Texas Instruments CY74FCT157CTSOCT, CY74FCT157CTSOC, CY74FCT157CTQCT, CY74FCT157CTQC, CY74FCT157ATSOCT Datasheet

...
Quad 2-Input Multiplexe
r
CY54/74FCT157T
SCCS014 - May 1994 - Revised February 2000
Data sheet acquired from Cypress Semiconductor Corporation. Data sheet modified to remove devices not offered.
Copyright © 2000, Texas Instruments Incorporated
Function, pinout, and drive compatible with FCT and
F logic
FCT-C speed at 4.3 ns max. (Com’l),
FCT-A speed at 5.0 ns max. (Com’l)
Reduced V
OH
(typically = 3.3V) versions of equivalent
FCT functions
Edge-rate control circuitry for significantly improved
noise characteristics
Power-off disable feature
Matched rise and fall times
Fully compatible with TTL input and output logic levels
• ESD > 2000V
Extended commercial range of 40˚C to +85˚C
• Sink current 64 mA (Com’l), 32 mA (Mil)
Source current 32 mA (Com’l),
12 mA (Mil)
Functional Description
The FCT157T is a quad two-input multiplexer that selects four bits of data from two sources under the control of a common data Select input (S). The Enable input (
E) is Active LOW.
When (
E) is HIGH, all of the outputs (Y) are forced LOW
regardless of all other input conditions. Moving data from two groups of registers to four common
output buses is a common use of the FCT157T. The state of the Select input determines the particular register from which the data comes. It can also be used as a function generator. The device is useful for implementing highly irregular logic by generating any four of the sixteen different functions of two variables with one variable common.
The FCT157T is a logic implementation of a four-pole, two-position switch where the position of the switch is determined by the logic levels supplied to the Select input.
The outputs are designed with a power-off disable feature to allow for liv e insertion of boards.
LogicBlock Diagram, FCT157T Pin Configurations
1 2 3 4 5 6 7 8
V
CC
GND
Top View
FCT157T
4
8 9 10 11 12
765
1516 17 18
3 2 1
20
13
14
19
I1bI
0b
Y
a
I
1d
I
0c
I
0d
NC
NC
NC
V
CC
E
GND
Y
d
Top View
SOIC/QSOP
I
1a
LCC
NC
16 15 14 13 12 11
10
9
Y
a
S
I
1a
I
0a
I
1d
I
0d
E
I
0a
SI
1a
I
0b
I
1b
I
0c
I
1c
I
0dI1d
Y
a
Y
b
Y
c
Y
d
Y
b
I
1b
I
0b
I
1c
I
0c
Y
d
Y
c
S
I
0a
Y
b
I
1c
Y
c
E
FCT157T
–1
Y
a
S
I
1a
I
0a
I1dI
0d
Y
b
I1bI
0b
I1cI
0c
Y
c
Y
d
E
FCT157T
FCT157T
Logic Symbol
CY54/74FCT157T
2
Maximum Ratings
[2,3]
(Above which the useful life may be impaired. For user guide­lines, not tested.)
Storage Temperature .....................................−65°C to +150°C
Ambient Temperature with
Power Applied..................................................−65°C to +135°C
Supply Voltage to Ground Potential..................−0.5V to +7.0V
DC Input Voltage .................................................−0.5V to +7.0V
DC Output Voltage ..............................................−0.5V to +7.0V
DC Output Current (Maximum Sink Current/Pin) ......120 mA
Power Dissipation..........................................................0.5W
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Pin Description
Name Description
S Common Select Input E Enable Inputs (Active LOW) I
0
Data Inputs from Source 0
I
1
Data Inputs from Source 1
Y Non-Inverted Output
Function Table
[1]
Inputs Outputs
E S I
0
I
1
Y
H X X X L L H X L L L H X H H L L L X L L L H X H
Operating Range
Range Range
Ambient
Temperature V
CC
Commercial All 40°C to +85°C 5V ± 5% Military
[4]
All 55°C to +125°C 5V ± 10%
Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions Min. Typ.
[5]
Max. Unit
V
OH
Output HIGH Voltage VCC=Min., IOH=32 mA Com’l 2.0 V
VCC=Min., IOH=15 mA Com’l 2.4 3.3 V VCC=Min., IOH=12 mA Mil 2.4 3.3 V
V
OL
Output LOW Voltage VCC=Min., IOL=64 mA Com’l 0.3 0.55 V
VCC=Min., IOL=32 mA Mil 0.3 0.55 V
V
IH
Input HIGH Voltage 2.0 V
V
IL
Input LOW Voltage 0.8 V
V
H
Hysteresis
[6]
All inputs 0.2 V
V
IK
Input Clamp Diode Voltage VCC=Min., IIN=18 mA 0.7 1.2 V
I
I
Input HIGH Current VCC=Max., VIN=V
CC
5 µA
I
IH
Input HIGH Current VCC=Max., VIN=2.7V ±1 µA
I
IL
Input LOW Current VCC=Max., VIN=0.5V ±1 µA
I
OZH
Off State HIGH-Level Output Current
VCC= Max., V
OUT
= 2.7V 10 µA
I
OZL
Off State LOW-Level Output Current
VCC = Max., V
OUT
= 0.5V 10 µA
I
OS
Output Short Circuit Current
[7]
VCC=Max., V
OUT
=0.0V 60 120 225 mA
I
OFF
Power-Off Disable VCC=0V, V
OUT
=4.5V ±1 µA
Note:
1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care
2. Unless otherwise noted, these limits are over the operating free-air temperature range.
3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either V
CC
or ground.
4. TA is the “instant on” case temperature.
5. Typical values are at VCC=5.0V, TA=+25˚C ambient.
6. This parameter is specified but not tested.
7. Not morethanone output should beshortedata time. Duration ofshort should notexceed one second. Theuse of high-speed test apparatusand/or sample and holdtechniques are preferablein order to minimizeinternalchip heating and more accuratelyreflect operational values.Otherwise prolonged shorting of a high output mayraise the chip temperature well above normal and therebycause invalid readings in other parametric tests. In anysequence of parameter tests, IOS tests should be performed last.
CY54/74FCT157T
3
Capacitance
[6]
Parameter Description Typ.
[5]
Max. Unit
C
IN
Input Capacitance 5 10 pF
C
OUT
Output Capacitance 9 12 pF
Power Supply Characteristics
Parameter Description Test Conditions Typ.
[5]
Max. Unit
I
CC
Quiescent Power Supply Current VCC=Max., VIN≤0.2V, VIN≥VCC−0.2V 0.1 0.2 mA
I
CC
Quiescent Power Supply Current (TTL inputs HIGH)
VCC=Max., VIN=3.4V,
[8]
f1=0, Outputs Open
0.5 2.0 mA
I
CCD
Dynamic Power Supply Current
[9]
VCC=Max., One Input Toggling, 50% Duty Cycle, Outputs Open, OE=GND, VIN≤0.2V or VIN≥VCC−0.2V
0.06 0.12 mA/MHz
I
C
Total Power Supply Current
[10]
VCC=Max., 50% Duty Cycle, Outputs Open, One Input Toggling at f
1
=10 MHz,
OE=GND, VIN≤0.2V or VIN≥VCC−0.2V
0.7 1.4 mA
VCC=Max., 50% Duty Cycle, Outputs Open, One Input Toggling at f
1
=10 MHz,
OE=GND, VIN=3.4V or VIN=GND
1.0 2.4 mA
VCC=Max., 50% Duty Cycle, Outputs Open, Four Bits Toggling at f
1
=2.5 MHz,
OE=GND, VIN≤0.2V or VIN≥VCC−0.2V
0.7 1.4
[11]
mA
VCC=Max., 50% Duty Cycle, Outputs Open, Four Bits Toggling at f
1
=2.5 MHz,
OE=GND, VIN=3.4V or VIN=GND
1.7 5.4
[11]
mA
Notes:
8. Per TTL driven input (V
IN
=3.4V); all other inputs at VCC or GND.
9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
10. I
C
=I
QUIESCENT
+ I
INPUTS
+ I
DYNAMIC
IC=ICC+ICCDHNT+I
CCD(f0
/2 + f1N1)
I
CC
= Quiescent Current with CMOS input levels
I
CC
= Power Supply Current for a TTL HIGH input (VIN=3.4V)
D
H
= Duty Cycle for TTL inputs HIGH
N
T
= Number of TTL inputs at D
H
I
CCD
= Dynamic Current caused by an input transition pair (HLH or LHL)
f
0
= Clock frequency for registered devices, otherwise zero
f
1
= Input signal frequency
N
1
= Number of inputs changing at f
1
All currents are in milliamps and all frequencies are in megahertz.
11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
CY54/74FCT157T
4
Document #: 3800288-C
Switching Characteristics Over the Operating Range
Parameter Description
FCT157T FCT157AT FCT157CT
Unit
Fig.
No.
[13}
Commercial Military Commercial Commercial
Min.
[12]
Max. Min.
[12]
Max. Min.
[12]
Max. Min.
[12]
Max.
t
PLH
t
PHL
Propagation Delay I to Y
1.5 6.0 1.5 5.8 1.5 5.0 1.5 4.3 ns 1, 3
t
PLH
t
PHL
Propagation Delay E to Y
1.5 10.5 1.5 7.4 1.5 6.0 1.5 4.8 ns 1, 5
t
PLH
t
PHL
Propagation Delay S to Y
1.5 10.5 1.5 8.1 1.5 7.0 1.5 5.2 ns 1, 3
Ordering Information
Speed
(ns) Ordering Code
Package
Name Package Type
Operating
Range
4.3 CY74FCT157CTQCT Q1 16-Lead (150-Mil) QSOP Commercial CY74FCT157CTSOC/SOCT S1 16-Lead (300-Mil) Molded SOIC
5.0 CY74FCT157ATQCT Q1 16-Lead (150-Mil) QSOP Commercial CY74FCT157ATSOC/SOCT S1 16-Lead (300-Mil) Molded SOIC
5.8 CY54FCT157ATLMB L61 20-Pin Square Leadless Chip Carrier Military
Note:
12. Minimum limits are specified but not tested on Propagation Delays.
13. See “Parameter Measurement Information” in the General Information Section
Package Diagrams
20-Pin Square Leadless Chip Carrier L61
MILSTD1835 C2A
CY54/74FCT157T
5
Package Diagrams (continued)
16-Lead Quarter Size Outline
Q1
16-Lead Molded SOIC
S1
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOL VE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICA TIONS IS UNDERSTOOD T O BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
Loading...