µF

0.47 µF

V

CC

vs CAPACITOR VALUES

DOUT1

DOUT2

†

C3 can be connected to VCC or GND.

NOTES: A. Resistor values shown are nominal.

B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be

connected as shown.

†

V−

5 kΩ

3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER

APPLICATION INFORMATION

MAX3232E

WITH ± 15-kV IEC ESD PROTECTION

SLLS664A – AUGUST 2005 – REVISED APRIL 2007

Figure 4. Typical Operating Circuit and Capacitor Values

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PACKAGE OPTION ADDENDUM

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PACKAGING INFORMATION

Orderable Device Status

MAX3232ECD ACTIVE SOIC D 16 40 Green (RoHS &

MAX3232ECDB ACTIVE SSOP DB 16 80 Green (RoHS &

MAX3232ECDBE4 ACTIVE SSOP DB 16 80 Green (RoHS &

MAX3232ECDBR ACTIVE SSOP DB 16 2000 Green (RoHS &

MAX3232ECDBRE4 ACTIVE SSOP DB 16 2000 Green(RoHS &

MAX3232ECDE4 ACTIVE SOIC D 16 40 Green (RoHS &

MAX3232ECDG4 ACTIVE SOIC D 16 40 Green (RoHS &

MAX3232ECDR ACTIVE SOIC D 16 2500 Green(RoHS &

MAX3232ECDRE4 ACTIVE SOIC D 16 2500 Green (RoHS &

MAX3232ECDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &

MAX3232ECDW ACTIVE SOIC DW 16 40 Green (RoHS &

MAX3232ECDWR ACTIVE SOIC DW 16 2000 Green (RoHS &

MAX3232ECPW ACTIVE TSSOP PW 16 90 Green (RoHS &

MAX3232ECPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &

MAX3232ECPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &

MAX3232ECPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &

MAX3232EID ACTIVE SOIC D 16 40 Green (RoHS &

MAX3232EIDB ACTIVE SSOP DB 16 80 Green (RoHS &

MAX3232EIDBE4 ACTIVE SSOP DB 16 80 Green (RoHS &

MAX3232EIDBR ACTIVE SSOP DB 16 2000 Green (RoHS &

MAX3232EIDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS &

MAX3232EIDE4 ACTIVE SOIC D 16 40 Green (RoHS &

MAX3232EIDG4 ACTIVE SOIC D 16 40 Green (RoHS &

MAX3232EIDR ACTIVE SOIC D 16 2500 Green (RoHS &

MAX3232EIDRE4 ACTIVE SOIC D 16 2500 Green (RoHS &

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

no Sb/Br)

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

23-Apr-2007

(3)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

MAX3232EIDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

23-Apr-2007

(3)

no Sb/Br)

MAX3232EIDW ACTIVE SOIC DW 16 40 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

MAX3232EIDWR ACTIVE SOIC DW 16 2000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

MAX3232EIPW ACTIVE TSSOP PW 16 90 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

MAX3232EIPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

MAX3232EIPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

MAX3232EIPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

MAX3232EIPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

MAX3232EIPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

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Addendum-Page 2

PACKAGE MATERIALS INFORMATION

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30-Apr-2007

TAPE AND REEL INFORMATION

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

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Device Package Pins Site Reel

Diameter

(mm)

MAX3232ECDBR DB 16 MLA 330 16 8.2 6.6 2.5 12 16 Q1

MAX3232ECDR D 16 MLA 330 16 6.5 10.3 12.1 2 16 Q1

MAX3232ECDWR DW 16 TAI 330 16 10.75 10.7 2.7 12 16 Q1

MAX3232ECPWR PW 16 MLA 330 12 7.0 5.6 1.6 8 12 Q1

MAX3232EIDBR DB 16 MLA 330 16 8.2 6.6 2.5 12 16 Q1

MAX3232EIDR D 16 MLA 330 16 6.5 10.3 12.1 2 16 Q1 MAX3232EIDWR DW 16 TAI 330 16 10.75 10.7 2.7 12 16 Q1 MAX3232EIPWR PW 16 MLA 330 12 7.0 5.6 1.6 8 12 Q1

Reel

Width

(mm)

A0 (mm) B0 (mm) K0 (mm) P1

(mm)W(mm)

30-Apr-2007

Pin1

Quadrant

TAPE AND REEL BOX INFORMATION

Device Package Pins Site Length (mm) Width (mm) Height (mm)

MAX3232ECDBR DB 16 MLA 333.2 333.2 28.58

MAX3232ECDR D 16 MLA 333.2 333.2 28.58

MAX3232ECDWR DW 16 TAI 346.0 346.0 33.0 MAX3232ECPWR PW 16 MLA 338.1 340.5 20.64

MAX3232EIDBR DB 16 MLA 333.2 333.2 28.58

MAX3232EIDR D 16 MLA 333.2 333.2 28.58 MAX3232EIDWR DW 16 TAI 346.0 346.0 33.0 MAX3232EIPWR PW 16 MLA 338.1 340.5 20.64

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

30-Apr-2007

Pack Materials-Page 3

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

28 PINS SHOWN

0,65

28

1

2,00 MAX

0,38 0,22

15

14

A

0,05 MIN

0,15

5,60 5,00

M

8,20 7,40

Seating Plane

0,10

0,25 0,09

0°–ā8°

Gage Plane

0,25

0,95 0,55

PINS **

DIM

A MAX

A MIN

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150

14

6,50

5,905,90

2016

7,50

6,90

24

8,50

28

10,50

9,907,90

30

10,50

9,90

38

12,90

12,30

4040065 /E 12/01

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,65

1,20 MAX

14

0,30 0,19

8

4,50 4,30

PINS **

7

Seating Plane

0,15

0,05

8

1

A

DIM

6,60 6,20

14

0,10

M

0,15 NOM

Gage Plane

0,25

0°–8°

2016

24

28

0,75 0,50

A MAX

A MIN

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

7,70

9,80

9,60

4040064/F 01/97

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265