Texas Instruments Chipcon Products CC2420 User Manual

CC2420
SWRS041B Page 1 of 89
Applications
2.4 GHz IEEE 802.15.4 systems ZigBee systems Home/building automation Industrial Control
Wireless sensor networks PC peripherals Consumer Electronics
Product Description
The
CC2420
is a true single-chip 2.4 GHz IEEE 802.15.4 compliant RF transceiver designed for low power and low voltage wireless applications.
CC2420
includes a digital direct sequence spread spectrum baseband modem providing a spreading gain of 9 dB and an effective data rate of 250 kbps.
The
CC2420
is a low-cost, highly integrated solution for robust wireless communication in the 2.4 GHz unlicensed ISM band. It complies with worldwide regulations covered by ETSI EN 300 328 and EN 300 440 class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan).
The
CC2420
provides extensive hardware support for packet handling, data buffering, burst transmissions, data encryption, data authentication, clear channel assessment, link quality indication and packet timing information. These
features reduce the load on the host controller and allow
CC2420
to interface
low-cost microcontrollers.
The configuration interface and transmit / receive FIFOs of
CC2420
are accessed via
an SPI interface. In a typical application
CC2420
will be used together with a microcontroller and a few external passive components.
CC2420
is based on Chipcon’s SmartRF­03 technology in 0.18 m CMOS.
Key Features
True single-chip 2.4 GHz IEEE
802.15.4 compliant RF transceiver with baseband modem and MAC support
DSSS baseband modem with 2
MChips/s and 250 kbps effective data rate.
Suitable for both RFD and FFD
operation
Low current consumption (RX: 18.8
mA, TX: 17.4 mA)
Low supply voltage (2.1 – 3.6 V) with
integrated voltage regulator
Low supply voltage (1.6 – 2.0 V) with
external voltage regulator
Programmable output power No external RF switch / filter needed I/Q low-IF receiver I/Q direct upconversion transmitter Very few external components 128(RX) + 128(TX) byte data buffering Digital RSSI / LQI support Hardware MAC encryption (AES-128) Battery monitor QLP-48 package, 7x7 mm Complies with ETSI EN 300 328, EN
300 440 class 2, FCC CFR-47 part 15 and ARIB STD-T66
Powerful and flexible development
tools available
CC2420
SWRS041B Page 2 of 89
Table of contents
1 Abbreviations_________________________________________________________________5 2 References ___________________________________________________________________6 3 Features _____________________________________________________________________ 7 4 Absolute Maximum Ratings_____________________________________________________8 5 Operating Conditions __________________________________________________________8 6 Electrical Specifications ________________________________________________________9
6.1 Overall___________________________________________________________________9
6.2 Transmit Section ___________________________________________________________9
6.3 Receive Section___________________________________________________________10
6.4 RSSI / Carrier Sense _______________________________________________________11
6.5 IF Section _______________________________________________________________11
6.6 Frequency Synthesizer Section _______________________________________________11
6.7 Digital Inputs/Outputs______________________________________________________12
6.8 Voltage Regulator _________________________________________________________13
6.9 Battery Monitor___________________________________________________________13
6.10 Power Supply ____________________________________________________________13
7 Pin Assignment ______________________________________________________________15 8 Circuit Description ___________________________________________________________17 9 Application Circuit ___________________________________________________________19
9.1 Input / output matching_____________________________________________________19
9.2 Bias resistor______________________________________________________________19
9.3 Crystal __________________________________________________________________19
9.4 Voltage regulator__________________________________________________________19
9.5 Power supply decoupling and filtering _________________________________________19
10 IEEE 802.15.4 Modulation Format ____________________________________________24 11 Configuration Overview _____________________________________________________25 12 Evaluation Software ________________________________________________________26 13 4-wire Serial Configuration and Data Interface__________________________________27
13.1 Pin configuration__________________________________________________________27
13.2 Register access____________________________________________________________27
13.3 Status byte_______________________________________________________________28
13.4 Command strobes _________________________________________________________29
13.5 RAM access______________________________________________________________29
13.6 FIFO access______________________________________________________________31
13.7 Multiple SPI access ________________________________________________________31
14 Microcontroller Interface and Pin Description __________________________________32
14.1 Configuration interface _____________________________________________________32
14.2 Receive mode ____________________________________________________________33
14.3 RXFIFO overflow _________________________________________________________33
14.4 Transmit mode____________________________________________________________34
14.5 General control and status pins _______________________________________________35
15 Demodulator, Symbol Synchroniser and Data Decision ___________________________35 16 Frame Format _____________________________________________________________36
16.1 Synchronisation header _____________________________________________________36
16.2 Length field______________________________________________________________37
16.3 MAC protocol data unit_____________________________________________________37
16.4 Frame check sequence ______________________________________________________38
CC2420
SWRS041B Page 3 of 89
17 RF Data Buffering__________________________________________________________39
17.1 Buffered transmit mode_____________________________________________________39
17.2 Buffered receive mode _____________________________________________________39
17.3 Unbuffered, serial mode ____________________________________________________40
18 Address Recognition ________________________________________________________41 19 Acknowledge Frames _______________________________________________________41 20 Radio control state machine__________________________________________________43 21 MAC Security Operations (Encryption and Authentication) _______________________45
21.1 Keys____________________________________________________________________45
21.2 Nonce / counter ___________________________________________________________45
21.3 Stand-alone encryption _____________________________________________________46
21.4 In-line security operations___________________________________________________46
21.5 CTR mode encryption / decryption ____________________________________________47
21.6 CBC-MAC_______________________________________________________________47
21.7 CCM ___________________________________________________________________47
21.8 Timing__________________________________________________________________48
22 Linear IF and AGC Settings__________________________________________________48 23 RSSI / Energy Detection _____________________________________________________48 24 Link Quality Indication _____________________________________________________49 25 Clear Channel Assessment ___________________________________________________50 26 Frequency and Channel Programming_________________________________________50 27 VCO and PLL Self-Calibration _______________________________________________51
27.1 VCO____________________________________________________________________51
27.2 PLL self-calibration________________________________________________________51
28 Output Power Programming _________________________________________________51 29 Voltage Regulator __________________________________________________________51 30 Battery Monitor____________________________________________________________52 31 Crystal Oscillator __________________________________________________________53 32 Input / Output Matching ____________________________________________________54 33 Transmitter Test Modes _____________________________________________________54
33.1 Unmodulated carrier _______________________________________________________54
33.2 Modulated spectrum _______________________________________________________55
34 System Considerations and Guidelines _________________________________________57
34.1 Frequency hopping and multi-channel systems___________________________________57
34.2 Data burst transmissions ____________________________________________________57
34.3 Crystal accuracy and drift ___________________________________________________57
34.4 Communication robustness __________________________________________________57
34.5 Communication security ____________________________________________________57
34.6 Low-cost systems _________________________________________________________58
34.7 Battery operated systems____________________________________________________58
34.8 BER / PER measurements___________________________________________________58
35 PCB Layout Recommendations _______________________________________________59 36 Antenna Considerations _____________________________________________________59 37 Configuration Registers _____________________________________________________61 38 Test Output Signals_________________________________________________________81 39 Package Description (QLP 48)________________________________________________83 40 Recommended layout for package (QLP 48) ____________________________________84
CC2420
SWRS041B Page 4 of 89
40.1 Package thermal properties __________________________________________________84
40.2 Soldering information ______________________________________________________84
40.3 Plastic tube specification____________________________________________________85
40.4 Carrier tape and reel specification _____________________________________________85
41 Ordering Information_______________________________________________________85 42 General Information ________________________________________________________86
42.1 Document History_________________________________________________________86
42.2 Product Status Definitions___________________________________________________87
43 Address Information________________________________________________________88 44 TI Worldwide Technical Support _____________________________________________88
CC2420
SWRS041B Page 5 of 89
1 Abbreviations
ADC - Analog to Digital Converter AES - Advanced Encryption Standard AGC - Automatic Gain Control ARIB - Association of Radio Industries and Businesses BER - Bit Error Rate CBC-MAC - Cipher Block Chaining Message Authentication Code CCA - Clear Channel Assessment CCM - Counter mode + CBC-MAC CFR - Code of Federal Regulations CSMA-CA - Carrier Sense Multiple Access with Collision Avoidance CTR - Counter mode (encryption) CW - Continuous Wave DAC - Digital to Analog Converter DSSS - Direct Sequence Spread Spectrum ESD - Electro Static Discharge ESR - Equivalent Series Resistance EVM - Error Vector Magnitude FCC - Federal Communications Commission FCF - Frame Control Field FIFO - First In First Out FFCTRL - FIFO and Frame Control HSSD - High Speed Serial Debug IEEE - Institute of Electrical and Electronics Engineers IF - Intermediate Frequency ISM - Industrial, Scientific and Medical ITU-T - International Telecommunication Union – Telecommunication Standardization Sector I/O - Input / Output I/Q - In-phase / Quadrature-phase kbps - kilo bits per second LNA - Low-Noise Amplifier LO - Local Oscillator LQI - Link Quality Indication LSB - Least Significant Bit / Byte MAC - Medium Access Control MFR - MAC Footer MHR - MAC Header MIC - Message Integrity Code MPDU - MAC Protocol Data Unit MSDU - MAC Service Data Unit NA - Not Available NC - Not Connected O-QPSK - Offset - Quadrature Phase Shift Keying PA - Power Amplifier PCB - Printed Circuit Board PER - Packet Error Rate PHY - Physical Layer PHR - PHY Header PLL - Phase Locked Loop PSDU - PHY Service Data Unit QLP - Quad Leadless Package RAM - Random Access Memory RBW - Resolution BandWidth RF - Radio Frequency RSSI - Receive Signal Strength Indicator RX - Receive
CC2420
SWRS041B Page 6 of 89
SHR - Synchronisation Header SPI - Serial Peripheral Interface TBD - To Be Decided / To Be Defined T/R - Transmit / Receive TX - Transmit VCO - Voltage Controlled Oscillator VGA - Variable Gain Amplifier
2 References
[1] IEEE std. 802.15.4 - 2003: Wireless Medium Access Control (MAC) and
Physical Layer (PHY) specifications for Low Rate Wireless Personal Area Networks (LR-WPANs)
http://standards.ieee.org/getieee802/download/802.15.4-2003.pdf
[2] NIST FIPS Pub 197: Advanced Encryption Standard (AES), Federal
Information Processing Standards Publication 197, US Department of Commerce/N.I.S.T., November 26, 2001. Available from the NIST website.
http://csrc.nist.gov/publications/fips/fips197/fips-197.pdf
[3] R. Housley, D. Whiting, N. Ferguson, Counter with CBC-MAC (CCM),
submitted to NIST, June 3, 2002. Available from the NIST website.
http://csrc.nist.gov/CryptoToolkit/modes/proposedmodes/ProposedModesPa ge.html
CC2420
SWRS041B Page 7 of 89
3 Features
2400 – 2483.5 MHz RF Transceiver
Direct Sequence Spread
Spectrum (DSSS) transceiver
250 kbps data rate, 2 MChip/s
chip rate
O-QPSK with half sine pulse
shaping modulation
Very low current consumption
(RX: 18.8 mA, TX: 17.4 mA)
High sensitivity (-95 dBm) High adjacent channel rejection
(30/45 dB)
High alternate channel rejection
(53/54 dB)
On-chip VCO, LNA and PA Low supply voltage (2.1 – 3.6 V)
with on-chip voltage regulator
Programmable output power I/Q low-IF soft decision receiver I/Q direct up-conversion
transmitter
Separate transmit and receive FIFOs
128 byte transmit data FIFO 128 byte receive data FIFO
Very few external components
Only reference crystal and a
minimised number of passives
No external filters needed
Easy configuration interface
4-wire SPI interface Serial clock up to 10 MHz
802.15.4 MAC hardware support:
Automatic preamble generator Synchronisation word
insertion/detection
CRC-16 computation and
checking over the MAC payload
Clear Channel Assessment Energy detection / digital RSSI Link Quality Indication Full automatic MAC security
(CTR, CBC-MAC, CCM)
802.15.4 MAC hardware security:
Automated security operations
within the receive and transmit FIFOs.
CTR mode encryption / decryption CBC-MAC authentication CCM encryption / decryption and
authentication
Stand-alone AES encryption
Development tools available
Fully equipped development kit Demonstration board reference
design with microcontroller code
Easy-to-use software for
generating the
CC2420
configu-
ration data
Small size QLP-48 package, 7 x 7 mm Complies with EN 300 328, EN 300
440 class 2, FCC CFR47 part 15 and ARIB STD-T66
CC2420
SWRS041B Page 8 of 89
4 Absolute Maximum Ratings
Parameter Min. Max. Units Condition
Supply voltage for on-chip voltage regulator, VREG_IN pin 43.
-0.3 3.6 V
Supply voltage (VDDIO) for digital I/Os, DVDD3.3, pin 25.
-0.3 3.6 V
Supply voltage (VDD) on AVDD_VCO, DVDD1.8, etc (pin no 1, 2, 3, 4, 10, 14, 15, 17, 18, 20, 26, 35, 37, 44 and 48)
0.3 2.0 V
Voltage on any digital I/O pin, (pin no. 21, 27-34 and 41)
-0.3 VDDIO+0.3, max 3.6 V
Voltage on any other pin, (pin no. 6, 7, 8, 11, 12, 13, 16, 36, 38, 39, 40, 45, 46 and 47)
-0.3 VDD+0.3, max 2.0 V
Input RF level 10 dBm
Storage temperature range 50 150
C
Reflow solder temperature 260
C
T = 10 s
The absolute maximum ratings given above should under no circumstances be violated. Stress exceeding one or more of
the limiting values may cause permanent damage to the device.
Caution! ESD sensitive device. Precaution should be used when handling the device in order to prevent permanent damage.
5 Operating Conditions
Parameter Min. Typ. Max. Units Condition
Supply voltage for on-chip voltage regulator, VREG_IN pin 43.
2.1 3.6 V
Supply voltage (VDDIO) for digital I/Os, DVDD3.3, pin 25 .
1.6 3.6 V The digital I/O voltage (DVDD3.3 pin)
must match the external interfacing circuit (e.g. microcontroller).
Supply voltage (VDD) on AVDD_VCO, DVDD1.8, etc (pin no 1, 2, 3, 4, 10, 14, 15, 17, 18, 20, 26, 35, 37, 44 and 48)
1.6 1.8 2.0 V The typical application uses regulated
1.8 V supply generated by the on-chip voltage regulator.
Operating ambient temperature range, TA 40 85
C
CC2420
SWRS041B Page 9 of 89
6 Electrical Specifications
Measured on CC2420 EM with transmission line balun, TA = 25 C, DVDD3.3 and VREG_IN = 3.3 V, internal voltage regulator used if nothing else stated.
6.1 Overall
Parameter Min. Typ. Max. Unit Condition / Note
RF Frequency Range 2400 2483.5 MHz Programmable in 1 MHz steps, 5
MHz steps for compliance with [1]
6.2 Transmit Section
Parameter Min. Typ. Max. Unit Condition / Note
Transmit bit rate 250
250 kbps As defined by [1]
Transmit chip rate
2000 2000 kChips/s As defined by [1]
Nominal output power -3 0 dBm
Delivered to a single ended 50 load through a balun.
[1] requires minimum –3 dBm
Programmable output power range
24 dB The output power is
programmable in 8 steps from approximately –24 to 0 dBm.
Harmonics
2
nd
harmonic
3
rd
harmonic
-44
-64
dBm
dBm
Measured conducted with 1 MHz resolution bandwidth on spectrum analyser. At max output power delivered to a single ended 50 load through a balun. See page
54.
Spurious emission
30 - 1000 MHz 1– 12.75 GHz
1.8 – 1.9 GHz
5.15 – 5.3 GHz
-56
-44
-56
-51
dBm dBm dBm dBm
Maximum output power.
Complies with EN 300 328, EN 300 440, FCC CFR47 Part 15 and ARIB STD-T-66
Error Vector Magnitude (EVM) 11 % Measured as defined by [1]
[1] requires max. 35 %
Optimum load impedance 95
+ j187
Differential impedance as seen from the RF-port (RF_P and RF_N) towards the antenna. For matching details see the Input / Output Matching section on page
54.
CC2420
SWRS041B Page 10 of 89
6.3 Receive Section
Parameter Min. Typ. Max. Unit Condition / Note
Receiver Sensitivity
-90
-95
dBm
PER = 1%, as specified by [1]
Measured in a 50 single-ended load through a balun.
[1] requires –85 dBm
Saturation (maximum input level) 0 10 dBm PER = 1%, as specified by [1]
Measured in a 50 single–ended load through a balun.
[1] requires –20 dBm
Adjacent channel rejection
+ 5 MHz channel spacing
45
dB
Wanted signal @ -82 dBm, adjacent modulated channel at +5 MHz, PER = 1 %, as specified by [1].
[1] requires 0 dB
Adjacent channel rejection
- 5 MHz channel spacing
30
dB
Wanted signal @ -82 dBm, adjacent modulated channel at
-5 MHz, PER = 1 %, as specified by [1].
[1] requires 0 dB
Alternate channel rejection
+ 10 MHz channel spacing
54
dB
Wanted signal @ -82 dBm, adjacent modulated channel at +10 MHz, PER = 1 %, as specified by [1]
[1] requires 30 dB
Alternate channel rejection
- 10 MHz channel spacing
53
dB
Wanted signal @ -82 dBm, adjacent modulated channel at
-10 MHz, PER = 1 %, as specified by [1]
[1] requires 30 dB
Channel rejection
+ 15 MHz
- 15 MHz
62
62
dB
dB
Wanted signal @ -82 dBm. Undesired signal is an IEEE
802.15.4 modulated channel, stepped through all channels from 2405 to 2480 MHz. Signal level for PER = 1%.
Co-channel rejection
-3
dB
Wanted signal @ -82 dBm. Undesired signal is an IEEE
802.15.4 modulated at the same frequency as the desired signal. Signal level for PER = 1%.
Blocking / Desensitisation
+/- 5 MHz from band edge +/- 20 MHz from band edge +/- 30 MHz from band edge +/- 50 MHz from band edge
-28
-28
-27
-28
dBm dBm dBm dBm
Wanted signal 3 dB above the sensitivity level, CW jammer, PER = 1%. Complies with EN 300 440 class 2.
Spurious emission
30 – 1000 MHz 1 – 12.75 GHz
-73
-58
dBm dBm
Conducted measurement in a 50 single ended load. Measured according to EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66
CC2420
SWRS041B Page 11 of 89
Parameter Min. Typ. Max. Unit Condition / Note
Frequency error tolerance -300 300 kHz Difference between centre
frequency of the received RF signal and local oscillator frequency
[1] requires 200 kHz
Symbol rate error tolerance 120 ppm Difference between incoming
symbol rate and the internally generated symbol rate
[1] requires 80 ppm
Data latency 3
s
Processing delay in receiver. Time from complete transmission of SFD until complete reception of SFD, i.e. from SFD goes active on transmitter until active on receiver.
6.4 RSSI / Carrier Sense
Parameter Min. Typ. Max. Unit Condition / Note
Carrier sense level
77 dBm Programmable in
RSSI.CCA_THR
RSSI dynamic range
100 dB The range is approximately from
–100 dBm to 0 dBm
RSSI accuracy
6
dB See page 48 for details
RSSI linearity
3
dB
RSSI average time 128
s
8 symbol periods, as specified by [1]
6.5 IF Section
Parameter Min. Typ. Max. Unit Condition / Note
Intermediate frequency (IF) 2 MHz
6.6 Frequency Synthesizer Section
Parameter Min. Typ. Max. Unit Condition / Note
Crystal oscillator frequency
16 MHz See page 53 for details.
Crystal frequency accuracy requirement
- 40
40 ppm Including aging and temperature
dependency, as specified by [1]
Crystal operation
Parallel
C381 and C391 are loading
capacitors, see page 53
CC2420
SWRS041B Page 12 of 89
Parameter Min. Typ. Max. Unit Condition / Note
Crystal load capacitance
12 16 20 pF 16 pF recommended
Crystal ESR
60
Crystal oscillator start-up time 1.0 ms
16 pF load
Phase noise
109
117
117
117
dBc/Hz dBc/Hz dBc/Hz dBc/Hz
Unmodulated carrier
At ±1 MHz offset from carrier At ±2 MHz offset from carrier At ±3 MHz offset from carrier At ±5 MHz offset from carrier
PLL loop bandwidth 100 kHz
PLL lock time
192
s
The startup time from the crystal oscillator is running and RX / TX turnaround time
6.7 Digital Inputs/Outputs
Parameter Min. Typ. Max. Unit Condition / Note
General
Signal levels are referred to the voltage level at pin DVDD3.3
Logic "0" input voltage
0 0.3*
DVDD
V
Logic "1" input voltage
0.7* DVDD
DVDD V
Logic "0" output voltage 0
0.4 V Output current −8 mA,
3.3 V supply voltage
Logic "1" output voltage 2.5
VDD V Output current 8 mA,
3.3 V supply voltage
Logic "0" input current
NA −1
A
Input signal equals GND
Logic "1" input current
NA 1
A
Input signal equals VDD
FIFO setup time 20 ns TX unbuffered mode, minimum
time FIFO must be ready before the positive edge of FIFOP
FIFO hold time
10 ns TX unbuffered mode, minimum
time FIFO must be held after the positive edge of FIFOP
Serial interface pins (SCLK, SI, SO and CSn) timing specification
See Table 4 on page 28
CC2420
SWRS041B Page 13 of 89
6.8 Voltage Regulator
Parameter Min. Typ. Max. Unit Condition / Note
General
Note that the internal voltage regulator can only supply CC2420 and no external circuitry.
Input Voltage
2.1 3.0 3.6 V On the VREG_IN pin
Output Voltage
1.7 1.8 1.9 V On the VREG_OUT pin
Quiescent current
13 20 29
A
No current drawn from the VREG_OUT pin. Min and max numbers include 2.1 through 3.6 V input voltage
Start-up time
0.3 0.6 ms
6.9 Battery Monitor
Parameter Min. Typ. Max. Unit Condition / Note
Current consumption
6 30 90
A
When enabled
Start-up time
100
s
Voltage regulator already enabled
Settling time
2
s
New toggle voltage programmed
Step size
50 mV
Hysteresis
10 mV
Absolute accuracy
-80 80 mV May be software calibrated for known reference voltage
Relative accuracy
-50 50 mV
6.10 Power Supply
Parameter Min. Typ. Max. Unit Condition / Note
Current consumption in different modes (see Figure 25, page 44)
Voltage regulator off (OFF) Power Down mode (PD) Idle mode (IDLE)
0.02 20 426
1
A A A
Current drawn from VREG_IN, through voltage regulator
Voltage regulator off Voltage regulator on Including crystal oscillator and voltage regulator
Current Consumption, receive mode
18.8 mA
CC2420
SWRS041B Page 14 of 89
Parameter Min. Typ. Max. Unit Condition / Note
Current Consumption, transmit mode:
P = -25 dBm P = -15 dBm P = -10 dBm P = 5 dBm P = 0 dBm
8.5
9.9 11 14
17.4
mA mA mA mA mA
The output power is delivered differentially to a 50 singled ended load through a balun, see also page 54.
CC2420
SWRS041B Page 15 of 89
7 Pin Assignment
VREG_OUT
AVDD_CHP
QLP48
7x7
1
2
3
4
5
6
7
8
9
10
11
12
35
34
33
32
31
30
29
28
27
26
25
36
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
CC2420
R_BIAS
AVDD_IF1
VREG_IN
VREG_EN
XOSC16_Q1
XOSC16_Q2
ATEST2
ATEST1
NC
RF_P
RF_N
AVDD_PRE
AVDD_RF1
TXRX_SWITCH
AVDD_VCO
VCO_GUARD
AVDD_SW
GND
GND
NC
NC
DSUB_CORE
DSUB_PADS
AVDD_ADC
DVDD_ADC
DGUARD
AVDD_IF2
DGND_GUARD
AVDD_RF2
DGND
NC
CSn
FIFO
FIFOP
CCA
SFD
DVDD1.8
SCLK
DVDD_RAM
SI
SO
DVDD3.3
NC
AVDD_XOSC16
NC
AGND
Exposed die
attach pad
RESETn
Figure 1.
CC2420
Pinout – Top View
Pin Pin Name Pin type Pin Description
-
AGND
Ground (analog) Exposed die attach pad. Must be connected to solid ground
plane
1
VCO_GUARD
Power (analog) Connection of guard ring for VCO (to AVDD) shielding
2
AVDD_VCO
Power (analog) 1.8 V Power supply for VCO
3
AVDD_PRE
Power (analog) 1.8 V Power supply for Prescaler
4
AVDD_RF1
Power (analog) 1.8 V Power supply for RF front-end
5
GND
Ground (analog) Grounded pin for RF shielding
6
RF_P
RF I/O Positive RF input/output signal to LNA/from PA in
receive/transmit mode
7
TXRX_SWITCH
Power (analog) Common supply connection for integrated RF front-end. Must
be connected to RF_P and RF_N externally through a DC path
8
RF_N
RF I/O Negative RF input/output signal to LNA/from PA in
receive/transmit mode
9
GND
Ground (analog) Grounded pin for RF shielding
10
AVDD_SW
Power (analog) 1.8 V Power supply for LNA / PA switch
11
NC
- Not Connected
12
NC
- Not Connected
13
NC
- Not Connected
14
AVDD_RF2
Power (analog) 1.8 V Power supply for receive and transmit mixers
15
AVDD_IF2
Power (analog) 1.8 V Power supply for transmit / receive IF chain
CC2420
SWRS041B Page 16 of 89
Pin Pin Name Pin type Pin Description
16
NC
- Not Connected
17
AVDD_ADC
Power (analog) 1.8 V Power supply for analog parts of ADCs and DACs
18
DVDD_ADC
Power (digital) 1.8 V Power supply for digital parts of receive ADCs
19
DGND_GUARD
Ground (digital) Ground connection for digital noise isolation
20
DGUARD
Power (digital) 1.8 V Power supply connection for digital noise isolation
21
RESETn
Digital Input Asynchronous, active low digital reset
22
DGND
Ground (digital) Ground connection for digital core and pads
23
DSUB_PADS
Ground (digital) Substrate connection for digital pads
24
DSUB_CORE
Ground (digital) Substrate connection for digital modules
25
DVDD3.3
Power (digital) 3.3 V Power supply for digital I/Os
26
DVDD1.8
Power (digital) 1.8 V Power supply for digital core
27
SFD
Digital output SFD (Start of Frame Delimiter) / digital mux output
28
CCA
Digital output CCA (Clear Channel Assessment) / digital mux output
29
FIFOP
Digital output Active when number of bytes in FIFO exceeds threshold /
serial RF clock output in test mode
30
FIFO
Digital I/O Active when data in FIFO /
serial RF data input / output in test mode
31
CSn
Digital input SPI Chip select, active low
32
SCLK
Digital input SPI Clock input, up to 10 MHz
33
SI
Digital input SPI Slave Input. Sampled on the positive edge of SCLK
34
SO
Digital output (tristate)
SPI Slave Output. Updated on the negative edge of SCLK. Tristate when CSn high.
35
DVDD_RAM
Power (digital) 1.8 V Power supply for digital RAM
36
NC
- Not Connected
37
AVDD_XOSC16
Power (analog) 1.8 V crystal oscillator power supply
38
XOSC16_Q2
Analog I/O 16 MHz Crystal oscillator pin 2
39
XOSC16_Q1
Analog I/O 16 MHz Crystal oscillator pin 1 or external clock input
40
NC
- Not Connected
41
VREG_EN
Digital input Voltage regulator enable, active high, held at VREG_IN
voltage level when active. Note that VREG_EN is relative VREG_IN, not DVDD3.3.
42
VREG_OUT
Power output Voltage regulator 1.8 V power supply output
43
VREG_IN
Power (analog) Voltage regulator 2.1 to 3.6 V power supply input
44
AVDD_IF1
Power (analog) 1.8 V Power supply for transmit / receive IF chain
45
R_BIAS
Analog output
External precision resistor, 43 k,  1 %
46
ATEST2
Analog I/O Analog test I/O for prototype and production testing
47
ATEST1
Analog I/O Analog test I/O for prototype and production testing
48
AVDD_CHP
Power (analog) 1.8 V Power supply for phase detector and charge pump
NOTES:
The exposed die attach pad must be connected to a solid ground plane as this is the main ground connection for the chip.
CC2420
SWRS041B Page 17 of 89
8 Circuit Description
Serial
microcontroller
interface
LNA
DIGITAL
DEMODULATOR
- Digital RSSI
- Gain Control
- Image Suppression
- Channel Filtering
- Demodulation
- Frame synchronization
DIGITAL
MODULATOR
- Data spreading
- Modulation
On-chip
BIAS
DIGITAL
INTERFACE
WITH FIFO BUFFERS,
CRC AND
ENCRYPTION
CONTROL LOGIC
AUTOMATIC GAIN CONTROL
TX POWER CONTROL
TX/RX CONTROL
XOSC
16 MHz
R
ADC
ADC
DAC
DAC
0
90
FREQ
SYNTH
SmartRF
CC2420
Power
Control
PA
Serial
voltage
regulator
Digital and
Analog test
interface
Figure 2.
CC2420
simplified block diagram
A simplified block diagram of
CC2420
is
shown in Figure 2.
CC2420
features a low-IF receiver. The received RF signal is amplified by the low­noise amplifier (LNA) and down-converted in quadrature (I and Q) to the intermediate frequency (IF). At IF (2 MHz), the complex I/Q signal is filtered and amplified, and then digitized by the ADCs. Automatic gain control, final channel filtering, de­spreading, symbol correlation and byte synchronisation are performed digitally.
When the SFD pin goes active, this indicates that a start of frame delimiter has been detected.
CC2420
buffers the received data in a 128 byte receive FIFO. The user may read the FIFO through an SPI interface. CRC is verified in hardware. RSSI and correlation values are appended to the frame. CCA is available on a pin in receive mode. Serial (unbuffered) data modes are also available for test purposes.
The
CC2420
transmitter is based on direct up-conversion. The data is buffered in a 128 byte transmit FIFO (separate from the receive FIFO). The preamble and start of frame delimiter are generated by hardware. Each symbol (4 bits) is spread using the IEEE 802.15.4 spreading sequence to 32 chips and output to the digital-to-analog converters (DACs).
An analog low pass filter passes the signal to the quadrature (I and Q) upconversion mixers. The RF signal is amplified in the power amplifier (PA) and fed to the antenna.
The internal T/R switch circuitry makes the antenna interface and matching easy. The RF connection is differential. A balun may be used for single-ended antennas. The biasing of the PA and LNA is done by connecting TXRX_SWITCH to RF_P and RF_N through an external DC path.
The frequency synthesizer includes a completely on-chip LC VCO and a 90 degrees phase splitter for generating the I
CC2420
SWRS041B Page 18 of 89
and Q LO signals to the down-conversion mixers in receive mode and up-conversion mixers in transmit mode. The VCO operates in the frequency range 4800 – 4966 MHz, and the frequency is divided by two when split in I and Q.
A crystal must be connected to XOSC16_Q1 and XOSC16_Q2 and provides the reference frequency for the synthesizer. A digital lock signal is available from the PLL.
The digital baseband includes support for frame handling, address recognition, data buffering and MAC security.
The 4-wire SPI serial interface is used for configuration and data buffering.
An on-chip voltage regulator delivers the regulated 1.8 V supply voltage. The voltage regulator may be enabled / disabled through a separate pin.
A battery monitor may optionally be used to monitor the unregulated power supply voltage. The battery monitor is configurable through the SPI interface.
CC2420
SWRS041B Page 19 of 89
9 Application Circuit
Few external components are required for the operation of
CC2420
. A typical application circuit is shown in Figure 4. The external components shown are described in Table 1 and typical values are given in Table 2. Note that most decoupling capacitors are not shown on the application circuits. For the complete reference design please refer to Texas Instrument’s web site: http://www.ti.com
.
9.1 Input / output matching
The RF input/output is high impedance and differential. The optimum differential load for the RF port is 95+j187 .
When using an unbalanced antenna such as a monopole, a balun should be used in order to optimise performance. The balun can be implemented using low-cost discrete inductors and capacitors only or in combination with transmission lines.
Figure 3 shows the balun implemented in a two-layer reference design. It consists of a half wave transmission line, C81, L61, L71 and L81. The circuit will present the optimum RF termination to
CC2420
with a 50 load on the antenna connection. This circuit has improved EVM performance, sensitivity and harmonic suppression compared to the design in Figure 4. Please refer to the input/output matching section on page 54 for more details.
The balun in Figure 4 consists of C61, C62, C71, C81, L61, L62 and L81, and will present the optimum RF termination to
CC2420
with a 50 load on the antenna connection. A low pass filter may be added to add margin to the FCC requirement on second harmonic level.
If a balanced antenna such as a folded dipole is used, the balun can be omitted. If the antenna also provides a DC path from the TXRX_SWITCH pin to the RF pins, inductors are not needed for DC bias.
Figure 5 shows a suggested application circuit using a differential antenna. The antenna type is a standard folded dipole. The dipole has a virtual ground point; hence bias is provided without degradation in antenna performance.
9.2 Bias resistor
The bias resistor R451 is used to set an accurate bias current.
9.3 Crystal
An external crystal with two loading capacitors (C381 and C391) is used for the crystal oscillator. See page 53 for details.
9.4 Voltage regulator
The on chip voltage regulator supplies all
1.8 V power supply inputs. C42 is required for stability of the regulator. A series resistor may be used to comply with the ESR requirement.
9.5 Power supply decoupling and filtering
Proper power supply decoupling must be used for optimum performance. The placement and size of the decoupling capacitors and the power supply filtering are very important to achieve the best performance in an application. Texas Instruments provides a compact reference design that should be followed very closely..
CC2420
SWRS041B Page 20 of 89
Ref Description
C42 Voltage regulator load capacitance
C61 Balun and match
C62 DC block to antenna and match
C71 Front-end bias decoupling and match
C81 Balun and match
C381 16MHz crystal load capacitor, see page 53
C391 16MHz crystal load capacitor, see page 53
L61 DC bias and match
L62 DC bias and match
L71 DC bias and match
L81 Balun and match
R451 Precision resistor for current reference generator
XTAL 16MHz crystal, see page 53
Table 1. Overview of external components
35
34
33
32
31
30
29
28
27
26
25
36
13
14
1516171819
202122
23
24
4847464544434241403938
37
1
2
3
4
5
6
7
8
9
10
11
12
QLP48
7x7
CC2420
RF
Transceiver
DSUB_CORE
DSUB_PADS
AVDD_ADC
DVDD_ADC
DGUARD
AVDD_IF2
DGND_GUARD
AVDD_RF2
DGND
NC
NC
RESETn
RF_P
RF_N
AVDD_PRE
AVDD_RF1
TXRX_SWITCH
AVDD_VCO
VCO_GUARD
AVDD_SW
GND
GND
NC
NC
VREG_OUT
AVDD_CHP
R_BIAS
AVDD_IF1
VREG_IN
VREG_EN
XOSC16_Q1
XOSC16_Q2
ATEST2
ATEST1
NC
AVDD_XOSC16
CSn
FIFO
FIFOP
CCA
SFD
DVDD1.8
SCLK
DVDD_RAM
SI
SO
DVDD3.3
NC
XTAL
Digital Interf ace
3.3 V Power supply

Antenna
(50 Ohm)
L61
C81 L81
L71
R451
C42
C391 C381
Figure 3. Typical application circuit with transmission line balun for single-ended
operation
CC2420
SWRS041B Page 21 of 89
35
34
33
32
31
30
29
28
27
26
25
36
13
14
15
16
17
1819202122
23
24
48
474645444342414039
38
37
1
2
3
4
5
6
7
8
9
10
11
12
QLP48
7x7
CC2420
RF
Transceiver
DSUB_CORE
DSUB_PADS
AVDD_ADC
DVDD_ADC
DGUARD
AVDD_IF2
DGND_GUARD
AVDD_RF2
DGND
NC
NC
RESETn
RF_P
RF_N
AVDD_PRE
AVDD_RF1
TXRX_SWITCH
AVDD_VCO
VCO_GUARD
AVDD_SW
GND
GND
NC
NC
VREG_OUT
AVDD_CHP
R_BIAS
AVDD_IF1
VREG_IN
VREG_EN
XOSC16_Q1
XOSC16_Q2
ATEST2
ATEST1
NC
AVDD_XOSC16
CSn
FIFO
FIFOP
CCA
SFD
DVDD1.8
SCLK
DVDD_RAM
SI
SO
DVDD3.3
NC
XTAL
C391 C381
C61
C71
C62
Antenna
(50 Ohm)
L81
C81
L62
Digital Interface
R451
3.3 V Power supply
L61
C42
Figure 4. Typical application circuit with discrete balun for single-ended operation
CC2420
SWRS041B Page 22 of 89
35
34
33
32
31
30
29
28
27
26
25
36
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
1
2
3
4
5
6
7
8
9
10
11
12
QLP48
7x7
CC2420
RF
Transceiver
DSUB_CORE
DSUB_PADS
AVDD_ADC
DVDD_ADC
DGUARD
AVDD_IF2
DGND_GUARD
AVDD_RF2
DGND
NC
NC
RESETn
RF_P
RF_N
AVDD_PRE
AVDD_RF1
TXRX_SWITCH
AVDD_VCO
VCO_GUARD
AVDD_SW
GND
GND
NC
NC
VREG_OUT
AVDD_CHP
R_BIAS
AVDD_IF1
VREG_IN
VREG_EN
XOSC16_Q1
XOSC16_Q2
ATEST2
ATEST1
NC
AVDD_XOSC16
CSn
FIFO
FIFOP
CCA
SFD
DVDD1.8
SCLK
DVDD_RAM
SI
SO
DVDD3.3
NC
XTAL
C391 C381
Digital Interface
R451
3.3 V Power supply
L61
C42
Folded
dipole
antenna
L71
Figure 5. Suggested application circuit with differential antenna (folded dipole)
CC2420
SWRS041B Page 23 of 89
Item Single ended output,
transmission line balun
Single ended output, discrete balun
Differential antenna
C42
10 µF, 0.5 < ESR < 5 10 µF, 0.5 < ESR < 5 10 µF, 0.5 < ESR < 5
C61 Not used 0.5 pF, +/- 0.25pF, NP0, 0402 Not used
C62 Not used 5.6 pF, +/- 0.25pF, NP0, 0402 Not used
C71 Not used 5.6 pF, 10%, X5R, 0402 Not used
C81 5.6 pF, +/- 0.25pF, NP0, 0402 0.5 pF, +/- 0.25pF, NP0, 0402 Not used
C381 27 pF, 5%, NP0, 0402 27 pF, 5%, NP0, 0402 27 pF, 5%, NP0, 0402
C391 27 pF, 5%, NP0, 0402 27 pF, 5%, NP0, 0402 27 pF, 5%, NP0, 0402
L61 8.2 nH, 5%,
Monolithic/multilayer, 0402
7.5 nH, 5%, Monolithic/multilayer, 0402
27 nH, 5%, Monolithic/multilayer, 0402
L62 Not used 5.6 nH, 5%,
Monolithic/multilayer, 0402
Not used
L71 22 nH, 5%,
Monolithic/multilayer, 0402
Not used 12 nH, 5%, Monolithic/multilayer,
0402
L81 1.8 nH, +/- 0.3nH,
Monolithic/multilayer, 0402
7.5 nH, 5%, Monolithic/multilayer, 0402
Not used
R451
43 k, 1%, 0402 43 k, 1%, 0402 43 k, 1%, 0402
XTAL 16 MHz crystal, 16 pF load
(C
L
),
ESR < 60
16 MHz crystal, 16 pF load (CL), ESR < 60
16 MHz crystal, 16 pF load (C
L
),
ESR < 60
Table 2. Bill of materials for the application circuits
CC2420
SWRS041B Page 24 of 89
10 IEEE 802.15.4 Modulation Format
This section is meant as an introduction to the 2.4 GHz direct sequence spread spectrum (DSSS) RF modulation format defined in IEEE 802.15.4. For a complete description, please refer to [1].
The modulation and spreading functions are illustrated at block level in Figure 6 [1]. Each byte is divided into two symbols, 4 bits each. The least significant symbol is transmitted first. For multi-byte fields, the
least significant byte is transmitted first, except for security related fields where the most significant byte it transmitted first.
Each symbol is mapped to one out of 16 pseudo-random sequences, 32 chips each. The symbol to chip mapping is shown in Table 3. The chip sequence is then transmitted at 2 MChips/s, with the least significant chip (C
0
) transmitted first
for each symbol.
Bit-to-
Symbol
Symbol-
to-Chip
O-QPSK
Modulator
Transmitted
bit-stream (LSB first)
Modulated
Signal
Figure 6. Modulation and spreading functions [1]
Symbol Chip sequence (C0, C1, C2, … , C31)
0 1 1 0 1 1 0 0 1 1 1 0 0 0 0 1 1 0 1 0 1 0 0 1 0 0 0 1 0 1 1 1 0
1 1 1 1 0 1 1 0 1 1 0 0 1 1 1 0 0 0 0 1 1 0 1 0 1 0 0 1 0 0 0 1 0
2 0 0 1 0 1 1 1 0 1 1 0 1 1 0 0 1 1 1 0 0 0 0 1 1 0 1 0 1 0 0 1 0
3 0 0 1 0 0 0 1 0 1 1 1 0 1 1 0 1 1 0 0 1 1 1 0 0 0 0 1 1 0 1 0 1
4 0 1 0 1 0 0 1 0 0 0 1 0 1 1 1 0 1 1 0 1 1 0 0 1 1 1 0 0 0 0 1 1
5 0 0 1 1 0 1 0 1 0 0 1 0 0 0 1 0 1 1 1 0 1 1 0 1 1 0 0 1 1 1 0 0
6 1 1 0 0 0 0 1 1 0 1 0 1 0 0 1 0 0 0 1 0 1 1 1 0 1 1 0 1 1 0 0 1
7 1 0 0 1 1 1 0 0 0 0 1 1 0 1 0 1 0 0 1 0 0 0 1 0 1 1 1 0 1 1 0 1
8 1 0 0 0 1 1 0 0 1 0 0 1 0 1 1 0 0 0 0 0 0 1 1 1 0 1 1 1 1 0 1 1
9 1 0 1 1 1 0 0 0 1 1 0 0 1 0 0 1 0 1 1 0 0 0 0 0 0 1 1 1 0 1 1 1
10 0 1 1 1 1 0 1 1 1 0 0 0 1 1 0 0 1 0 0 1 0 1 1 0 0 0 0 0 0 1 1 1
11 0 1 1 1 0 1 1 1 1 0 1 1 1 0 0 0 1 1 0 0 1 0 0 1 0 1 1 0 0 0 0 0
12 0 0 0 0 0 1 1 1 0 1 1 1 1 0 1 1 1 0 0 0 1 1 0 0 1 0 0 1 0 1 1 0
13 0 1 1 0 0 0 0 0 0 1 1 1 0 1 1 1 1 0 1 1 1 0 0 0 1 1 0 0 1 0 0 1
14 1 0 0 1 0 1 1 0 0 0 0 0 0 1 1 1 0 1 1 1 1 0 1 1 1 0 0 0 1 1 0 0
15 1 1 0 0 1 0 0 1 0 1 1 0 0 0 0 0 0 1 1 1 0 1 1 1 1 0 1 1 1 0 0 0
Table 3. IEEE 802.15.4 symbol-to-chip mapping [1]
The modulation format is Offset – Quadrature Phase Shift Keying (O-QPSK) with half-sine chip shaping. This is equivalent to MSK modulation. Each chip
is shaped as a half-sine, transmitted alternately in the I and Q channels with one half chip period offset. This is illustrated for the zero-symbol in Figure 7.
CC2420
SWRS041B Page 25 of 89
1
01
0
1101
I-phase
Q-phase
1
00
1
1001
0
00
1100
1
0
11
0010
1
T
C
2T
C
Figure 7. I / Q Phases when transmitting a zero-symbol chip sequence, TC = 0.5 µs
11 Configuration Overview
CC2420
can be configured to achieve the best performance for different applications. Through the programmable configuration registers the following key parameters can be programmed:
Receive / transmit mode RF channel selection RF output power
Power-down / power-up mode Crystal oscillator power-up / power
down
Clear Channel Assessment mode Packet handling hardware support Encryption / Authentication modes
CC2420
SWRS041B Page 26 of 89
12 Evaluation Software
Texas Instruments (TI) provides users of
CC2420
with a software program, SmartRF
®
Studio (Windows interface) which may be used for radio performance and functionality evaluation. SmartRF®
Studio can be downloaded from TI’s web page: http://www.ti.com
. Figure 8 shows
the user interface of the
CC2420
configuration software.
Figure 8. SmartRF Studio user interface
CC2420
SWRS041B Page 27 of 89
13 4-wire Serial Configuration and Data Interface
CC2420
is configured via a simple 4-wire
SPI-compatible interface (pins SI, SO, SCLK and CSn) where
CC2420
is the slave. This interface is also used to read and write buffered data (see page 39). All address and data transfer on the SPI interface is done most significant bit first.
13.1 Pin configuration
The digital inputs SCLK, SI and CSn are high-impedance inputs (no internal pull­up) and should have external pull-ups if not driven. SO is high-impedance when CSn is high. An external pull-up should be used at SO to prevent floating input at microcontroller. Unused I/O pins on the MCU can be set to outputs with a fixed ‘0’ level to avoid leakage currents.
13.2 Register access
There are 33 16-bit configuration and status registers, 15 command strobe registers, and two 8-bit registers to access the separate transmit and receive FIFOs. Each of the 50 registers is addressed by a 6-bit address. The RAM/Register bit (bit 7) must be cleared for register access. The Read/Write bit (bit 6) selects a read or a write operation and makes up the 8-bit address field together with the 6-bit address.
In each register read or write cycle, 24 bits are sent on the SI-line. The CSn pin (Chip Select, active low) must be kept low during this transfer. The bit to be sent first is the
RAM/Register bit (set to 0 for register access), followed by the R/W bit (0 for write, 1 for read). The following 6 bits are
the address-bits (A5:0). A5 is the most
significant bit of the address and is sent first. The 16 data-bits are then transferred (D15:0), also MSB first. See Figure 9 for an illustration.
The configuration registers can also be read by the microcontroller via the same configuration interface. The R/W bit must be set high to initiate the data read-back.
CC2420
then returns the data from the
addressed register on the 16 clock cycles following the register address. The SO pin is used as the data output and must be configured as an input by the microcontroller.
The timing for the programming is also shown in Figure 9 with reference to Table
4. The clocking of the data on SI into the
CC2420
is done on the positive edge of
SCLK. When the last bit, D0, of the 16 data-bits has been written, the data word is loaded in the internal configuration register.
Multiple registers may be written without releasing CSn, as described in the Multiple SPI access section on page 31.
The register data will be retained during power down mode, but not when the power-supply is turned off (e.g. by disabling the voltage regulator using the VREG_EN pin). The registers can be programmed in any order.
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