DRV601
www.ti.com
........................................................................................................................................... SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008
DIRECTPATH™ STEREO LINE DRIVER, ADJUSTABLE GAIN
1
FEATURES
2
• External Gain Setting Resistors
• Space Saving Package
– 20-Pin, 4 mm × 4 mm Thin QFN, Thermally
Optimized PowerPAD™ Package
• Ground-Referenced Outputs Eliminate
DC-Blocking Capacitor
– Reduce Board Area
– Reduce Component Cost
– Improve THD+N Performance
– No Degradation of Low-Frequency
Response Due to Output Capacitors
• Wide Power Supply Range: 1.8 V to 4.5 V
• 2 Vrms/Ch Output Voltage into 600 Ω at 3.3 V
supply
DESCRIPTION
The DRV601 is a stereo line driver designed to allow the removal of the output dc-blocking capacitors for
reduced component count and cost. The device is ideal for single supply electronics where size and cost are
critical design parameters.
The DRV601 is capable of driving 2 Vrms into a 600- Ω load at 3.3 V. The device has external gain setting
resistors, that support a gain range of -1V/V to -10V/V, and line outputs that has ± 8-kV IEC ESD protection. The
device has independent shutdown control for the right and left audio channels.
The DRV601 is available in a 4 mm × 4 mm Thin QFN package.
• Independent Right and Left Channel
Shutdown Control
• Short-Circuit and Thermal Protection
• Pop Reduction Circuitry
APPLICATIONS
• Set-Top Boxes
• CD / DVD Players
• DVD-Receivers
• HTIB
• PDP / LCD TV's
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 DIRECTPATH, PowerPAD, DirectPath are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
NC
PVDD
SDL
SGND
NC
C1P
PGND
C1N
NC
PVSS
INR
SDR
INL
NC
OUTR
NC
SVSS
NC
OUTL
SVDD
NC − Nointernalconnection
DRV601
SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008 ...........................................................................................................................................
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
RTJ (QFN) PACKAGE
(TOP VIEW)
www.ti.com
TERMINAL FUNCTIONS
TERMINAL
NAME QFN
C1P 1 I/O Charge pump flying capacitor positive terminal
PGND 2 I Power ground, connect to ground.
C1N 3 I/O Charge pump flying capacitor negative terminal
NC 4, 6, 8, 12, 16, 20 No connection
PVSS 5 O Output from charge pump.
SVSS 7 I Amplifier negative supply, connect to PVSS via star connection.
OUTL 9 O Left audio channel output signal
SVDD 10 I Amplifier positive supply, connect to PVDD via star connection.
OUTR 11 O Right audio channel output signal
INL 13 I Left audio channel input signal
SDR 14 I Right channel shutdown, active low logic.
INR 15 I Right audio channel input signal
SGND 17 I Signal ground, connect to ground.
SDL 18 I Left channel shutdown, active low logic.
PVDD 19 I Supply voltage, connect to positive supply.
Exposed Pad
I/O DESCRIPTION
Exposed pad must be soldered to a floating plane. Do NOT connect to power or ground.
2 Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): DRV601
DRV601
www.ti.com
ABSOLUTE MAXIMUM RATINGS
........................................................................................................................................... SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008
(1)
over operating free-air temperature range, TA= 25 ° C (unless otherwise noted)
VALUE / UNIT
Supply voltage, AVDD, PVDD – 0.3 V to 5.5 V
V
R
T
T
T
Input voltage V
I
Minimum load impedance ≥ 100 Ω
(Load)
Operating free-air temperature range – 40 ° C to 85 ° C
A
Operating junction temperature range 0 ° C to 150 ° C
J
Storage temperature range – 65 ° C to 85 ° C
stg
– 0.3 V to V
SS
+ 0.3 V
DD
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
AVAILABLE OPTIONS
T
A
PACKAGED DEVICES
-40 ° C to 85 ° C 20-pin, 4 mm × 4 mm QFN DRV601RTJ
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
(2) The RTJ package is only available taped and reeled. To order, add the suffix “ R ” to the end of the part number for a reel of 3000, or add
the suffix “ T ” to the end of the part number for a reel of 250 (e.g., DRV601RTJR).
(1)
PART NUMBER SYMBOL
(2)
AKQ
RECOMMENDED OPERATING CONDITIONS
V
SS
V
IH
V
IL
T
A
(1) Device can shut down for V
Supply voltage, AVDD, PVDD 1.8 4.5
High-level input voltage SDL, SDR 1.5 V
Low-level input voltage SDL, SDR 0.5 V
Operating free-air temperature – 40 85 ° C
> 4.5 V to prevent damage to the device.
DD
ELECTRICAL CHARACTERISTICS
TA= 25 ° C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
|V
| Output offset voltage V
OS
PSRR Power Supply Rejection Ratio V
V
V
|IIH| High-level input current ( SDL, SDR) V
|IIL| Low-level input current ( SDL, SDR) V
I
High-level output voltage V
OH
Low-level output voltage V
OL
Supply Current
DD
MIN MAX UNIT
= 1.8 V to 4.5 V, Inputs grounded 8 mV
DD
= 1.8 V to 4.5 V 88 dB
DD
= 3.3 V, RL= 600 Ω 3.10 V
DD
= 3.3 V, RL= 600 Ω – 3.05 V
DD
= 4.5 V, VI= V
DD
= 4.5 V, VI= 0 V 1 µ A
DD
V
= 1.8 V, No load, SDL= SDR = V
DD
V
= 3.3 V, No load, SDL = SDR = V
DD
V
= 4.5 V, No load, SDL = SDR = V
DD
Shutdown mode, V
DD
DD
DD
DD
= 1.8 V to 4.5 V 1 µ A
DD
5.3
7.1 mA
8.7
(1)
V
1 µ A
Copyright © 2008, Texas Instruments Incorporated 3
Product Folder Link(s): DRV601
DRV601
SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008 ...........................................................................................................................................
OPERATING CHARACTERISTICS
V
= 3.3 V , TA= 25 ° C, RL= 600 Ω , C
DD
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
O
Output Voltage(Outputs In Phase) V
THD+N Total harmonic distortion plus noise
Crosstalk VO= 2 Vrms, f = 1 kHz -80 dB
A
vo
R
in
R
fb
Open-loop voltage gain 155 dB
Input resistor range 1 10 47 k Ω
Feedback resistor range 4.7 20 100 k Ω
Slew rate 2.2 V/ µ s
Maximum capacitive load 300 pF
V
n
Noise output voltage 22-kHz filter, A-weighted 10 µ Vrms
ESD Electrostatic discharge OUTR, OUTL ± 8 kV
f
osc
Charge pump switching frequency 280 320 420 kHz
Start-up time from shutdown 450 µ s
Input impedance 1 M Ω
SNR Signal-to-noise ratio 105 dB
G
(bw)
Unity Gain Bandwidth 3.5 MHz
Thermal shutdown
= C
(PUMP)
(PVSS)
= 1 µ F , C
THD = 1%, V
THD = 1%, V
THD = 1%, V
100 k Ω
= 1 µ F, R
IN
= 3.3 V, f = 1 kHz 2.1
DD
= 4.5 V, f = 1 kHz 2.7
DD
= 4.5 V, f = 1 kHz, RL=
DD
= 10 k Ω , R
in
= 20 k Ω (unless otherwise noted)
fb
2.8
VO= 2 Vrms, f = 1 kHz 0.008%
VO= 2 Vrms, f = 6.67 kHz 0.030%
Vo= 2 Vrms (THD+N = 0.1%), 22-kHz BW,
A-weighted
Threshold 150 170 ° C
Hysteresis 15 ° C
www.ti.com
RMS
4 Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): DRV601
FunctionalBlockDiagram
Rin
SVDD
SVDD
SVSS
SVSS
SGND
AudioOut - R
AudioOut - L
Short
Circuit
Protection
Charge
Pump
Bias
Circuitry
SDx
C 1N
C 1P
PVSS
Rin
Rfb
Rfb
+
+
-
-
DRV601
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........................................................................................................................................... SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008
Functional Block Diagram
Copyright © 2008, Texas Instruments Incorporated 5
Product Folder Link(s): DRV601
3m 3 10m 100m 500m 2
V -OutputVoltage-Vrms
O
0.001
10
0.01
0.1
1
THD+N-totalHarmonicDistortion+Noise-%
V =1.8V,
R =100k ,
f=1kHz
DD
L
W
0.001
10
0.01
0.1
1
THD+N-totalHarmonicDistortion+Noise-%
3m 3 10m 100m 500m 2
V -OutputVoltage-Vrms
O
V =3.3V,
R =100k ,
f=1kHz
DD
L
W
0.001
10
0.01
0.1
1
THD+N-totalHarmonicDistortion+Noise-%
3m 3 10m 100m 500m 2
V -OutputVoltage-Vrms
O
V =4.5V,
R =100k ,
f=1kHz
DD
L
W
0.001
10
0.01
0.1
1
THD+N-totalHarmonicDistortion+Noise-%
3m 3 10m 100m 500m 2
V -OutputVoltage-Vrms
O
V =3.3V,
R =600 ,
f=1kHz
DD
L
W
0.001
10
0.01
0.1
1
THD+N-totalHarmonicDistortion+Noise-%
3m 3 10m 100m 500m 2
V -OutputVoltage-Vrms
O
V =1.8V,
R =600 ,
f=1kHz
DD
L
W
0.001
10
0.01
0.1
1
THD+N-totalHarmonicDistortion+Noise-%
3m 3 10m 100m 500m 2
V -OutputVoltage-Vrms
O
V =4.5V,
R =600 ,
f=1kHz
DD
L
W
DRV601
SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008 ...........................................................................................................................................
TYPICAL CHARACTERISTICS
C
= C
(PUMP)
= 1 µ F , C
(PVSS)
= 1 µ F, R
IN
= 10 k Ω , R
in
= 20 k Ω (unless otherwise noted)
fb
Table of Graphs
Total harmonic distortion + noise vs Output Voltage 1-6
Total harmonic distortion + noise vs Frequency 7-8
Quiescent supply current vs Supply voltage 9
Output spectrum 10
Gain and phase vs Frequency 11-12
TOTAL HARMONIC DISTORTION + TOTAL HARMONIC DISTORTION + TOTAL HARMONIC DISTORTION +
NOISE NOISE NOISE
vs vs vs
OUTPUT VOLTAGE OUTPUT VOLTAGE OUTPUT VOLTAGE
www.ti.com
FIGURE
Figure 1. Figure 2. Figure 3.
TOTAL HARMONIC DISTORTION + TOTAL HARMONIC DISTORTION + TOTAL HARMONIC DISTORTION +
NOISE NOISE NOISE
OUTPUT VOLTAGE OUTPUT VOLTAGE OUTPUT VOLTAGE
vs vs vs
Figure 4. Figure 5. Figure 6.
6 Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): DRV601
20 20k 50 100 500 1k 2k 5k
f-frequency-Hz
0.001
10
0.01
0.1
1
THD+N-totalHarmonicDistortion+Noise-%
V =3.3V,
R =600 ,
2Vrms
DD
L
W
20 20k 50 100 500 1k 2k 5k
f-frequency-Hz
0.001
10
0.01
0.1
1
THD+N-totalHarmonicDistortion+Noise-%
V =3.3V,
R =600 ,
200mVrms
DD
L
W
0
10
2
4
6
8
0 4.5 0.5 1 1.5 2 2.5 3 3.5
V -SupplyVoltage-V
DD
I -SupplyCurrent-mA
DD
R =600 ,
NoLoad
L
W
-140
0
-120
-100
-80
-60
-40
-20
0 20k 10k
f-frequency-Hz
FFT-dBr
V =3.3V,
R =600 ,
G=-60dB
DD
L
W
3
7
3.5
4
4.5
5
5.5
6
6.5
20 100k 100 1k 2k 10k
f-frequency-Hz
Gain-dB
V =3.3V,
R =600 ,
2Vrms
DD
L
W
-200
0
-175
-150
-125
-100
-75
-50
-25
20 100k 100 1k 2k 10k
f-frequency-Hz
Phase-deg
V =3.3V,
R =600 ,
2Vrms
DD
L
W
DRV601
www.ti.com
........................................................................................................................................... SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008
TOTAL HARMONIC DISTORTION + TOTAL HARMONIC DISTORTION +
NOISE NOISE QUIESCENT SUPPLY CURRENT
vs vs vs
FREQUENCY FREQUENCY SUPPLY VOLTAGE
Figure 7. Figure 8. Figure 9.
FFT GAIN PHASE
vs vs vs
FREQUENCY FREQUENCY FREQUENCY
Figure 10. Figure 11. Figure 12.
Copyright © 2008, Texas Instruments Incorporated 7
Product Folder Link(s): DRV601
C
O
C
O
V
OUT
GND
V
DD
V /2
DD
Conventional
GND
V
DD
V
SS
DirectPath
DRV601
SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008 ...........................................................................................................................................
www.ti.com
APPLICATION INFORMATION
Line Driver Amplifiers
Single-supply Line Driver amplifiers typically require dc-blocking capacitors. The top drawing in Figure 13
illustrates the conventional Line Driver amplifier connection to the load and output signal.
DC blocking capacitors are often large in value. The line load (typical resistive values of 600 Ω to 10 k Ω )
combine with the dc blocking capacitors to form a high-pass filter. Equation 1 shows the relationship between the
load impedance (R
C
can be determined using Equation 2 , where the load impedance and the cutoff frequency are known.
O
If fCis low, the capacitor must then have a large value because the load resistance is small. Large capacitance
values require large package sizes. Large package sizes consume PCB area, stand high above the PCB,
increase cost of assembly, and can reduce the fidelity of the audio output signal.
), the capacitor (C
L
), and the cutoff frequency (fC).
O
(1)
(2)
Figure 13. Amplifier Applications
The DirectPath™ amplifier architecture operates from a single supply but makes use of an internal charge pump
to provide a negative voltage rail. Combining the user provided positive rail and the negative rail generated by
the IC, the device operates in what is effectively a split supply mode. The output voltages are now centered at
zero volts with the capability to swing to the positive rail or negative rail. The DirectPath™ amplifier requires no
output dc blocking capacitors. The bottom block diagram and waveform of Figure 13 illustrate the
ground-referenced Line Driver architecture. This is the architecture of the DRV601.
8 Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): DRV601
fc
IN
+
1
2p RINC
IN
C
IN
+
1
2p fcINR
IN
or
DRV601
www.ti.com
........................................................................................................................................... SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008
Charge Pump Flying Capacitor and PVSS Capacitor
The charge pump flying capacitor serves to transfer charge during the generation of the negative supply voltage.
The PVSS capacitor must be at least equal to the charge pump capacitor in order to allow maximum charge
transfer. Low ESR capacitors are an ideal selection, and a value of 1 µ F is typical. Capacitor values that are
smaller than 1 µ F can be used, but the maximum output voltage may be reduced and the device may not operate
to specifications.
Decoupling Capacitors
The DRV601 is a DirectPath™ Line Driver amplifier that require adequate power supply decoupling to ensure
that the noise and total harmonic distortion (THD) are low. A good low equivalent-series-resistance (ESR)
ceramic capacitor, typically 2.2 µ F, placed as close as possible to the device V
lead works best. Placing this
DD
decoupling capacitor close to the DRV601 is important for the performance of the amplifier. For filtering lower
frequency noise signals, a 10- µ F or greater capacitor placed near the audio power amplifier would also help, but
it is not required in most applications because of the high PSRR of this device.
Gain setting resistors ranges
The gain setting resistors, R
DRV601 is kept within acceptable limits. Voltage gain is defined as R
Selecting values that are too low demands a large input ac-coupling capacitor, C
high increases the noise of the amplifier. Table 1 lists the recommended resistor values for different gain
settings.
Gain Input Resistor Value, R
-1 V/V 10 k Ω 10 k Ω
-1.5 V/V 10 k Ω 15 k Ω
-2 V/V 10 k Ω 20 k Ω
-10 V/V 4,7 k Ω 47 k Ω
and Rfb, must be chosen so that noise, stability and input capacitor size of the
in
divided by Rin.
fb
. Selecting values that are too
IN
Table 1. Recommended Resistor Values
in
Feedback Resistor Value, R
fb
Input-Blocking Capacitors
DC input-blocking capacitors are required to be added in series with the audio signal into the input pins of the
DRV601. These capacitors block the DC portion of the audio source and allow the DRV601 inputs to be properly
biased to provide maximum performance.
These capacitors form a high-pass filter with the input resistor, Rin. The cutoff frequency is calculated using
Equation 3 . For this calculation, the capacitance used is the input-blocking capacitor and the resistance is the
input resistor chosen from the gain table above, then the frequency and/or capacitance can be determined when
one of the two values are given.
Supply Voltage Limiting At 4.5 V
The DRV601 have a built-in charge pump which serves to generate a negative rail for the line driver. Because
the line driver operates from a positive voltage and negative voltage supply, circuitry has been implemented to
protect the devices in the amplifier from an overvoltage condition. Once the supply is above 4.5 V, the DRV601
can shut down in an overvoltage protection mode to prevent damage to the device. The DRV601 resume normal
operation once the supply is reduced to 4.5 V or lower.
Capacitive load
The DRV601 has the ability to drive a high capacitive load up to 330pF directly, higher capacitive loads can be
accepted by adding a series resistor of 10 Ω or larger. The figure below shows a 10kHz signal into a 470pF
capacitor using the 10R series resistor.
(3)
Copyright © 2008, Texas Instruments Incorporated 9
Product Folder Link(s): DRV601
t − Time=20ms/div
Ch2
1 V/div
DRV601
SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008 ...........................................................................................................................................
SQUARE WAVE OUTPUT VOLTAGE
with
CAPACITIVE LOAD
Figure 14.
Layout Recommendations
A proposed layout for the DRV601 can be seen in the DRV601EVM user's guide, SLOU215 , and the Gerber files
can be downloaded on www.ti.com , open the DRV601 product folder and look in the Tools & Software folder.
www.ti.com
Exposed Pad On DRV601RTJ Package
The exposed metal pad on the DRV601RTJ package must be soldered down to a pad on the PCB in order to
maintain reliability. The pad on the PCB should be allowed to float and not be connected to ground or power .
Connecting this pad to power or ground prevents the device from working properly because it is connected
internally to PVSS.
SGND and PGND Connections
The SGND and PGND pins of the DRV601 must be routed back to the decoupling capacitor separately in order
to provide proper device operation. If the SGND and PGND pins are connected directly to each other, the part
functions without risk of failure, but the noise and THD performance do not meet the specifications.
Gain setting resistors
The gain setting resistors, R
and R
in
, must be placed close to pin 13 respectively pin 17 to minimize the
fb
capacitive loading on these input pins and to ensure maximum stability of the DRV601. For the recommenced
PCB layout, see the DRV601EVM user guide.
10 Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): DRV601
DRV601
AudioIn-R
AudioIn-L
SGND
AudioOut-R
AudioOut-L
SDL
C1N
Right
Output
PVSS
SDR
PGND
PVDD SVDD
Shuntdown
Control
PCM1773
VOUT_R
VOUT_L
330pF
LeftOutput
VCC
47kW
33pF
3.3V
1 Fm
15kW
15kW
1 Fm
33kW
33kW
33pF
330pF
47kW
1 Fm
1 Fm
C1P
1 Fm
DRV601
www.ti.com
........................................................................................................................................... SLOS553B – JANUARY 2008 – REVISED NOVEMBER 2008
Figure 15. Application Circuit
Copyright © 2008, Texas Instruments Incorporated 11
Product Folder Link(s): DRV601
PACKAGE OPTION ADDENDUM
www.ti.com 16-Apr-2009
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
DRV601RTJR ACTIVE QFN RTJ 20 3000 Green (RoHS &
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-2-260C-1 YEAR
(3)
no Sb/Br)
DRV601RTJRG4 ACTIVE QFN RTJ 20 3000 Green (RoHS &
CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
DRV601RTJT ACTIVE QFN RTJ 20 250 Green (RoHS &
CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
DRV601RTJTG4 ACTIVE QFN RTJ 20 250 Green (RoHS &
CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 1-May-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
DRV601RTJR QFN RTJ 20 3000 330.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2
DRV601RTJT QFN RTJ 20 250 180.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 1-May-2009
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DRV601RTJR QFN RTJ 20 3000 346.0 346.0 29.0
DRV601RTJT QFN RTJ 20 250 190.5 212.7 31.8
Pack Materials-Page 2
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mandated by government requirements, testing of all parameters of each product is not necessarily performed.
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