•Low Noise and THD
– SNR > 109 dB
– Typical Vn < 7 μVms
– THD+N < 0.002%
•Output Voltage Into 2.5-kΩ Load
– 2 Vrms With 3.3-V Supply Voltage
– 3 Vrms With 5-V Supply Voltage
•Differential Input
•External Undervoltage Mute
APPLICATIONS
•PDP / LCD TV
•Blu-ray Disc™, DVD Players
•Home Theater in a Box
•Set-Top Boxes
Check for Samples: DRV603
DESCRIPTION
The DRV603PW is a 3-V
driver designed to allow the removal of the output
dc-blocking capacitors for reduced component count
and cost. The device is ideal for single-supply
electronics where size and cost are critical design
parameters.
DesignedusingTI’spatentedDirectPath™
technology, The DRV603 is capable of driving 3 V
into a 2.5-kΩ load with 5-V supply voltage. The
device has differential inputs and uses external
gain-setting resistors to support a gain range of ±1
V/V to ±10 V/V, and line outputs that have ±8 kV IEC
ESD protection. The DRV603 (occasionally referred
to as the ‘603) has built-in shutdown control for
pop-free on/off control. The DRV603 has an external
and internal undervoltage detector that mutes the
output.
Using the DRV603 in audio products can reduce
componentcountconsiderablycomparedto
traditional methods of generating a 3-V
DRV603 does not require a power supply greater
than 5 V to generate its 8.5-Vppoutput, nor does it
require a split-rail power supply. The DRV603
integrates its own charge pump to generate a
negative supply rail that provides a clean, pop-free
ground biased 3-V
The DRV603 is available in a 14-pin TSSOP.
If the low noise and trimmed dc-offset and external
undervoltage mute function are not beneficial in the
application, TI recommends the footprint compatible
DRV602.
SLOS617C –JANUARY 2009–REVISED NOVEMBER 2009
pop-free stereo line
RMS
rms
output. The
rms
output.
rms
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2DirectPath is a trademark of Texas Instruments.
3Blu-ray Disc is a trademark of Blu-ray Disc Association.
4All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1)
Tape and reel, 2000
T
A
–40°C to 85°C
ORDERING INFORMATION
PACKAGETRANSPORT MEDIA, QUANTITY
DRV603PWRAIL, 90
DRV603PWR
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range
VALUEUNIT
Supply voltage, VDDto GND–0.3 to 5.5V
V
R
T
T
ESDElectrostatic discharge, IEC ESDOUTL, OUTR±8kV
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
Input voltageVSS– 0.3 to VDD+ 0.3V
I
Minimum load impedance> 600Ω
L
EN to GND–0.3 to VDD+0.3V
Maximum operating junction temperature range–40 to 150°C
J
Storage temperature range–40 to 150°C
stg
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS
PACKAGER
(°C/W)R
θJC
θJA
TSSOP-14 (PW)35115
(°C/W)
(2)
POWER RATING
AT TA≤ 25°CAT TA≤ 70°C
870 mW348 mW
(1)
POWER RATING
(1) Power rating is determined with a junction temperature of 125°C. This is the point where performance starts to degrade and long-term
reliability starts to be reduced. Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C
for best performance and reliability.
(2) These data were taken with the JEDEC high-K test printed circuit board (PCB). For the JEDEC low-K test PCB, the R
|VOS|Output offset voltageVDD= 3 V to 5 V, input grounded, unity gain1mV
PSRR Power-supply rejection ratioVDD= 3 V to 5 V88dB
V
V
|IIH|High-level input current (EN)VDD= 5 V, VI= V
|IIL|Low-level input current (EN)VDD= 5 V, VI= 0 V1µA
Single-supply line-driver amplifiers typically require dc-blocking capacitors. The top drawing in Figure 11
illustrates the conventional line-driver amplifier connection to the load and output signal.
DC blocking capacitors are often large in value, and a mute circuit is needed during power up to minimize click
and pop. The output capacitor and mute circuit consume PCB area and increase cost of assembly, and can
reduce the fidelity of the audio output signal.
Figure 11. Conventional and DirectPath Line Driver
The DirectPath™ amplifier architecture operates from a single supply but makes use of an internal charge pump
to provide a negative voltage rail.
Combining the user-provided positive rail and the negative rail generated by the IC, the device operates in what
is effectively a split supply mode.
The output voltages are now centered at zero volts with the capability to swing to the positive rail or negative rail.
Combining this with the built-in click and pop reduction circuit, the DirectPath™ amplifier requires no output dc
blocking capacitors.
The bottom block diagram and waveform of Figure 11 illustrate the ground-referenced line-driver architecture.
This is the architecture of the DRV603.
The charge pump flying capacitor serves to transfer charge during the generation of the negative supply voltage.
The PVSS capacitor must be at least equal to the charge pump capacitor in order to allow maximum charge
transfer. Low-ESR capacitors are an ideal selection, and a value of 1 μF is typical. Capacitor values that are
smaller than 1 μF can be used, but the maximum output voltage may be reduced and the device may not
operate to specifications.
DECOUPLING CAPACITORS
The DRV603 is a DirectPath™ line-driver amplifier that requires adequate power supply decoupling to ensure
that the noise and total harmonic distortion (THD) are low. A good low equivalent-series-resistance (ESR)
ceramic capacitor, typically 1 μF, placed as close as possible to the device VDDlead works best. Placing this
decoupling capacitor close to the DRV603 is important for the performance of the amplifier. For filtering
lower-frequency noise signals, a 10-μF or greater capacitor placed near the audio power amplifier would also
help, but it is not required in most applications because of the high PSRR of this device.
GAIN-SETTING RESISTOR RANGES
The gain-setting resistors, RINand Rfb, must be chosen so that noise, stability, and input capacitor size of the
DRV603 are kept within acceptable limits. Voltage gain is defined as Rfbdivided by RIN.
Selecting values that are too low demands a large input ac-coupling capacitor, CIN. Selecting values that are too
high increases the noise of the amplifier. Table 1 lists the recommended resistor values for different gain
settings.
Figure 12. Differential, Inverting and Non-Inverting Gain Configurations
Product Folder Link(s): DRV603
fc
IN
+
1
2p RINC
IN
C
IN
+
1
2p fcINR
IN
or
--IN
DifferentialInput
InvertingInput
DRV603
R1
R1
R2
R2
+
-
C3
C3
R3
R3
C1
C1
C2
R1
R2
+
-
C3
R3
C1
C2
+IN
-IN
DRV603
DRV603
www.ti.com
SLOS617C –JANUARY 2009–REVISED NOVEMBER 2009
INPUT-BLOCKING CAPACITORS
DC input-blocking capacitors are required to be added in series with the audio signal into the input pins of the
DRV603. These capacitors block the dc portion of the audio source and allow the DRV603 inputs to be properly
biased to provide maximum performance.
These capacitors form a high-pass filter with the input resistor, RIN. The cutoff frequency is calculated using
Equation 1. For this calculation, the capacitance used is the input-blocking capacitor and the resistance is the
input resistor chosen from Table 1. Then the frequency and/or capacitance can be determined when one of the
two values is given.
(1)
USING THE DRV603 AS A SECOND-ORDER FILTER
Several audio DACs used today require an external low-pass filter to remove out-of-band noise. This is possible
with the DRV603, as it can be used like a standard OPAMP. Several filter topologies can be implemented, both
single-ended and differential. In Figure 13 , a multi-feedback (MFB) with differential input and single-ended input
is shown.
An ac-coupling capacitor to remove dc content from the source is shown; it serves to block any dc content from
the source and lowers the dc-gain to 1, helping reducing the output dc-offset to minimum.
The component values can be calculated with the help of the TI FilterPro™ program available on the TI website
at:
The resistor values should have a low value for obtaining low noise, but should also have a high enough value to
get a small size ac-coupling capacitor. Using 5.6 kΩ for the resistors, C1 = 220 pF, and C2 = 470 pF, a DNR of
112 dB can be achieved with a 10-μF input ac-coupling capacitor.
Pop-free power up is ensured by keeping the SD (shutdown pin) low during power-supply ramp up and ramp
down. The SD pin should be kept low until the input ac-coupling capacitors are fully charged before asserting the
SD pin high to achieve pop-less power up. Figure 14 illustrates the preferred sequence.
Figure 14. Power-Up Sequence
EXTERNAL UNDERVOLTAGE DETECTION
External undervoltage detection can be used to
mute/shut down the DRV603 before an input device
can generate a pop.
The shutdown threshold at the UVP pin is 1.25 V.
The user selects a resistor divider to obtain the
shutdown threshold and hysteresis for the specific
application. The thresholds can be determined as
follows:
V
= 1.25 V × (R11 + R12) / R12
UVP
Hysteresis = 5 μA × R13 × (R11 + R12) / R12
with the condition R13 >> R11//R12.
For example, to obtain V
The DRV603 has the ability to drive a high capacitive load up to 220 pF directly. Higher capacitive loads can be
accepted by adding a series resistor of 47 Ω or larger.
LAYOUT RECOMMENDATIONS
A proposed layout for the DRV603 can be seen in the DRV603EVM User's Guide (SLOU248), and the Gerber
files can be downloaded from http://focus.ti.com/docs/toolsw/folders/print/drv603evm.html. To access this
information, open the DRV603 product folder and look in the Tools and Software folder.
GAIN-SETTING RESISTORS
The gain-setting resistors, RINand Rfb, must be placed close to the input pins to minimize capacitive loading on
these input pins and to ensure maximum stability of the DRV603. For the recommended PCB layout, see the
DRV603EVM user's guide (SLOU248).
NOTE: Page numbers of current version may differ from previous versions.
Changes from Revision A (February 2009) to Revision BPage
•Changed Crosstalk spec from –80dB to –100dB ................................................................................................................. 3
•Added missing voltage value (1.25V) to External Undervoltage Detection threshold equation. ........................................ 12
Changes from Revision B (October 2009) to Revision CPage
•Changed maximum operating junction temperature ............................................................................................................. 2
•In Dissipation Ratings section, changed θJxto R
in three places and 185°C to 185°C/W ............................................... 2
θJx
•Corrected reference to Figure 11 .......................................................................................................................................... 9
•Added cross-reference to Figure 13 ................................................................................................................................... 11
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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