Input Voltage Range Extends to Ground
Output Swings to Ground While Sinking
Current
D
Input Offset Voltage
150 µV Max at 25°C for LT1013A
D
Offset Voltage Temperature Coefficient
2.5 µV/°C Max for LT1013A
D
Input Offset Current
0.8 nA Max at 25°C for LT1013A
D
High Gain...1.5 V/µV Min ( R
0.8 V/µV Min ( R
D
Low Supply Current...0.5 mA Max at
T
= 25°C for LT1013A
A
D
Low Peak-to-Peak Noise Voltage
= 600 kΩ) for LT1013A
L
= 2 kΩ),
L
0.55 µV Typ
D
Low Current Noise...0.07 pA/√HZ Typ
description
The LT1013 is a dual precision operational
amplifier featuring low offset voltage temperature
coefficient, high gain, low supply current, and low
noise.
The LT1013 can be operated from a single 5-V
power supply; the common-mode input voltage
range includes ground, and the output can also
swing to within a few millivolts of ground.
Crossover distortion is eliminated. The LT1013
can be operated with both dual ±15-V and single
5-V supplies.
D PACKAGE
(TOP VIEW)
1IN+
V
CC–
2IN+
2IN–
NC
1IN–
NC
1IN+
NC
NC – No internal connection
1OUT
1IN–
1IN+
V
CC–
1
2
3
4
FK PACKAGE
(TOP VIEW)
NC
3 2 1 20 19
4
5
6
7
8
910111213
NC
JG OR P PACKAGE
(TOP VIEW)
1
2
3
4
1OUT
NCNCNC
NC
CC –
V
8
7
6
5
CC±
V
2IN+
8
7
6
5
1IN–
1OUT
V
CC+
2OUT
18
17
16
15
14
V
CC+
2OUT
2IN–
2IN+
NC
2OUT
NC
2IN–
NC
The L T1013C and LT1013AC, and L T1013D are characterized for operation from 0°C to 70°C. The L T1013I and
L T1013AI, and L T1013DI are characterized for operation from –40°C to 105°C. The L T1013M and L T1013AM,
and LT1013DM are characterized for operation over the full military temperature range of –55°C to 125°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1996, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
1
LT1013, LT1013A, LT1013D, LT1013Y
VIOmax
CHIP FORM
µ
µ
µ
DUAL PRECISION OPERATIONAL AMPLIFIERS
SLOS018B – MA Y 1988 – REVISED OCT OBER 1996
AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
0°C to 70°C
–40°C to 105°C
–55°C to 125°C
The D package is available taped and reeled. Add the suffix R to the device type (e.g., LT1013DDR).
This chip, when properly assembled, displays characteristics similar to the LT1013. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
79
(2)
(3)
BONDING PAD ASSIGNMENTS
(8)
(1)
(7)
(4)
96
(6)
(5)
IN+
IN–
2 IN+
2IN–
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
(3)
(2)
(5)
(6)
V
CC+
(8)
+
–
+
–
V
CC–
(4)
(1)
(7)
1OUT
2OUT
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)