Texas Instruments CSM30003Y, CSM30003PJM Datasheet

MSP50C30
MIXED-SIGNAL PROCESSOR
SPSS021 NOVEMBER 1998
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D
Interface to External ROM/EPROM (Up to 8 MBytes)
D
D
32 Twelve-Bit Words and 992 Bytes of RAM
D
4K Internal ROM
D
3.3V to 6.5V CMOS Technology for Low Power Dissipation
D
28 Software-Configurable I/O Lines
D
10-kHz or 8-kHz Speech Sample Rate
description
The MSP50C30 combines an 8-bit microprocessor, two speech synthesizers, ROM, RAM, and I/O in a low-cost single-chip system. The architecture uses the same arithmetic logic unit (ALU) for the two synthesizers and the microprocessor, thus reducing chip area and cost and enabling the microprocessor to do a multiply operation in 0.8 µs. The MSP50C30 features two independent channels of linear predictive coding (LPC), which synthesize high-quality speech at a low data rate. Pulse-code modulation (PCM) can produce music or sound effects. For more information, see the MSP50C30 User’s Guide (literature number SPSU012).
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
81
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86
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90
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94
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96
97
98
99
100
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56
50
49
48
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46
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43
42
41
40
39
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37
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35
34
33
32
31
NC NC NC
NC OA0
PD3 PD2 PD1 PD0
DAC– DAC+
PC6
PC7
PC3 PC2 PC1 PC0 OSC OUT NC
NC NC
NC NC
NC OA17 OA18 OA19
OA21 OA22
ID7 ID6 ID5 ID4 ID3 ID2 ID1
ID0
PA0
NC
OA16
OA14
OA13
OA12
OA11
OA10
OA7
OA3
OA2
OA1NCNC
NC
PA1
PA2
PA3
PA4
PA5
PA6
NC
PA7
PB1
PB2
PB3
PB4
PB5
PB7
OSC IN
PB6
PJM PACKAGE
(TOP VIEW)
NC
OA5
OA9
OA8
NC
PC4
PB0
OA20
V
SS
INIT
26 27 28 29 30
55 54 53 52 51
NC
NC
NC
NC
NC
NC NC
NC NC
NC
OA4
OA15
V
DD
NC
NC
NC
PC5
V
SS
V
DD
NC
OA6
NC
Copyright 1998, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MSP50C30 MIXED-SIGNAL PROCESSOR
SPSS021 NOVEMBER 1998
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range
Supply voltage range, V
DD
(see Note 1) –0.3 V to 8 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply current, I
DD
or ISS (see Note 2) 100 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, V
I
(see Note 1) –0.3 V to VDD + 0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, V
O
(see Note 1) –0.3 V to VDD + 0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range –30°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to ground.
2. The total supply current includes the current out of all the I/O terminals and DAC terminals as well as the operating current of the device.
recommended operating conditions (MSP50C32, MSP50C33, MSP50x34)
MAX MAX UNIT
V
DD
Supply voltage
3.3 6.5 V
VDD = 3.3 V 2.5 3.3
V
IH
High-level input voltage
VDD = 5 V
3.8 5
V VDD = 6 V 4.5 6 VDD = 3.3 V 0 0.65
V
IL
Low-level input voltage
VDD = 5 V
0 1
V VDD = 6 V 0 1.3
T
A
Operating free-air temperature Device functionality 0 70 °C
Rspeaker Minimum speaker impedance Direct speaker drive using 2 pin push-pull DAC option 32
Unless otherwise noted, all voltages are with respect to VSS.
MSP50C30
MIXED-SIGNAL PROCESSOR
SPSS021 NOVEMBER 1998
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VDD = 3.5 V 2
VT+Positive-going threshold voltage (INIT)
VDD = 6 V 3.4
V
VDD = 3.5 V 1.6
VT–Negative-going threshold voltage (INIT)
VDD = 6 V 2.3
V
VDD = 3.5 V 0.4
V
hys
Hysteresis (V
T+
VT–) (INIT)
VDD = 6 V 1.1
V
I
Ikg
Input leakage current (except for OSC IN)
2 µA
I
standby
Standby current (INIT low, SETOFF)
10 µA
VDD = 3.3 V, 2.1
I
DD
Supply current
VDD = 5 V,
3.1
mA
DD
VDD = 6 V, 4.5 VDD = 3.3 V, VOH = 2.75 V –4 –12 VDD = 5 V, VOH = 4.5 V –5 –14
mA
p
VDD = 6 V, VOH = 5.5 V –6 –15
IOHHigh-level output current (PA, PB)
VDD = 3.3 V, VOH = 2.2 V –8 –20 VDD = 5 V, VOH = 3.33 V –14 –40
mA VDD = 6 V, VOH = 4 V –20 –51 VDD = 3.3 V, VOL = 0.5 V 5 9 VDD = 5 V, VOL = 0.5 V 5 9
mA
p
VDD = 6 V, VOL = 0.5 V 5 9
IOLLow-level output current (PA, PB)
VDD = 3.3 V, VOL = 1.1 V 10 19 VDD = 5 V, VOL = 1.67 V 20 29
mA VDD = 6 V, VOL = 2 V 25 35 VDD = 3.3 V, VOH = 2.75 V –30 –50 VDD = 5 V, VOH = 4.5 V –35 –60
mA
p
VDD = 6 V, VOH = 5.5 V –40 –65
IOHHigh-level output current (D/A)
VDD = 3.3 V, VOH = 2.3 V –50 –90 VDD = 5 V, VOH = 4 V –90 –140
mA VDD = 6 V, VOH = 5 V –100 –150 VDD = 3.3 V, VOL = 0.5 V 50 80 VDD = 5 V, VOL = 0.5 V 70 90
mA
p
VDD = 6 V, VOL = 0.5 V 80 110
IOLLow-level output current (D/A)
VDD = 3.3 V, VOL = 1 V 100 140 VDD = 5 V, VOL = 1 V 140
mA VDD = 6 V, VOL = 1 V 150
Pullup resistance
Resistors selected by software and connected between terminal and V
DD
10 20 50 k
VDD = 5 V, TA = 25°C,
f
osc(low)
Oscill
ator frequency
Target frequency = 15.36 MHz
14.89
15.36
15.86
MH
z
VDD = 5 V, TA = 25°C,
f
osc(high)
Oscill
ator frequency
Target frequency = 19.2 MHz
18.62
19.2
19.7
MH
z
Operating current assumes all inputs are tied to either VSS or VDD with no input currents due to programmed pullup resistors. The DAC output and other outputs are open circuited.
The frequency of the internal clock has a temperature coefficient of approximately –0.2 %/°C and a VDD coefficient of approximately ±1%/V.
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