The L293 and L293D are quadruple high-current
half-H drivers. The L293 is designed to provide
bidirectional drive currents of up to 1 A at voltages
from 4.5 V to 36 V. The L293D is designed to
provide bidirectional drive currents of up to
600-mA at voltages from 4.5 V to 36 V. Both
devices are designed to drive inductive loads such
as relays, solenoids, dc and bipolar stepping
motors, as well as other high-current/high-voltage
loads in positive-supply applications.
1,2EN
HEAT SINK AND
GROUND
1,2EN
HEAT SINK AND
GROUND
L293 ...N OR NE PACKAGE
L293D . . . NE PACKAGE
(TOP VIEW)
16
15
14
13
12
11
10
28
27
26
25
24
23
22
21
20
19
18
17
16
15
9
V
CC1
4A
4Y
HEAT SINK AND
GROUND
3Y
3A
3,4EN
V
CC1
4A
4Y
NC
NC
NC
HEAT SINK AND
GROUND
NC
NC
3Y
3A
3,4EN
1
1A
2
1Y
3
4
5
6
2Y
7
2A
V
V
8
CC2
L293 . . . DWP PACKAGE
(TOP VIEW)
1
2
1A
3
1Y
4
NC
5
NC
6
NC
7
8
9
10
NC
11
NC
12
2Y
13
2A
14
CC2
All inputs are TTL compatible. Each output is a
complete totem-pole drive circuit, with a
Darlington transistor sink and a pseudoDarlington source. Drivers are enabled in pairs, with drivers 1 and 2 enabled by 1,2EN and drivers 3 and 4
enabled by 3,4EN. When an enable input is high, the associated drivers are enabled, and their outputs are active
and in phase with their inputs. When the enable input is low, those drivers are disabled, and their outputs are
off and in the high-impedance state. With the proper data inputs, each pair of drivers forms a full-H (or bridge)
reversible drive suitable for solenoid or motor applications.
ORDERING INFORMATION
T
A
HSOP (DWP)Tube of 20L293DWPL293DWP
0°C to 70°C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
PDIP (N)Tube of 25L293NL293N
PDIP (NE)
PACKAGE
†
Tube of 25L293NEL293NE
Tube of 25L293DNEL293DNE
ORDERABLE
PART NUMBER
Copyright 2004, Texas Instruments Incorporated
TOP-SIDE
MARKING
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
L293, L293D
OUTPUT
QUADRUPLE HALF-H DRIVERS
SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004
description/ordering information (continued)
On the L293, external high-speed output clamp diodes should be used for inductive transient suppression.
A V
terminal, separate from V
CC1
, is provided for the logic inputs to minimize device power dissipation.
CC2
The L293and L293D are characterized for operation from 0°C to 70°C.
block diagram
1
1
0
2
1
0
1
3
4
M
5
6
1
0
2
7
8
V
CC1
16
15
4
14
13
12
11
3
10
9
1
0
1
0
1
0
M
M
V
CC2
NOTE: Output diodes are internal in L293D.
FUNCTION TABLE
(each driver)
†
INPUTS
AEN
HHH
LHL
XLZ
H = high level, L = low level, X = irrelevant,
Z = high impedance (off)
†
In the thermal shutdown mode, the output is
in the high-impedance state, regardless of
the input levels.
OUTPUT
Y
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic diagram
L293, L293D
QUADRUPLE HALF-H DRIVERS
SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004
1A
1,2EN
2A
3A
3,4EN
4A
schematics of inputs and outputs (L293)
EQUIVALENT OF EACH INPUT
V
CC1
Current
Source
Input
2
1
7
10
9
15
3
1Y
6
2Y
11
3Y
14
4Y
TYPICAL OF ALL OUTPUTS
V
CC2
Output
GND
GND
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
L293, L293D
QUADRUPLE HALF-H DRIVERS
SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004
schematics of inputs and outputs (L293D)
EQUIVALENT OF EACH INPUT
V
CC1
Current
Source
Input
GND
TYPICAL OF ALL OUTPUTS
V
CC2
Output
GND
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
Output supply voltage, V
Input voltage, V
Output voltage range, V
Peak output current, I
Peak output current, I
Continuous output current, I
Continuous output current, I
Package thermal impedance, θ
Maximum junction temperature, T
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to the network ground terminal.
2. Maximum power dissipation is a function of T
ambient temperature is P
3. The package thermal impedance is calculated in accordance with JESD 51-7.
The Rthj-amp of the L293 can be reduced by soldering the GND pins to a suitable copper area of the printed
circuit board or to an external heat sink.
Figure 9 shows the maximum package power P
and the θ
TOT
as a function of the side of two equal square
JA
copper areas having a thickness of 35 µm (see Figure 7). In addition, an external heat sink can be used (see
Figure 8).
During soldering, the pin temperature must not exceed 260°C, and the soldering time must not exceed 12
seconds.
The external heatsink or printed circuit copper area must be connected to electrical ground.
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
Copper Area 35-µm Thickness
Printed Circuit Board
L293, L293D
QUADRUPLE HALF-H DRIVERS
SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004
Figure 7. Example of Printed Circuit Board Copper Area
(used as heat sink)
17.0 mm
11.9 mm
38.0 mm
Figure 8. External Heat Sink Mounting Example
= 25°C/W)
(θ
JA
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
11
L293, L293D
QUADRUPLE HALF-H DRIVERS
SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004
APPLICATION INFORMATION
MAXIMUM POWER AND JUNCTION
THERMAL RESISTANCE
4
θ
3
2
P
TOT
− Power Dissipation − W
1
TOT
P
0
01020
JA
(TA = 70°C)
Side − mm
Figure 9
vs
30
40
50
80
60
40
20
MAXIMUM POWER DISSIPATION
vs
AMBIENT TEMPERATURE
5
4
3
2
− Power Dissipation − W
1
TOT
− Thermal Resistance − °C/W
P
JA
θ
0
0
−50050
Heat Sink With θJA = 25°C/W
T
− Ambient Temperature − °C
A
With Infinite Heat Sink
Free Air
100
150
Figure 10
12
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
21-Mar-2013
PACKAGING INFORMATION
Orderable DeviceStatus
L293DNEACTIVEPDIPNE1625Pb-Free
L293DNEE4ACTIVEPDIPNE1625Pb-Free
L293DWPOBSOLETESOICDW28TBDCall TICall TI0 to 70L293DWP
L293DWPG4OBSOLETESOICDW28TBDCall TICall TI0 to 70
L293DWPTROBSOLETESO PowerPADDWP28TBDCall TICall TI0 to 70
L293NOBSOLETEPDIPN16TBDCall TICall TI0 to 70L293N
L293NEACTIVEPDIPNE1625Pb-Free
L293NEE4ACTIVEPDIPNE1625Pb-Free
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
L293NG4OBSOLETEPDIPN16TBDCall TICall TI0 to 70
Package Type Package
(1)
Drawing
Pins Package QtyEco Plan
(2)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
Lead/Ball FinishMSL Peak Temp
(3)
CU NIPDAUN / A for Pkg Type0 to 70L293DNE
CU NIPDAUN / A for Pkg Type0 to 70L293DNE
CU NIPDAUN / A for Pkg Type0 to 70L293NE
CU NIPDAUN / A for Pkg Type0 to 70L293NE
Op Temp (°C)Top-Side Markings
(4)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.
Samples
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
21-Mar-2013
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
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