Texas Instruments JM38510-65308BEA, JM38510-65308BFA, SN54HC175J, SN74HC175APWR, SN74HC175D Datasheet

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SN54HC175, SN74HC175
QUADRUPLE D-TYPE FLIP-FLOPS
WITH CLEAR
SCLS299A – JANUARY 1996 – REVISED MA Y 1997
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D
D
Applications Include: – Buffer/Storage Registers – Shift Registers – Pattern Generators
D
Package Options Include Plastic Small-Outline (D), Thin Shrink Small-Outline (PW), and Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs
description
These monolithic positive-edge-triggered D-type flip-flops have a direct clear (CLR) input. The ’HC175 feature complementary outputs from each flip-flop.
Information at the data (D) inputs meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock (CLK) pulse. Clock triggering occurs at a particular voltage level and is not directly related to the transition time of the positive-going edge of CLK. When CLK is at either the high or low level, the D input has no effect at the output.
The SN54HC175 is characterized for operation over the full military temperature range of –55°C to 125°C. The SN74HC175 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each flip-flop)
INPUTS OUTPUTS
CLR CLK D Q Q
L X X L H H HHL H LLH H L X Q
0
Q
0
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SN54HC175 ...J OR W PACKAGE
SN74HC175 . . . D, N, OR PW PACKAGE
(TOP VIEW)
SN54HC175 . . . FK PACKAGE
(TOP VIEW)
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10
9
CLR
1Q 1Q 1D 2D 2Q 2Q
GND
V
CC
4Q 4Q 4D 3D 3Q 3Q CLK
3212019
910111213
4 5 6 7 8
18 17 16 15 14
4Q 4D NC 3D 3Q
1Q 1D
NC
2D 2Q
1Q
CLR
NC
CLK
3Q
4Q
2Q
GND
NC
V
CC
NC – No internal connection
Copyright 1997, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
SN54HC175, SN74HC175 QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SCLS299A – JANUARY 1996 – REVISED MA Y 1997
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
logic symbol
CLR
1Q
2Q
R
1 9
CLK C1
1D
4
1D
3
1Q
2
5
2D
6
2Q
7
12
3D
11
3Q
10
13
4D
14
4Q
15
3Q
4Q
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Pin numbers shown are for the D, J, N, PW, and W packages.
logic diagram (positive logic)
1Q
9
1
C1
1D
CLR
CLK
1D
R
1Q
To Three Other Channels
4
2
3
Pin numbers shown are for the D, J, N, PW, and W packages.
absolute maximum ratings over operating free-air temperature range
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, I
O
(VO = 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θ
JA
(see Note 2): D package 113°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 78°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 149°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace length of zero.
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