TEXAS INSTRUMENTS DRV1100 Technical data

®
DRV1100
DRV1100
OPA658
DRV1100
HIGH POWER DIFFERENTIAL DRIVER AMPLIFIER
FEATURES
HIGH OUTPUT CURRENT: 230mA
SINGLE SUPPLY OPERATION: 5V
5MHz BANDWIDTH: 6Vp-p into 15
VERY LOW THD AT HIGH POWER:
–72dBc at 6Vp-p, 100kHz, 100
LOW QUIESCENT CURRENT: 11mA
FIXED DIFFERENTIAL GAIN: 3V/V
APPLICATIONS
xDSL TWISTED PAIR LINE DRIVER
COMMUNICATIONS LINE DRIVER
TRANSFORMER DRIVER
SOLENOID DRIVER
HIGH POWER AUDIO DRIVER
CRT YOKE DRIVER
DESCRIPTION
The DRV1100 is fixed gain differential line driver designed for very low harmonic distortion at the high powers required of xDSL line interface standards. Operating on a single +5V supply, it can deliver 230mA peak output current and 9.5Vp-p differential output voltage swing. This high output power on a single +5V supply makes the DRV1100 an excellent choice for the xDSL applications that require up to 17dBm power onto the line with high crest factors. The DRV1100 is available in both 8-pin plastic DIP and SO-8 packages.
SBWS004
+5V
DRV1100
4
In+
G = 3V/V
In–
Pending
GND
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111
Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
©
1996 Burr-Brown Corporation PDS-1354 Printed in U.S.A. December, 1996
Out+
Out–
4
Protection
135
1:4
Transformer
SPECIFICATIONS
At VDD = +5.0V, VCM = VDD/2, TA = 25°C, unless otherwise specified.
DRV1100P, U PARAMETER CONDITIONS MIN TYP MAX UNITS AC PERFORMANCE
–3dB Bandwidth R
Differential Slew Rate R Step Response Delay
(1)
Settling Time to 1%, Step Input V Settling Time to 1%, Step Input V Settling Time to 0.1%, Step Input V Settling Time to 0.1%, Step Input V THD, Total Harmonic Distortion
(2)
f = 10kHz RL = 100, VO = 6Vp-p –85 dBc f = 10kHz R f = 100kHz R
f = 100kHz R Input Voltage Noise f = 100kHz 30 nV/√Hz Input Current Noise f = 100kHz 0.5 fA/√Hz
INPUT CHARACTERISTICS
Differential Input Resistance 10 Differential Input Capacitance 1pF Common-Mode Input Resistance 10 Common-Mode Input Capacitance 6pF Input Offset Voltage 5mV Input Bias Current 1pA Common-Mode Rejection Ratio Input Referred 62 dB Power Supply Rejection Ratio Input Referred 60 76 dB Input Common-Mode Voltage Range
(3)
OUTPUT CHARACTERISTICS
Differential Output Offset, RTO 10 25 mV Differential Output Offset Drift, RTO –40°C to +85°C30µV/°C Differential Output Resistance 0.16 Peak Current (Continuous) R Differential Output Voltage Swing R
Output Voltage Swing, Each Side R Gain Fixed Gain, Differential 3 V/V Gain Error ±0.25 dB
POWER SUPPLY
Operating Voltage Range +4.5 +5.0 +5.5 V Quiescent Current V
TEMPERATURE RANGE –40 +85 °C Thermal Resistance,
DRV1100P 8-Pin DIP 100 °C/W
θ
JA
DRV1100U 8-Pin SO-8 125 °C/W
NOTES: (1) Time from 50% point of input step to 50% point of output step. (2) Measurement Bandwidth = 500kHz. (3) Output common-mode voltage follows input common-mode voltage; therefore, if input V
= VDD/2, then output VCM = VDD/2.
CM
= 15, VO = 1Vp-p 8 MHz
L
R
100, VO = 1Vp-p 11 MHz
L
R
= 15, VO = 6Vp-p 5 MHz
L
R
100, VO = 6Vp-p 6 MHz
L
= 100, VO = 6Vp-p 80 V/µs
L
VO = 1Vp-p 25 ns
= 1Vp-p, RL = 100 0.25 µs
O
= 6Vp-p, RL = 100 0.3 µs
O
= 1Vp-p, RL = 100 0.8 µs
O
= 6Vp-p, RL = 100 1.1 µs
O
= 15, VO = 6Vp-p –66 –76 dBc
L
= 100, VO = 6Vp-p –72 dBc
L
= 15, VO = 6Vp-p –65 dBc
L
11
11
0.5 VDD –0.5 V
= 15 200 230 mA
L
= 1k 9.6 Vp-p
L
R
= 100 8.5 9.5 Vp-p
L
R
= 15 6.0 6.6 Vp-p
L
= 1k 0.125 4.875 V
L
= 5.0V +11 +16 mA
DD
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
®
DRV1100
2
PIN CONFIGURATIONS
Top View
1
GND
2
In+
3
In–
ABSOLUTE MAXIMUM RATINGS
Analog Inputs: Current .............................................. ±100mA, Momentary
Analog Outputs Short Circuit to Ground (+25°C) ..................... Momentary
8
Out–
7
V
(+5V)
DD
6
V
(+5V)
DD
Analog Outputs Short Circuit to V V
to GND .............................................................................. –0.3V to 6V
DD
Junction Temperature ................................................................... +150°C
Storage Temperature Range .......................................... –40°C to +125°C
Lead Temperature (soldering, 3s)................................................. +260°C
Power Dissipation .............................. (See Thermal/Analysis Discussion)
Voltage....................................... GND –0.3V to V
(+25°C) ........................... Momentary
DD
±10mA, Continuous
DD
+0.2V
GND
In+
In–
4
5
Out+
PACKAGE/ORDERING INFORMATION
PRODUCT PACKAGE NUMBER
+5V
67
2
3
5
Out+
8
Out–
DRV1100P 8-Pin PDIP 006 DRV1100U 8-Lead SO-8 182
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book.
PACKAGE DRAWING
(1)
ELECTROSTATIC
41
GND
This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DISCHARGE SENSITIVITY
®
3
DRV1100
TYPICAL PERFORMANCE CURVES
At VDD = +5.0V, VCM = VDD/2, TA = 25°C, unless otherwise specified.
SMALL SIGNAL FREQUENCY RESPONSE
9.5
8.5
7.5
6.5
5.5
4.5
3.5
Differential Gain (dB)
2.5 VO = 1Vp-p
1.5
10K 100K
–40 –45 –50 –55 –60 –65
2nd Harmonic (dB)
–70 –75 –80
SMALL SIGNAL 2ND HARMONIC DISTORTION
VO = 1Vp-p
100K
Frequency (Hz)
Frequency (Hz)
RL = 1k
RL = 100
RL = 15
1M 10M
RL = 15
RL = 100
1M 10M
LARGE SIGNAL FREQUENCY RESPONSE
9.5
8.5
7.5
6.5
5.5
4.5
3.5
Differential Gain (dB)
2.5 VO = 6Vp-p
1.5
10K 100K
–40 –45 –50 –55 –60 –65
3rd Harmonic (dB)
–70 –75 –80
SMALL SIGNAL 3RD HARMONIC DISTORTION
VO = 1Vp-p
100K
RL = 1k
RL = 100
RL = 15
1M 10M
Frequency (Hz)
RL = 15
RL = 100
1M 10M
Frequency (Hz)
–40 –45 –50 –55 –60 –65
2nd Harmonic (dB)
–70 –75 –80
LARGE SIGNAL 2ND HARMONIC DISTORTION
VO = 6Vp-p
100K
®
Frequency (Hz)
DRV1100
RL = 15
RL = 100
1M 10M
4
–40 –45 –50 –55 –60 –65
3rd Harmonic (dB)
–70 –75 –80
LARGE SIGNAL 3RD HARMONIC DISTORTION
VO = 6Vp-p
100K
RL = 15
RL = 100
1M 10M
Frequency (Hz)
TYPICAL PERFORMANCE CURVES (CONT)
–40
–50
–60
–70
–80
–90
1234
100kHz THD
THD (dBc)
Differential Output Voltage (Vp-p)
5678910
RL = 15
RL = 100
RL = 1k
+3V
0
–3V
LARGE SIGNAL STEP RESPONSE
Differential Voltage (750mV/div)
Time (50ns/div)
Output
Input
RL = 100
At VDD = +5.0V, VCM = VDD/2, TA = 25°C, unless otherwise specified.
–40
–50
–60
–70
THD (dBc)
–80
–90
1234
Differential Output Voltage (Vp-p)
SMALL SIGNAL STEP RESPONSE
+0.5V
0
10kHz THD
RL = 15 RL = 100
RL = 1k
Output
Input
5678910
RL = 100
Differential Voltage (125mV/div)
–0.5V
Time (50ns/div)
10
9 8 7 6 5 4 3 2
Differential Output Swing (Vp-p)
1 0
LARGE SIGNAL OPERATING RANGE
10K1K 100K
Frequency (Hz)
RL = 1001% THD
RL = 15
RL = 1k
1M 10M
12
10
8
6
4
2
Differential Output Voltage (Vp-p)
0
4.5 4.75 5 5.25 5.5
MAXIMUM V
vs SUPPLY VOLTAGE
O
Supply Voltage (VDD)
RL = 1k
RL = 100
RL = 15
®
5
DRV1100
TYPICAL PERFORMANCE CURVES (CONT)
At VDD = +5.0V, VCM = VDD/2, TA = 25°C, unless otherwise specified.
1000
100
Voltage Noise (nV/Hz)
10
100 1K 10K 100K 1M
13 12 11 10
9 8 7 6
Quiescent Current (mA)
5 4 3
–40 –20 0 20 40 60 80 100
DIFFERENTIAL INPUT VOLTAGE NOISE
Frequency (Hz)
QUIESCENT CURRENT vs TEMPERATURE
VDD = +5V
Temperature (°C)
DIFFERENTIAL OUTPUT IMPEDANCE
10
1
Impedance ()
0.1
1k 10K 100K 1M 10M
Frequency
80 70 60 50 40
PSRR (dB)
30 20 10
POWER SUPPLY REJECTION vs FREQUENCY
0
10K1K 100K
Frequency (Hz)
1M 10M
®
DRV1100
6
APPLICATIONS INFORMATION
INTERNAL BLOCK DIAGRAM
The DRV1100 is a true differential input to differential output fixed gain amplifier. Operating on a single +5V power supply, it provides an internally fixed differential gain of +3 and a common-mode gain of +1 from the input to output. Fabricated on an advanced CMOS process, it offers very high input impedance along with a low impedance 230mA output drive. Figure 1 shows a simplified internal block diagram.
Out+
In+
Buffer
Preamp
Out–
In–
Out+
V
V
DD
Out–
V
DD
Load
/2
/2
0V
P
V
P
V
P
V
P
FIGURE 2. DRV1100 Single Ended and Differential Output
Waveforms.
(Vp-p). Squaring 1/2 of the Vp-p and dividing by the load will give the peak power. For example, the Typical Perfor­mance Curves show that on +5V supply the DRV1100 will deliver 6.8Vp-p into 15 at 500kHz. The peak load power under this condition is (6.8Vp-p/2)2/15 = 770mW.
FIGURE 1. Simplified DRV1100 Internal Block Diagram.
To achieve the maximum dynamic range, operate the DRV1100 with the inputs centered at VDD/2. This will place the output differential swing centered at VDD/ 2 for maxi­mum swing and lowest distortion. Purely differential input signals will produce a purely differential output signal. A single ended input signal, applied to one input of the DRV1100, with the other input at a fixed voltage, will produce both a differential and common-mode output signal. This is an acceptable mode of operation when the DRV1100 is driving an element with good common-mode rejection (such as a transformer).
DIFFERENTIAL OUTPUT VOLTAGE AND POWER
Applying the balanced differential output voltage of the DRV1100 to a load between the outputs will produce a peak­to-peak voltage swing that is twice the swing of each individual output. This is illustrated in Figure 2 where the common-mode voltage is VDD/2. For a load connected between the outputs, the only voltage that matters is the differential voltage between the two outputs—the common­mode voltage does not produce any load current in this case.
The peak power that the DRV1100 can deliver into a differential load is V
2
/RL. The Typical Performance Curves
P
show the maximum Vp-p versus load and frequency. The peak voltage (Vp) equals 1/2 of the peak-to-peak voltage
SUPPLY VOLTAGE
The DRV1100 is designed for operation on a single +5V supply. For loads > 200, each output will swing rail to rail. This gives a peak-to-peak differential output swing that is approximately = 2 • VDD. For best distortion performance, the power supply should be decoupled to a good ground plane immediately adjacent to the package with a 0.1µF capacitor. In addition, a larger electolytic supply decoupling capacitor (6.8µF) should be near the package but can be shared among multiple devices.
DIGITAL SUBSCRIBER LINE APPLICATIONS
The DRV1100 is particularly suited to the high power, low distortion, requirements of a twisted pair driver in digital communications applications. These include HDSL (High bit rate Digital Subscriber Lines), ADSL (Asymmetrical Digital Subscriber Lines), and RADSL (Rate adaptive ADSL). Figure 3 shows a typical transformer coupled xDSL line driver configuration. In general, the DRV1100 is usable for output power requirements up to 17dBm with a crest factor up to 6 (crest factor is the ratio of peak to rms voltage).
To calculate the required amplifier power for an xDSL application—
• Determine the average power required onto the line in the particular application. The DRV1100 must be able to deliver twice this power (+3dB) to account for the power
®
7
DRV1100
+5V
DRV1100
In+
In–
GND
Out+
Out–
FIGURE 3. Typical Digital Subscriber Line Application.
4
4
Protection Circuits
Line Impedance
135
1:4
Transformer
loss through the series impedance matching resistors shown in Figure 3. Twice the required line power must be
delivered by the DRV1100 through the frequency band of interest with the distortion required by the system.
• Calculate the RMS voltage required at the output of the DRV1100 with this 2X line power requirement. Vrms = (2 • P
LINE
• RL)
1/2
, where RL is the total load impedance that the DRV1100 must drive. Multiply this Vrms by 2 • crest factor to get the total required differential peak-to­peak voltage at the output. The DRV1100 must be able
to drive the peak-to-peak differential voltage into the load impedance.
Where possible, the transformer turns ratio may be adjusted to keep within the DRV1100 output voltage and current constraints for a given R
and desired power onto the
LINE
line. Using the example of Figure 3, assume the average power
desired on a 135 line is 14dBm (HDSL). Twice this power (17dBm) is required into the matching resistors on the primary side of the transformer. This 135 load is reflected through the 1:4 transformer as a (135/(42)) = 8.4 load. The two series 4.1 resistors, along with the 0.2 differential output impedance of the DRV1100, will provide impedance matching into this 8.4 load. The DRV1100 will see ap­proximately a 16.5 load under these conditions. The re­quired 17dBm (50mW) into this load will need an output Vrms = (50mW • 16.5)
1/2
= 0.91Vrms. Assuming a crest
factor of 3, the differential peak-to-peak output voltage = 6
• 0.91 = 5.45Vp-p. The Typical Performance Curves show that, at 100kHz, the DRV1100 can deliver this voltage swing with less than –62dB THD.
OUTPUT PROTECTION
Figure 3 also shows overvoltage and short circuit protection elements that are commonly included in xDSL applications. Overvoltage suppressors include diodes or MOV’s. The outputs of the DRV1100 can be momentarily shorted to
ground or to the supply without damage. The outputs are not, however, designed for a continuous short to ground or the supply.
POWER DISSIPATION AND THERMAL ANALYSIS
The total internal power dissipation of the DRV1100 is the sum of a quiescent term and the power dissipated internally to deliver the load power. The Typical Performance Curves show the quiescent current over temperature. At +5V sup­ply, the typical no load supply current of 11mA will dissi­pate 55mW quiescent power. The rms power dissipated in the output circuit to deliver a Vrms to a load RL is:
Prms = (VDD – Vrms) • (Vrms/RL)
The internal power dissipation will reach a maximum when Vrms is equal to VDD/2. For a sinusoidal output, this corresponds to an output Vp-p = 1.41 • VDD.
As an example, compute the power and junction temperature under a worst case condition with VDD = +5V and Vrms =
2.5V into a 16 differential load (peak output current for a sinusoid would be 222mA). The total internal power dissi­pation would be:
(5V • 11mA) + (5V – 2.5V) • (2.5V/16) = 446mW
To compute the internal junctions temperature, this power is multiplied by the junction to ambient thermal impedance (to get the temperature rise above ambient) then added to the ambient temperature. Using the specified maximum ambient temperature of +85°C, the junction temperature for the DRV1100 in an SO-8 package under these worst case conditions will be:
TJ = 85°C + 0.446W • 125°C/W = 141°C
®
DRV1100
8
INTERNAL TEMPERATURE RISE
90 80
Limit at 85°C Ambient
70 60 50 40 30
Temperature Rise
20 10
0
0 0.5 1 1.5
OF DRV1100 IN SOIC
RL = 15
RL = 100
2 2.5 3 3.5
Load Voltage (rms)
FIGURE 4. Junction Temperature Rise From Ambient for
the DRV1100U.
The internal junction temperature should, in all cases, be limited to < 150°C. For a maximum ambient temperature of +85°C, this limits the internal temperature rise to less than 65°C. Figure 4 shows the temperature rise from ambient to junction for loads of 15 and 100. This shows that the internal junction temperature will never exceed the rated maximum for a 15 load.
INPUT INTERFACE CIRCUITS
Best performance with the DRV1100 is achieved with a differential input centered at VDD/2. Signals that do not require DC coupling may be connected as shown in Figure 5 through blocking caps to a midpoint reference developed through resistor dividers from the supply voltage. The value for the RB resistors determine four performance require­ments.
• They bias the inputs at the supply midpoint.
• They provide a DC bias current path for the input to the DRV1100
• They set the AC input impedance for the source signals to RB/2.
• They set the low frequency cutoff frequency along with CB.
+V
DD
Often, the RB resistors will be set to a relatively high value (> 10k) to minimize quiescent current in the reference path. If a lower input impedance is desired, additional terminating resistors may be added to the input side of the blocking capacitors (CB).
The circuit of Figure 5 may also be operated with only a single ended input. In that case, the reference voltage on the other input should be decoupled to ground with a 0.1µF capacitor. In this connection, the input will generate unbal­anced outputs. The differential output voltage will still be 3 times the input peak-to-peak voltage, but since there is now a common-mode voltage input, there will be a common mode voltage output. The output common-mode voltage will be equal to the input signal’s peak-to-peak swing. This common-mode component will reduce the available differ­ential output voltage swing. However, if the output load has good common-mode rejection, such as a transformer, this is an acceptable way of using the DRV1100 with a single ended source.
Figure 6 shows a means of translating a ground centered single ended input to a purely differential signal for applica­tion to DRV1100 input. This circuit uses a wideband dual op amp in cross coupled feedback configuration.
The outputs of this circuit may then be fed into the inputs of Figure 5. The total gain of Figure 6 is 2 • (RF/RG). The circuit will act to hold all 4 op amp inputs equal to the + input of the lower op amp. Since this is at ground, the midpoint for the input signal (where the two outputs will be equal) is also at 0V.
R
F
R
G
V
I
R
F
+ V
R
G
I
500
1/2
OPA2650
500
500
500
R
R
B
B
DRV1100
R
C
V
1
V
2
B
R
B
C
B
R
B
FIGURE 5. AC Coupled Differential Input Interface.
1/2
OPA2650
L
R
F
– V
R
G
I
FIGURE 6. Single Ended to Differential Conversion.
®
9
DRV1100
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2008
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package Drawing
Pins Package
Qty
Eco Plan
DRV1100U NRND SOIC D 8 75 Green (RoHS &
no Sb/Br)
DRV1100U/2K5 NRND SOIC D 8 2500 Green (RoHS &
no Sb/Br)
DRV1100U/2K5G4 NRND SOIC D 8 2500 Green (RoHS &
no Sb/Br)
DRV1100UG4 NRND SOIC D 8 75 Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
(3)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
TAPE AND REEL INFORMATION
11-Mar-2008
*All dimensions are nominal
Device Package
DRV1100U/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0(mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height(mm)
DRV1100U/2K5 SOIC D 8 2500 346.0 346.0 29.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Clocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrol Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Telephony www.ti.com/telephony RF/IF and ZigBee® Solutions www.ti.com/lprf Video & Imaging www.ti.com/video
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated
Wireless www.ti.com/wireless
Loading...