LP2985 150-mA Low-noise Low-dropout Regulator With Shutdown
1Features3Description
1
•Output Tolerance of
– 1% (A Grade)
– 1.5% (Standard Grade)
•Ultra-Low Dropout, Typically
– 280 mV at Full Load of 150 mA
– 7 mV at 1 mA
•Wide VINRange: 16 V Max
•Low IQ: 850 μA at Full Load at 150 mA
•Shutdown Current: 0.01 μA Typ
•Low Noise: 30 μV
With 10-nF Bypass
RMS
Capacitor
•Stable With Low-ESR Capacitors, Including
Ceramic
•Overcurrent and Thermal Protection
•High Peak-Current Capability
•ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
The LP2985 family of fixed-output, low-dropout
regulatorsoffersexceptional,cost-effective
performance for both portable and nonportable
applications. Available in voltages of 1.8 V, 2.5 V, 2.8
V, 2.9 V, 3 V, 3.1 V, 3.3 V, 5 V, and 10 V, the family
has an output tolerance of 1% for the A version (1.5%
for the non-A version) and is capable of delivering
150-mA continuous load current. Standard regulator
features, such as overcurrent and overtemperature
protection, are included.
PART NUMBERPACKAGEBODY SIZE (NOM)
LP2985SOT-23 (5)2.90 mm x 1.60 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Dropout Voltage vs Temperature
LP2985
SLVS522O –JULY 2004–REVISED JANUARY 2015
Device Information
(1)
2Applications
•Portable Devices
•Digital Cameras and Camcorders
•CD Players
•MP3 Players
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
Changes from Revision N (June 2011) to Revision OPage
•Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table,
Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply
Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,
Packaging, and Orderable Information section. ..................................................................................................................... 1
•Deleted Ordering Information table. ....................................................................................................................................... 1
over virtual junction temperature range (unless otherwise noted)
V
IN
V
ON/ OFF
I
O
θ
JA
T
J
T
stg
Continuous input voltage range
ON/OFF input voltage range–0.316V
Output voltage range
Output current
(3)
(4)
Package thermal impedance
Operating virtual junction temperature150°C
Storage temperature range–65150°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The PNP pass transistor has a parasitic diode connected between the input and output. This diode normally is reverse biased
(VIN> V
more details).
), but will be forward biased if the output voltage exceeds the input voltage by a diode drop (see Application Information for
OUT
(3) If load is returned to a negative power supply in a dual-supply system, the output must be diode clamped to GND.
(4) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD= (TJ(max) – TA)/θJA. Operating at the absolute maximum TJof 150°C can affect reliability.
(5) The package thermal impedance is calculated in accordance with JESD 51-7.
(2)
(4) (5)
(1)
MINMAXUNIT
–0.316V
–0.39V
Internally limited
(short-circuit protected)
—
206°C/W
6.2 ESD Ratings
VALUEUNIT
(1)
2000
1000
V
(ESD)
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
Electrostatic dischargeV
Charged device model (CDM), per JEDEC specification JESD22-C101,
(2)
all pins
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
The LP2985 family of fixed-output, low-dropout regulators offers exceptional, cost-effective performance for both
portable and nonportable applications. Available in voltages of 1.8 V, 2.5 V, 2.8 V, 2.9 V, 3 V, 3.1 V, 3.3 V, 5 V,
and 10 V, the family has an output tolerance of 1% for the A version (1.5% for the non-A version) and is capable
of delivering 150-mA continuous load current. Standard regulator features, such as overcurrent and
overtemperature protection, are included.
7.2 Functional Block Diagram
7.3 Feature Description
The LP2985 has a host of features that makes the regulator an ideal candidate for a variety of portable
applications:
•Low dropout: A PNP pass element allows a typical dropout of 280 mV at 150-mA load current and 7 mV at 1mA load.
•Low quiescent current: The use of a vertical PNP process allows for quiescent currents that are considerably
lower than those associated with traditional lateral PNP regulators.
•Shutdown: A shutdown feature is available, allowing the regulator to consume only 0.01 μA when the
ON/OFF pin is pulled low.
•Low-ESR-capacitor friendly: The regulator is stable with low-ESR capacitors, allowing the use of small,
inexpensive, ceramic capacitors in cost-sensitive applications.
•Low noise: A BYPASS pin allows for low-noise operation, with a typical output noise of 30 μV
, with the
RMS
use of a 10-nF bypass capacitor.
•Small packaging: For the most space-constrained needs, the regulator is available in the SOT-23 package.
7.4 Device Functional Modes
7.4.1 Normal Operation
In normal operation, the device will output a fixed voltage corresponding with the orderable part number. The
device can deliver 150 mA of continuous load current.
7.4.2 Shutdown Mode
Set the ON/OFF pin low to shut down the device when VINis still present. If a shutdown mode is not needed, tie
the pin to VIN. For proper operation, do not leave ON/OFF unconnected, and apply a signal with a slew rate of
≥40 mV/μs.
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The following application schematic shows the standard usage of the LP2985 as a low-dropout regulator.
8.1.1 Typical Application
www.ti.com
8.1.2 Design Requirements
Minimum C
value for stability (can be increased without limit for improved stability and transient response)
OUT
ON/OFF must be actively terminated. Connect to VINif shutdown feature is not used.
Optional BYPASS capacitor for low-noise operation
8.1.3 Capacitors
8.1.3.1 Input Capacitor (CIN)
A minimum value of 1 μF (over the entire operating temperature range) is required at the input of the LP2985. In
addition, this input capacitor should be located within 1 cm of the input pin and connected to a clean analog
ground. There are no equivalent series resistance (ESR) requirements for this capacitor, and the capacitance
can be increased without limit.
As an advantage over other regulators, the LP2985 permits the use of low-ESR capacitors at the output,
including ceramic capacitors that can have an ESR as low as 5 mΩ. Tantalum and film capacitors also can be
used if size and cost are not issues. The output capacitor also should be located within 1 cm of the output pin
and be returned to a clean analog ground.
As with other PNP LDOs, stability conditions require the output capacitor to have a minimum capacitance and an
ESR that falls within a certain range.
•Minimum C
: 2.2 μF (can be increased without limit to improve transient response stability margin)
OUT
•ESR range: see Figure 18 through Figure 20
It is critical that both the minimum capacitance and ESR requirement be met over the entire operatingtemperature range. Depending on the type of capacitors used, both these parameters can vary significantly with
temperature (see capacitor characteristics).
8.1.3.3 Noise Bypass Capacitor (C
The LP2985 allows for low-noise performance with the use of a bypass capacitor that is connected to the internal
bandgap reference via the BYPASS pin. This high-impedance bandgap circuitry is biased in the microampere
range and, thus, cannot be loaded significantly, otherwise, its output – and, correspondingly, the output of the
regulator – changes. Thus, for best output accuracy, dc leakage current through C
much as possible and never should exceed 100 nA.
A 10-nF capacitor is recommended for C
OUT
)
BYPASS
BYPASS
)
BYPASS
should be minimized as
. Ceramic and film capacitors are well suited for this purpose.
8.1.3.4 Reverse Input-Output Voltage
There is an inherent diode present across the PNP pass element of the LP2985.
With the anode connected to the output, this diode is reverse biased during normal operation, since the input
voltage is higher than the output. However, if the output is pulled higher than the input for any reason, this diode
is forward biased and can cause a parasitic silicon-controlled rectifier (SCR) to latch, resulting in high current
flowing from the output to the input. Thus, to prevent possible damage to the regulator in any application where
the output may be pulled above the input, or the input may be shorted to ground, an external Schottky diode
should be connected between the output and input. With the anode on output, this Schottky limits the reverse
voltage across the output and input pins to ∼0.3 V, preventing the regulator’s internal diode from forward biasing.
Ceramic capacitors are ideal choices for use on the output of the LP2985 for several reasons. For capacitances
in the range of 2.2 μF to 4.7 μF, ceramic capacitors have the lowest cost and the lowest ESR, making them
choice candidates for filtering high-frequency noise. For instance, a typical 2.2-μF ceramic capacitor has an ESR
in the range of 10 mΩ to 20 mΩ and, thus, satisfies minimum ESR requirements of the regulator.
Ceramic capacitors have one major disadvantage that must be taken into account – a poor temperature
coefficient, where the capacitance can vary significantly with temperature. For instance, a large-value ceramic
capacitor (≥ 2.2 μF) can lose more than half of its capacitance as the temperature rises from 25°C to 85°C. Thus,
a 2.2-μF capacitor at 25°C drops well below the minimum C
rises. For this reason, select an output capacitor that maintains the minimum 2.2 μF required for stability over the
entire operating temperature range. Note that there are some ceramic capacitors that can maintain a ±15%
capacitance tolerance over temperature.
8.1.4.1.2 Tantalum
Tantalum capacitors can be used at the output of the LP2985, but there are significant disadvantages that could
prohibit their use:
•In the 1-μF to 4.7-μF range, tantalum capacitors are more expensive than ceramics of the equivalent
capacitance and voltage ratings.
•Tantalum capacitors have higher ESRs than their equivalent-sized ceramic counterparts. Thus, to meet the
ESR requirements, a higher-capacitance tantalum may be required, at the expense of larger size and higher
cost.
•The ESR of a tantalum capacitor increases as temperature drops, as much as double from 25°C to –40°C.
Thus, ESR margins must be maintained over the temperature range to prevent regulator instability.
required for stability, as ambient temperature
OUT
8.1.4.2 ON/OFF Operation
The LP2985 allows for a shutdown mode via the ON/OFF pin. Driving the pin LOW (≤ 0.3 V) turns the device
OFF; conversely, a HIGH (≥ 1.6 V) turns the device ON. If the shutdown feature is not used, ON/OFF should be
connected to the input to ensure that the regulator is on at all times. For proper operation, do not leave ON/OFF
unconnected, and apply a signal with a slew rate of ≥ 40 mV/μs.
•It is recommended that the input pin be bypassed to ground with a bypass-capacitor.
•The optimum placement of the bypass capacitor is closest to the VINof the device and GND of the system.
Care must be taken to minimize the loop area formed by the bypass-capacitor connection, the VINpin, and
the GND pin of the system.
•For operation at full-rated load, it is recommended to use wide trace lengths to eliminate IR drop and heat
dissipation.
10.2 Layout Example
Figure 32. Layout Diagram
11Device and Documentation Support
11.1 Trademarks
All trademarks are the property of their respective owners.
11.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
LP2985-28DBVTE4ACTIVESOT-23DBV5TBDCall TICall TI-40 to 125
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
CU NIPDAULevel-1-260C-UNLIM-40 to 125LRCG
CU NIPDAULevel-1-260C-UNLIM-40 to 125LRCG
CU NIPDAU | CU SNLevel-1-260C-UNLIM-40 to 125(LPHG ~ LPHL)
CU NIPDAULevel-1-260C-UNLIM-40 to 125LPHG
CU NIPDAULevel-1-260C-UNLIM-40 to 125LPHG
CU NIPDAU | CU SNLevel-1-260C-UNLIM-40 to 125(LPHG ~ LPHL)
CU NIPDAULevel-1-260C-UNLIM-40 to 125LPHG
CU NIPDAULevel-1-260C-UNLIM-40 to 125LPHG
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LPLG ~ LPLL)
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LPLG ~ LPLL)
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LPLG ~ LPLL)
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LPLG ~ LPLL)
CU NIPDAU | CU SNLevel-1-260C-UNLIM-40 to 125(LPGG ~ LPGL)
CU NIPDAU | CU SNLevel-1-260C-UNLIM-40 to 125(LPGG ~ LPGL)
18-Sep-2015
Op Temp (°C)Device Marking
(4/5)
Samples
LP2985-28DBVTG4ACTIVESOT-23DBV5250Green (RoHS
& no Sb/Br)
LP2985-29DBVRACTIVESOT-23DBV53000Green (RoHS
& no Sb/Br)
Addendum-Page 1
CU NIPDAULevel-1-260C-UNLIM-40 to 125LPGG
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LPMG ~ LPML)
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable DeviceStatus
Package Type Package
(1)
Drawing
Pins Package
Qty
LP2985-30DBVRACTIVESOT-23DBV53000Green (RoHS
LP2985-30DBVRG4ACTIVESOT-23DBV53000Green (RoHS
LP2985-30DBVTACTIVESOT-23DBV5250Green (RoHS
LP2985-30DBVTG4ACTIVESOT-23DBV5250Green (RoHS
LP2985-33DBVRACTIVESOT-23DBV53000Green (RoHS
LP2985-33DBVRE4ACTIVESOT-23DBV53000Green (RoHS
LP2985-33DBVRG4ACTIVESOT-23DBV53000Green (RoHS
LP2985-33DBVTACTIVESOT-23DBV5250Green (RoHS
LP2985-33DBVTE4ACTIVESOT-23DBV5250Green (RoHS
LP2985-33DBVTG4ACTIVESOT-23DBV5250Green (RoHS
LP2985-50DBVRACTIVESOT-23DBV53000Green (RoHS
LP2985-50DBVRG4ACTIVESOT-23DBV53000Green (RoHS
LP2985-50DBVTACTIVESOT-23DBV5250Green (RoHS
LP2985-50DBVTG4ACTIVESOT-23DBV5250Green (RoHS
LP2985A-10DBVRACTIVESOT-23DBV53000Green (RoHS
LP2985A-10DBVTACTIVESOT-23DBV5250Green (RoHS
LP2985A-18DBVJACTIVESOT-23DBV510000Green (RoHS
LP2985A-18DBVRACTIVESOT-23DBV53000Green (RoHS
Eco Plan
(2)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)Device Marking
(4/5)
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LPNG ~ LPNL)
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LPNG ~ LPNL)
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LPNG ~ LPNL)
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LPNG ~ LPNL)
CU NIPDAU | CU SNLevel-1-260C-UNLIM-40 to 125(LPFG ~ LPFL)
CU NIPDAULevel-1-260C-UNLIM-40 to 125LPFG
CU NIPDAULevel-1-260C-UNLIM-40 to 125LPFG
CU NIPDAU | CU SNLevel-1-260C-UNLIM-40 to 125(LPFG ~ LPFL)
CU NIPDAULevel-1-260C-UNLIM-40 to 125LPFG
CU NIPDAULevel-1-260C-UNLIM-40 to 125LPFG
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LPSG ~ LPSL)
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LPSG ~ LPSL)
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LPSG ~ LPSL)
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LPSG ~ LPSL)
CU NIPDAULevel-1-260C-UNLIM-40 to 125LRDG
CU NIPDAULevel-1-260C-UNLIM-40 to 125LRDG
CU NIPDAULevel-1-260C-UNLIM-40 to 125LPTL
CU NIPDAU | CU SNLevel-1-260C-UNLIM-40 to 125(LPTG ~ LPTL)
18-Sep-2015
Samples
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable DeviceStatus
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
LP2985A-18DBVRE4ACTIVESOT-23DBV5TBDCall TICall TI-40 to 125
LP2985A-18DBVRG4ACTIVESOT-23DBV53000Green (RoHS
CU NIPDAULevel-1-260C-UNLIM-40 to 125LPTG
& no Sb/Br)
LP2985A-18DBVTACTIVESOT-23DBV5250Green (RoHS
CU NIPDAU | CU SNLevel-1-260C-UNLIM-40 to 125(LPTG ~ LPTL)
& no Sb/Br)
LP2985A-18DBVTE4ACTIVESOT-23DBV5TBDCall TICall TI-40 to 125
LP2985A-25DBVRACTIVESOT-23DBV53000Green (RoHS
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LPUG ~ LPUL)
& no Sb/Br)
LP2985A-25DBVRG4ACTIVESOT-23DBV53000Green (RoHS
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LPUG ~ LPUL)
& no Sb/Br)
LP2985A-25DBVTACTIVESOT-23DBV5250Green (RoHS
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LPUG ~ LPUL)
& no Sb/Br)
LP2985A-25DBVTG4ACTIVESOT-23DBV5250Green (RoHS
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LPUG ~ LPUL)
& no Sb/Br)
LP2985A-28DBVRACTIVESOT-23DBV53000Green (RoHS
CU NIPDAU | CU SNLevel-1-260C-UNLIM-40 to 125(LPJG ~ LPJL)
& no Sb/Br)
LP2985A-28DBVTACTIVESOT-23DBV5250Green (RoHS
CU NIPDAU | CU SNLevel-1-260C-UNLIM-40 to 125(LPJG ~ LPJL)
& no Sb/Br)
LP2985A-29DBVRACTIVESOT-23DBV53000Green (RoHS
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LPZG ~ LPZL)
& no Sb/Br)
LP2985A-30DBVRACTIVESOT-23DBV53000Green (RoHS
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LRAG ~ LRAL)
& no Sb/Br)
LP2985A-30DBVTACTIVESOT-23DBV5250Green (RoHS
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LRAG ~ LRAL)
& no Sb/Br)
LP2985A-30DBVTG4ACTIVESOT-23DBV5250Green (RoHS
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LRAG ~ LRAL)
& no Sb/Br)
LP2985A-33DBVRACTIVESOT-23DBV53000Green (RoHS
CU NIPDAU | CU SNLevel-1-260C-UNLIM-40 to 125(LPKG ~ LPKL)
& no Sb/Br)
LP2985A-33DBVRE4ACTIVESOT-23DBV5TBDCall TICall TI-40 to 125
18-Sep-2015
Op Temp (°C)Device Marking
(4/5)
Samples
LP2985A-33DBVRG4ACTIVESOT-23DBV53000Green (RoHS
& no Sb/Br)
LP2985A-33DBVTACTIVESOT-23DBV5250Green (RoHS
& no Sb/Br)
Addendum-Page 3
CU NIPDAULevel-1-260C-UNLIM-40 to 125LPKG
CU NIPDAU | CU SNLevel-1-260C-UNLIM-40 to 125(LPKG ~ LPKL)
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable DeviceStatus
LP2985A-33DBVTE4ACTIVESOT-23DBV5250Green (RoHS
LP2985A-33DBVTG4ACTIVESOT-23DBV5250Green (RoHS
LP2985A-50DBVRACTIVESOT-23DBV53000Green (RoHS
LP2985A-50DBVRG4ACTIVESOT-23DBV53000Green (RoHS
LP2985A-50DBVTACTIVESOT-23DBV5250Green (RoHS
LP2985A-50DBVTG4ACTIVESOT-23DBV5250Green (RoHS
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
Lead/Ball Finish
(6)
CU NIPDAULevel-1-260C-UNLIM-40 to 125LPKG
CU NIPDAULevel-1-260C-UNLIM-40 to 125LPKG
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LR1G ~ LR1L)
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LR1G ~ LR1L)
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LR1G ~ LR1L)
CU NIPDAULevel-1-260C-UNLIM-40 to 125(LR1G ~ LR1L)
MSL Peak Temp
(3)
Op Temp (°C)Device Marking
18-Sep-2015
(4/5)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Samples
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
18-Sep-2015
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