TEXAS INSTRUMENTS DRV601 Technical data

DRV601
www.ti.com
........................................................................................................................................... SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008
DIRECTPATH™ STEREO LINE DRIVER, ADJUSTABLE GAIN
1

FEATURES

2
External Gain Setting Resistors
Space Saving Package
20-Pin, 4 mm × 4 mm Thin QFN, Thermally
Optimized PowerPAD™ Package
Ground-Referenced Outputs Eliminate
DC-Blocking Capacitor – Reduce Board Area – Reduce Component Cost – Improve THD+N Performance – No Degradation of Low-Frequency
Response Due to Output Capacitors
Wide Power Supply Range: 1.8 V to 4.5 V
2 Vrms/Ch Output Voltage into 600 at 3.3 V
supply

DESCRIPTION

The DRV601 is a stereo line driver designed to allow the removal of the output dc-blocking capacitors for reduced component count and cost. The device is ideal for single supply electronics where size and cost are critical design parameters.
The DRV601 is capable of driving 2 Vrms into a 600- load at 3.3 V. The device has external gain setting resistors, that support a gain range of -1V/V to -10V/V, and line outputs that has ± 8-kV IEC ESD protection. The device has independent shutdown control for the right and left audio channels.
The DRV601 is available in a 4 mm × 4 mm Thin QFN package.
Shutdown Control
Short-Circuit and Thermal Protection
Pop Reduction Circuitry

APPLICATIONS

Set-Top Boxes
CD / DVD Players
DVD-Receivers
HTIB
PDP / LCD TV's
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 DIRECTPATH, PowerPAD, DirectPath are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
NC
PVDD
SDL
SGND
NC
C1P
PGND
C1N
NC
PVSS
INR
SDR
INL
NC
OUTR
NC
SVSS
NC
OUTL
SVDD
NC − Nointernalconnection
DRV601
SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008 ...........................................................................................................................................
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
RTJ (QFN) PACKAGE
(TOP VIEW)
www.ti.com
TERMINAL FUNCTIONS
TERMINAL
NAME QFN
C1P 1 I/O Charge pump flying capacitor positive terminal PGND 2 I Power ground, connect to ground. C1N 3 I/O Charge pump flying capacitor negative terminal NC 4, 6, 8, 12, 16, 20 No connection PVSS 5 O Output from charge pump. SVSS 7 I Amplifier negative supply, connect to PVSS via star connection. OUTL 9 O Left audio channel output signal SVDD 10 I Amplifier positive supply, connect to PVDD via star connection. OUTR 11 O Right audio channel output signal INL 13 I Left audio channel input signal SDR 14 I Right channel shutdown, active low logic. INR 15 I Right audio channel input signal SGND 17 I Signal ground, connect to ground. SDL 18 I Left channel shutdown, active low logic. PVDD 19 I Supply voltage, connect to positive supply.
Exposed Pad
I/O DESCRIPTION
Exposed pad must be soldered to a floating plane. Do NOT connect to power or ground.
2 Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): DRV601
DRV601
www.ti.com

ABSOLUTE MAXIMUM RATINGS

........................................................................................................................................... SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008
(1)
over operating free-air temperature range, TA= 25 ° C (unless otherwise noted)
VALUE / UNIT
Supply voltage, AVDD, PVDD – 0.3 V to 5.5 V V R T T T
Input voltage V
I
Minimum load impedance 100
(Load)
Operating free-air temperature range – 40 ° C to 85 ° C
A
Operating junction temperature range 0 ° C to 150 ° C
J
Storage temperature range – 65 ° C to 85 ° C
stg
0.3 V to V
SS
+ 0.3 V
DD
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
AVAILABLE OPTIONS
T
A
PACKAGED DEVICES
-40 ° C to 85 ° C 20-pin, 4 mm × 4 mm QFN DRV601RTJ
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
(2) The RTJ package is only available taped and reeled. To order, add the suffix “ R ” to the end of the part number for a reel of 3000, or add
the suffix “ T ” to the end of the part number for a reel of 250 (e.g., DRV601RTJR).
(1)
PART NUMBER SYMBOL
(2)
AKQ

RECOMMENDED OPERATING CONDITIONS

V
SS
V
IH
V
IL
T
A
(1) Device can shut down for V
Supply voltage, AVDD, PVDD 1.8 4.5 High-level input voltage SDL, SDR 1.5 V Low-level input voltage SDL, SDR 0.5 V Operating free-air temperature – 40 85 ° C
> 4.5 V to prevent damage to the device.
DD

ELECTRICAL CHARACTERISTICS

TA= 25 ° C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
|V
| Output offset voltage V
OS
PSRR Power Supply Rejection Ratio V V V |IIH| High-level input current ( SDL, SDR) V |IIL| Low-level input current ( SDL, SDR) V
I
High-level output voltage V
OH
Low-level output voltage V
OL
Supply Current
DD
MIN MAX UNIT
= 1.8 V to 4.5 V, Inputs grounded 8 mV
DD
= 1.8 V to 4.5 V 88 dB
DD
= 3.3 V, RL= 600 3.10 V
DD
= 3.3 V, RL= 600 – 3.05 V
DD
= 4.5 V, VI= V
DD
= 4.5 V, VI= 0 V 1 µ A
DD
V
= 1.8 V, No load, SDL= SDR = V
DD
V
= 3.3 V, No load, SDL = SDR = V
DD
V
= 4.5 V, No load, SDL = SDR = V
DD
Shutdown mode, V
DD
DD
DD DD
= 1.8 V to 4.5 V 1 µ A
DD
5.3
7.1 mA
8.7
(1)
V
1 µ A
Copyright © 2008, Texas Instruments Incorporated 3
Product Folder Link(s): DRV601
DRV601
SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008 ...........................................................................................................................................

OPERATING CHARACTERISTICS

V
= 3.3 V , TA= 25 ° C, RL= 600 , C
DD
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
O
Output Voltage(Outputs In Phase) V
THD+N Total harmonic distortion plus noise
Crosstalk VO= 2 Vrms, f = 1 kHz -80 dB
A
vo
R
in
R
fb
Open-loop voltage gain 155 dB Input resistor range 1 10 47 k Feedback resistor range 4.7 20 100 k Slew rate 2.2 V/ µ s Maximum capacitive load 300 pF
V
n
Noise output voltage 22-kHz filter, A-weighted 10 µ Vrms ESD Electrostatic discharge OUTR, OUTL ± 8 kV f
osc
Charge pump switching frequency 280 320 420 kHz
Start-up time from shutdown 450 µ s
Input impedance 1 M SNR Signal-to-noise ratio 105 dB G
(bw)
Unity Gain Bandwidth 3.5 MHz
Thermal shutdown
= C
(PUMP)
(PVSS)
= 1 µ F , C
THD = 1%, V THD = 1%, V THD = 1%, V
100 k
= 1 µ F, R
IN
= 3.3 V, f = 1 kHz 2.1
DD
= 4.5 V, f = 1 kHz 2.7
DD
= 4.5 V, f = 1 kHz, RL=
DD
= 10 k , R
in
= 20 k (unless otherwise noted)
fb
2.8
VO= 2 Vrms, f = 1 kHz 0.008% VO= 2 Vrms, f = 6.67 kHz 0.030%
Vo= 2 Vrms (THD+N = 0.1%), 22-kHz BW, A-weighted
Threshold 150 170 ° C Hysteresis 15 ° C
www.ti.com
RMS
4 Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): DRV601
FunctionalBlockDiagram
Rin
SVDD
SVDD
SVSS
SVSS
SGND
AudioOut - R
AudioOut - L
Short
Circuit
Protection
Charge
Pump
Bias
Circuitry
SDx
C 1N
C 1P
PVSS
Rin
Rfb
Rfb
+
+
-
-
DRV601
www.ti.com
........................................................................................................................................... SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008
Functional Block Diagram
Copyright © 2008, Texas Instruments Incorporated 5
Product Folder Link(s): DRV601
3m 310m 100m 500m 2
V -OutputVoltage-Vrms
O
0.001
10
0.01
0.1
1
THD+N-totalHarmonicDistortion+Noise-%
V =1.8V,
R =100k , f=1kHz
DD
L
W
0.001
10
0.01
0.1
1
THD+N-totalHarmonicDistortion+Noise-%
3m 310m 100m 500m 2
V -OutputVoltage-Vrms
O
V =3.3V,
R =100k , f=1kHz
DD
L
W
0.001
10
0.01
0.1
1
THD+N-totalHarmonicDistortion+Noise-%
3m 310m 100m 500m 2
V -OutputVoltage-Vrms
O
V =4.5V,
R =100k , f=1kHz
DD
L
W
0.001
10
0.01
0.1
1
THD+N-totalHarmonicDistortion+Noise-%
3m 310m 100m 500m 2
V -OutputVoltage-Vrms
O
V =3.3V,
R =600 , f=1kHz
DD
L
W
0.001
10
0.01
0.1
1
THD+N-totalHarmonicDistortion+Noise-%
3m 310m 100m 500m 2
V -OutputVoltage-Vrms
O
V =1.8V,
R =600 , f=1kHz
DD
L
W
0.001
10
0.01
0.1
1
THD+N-totalHarmonicDistortion+Noise-%
3m 310m 100m 500m 2
V -OutputVoltage-Vrms
O
V =4.5V,
R =600 , f=1kHz
DD
L
W
DRV601
SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008 ...........................................................................................................................................

TYPICAL CHARACTERISTICS

C
= C
(PUMP)
= 1 µ F , C
(PVSS)
= 1 µ F, R
IN
= 10 k , R
in
= 20 k (unless otherwise noted)
fb

Table of Graphs

Total harmonic distortion + noise vs Output Voltage 1-6 Total harmonic distortion + noise vs Frequency 7-8 Quiescent supply current vs Supply voltage 9 Output spectrum 10 Gain and phase vs Frequency 11-12
TOTAL HARMONIC DISTORTION + TOTAL HARMONIC DISTORTION + TOTAL HARMONIC DISTORTION +
NOISE NOISE NOISE
vs vs vs
OUTPUT VOLTAGE OUTPUT VOLTAGE OUTPUT VOLTAGE
www.ti.com
FIGURE
Figure 1. Figure 2. Figure 3.
TOTAL HARMONIC DISTORTION + TOTAL HARMONIC DISTORTION + TOTAL HARMONIC DISTORTION +
NOISE NOISE NOISE
OUTPUT VOLTAGE OUTPUT VOLTAGE OUTPUT VOLTAGE
vs vs vs
Figure 4. Figure 5. Figure 6.
6 Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): DRV601
20 20k50 100 500 1k 2k 5k
f-frequency-Hz
0.001
10
0.01
0.1
1
THD+N-totalHarmonicDistortion+Noise-%
V =3.3V,
R =600 , 2Vrms
DD
L
W
20 20k50 100 500 1k 2k 5k
f-frequency-Hz
0.001
10
0.01
0.1
1
THD+N-totalHarmonicDistortion+Noise-%
V =3.3V,
R =600 , 200mVrms
DD
L
W
0
10
2
4
6
8
0 4.50.5 1 1.5 2 2.5 3 3.5
V -SupplyVoltage-V
DD
I -SupplyCurrent-mA
DD
R =600 , NoLoad
L
W
-140
0
-120
-100
-80
-60
-40
-20
0 20k10k
f-frequency-Hz
FFT-dBr
V =3.3V,
R =600 , G=-60dB
DD
L
W
3
7
3.5
4
4.5
5
5.5
6
6.5
20 100k100 1k 2k 10k
f-frequency-Hz
Gain-dB
V =3.3V,
R =600 , 2Vrms
DD
L
W
-200
0
-175
-150
-125
-100
-75
-50
-25
20 100k100 1k 2k 10k
f-frequency-Hz
Phase-deg
V =3.3V,
R =600 , 2Vrms
DD
L
W
DRV601
www.ti.com
........................................................................................................................................... SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008
TOTAL HARMONIC DISTORTION + TOTAL HARMONIC DISTORTION +
NOISE NOISE QUIESCENT SUPPLY CURRENT
vs vs vs
FREQUENCY FREQUENCY SUPPLY VOLTAGE
Figure 7. Figure 8. Figure 9.
FFT GAIN PHASE
vs vs vs
FREQUENCY FREQUENCY FREQUENCY
Figure 10. Figure 11. Figure 12.
Copyright © 2008, Texas Instruments Incorporated 7
Product Folder Link(s): DRV601
f =
c
1
2 R Cp
L O
C =
O
1
2 R fp
L
c
C
O
C
O
V
OUT
GND
V
DD
V /2
DD
Conventional
GND
V
DD
V
SS
DirectPath
DRV601
SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008 ...........................................................................................................................................
www.ti.com

APPLICATION INFORMATION

Line Driver Amplifiers

Single-supply Line Driver amplifiers typically require dc-blocking capacitors. The top drawing in Figure 13 illustrates the conventional Line Driver amplifier connection to the load and output signal.
DC blocking capacitors are often large in value. The line load (typical resistive values of 600 to 10 k ) combine with the dc blocking capacitors to form a high-pass filter. Equation 1 shows the relationship between the load impedance (R
C
can be determined using Equation 2 , where the load impedance and the cutoff frequency are known.
O
If fCis low, the capacitor must then have a large value because the load resistance is small. Large capacitance values require large package sizes. Large package sizes consume PCB area, stand high above the PCB, increase cost of assembly, and can reduce the fidelity of the audio output signal.
), the capacitor (C
L
), and the cutoff frequency (fC).
O
(1)
(2)
Figure 13. Amplifier Applications
The DirectPath™ amplifier architecture operates from a single supply but makes use of an internal charge pump to provide a negative voltage rail. Combining the user provided positive rail and the negative rail generated by the IC, the device operates in what is effectively a split supply mode. The output voltages are now centered at zero volts with the capability to swing to the positive rail or negative rail. The DirectPath™ amplifier requires no output dc blocking capacitors. The bottom block diagram and waveform of Figure 13 illustrate the ground-referenced Line Driver architecture. This is the architecture of the DRV601.
8 Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): DRV601
fc
IN
+
1
2p RINC
IN
C
IN
+
1
2p fcINR
IN
or
DRV601
www.ti.com
........................................................................................................................................... SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008

Charge Pump Flying Capacitor and PVSS Capacitor

The charge pump flying capacitor serves to transfer charge during the generation of the negative supply voltage. The PVSS capacitor must be at least equal to the charge pump capacitor in order to allow maximum charge transfer. Low ESR capacitors are an ideal selection, and a value of 1 µ F is typical. Capacitor values that are smaller than 1 µ F can be used, but the maximum output voltage may be reduced and the device may not operate to specifications.

Decoupling Capacitors

The DRV601 is a DirectPath™ Line Driver amplifier that require adequate power supply decoupling to ensure that the noise and total harmonic distortion (THD) are low. A good low equivalent-series-resistance (ESR) ceramic capacitor, typically 2.2 µ F, placed as close as possible to the device V
lead works best. Placing this
DD
decoupling capacitor close to the DRV601 is important for the performance of the amplifier. For filtering lower frequency noise signals, a 10- µ F or greater capacitor placed near the audio power amplifier would also help, but it is not required in most applications because of the high PSRR of this device.

Gain setting resistors ranges

The gain setting resistors, R DRV601 is kept within acceptable limits. Voltage gain is defined as R
Selecting values that are too low demands a large input ac-coupling capacitor, C high increases the noise of the amplifier. Table 1 lists the recommended resistor values for different gain settings.
Gain Input Resistor Value, R
-1 V/V 10 k 10 k
-1.5 V/V 10 k 15 k
-2 V/V 10 k 20 k
-10 V/V 4,7 k 47 k
and Rfb, must be chosen so that noise, stability and input capacitor size of the
in
divided by Rin.
fb
. Selecting values that are too
IN
Table 1. Recommended Resistor Values
in
Feedback Resistor Value, R
fb

Input-Blocking Capacitors

DC input-blocking capacitors are required to be added in series with the audio signal into the input pins of the DRV601. These capacitors block the DC portion of the audio source and allow the DRV601 inputs to be properly biased to provide maximum performance.
These capacitors form a high-pass filter with the input resistor, Rin. The cutoff frequency is calculated using
Equation 3 . For this calculation, the capacitance used is the input-blocking capacitor and the resistance is the
input resistor chosen from the gain table above, then the frequency and/or capacitance can be determined when one of the two values are given.

Supply Voltage Limiting At 4.5 V

The DRV601 have a built-in charge pump which serves to generate a negative rail for the line driver. Because the line driver operates from a positive voltage and negative voltage supply, circuitry has been implemented to protect the devices in the amplifier from an overvoltage condition. Once the supply is above 4.5 V, the DRV601 can shut down in an overvoltage protection mode to prevent damage to the device. The DRV601 resume normal operation once the supply is reduced to 4.5 V or lower.

Capacitive load

The DRV601 has the ability to drive a high capacitive load up to 330pF directly, higher capacitive loads can be accepted by adding a series resistor of 10 or larger. The figure below shows a 10kHz signal into a 470pF capacitor using the 10R series resistor.
(3)
Copyright © 2008, Texas Instruments Incorporated 9
Product Folder Link(s): DRV601
t − Time=20ms/div
Ch2
1 V/div
DRV601
SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008 ...........................................................................................................................................
SQUARE WAVE OUTPUT VOLTAGE
with
CAPACITIVE LOAD
Figure 14.

Layout Recommendations

A proposed layout for the DRV601 can be seen in the DRV601EVM user's guide, SLOU215 , and the Gerber files can be downloaded on www.ti.com , open the DRV601 product folder and look in the Tools & Software folder.
www.ti.com

Exposed Pad On DRV601RTJ Package

The exposed metal pad on the DRV601RTJ package must be soldered down to a pad on the PCB in order to maintain reliability. The pad on the PCB should be allowed to float and not be connected to ground or power. Connecting this pad to power or ground prevents the device from working properly because it is connected internally to PVSS.

SGND and PGND Connections

The SGND and PGND pins of the DRV601 must be routed back to the decoupling capacitor separately in order to provide proper device operation. If the SGND and PGND pins are connected directly to each other, the part functions without risk of failure, but the noise and THD performance do not meet the specifications.

Gain setting resistors

The gain setting resistors, R
and R
in
, must be placed close to pin 13 respectively pin 17 to minimize the
fb
capacitive loading on these input pins and to ensure maximum stability of the DRV601. For the recommenced PCB layout, see the DRV601EVM user guide.
10 Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): DRV601
DRV601
AudioIn-R
AudioIn-L
SGND
AudioOut-R
AudioOut-L
SDL
C1N
Right
Output
PVSS
SDR
PGND
PVDD SVDD
Shuntdown
Control
PCM1773
VOUT_R
VOUT_L
330pF
LeftOutput
VCC
47kW
33pF
3.3V
1 Fm
15kW
15kW
1 Fm
33kW
33kW
33pF
330pF
47kW
1 Fm
1 Fm
C1P
1 Fm
DRV601
www.ti.com
........................................................................................................................................... SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008
Figure 15. Application Circuit
Copyright © 2008, Texas Instruments Incorporated 11
Product Folder Link(s): DRV601
PACKAGE OPTION ADDENDUM
www.ti.com 16-Apr-2009
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package Drawing
Pins Package
Qty
Eco Plan
DRV601RTJR ACTIVE QFN RTJ 20 3000 Green (RoHS &
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-2-260C-1 YEAR
(3)
no Sb/Br)
DRV601RTJRG4 ACTIVE QFN RTJ 20 3000 Green (RoHS &
CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
DRV601RTJT ACTIVE QFN RTJ 20 250 Green (RoHS &
CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
DRV601RTJTG4 ACTIVE QFN RTJ 20 250 Green (RoHS &
CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 1-May-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
DRV601RTJR QFN RTJ 20 3000 330.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2 DRV601RTJT QFN RTJ 20 250 180.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 1-May-2009
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DRV601RTJR QFN RTJ 20 3000 346.0 346.0 29.0 DRV601RTJT QFN RTJ 20 250 190.5 212.7 31.8
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP® Products www.dlp.com Broadband www.ti.com/broadband DSP dsp.ti.com Digital Control www.ti.com/digitalcontrol Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Military www.ti.com/military Logic logic.ti.com Optical Networking www.ti.com/opticalnetwork Power Mgmt power.ti.com Security www.ti.com/security Microcontrollers microcontroller.ti.com Telephony www.ti.com/telephony RFID www.ti-rfid.com Video & Imaging www.ti.com/video RF/IF and ZigBee® Solutions www.ti.com/lprf Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2009, Texas Instruments Incorporated
Loading...