LMV321 . . . 130 µA Typ
LMV358 . . . 210 µA Typ
LMV324 . . . 410 µA Typ
D
Rail-to-Rail Output Swing
D
Package Options Include Plastic
Small-Outline (D), Small-Outline Transistor
(SOT-23 DBV, SC-70 DCK), and Thin Shrink
Small-Outline (PW) Packages
description
The LMV324 and LMV358 are low-voltage (2.7 V
to 5.5 V) versions of the dual and quad operational
amplifiers, LM324 and LM358, that operate from
5 V to 30 V. The LMV321 is the single-amplifier
version.
The LMV321, LMV324, and LMV358 are the most
cost-effective solutions for applications where
low-voltage operation, space saving, and low
price are needed. They offer specifications that
meet or exceed those of the familiar LM358 and
LM324 devices. These devices have rail-to-rail
output-swing capability, and the input
common-mode voltage range includes ground.
They all exhibit excellent speed-to-power ratios,
achieving 1MHz of bandwidth at 1-V/µs slew rate
with low supply current.
LMV324 ...D OR PW PACKAGE
1OUT
V
2OUT
LMV358 ...D OR PW PACKAGE
1OUT
LMV321 .. . DBV OR DCK PACKAGE
1IN–
1IN+
CC+
2IN+
2IN–
1IN–
1IN+
GND
1IN+
GND
IN–
(TOP VIEW)
14
1
13
2
12
3
11
4
10
5
6
7
(TOP VIEW)
1
2
3
4
(TOP VIEW)
1
2
3
9
8
8
7
6
5
5
4
4OUT
4IN–
4IN+
GND
3IN+
3IN–
3OUT
V
CC+
2OUT
2IN–
2IN+
V
CC+
OUT
The LMV321 is available in the ultra-small DCK package, which is approximately one-half the size of the DBV
package. This package saves space on printed circuit boards and enables the design of small portable
electronic devices. It also allows the designer to place the device closer to the signal source to reduce noise
pickup and increase signal integrity.
The LMV321I, LMV324I, and LMV358I devices are characterized for operation from –40°C to 85°C.
symbol (each amplifier)
–
OUT
+
Copyright 2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
The D package is available taped and reeled. Add the suffix R to the device type (e.g.,
LMV324DR). The DCK, DBV, and PW packages are only available left-end taped and reeled.
PACKAGE
TYPE
5-pin SOT
8-pin SOIC
8-pin TSSOP
14-pin SOIC
14-pin TSSOP
SINGLEDUALQUADRUPLE
LMV321IDCKR
LMV321IDBVR
PACKAGED DEVICES
—
—
—
—
LMV358ID
LMV358IPWR
—
—
—
LMV324ID
LMV324IPWR
—
—
—
—
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or PW package 260°C. . . . . . . . . . . . . .
DBV or DCK package TBD. . . . . . . . . . . . .
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
2. Differential voltages are at IN+ with respect to IN–.
3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
4. Maximum power dissipation is a function of TJ(max),
ambient temperature is PD = (TJ(max) – TA)/
5. The package thermal impedance is calculated in accordance with JESD 51.
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
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