Texas Instruments DDC112, DDC112YK Datasheet

DDC112

Dual Current Input 20-Bit

ANALOG-TO-DIGITAL CONVERTER

FEATURES

● MONOLITHIC CHARGE MEASUREMENT A/D

CONVERTER

● DIGITAL FILTER NOISE REDUCTION:

3.2ppm, rms

● INTEGRAL LINEARITY:

±0.005% Reading ±0.5ppm FSR

● HIGH PRECISION, TRUE INTEGRATING FUNC-

TION

● PROGRAMMABLE FULL-SCALE

● SINGLE SUPPLY

● CASCADABLE OUTPUT

APPLICATIONS

● DIRECT PHOTOSENSOR DIGITIZATION

● CT SCANNER DAS

● INFRARED PYROMETER

● PRECISION PROCESS CONTROL

● LIQUID/GAS CHROMATOGRAPHY

● BLOOD ANALYSIS

DESCRIPTION

The DDC112 is a dual input, wide dynamic range, chargedigitizing analog-to-digital (A/D) converter with 20-bit resolution. Low-level current output devices, such as photosensors, can be directly connected to its inputs. Charge integration is continuous as each input uses two integrators; while one is being digitized, the other is integrating.

For each of its two inputs, the DDC112 combines current-tovoltage conversion, continuous integration, programmable full-scale range, A/D conversion, and digital filtering to achieve a precision, wide dynamic range digital result. In addition to the internal programmable full-scale ranges, external integrating capacitors allow an additional user-settable full-scale range of up to 1000pC.

To provide single-supply operation, the internal A/D converter utilizes a differential input, with the positive input tied to V

REF

. When the integration capacitor is reset at the beginning of each integration cycle, the capacitor charges to V

REF

. This charge is removed in proportion to the input current. At the end of the integration cycle, the remaining voltage is compared to V

REF

The high-speed serial shift register which holds the result of the last conversion can be configured to allow multiple DDC112 units to be cascaded, minimizing interconnections. The DDC112 is available in an SO-28 or TQFP-32 package and is offered in two performance grades.

Protected by US Patent #5841310

Dual

Switched

Integrator

Dual

Switched

Integrator

∆Σ

Modulator

Digital

Filter

Control

Digital

Input/Output

DVALID DXMIT DOUT DIN

DCLK

RANGE2 RANGE1 RANGE0

TEST

CONV

CLK

CAP1A CAP1A

CAP1B CAP1B

CAP2A CAP2A

CAP2B CAP2B

IN2

IN1

REF

DGNDDV

AGNDAV

CHANNEL 1

CHANNEL 2

SBAS085B – JANUARY 2000 – REVISED OCTOBER 2004

www.ti.com

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

All trademarks are the property of their respective owners.

DDC112

SBAS085B

www.ti.com

AVDD to DVDD.......................................................................–0.3V to +6V

to AGND ..................................................................... –0.3V to +6V

to DGND ..................................................................... –0.3V to +6V

AGND to DGND ............................................................................... ±0.3V

REF

Voltage to AGND ........................................... –0.3V to AVDD + 0.3V

Digital Input Voltage to DGND .............................. –0.3V to DV

+ 0.3V

Digital Output Voltage to DGND ........................... –0.3V to DV

+ 0.3V

Package Power Dissipation ............................................. (T

JMAX

– TA)/

Maximum Junction Temperature (T

JMAX

) ...................................... +150°C

Thermal Resistance, SO,

....................................................+150°C/W

Thermal Resistance, TQFP,

................................................+100°C/W

Lead Temperature (soldering, 10s) ............................................... +300°C

NOTE: (1) Stresses above those listed under

Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability.

ABSOLUTE MAXIMUM RATINGS

(1)

PACKAGE/ORDERING INFORMATION

(1)

MAXIMUM SPECIFICATION

INTEGRAL TEMPERATURE PACKAGE ORDERING TRANSPORT

PRODUCT LINEARITY ERROR RANGE PACKAGE-LEAD DESIGNATOR NUMBER

(2)

MEDIA

DDC112U

±0.025% Reading ±1.0ppm FSR

–40°C to +85°C SO-28 DW DDC112U Rails

"""""DDC112U/1K Tape and Reel

DDC112UK

±0.025% Reading ±1.0ppm FSR

0°C to +70°C SO-28 DW DDC112UK Rails

"""""DDC112UK/1K Tape and Reel

DDC112Y ±0.025% Reading ±1.0ppm FSR –40°C to +85°C TQFP-32 PJT DDC112Y/250 Tape and Reel

"""""DDC112Y/2K Tape and Reel

DDC112YK ±0.025% Reading ±1.0ppm FSR 0°C to +70°C TQFP-32 PJT DDC112YK/250 Tape and Reel

"""""DDC112YK/2K Tape and Reel

NOTES: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet. (2) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (/1K indicates 1000 devices per reel). Ordering 1000 pieces of

DDC112U/1K

will get a single 1000-

piece Tape and Reel.

ELECTROSTATIC DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

DDC112

SBAS085B

www.ti.com

ELECTRICAL CHARACTERISTICS

At TA = +25°C, AVDD = DVDD = +5V, DDC112U, Y: T

INT

= 500µs, CLK = 10MHz, DDC112UK, YK: T

INT

= 333.3µs, CLK = 15MHz, V

REF

= +4.096V, continuous mode

operation, and internal integration capacitors, unless otherwise noted.

✻ Specifications same as DDC112U, Y. NOTES: (1) Input is less than 1% of full scale. (2) C

SENSOR

is the capacitance seen at the DDC112 inputs from wiring, photodiode, etc. (3) FSR is Full-Scale Range. (4) A best-fit line is used in measuring linearity. (5) Matching between side A and side B, not input 1 to input 2. (6) Voltage produced by the DDC112 at its input which is applied to the sensor. (7) Range drift does not include external reference drift. (8) Input reference current decreases with increasing T

INT

(see the

Voltage Reference

section). (9) Data format is Straight Binary with a small offset (see the

Data Retrieval

section). (10) Ensured by design but not production tested.

DDC112U, Y DDC112UK, YK

PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS ANALOG INPUTS

External, Positive Full-Scale

Range 0 C

EXT

= 250pF 1000 ✻ pC

Internal, Positive Full-Scale

Range 1 47.5 50 52.5 ✻✻✻ pC Range 2 95 100 105 ✻✻✻ pC Range 3 142.5 150 157.5 ✻✻✻ pC Range 4 190 200 210 ✻✻✻ pC Range 5 237.5 250 262.5 ✻✻✻ pC Range 6 285 300 315 ✻✻✻ pC Range 7 332.5 350 367.5 ✻✻✻ pC

Negative Full-Scale Input –0.4% of Positive FS ✻ pC

DYNAMIC CHARACTERISTICS

Conversion Rate 2 3 kHz Integration Time, T

INT

Continuous Mode 500 1,000,000 333.3 ✻ µs

Integration Time, T

INT

Non-Continuous Mode 50 ✻ µs System Clock Input (CLK) 1 10 12 ✻✻15 MHz Data Clock (DCLK) 12 15 MHz

ACCURACY

Noise, Low-Level Current Input

(1)

SENSOR

(2)

= 0pF, Range 5 (250pC) 3.2 ✻

ppm of FSR

(3)

, rms

SENSOR

= 25pF, Range 5 (250pC) 3.8 ✻ ppm of FSR, rms

SENSOR

= 50pF, Range 5 (250pC) 4.2 6.0 ✻ 7 ppm of FSR, rms

Differential Linearity Error ±0.005% Reading ±0.5ppm

FSR (max) ✻

Integral Linearity Error

(4)

±0.005% Reading ±0.5ppm

FSR (typ) ✻

±0.025% Reading ±1.0ppm

FSR (max) ✻ No Missing Codes 20 ✻ Bits Input Bias Current T

= +25°C 0.1 10 ✻✻ pA Range Error Range 5 (250pC) 5 ✻ % of FSR Range Error Match

(5)

All Ranges 0.1 0.5 ✻✻% of FSR

Range Sensitivity to V

REF

= 4.096 ±0.1V 1:1 ✻ Offset Error Range 5, (250pC) ±200 ✻ ±600 ppm of FSR Offset Error Match

(5)

±100 ✻ ppm of FSR

DC Bias Voltage

(6)

(Input VOS) ±0.05 ±2 ✻✻ mV Power-Supply Rejection Ratio ±25 ±200 ✻✻ppm of FSR/V Internal Test Signal 13 ✻ pC Internal Test Accuracy ±10 ✻ %

PERFORMANCE OVER TEMPERATURE

Offset Drift ±0.5 ±3

(10)

ppm of FSR/°C

Offset Drift Stability ±0.2 ✻ ±0.7

(10)

ppm of FSR/minute DC Bias Voltage Drift Applied to Sensor Input 3 ±1 µV/°C Input Bias Current Drift +25°C to +45°C 0.01 1

(10)

✻✻ pA/°C

Input Bias Current T

= +75°C250

(10)

✻✻ pA

Range Drift

(7)

Range 5 (250pC) 25 0 25 50

(10)

ppm/°C

Range Drift Match

(5)

Range 5 (250pC) ±0.05 ✻ ppm/°C

REFERENCE

Voltage 4.000 4.096 4.200 ✻✻✻ V Input Current

(8)

INT

= 500µs 150 225 275 µA

DIGITAL INPUT/OUTPUT

Logic Levels

4.0

+ 0.3

✻✻V

–0.3 +0.8 ✻✻V

IOH = –500µA 4.5 ✻ V

IOL = 500µA 0.4 ✻ V

Input Current, I

–10 +10 ✻✻µA

Data Format

(9)

Straight Binary ✻

POWER-SUPPLY REQUIREMENTS

Power-Supply Voltage AV

and DV

4.75 5.25 ✻✻V

Supply Current

Analog Current AV

= +5V 14.8 15.2 mA

Digital Current DV

= +5V 1.2 1.8 mA

Total Power Dissipation 80 100 85 130 mW

TEMPERATURE RANGE

Specified Performance –40 +85 0 +70 °C Storage –60 +100 ✻✻°C

DDC112

SBAS085B

www.ti.com

PIN DESCRIPTIONS

PIN LABEL DESCRIPTION

1 IN1 Input 1: analog input for Integrators 1A and 1B. The

integrator that is active is set by the CONV input. 2 AGND Analog Ground 3 CAP1B External Capacitor for Integrator 1B 4 CAP1B External Capacitor for Integrator 1B 5 CAP1A External Capacitor for Integrator 1A 6 CAP1A External Capacitor for Integrator 1A 7AV

Analog Supply, +5V Nominal 8 TEST Test Control Input. When HIGH, a test charge is applied

to the A or B integrators on the next CONV transition. 9 CONV Controls which side of the integrator is connected to

input. In continuous mode; CONV HIGH → side A is

integrating, CONV LOW → side B is integrating. CONV

must be synchronized with CLK (see Figure 2).

10 CLK System Clock Input, 10MHz Nominal 11 DCLK Serial Data Clock Input. This input operates the serial I/

O shift register.

12 DXMIT Serial Data Transmit Enable Input. When LOW, this

input enables the internal serial shift register.

13 DIN Serial Digital Input. Used to cascade multiple DDC112s. 14 DV

Digital Supply, +5V Nominal

15 DGND Digital Ground 16 DOUT Serial Data Output, Hi-Z when DXMIT is HIGH 17 DVALID Data Valid Output. A LOW value indicates valid data is

available in the serial I/O register.

18 RANGE0 Range Control Input 0 (least significant bit) 19 RANGE1 Range Control Input 1 20 RANGE2 Range Control Input 2 (most significant bit) 21 AGND Analog Ground 22 V

REF

External Reference Input, +4.096V Nominal

23 CAP2A External Capacitor for Integrator 2A 24 CAP2A External Capacitor for Integrator 2A 25 CAP2B External Capacitor for Integrator 2B 26 CAP2B External Capacitor for Integrator 2B 27 AGND Analog Ground 28 IN2 Input 2: analog input for Integrators 2A and 2B. The

integrator that is active is set by the CONV input.

PIN CONFIGURATION

Top View SO

1 2 3 4 5 6 7 8

9 10 11 12 13 14

28 27 26 25 24 23 22 21 20 19 18 17 16 15

IN2 AGND CAP2B CAP2B CAP2A CAP2A V

REF

AGND RANGE2 (MSB) RANGE1 RANGE0 (LSB) DVALID DOUT DGND

IN1

AGND CAP1B CAP1B CAP1A CAP1A

TEST

CONV

CLK

DCLK

DXMIT

DIN

DDC112U

DDC112

SBAS085B

www.ti.com

CAP1A CAP1A

NC NC

TEST

CONV

CLK

CAP2A CAP2A V

REF

AGND NC NC RANGE2 (MSB) RANGE1

1 2 3 4 5 6 7 8

24 23 22 21 20 19 18 17

DDC112Y

CAP1B

AGND

IN1

IN2

AGND

CAP2B

DCLK

DXMIT

DIN

DGND

DOUT

DVALID

RANGE0 (LSB)

PIN CONFIGURATION

Top View TQFP

PIN DESCRIPTIONS

PIN LABEL DESCRIPTION

1 CAP1A External Capacitor for Integrator 1A 2 CAP1A External Capacitor for Integrator 1A 3AV

Analog Supply, +5V Nominal 4 NC No Connection 5 NC No Connection 6 TEST Test Control Input. When HIGH, a test charge is

applied to the A or B integrators on the next CONV

transition. 7 CONV Controls which side of the integrator is connected to

input. In continuous mode; CONV HIGH side A is

integrating, CONV LOW side B is integrating CONV

must be synchronized with CLK (see text). 8 CLK System Clock Input, 10MHz Nominal 9 DCLK Serial Data Clock Input. This input operates the

serial I/O shift register.

10 DXMIT Serial Data Transmit Enable Input. When LOW, this

input enables the internal serial shift register.

11 DIN Serial Digital Input. Used to cascade multiple

DDC112s.

12 DV

Digital Supply, +5V Nominal

13 DGND Digital Ground 14 DOUT Serial Data Output, Hi-Z when DXMIT is HIGH

PIN LABEL DESCRIPTION

15 DVALID Data Valid Output. A LOW value indicates valid data is

available in the serial I/O register. 16 RANGE0 Range Control Input 0 (least significant bit) 17 RANGE1 Range Control Input 1 18 RANGE2 Range Control Input 2. (most significant bit) 19 NC No Connection 20 NC No Connection 21 AGND Analog Ground 22 V

REF

External Reference Input, +4.096V Nominal 23 CAP2A External Capacitor for Integrator 2A 24 CAP2A External Capacitor for Integrator 2A 25 CAP2B External Capacitor for Integrator 2B 26 CAP2B External Capacitor for Integrator 2B 27 AGND Analog Ground 28 IN2 Input 2: analog input for Integrators 2A and 2B. The

integrator that is active is set by the CONV input. 29 IN1 Input 1: analog input for Integrators 1A and 1B. The

integrator that is active is set by the CONV input. 30 AGND Analog Ground 31 CAP1B External Capacitor for Integrator 1B 32 CAP1B External Capacitor for Integrator 1B

DDC112

SBAS085B

www.ti.com

NOISE vs T

INT

1 10000.1 10010

INT

(ms)

Noise (ppm of FSR, rms)

SENSOR

= 50pF

SENSOR

= 0pF

Range 5

TYPICAL CHARACTERISTICS

At TA = +25°C, characterization done with Range 5 (250pC), T

INT

= 500µs, V

REF

= +4.096, AVDD = DVDD = +5V, and CLK = 10MHz, unless otherwise noted.

NOISE vs C

SENSOR

200 8000 1000600400

SENSOR

(pF)

Noise (ppm of FSR, rms)

Range 7

Range 2

Range 1

Range 0

EXT

= 250pF)

NOISE vs INPUT LEVEL

30 4020 9010 10070 80 1050 60

Input Level (% of Full-Scale)

Noise (ppm of FSR, rms)

4.5 4

3.5 3

2.5 2

1.5 1

0.5 0

SENSOR

= 50pF

SENSOR

= 0pF

Range 5

NOISE vs TEMPERATURE

9 8 7 6 5 4 3 2 1 0

–40 –15 10 35 60 85

Temperature (°C)

Noise (ppm of FSR, rms)

Range 1

Range 2

Range 7

Range 3

SENSOR

= 0pF

RANGE DRIFT vs TEMPERATURE

–40 –15 10 35 60 85

Temperature (°C)

Range Drift (ppm)

Ranges 1 - 7

(Internal Integration Capacitor)

2000

1500

1000

500

–500

–1000

–1500

IB vs TEMPERATURE

25 35 45 55 65 75 85

Temperature (°C)

(pA)

All Ranges

0.1

0.01

DDC112

SBAS085B

www.ti.com

TYPICAL CHARACTERISTICS (Cont.)

At TA = +25°C, characterization done with Range 5 (250pC), T

INT

= 500µs, V

REF

= +4.096, AVDD = DVDD = +5V, and CLK = 10MHz, unless otherwise noted.

600

POWER-SUPPLY REJECTION RATIO vs FREQUENCY

0 10025 7550

Frequency (KHz)

PSRR (ppm of FSR/V)

100

200

300

400

500

INPUT VOS vs RANGE

1234567

Range

(µV)

DIGITAL SUPPLY CURRENT vs TEMPERATURE

1.4

1.2

1.0

0.8

0.6

0.4

0.2

–40 –15 10 35 60 85

Temperature (°C)

Current (mA)

ANALOG SUPPLY CURRENT vs TEMPERATURE

18 16 14 12 10

8 6 4 2 0

–40 –15 10 35 60 85

Temperature (°C)

Current (mA)

OFFSET DRIFT vs TEMPERATURE

25 35 45 55 65 75 85

Temperature (°C)

Offset Drift (ppm of FSR)

100

–50

–100

All Ranges

CROSSTALK vs FREQUENCY

–20

–40

–60

–80

–100

–120

–140

0 100 200 300 400 500

Frequency (Hz)

Separation (dB)

Separation Measured

Between Inputs 1 and 2

DDC112

SBAS085B

www.ti.com

THEORY OF OPERATION

The basic operation of the DDC112 is illustrated in

Figure 1. The device contains two identical input channels where each performs the function of current-to-voltage integration followed by a multiplexed analog-to-digital (A/D) conversion. Each input has two integrators so that the current-to-voltage integration can be continuous in time. The output of the four integrators are switched to one delta-sigma (∆Σ) converter via a four input multiplexer. With the DDC112 in the continuous integration mode, the output of the integrators from one side of both of the inputs will be digitized while the other two integrators are in the integration mode as illustrated in the timing diagram in Figure 2. This integration and A/D conversion process is controlled by the system clock, CLK. With a 10MHz system clock, the integrator combined with the deltasigma converter accomplishes a single 20-bit conversion in approximately 220µs. The results from side A and side B of each signal input are stored in a serial output shift register.

The DVALID

output goes LOW when the shift register

contains valid data. The digital interface of the DDC112 provides the digital

results via a synchronous serial interface consisting of a data clock (DCLK), a transmit enable pin (

DXMIT

), a valid data pin

(DVALID

), a serial data output pin (DOUT), and a serial data input pin (DIN). The DDC112 contains only one A/D converter, so the conversion process is interleaved between the two inputs, as shown in Figure 2. The integration and conversion process is fundamentally independent of the data retrieval process. Consequently, the CLK frequency and DCLK frequencies need not be the same. DIN is only used when multiple converters are cascaded and should be tied to DGND otherwise. Depending on T

INT

, CLK, and DCLK, it is possible to daisy-chain over 100 converters. This greatly simplifies the interconnection and routing of the digital outputs in cases where a large number of converters are needed.

Dual

Switched

Integrator

Dual

Switched

Integrator

∆Σ

Modulator

Digital

Filter

Control

Digital

Input/Output

DVALID DXMIT DOUT DIN

DCLK

RANGE2 RANGE1 RANGE0

TEST

CONV

CLK

CAP1A CAP1A

CAP1B CAP1B

CAP2A CAP2A

CAP2B CAP2B

IN2

IN1

REF

DGNDDV

AGNDAV

Input 1

Input 2

IN1, Integrator A

IN1, Integrator B

IN2, Integrator A

IN2, Integrator B

Conversion in Progress

DVALID

IN1B IN2B IN1A

Integrate

IN2A IN1B IN2B IN1A

IN2A

FIGURE 2. Basic Integration and Conversion Timing for the DDC112 (continuous mode).

FIGURE 1. Block Diagram.

DDC112

SBAS085B

www.ti.com

DEVICE OPERATION Basic Integration Cycle

The fundamental topology of the front end of the DDC112 is a classical analog integrator, as shown in Figure 3. In this diagram, only Input 1 is shown. This representation of the input stage consists of an operational amplifier, a selectable feedback capacitor network (C

), and several switches that implement the integration cycle. The timing relationships of all of the switches shown in Figure 3 are illustrated in Figure 4. Figure 4 is used to conceptualize the operation of the integrator input stage of the DDC112 and should not be used as an exact timing tool for design. Block diagrams of the reset, integrate, converter, and wait states of the integrator section of the DDC112 are shown in Figure 5. This internal switching network is controlled externally with the convert command (CONV), range selection pins (RANGE0RANGE2), and the system clock (CLK). For the best noise performance, CONV must be synchronized with the rising edge of CLK. It is recommended CONV toggle within ±10ns of the rising edge of CLK.

The noninverting inputs of the integrators are internally referenced to ground. Consequently, the DDC112 analog ground should be as clean as possible. The range switches, along with the internal and external capacitors (C

) are shown in parallel between the inverting input and output of the operational amplifier. Table I shows the value of the integration capacitor (C

) for each range. At the beginning of

a conversion, the switches S

A/D

, S

INTA

, S

INTB

, S

REF1

, S

REF2

and S

RESET

are set (see Figure 4).

At the completion of an A/D conversion, the charge on the integration capacitor (C

) is reset with S

REF1

and

INPUT RANGE

RANGE2 RANGE1 RANGE0 (pF, typ) (pC, typ)

0 0 0 External Up to 1000

12.5 to 250 0 0 1 12.5 –0.2 to 50 01025 –0.4 to 100 0 1 1 37.5 –0.6 to 150 10050 –0.8 to 200 1 0 1 62.5 –0.1 to 250 11075 –1.2 to 300 1 1 1 87.5 –1.4 to 350

TABLE I. Range Selection of the DDC112.

FIGURE 3. Basic Integrator Configuration for Input 1 Shown with a 250pC (CF = 62.5pF) Input Range.

RESET

(see Figures 4 and 5a). This is done during the reset time. In this manner, the selected capacitor is charged to the reference voltage, V

REF

. Once the integration capacitor is

charged, S

REF1

, and S

RESET

are switched so that V

REF

is no longer connected to the amplifier circuit while it waits to begin integrating (see Figure 5b). With the rising edge on CONV, S

INTA

closes which begins the integration of Channel A. This puts the integrator stage into its integrate mode (see Figure 5c).

Charge from the input signal is collected on the integration capacitor causing the voltage output of the amplifier to decrease. A falling edge CONV stops the integration by switching the input signal from side A to side B (S

INTA

and

INTB

). Prior to the falling edge of CONV, the signal on side B was converted by the A/D converter and reset during the time that side A was integrating. With the falling edge of CONV, side B starts integrating the input signal. Now the output voltage of side A’s operational amplifier is presented to the input of the ∆Σ A/D converter (see Figure 5d).

50pF

CAP1ACAP1A

25pF

12.5pF

REF

RANGE2

RANGE1

RANGE0

To Converter

RESET

REF2

A/D1A

INTA

REF1

INTB

IN1

ESD

Protection

Diode

Input

Current

Integrator A

Integrator B (same as A)

Photodiode

DDC112

SBAS085B

www.ti.com

FIGURE 5. Diagrams for the Four Configurations of the Front End Integrators of the DDC112.

FIGURE 4. Basic Integrator Timing Diagram as Illustrated in Figure 3.

To Converter

RESET

REF2

A/D

REF

REF1

INT

a) Reset Configuration

To Converter

RESET

REF2

A/D

REF

REF1

INT

c) Integrate Configuration

To Converter

RESET

REF2

A/D

REF

REF1

INT

d) Convert Configuration

To Converter

RESET

REF2

A/D

REF

REF1

INT

b) Wait Configuration

A/D1A

REF

Integrator A

Voltage Output

Configuration of

Integrator A

WaitConvert WaitConvertIntegrate

REF1

REF2

INTA

INTB

RESET

CONV

CLK

Wait

Reset

Wait

Reset

+ 21 hidden pages