DSpread Spectrum Clock Compatible
DOperating Frequency: 60 MHz to 180 MHz
DLow Jitter (cyc–cyc): ±50 ps
DDistributes One Differential Clock Input to
Four Differential Clock Outputs
DEnters Low Power Mode and Three-State
Outputs When Input CLK Signal Is Less
Than 20 MHz or PWRDWN Is Low
DOperates From Dual 2.5-V Supplies
D28-Pin TSSOP Package
DConsumes < 200-µA Quiescent Current
DExternal Feedback PIN (FBIN, FBIN) Are
GND
Y0
Y0
V
DDQ
GND
CLK
CLK
V
DDQ
AV
DD
AGND
V
DDQ
Y1
Y1
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
GND
Y3
Y3
V
PWRDWN
FBIN
FBIN
V
FBOUT
FBOUT
V
Y2
Y2
GND
Used to Synchronize the Outputs to the
Input Clocks
description
The CDCV855 is a high-performance, low-skew, low-jitter zero delay buf fer that distributes a dif ferential clock
input pair (CLK, CLK
feedback clock outputs (FBOUT , FBOUT
with CLK. When PWRDWN
shut down (low-power mode). The device also enters this low-power mode when the input frequency falls below
a suggested detection frequency that is below 20 MHz (typical 10 MHz). An input frequency detection circuit
detects the low-frequency condition and after applying a >20-MHz input signal this detection circuit turns on the
PLL again and enables the outputs.
) to four differential pairs of clock outputs (Y[0:3], Y[0:3]) and one differential pair of
). When PWRDWN is high, the outputs switch in phase and frequency
is low, all outputs are disabled to a high-impedance state (3-state), and the PLL is
DDQ
DDQ
DDQ
When A V
is tied to GND, the PLL is turned off and bypassed for test purposes. The CDCV855 is also able
DD
to track spread spectrum clocking for reduced EMI.
Since the CDCV855 is based on PLL circuitry , it requires a stabilization time to achieve phase-lock of the PLL.
This stabilization time is required following power up. The CDCV855 is characterized for both commercial and
industrial temperature ranges.
AVAILABLE OPTIONS
PACKAGED DEVICES
TSSOP (PW)
Copyright 2002, Texas Instruments Incorporated
0°C to 70°CCDCV855PW
–40°C to 85°CCDCV855IPW
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
T
A
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
CDCV855, CDCV855I
2.5-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS660A – SEPTEMBER 2001 – REVISED DECEMBER 2002
FUNCTION TABLE
(Select Functions)
INPUTS
AV
DD
GNDHLHLHLHBypassed/Off
GNDHHLHLHLBypassed/Off
XLLHZZZZOff
XLHLZZZZOff
2.5 V (nom)HLHLHLHOn
2.5 V (nom)HHLHLHLOn
2.5 V (nom)X<20 MHz{<20 MHz
†
Typically 10 MHz
functional block diagram
PWRDWN
AV
PWRDWNCLKCLKY[0:3]Y[0:3]FBOUTFBOUT
24
Powerdown
and Test
Logic
DD
9
OUTPUTSPLL
{
ZZZZOff
3
2
12
13
17
16
26
27
Y0
Y0
Y1
Y1
Y2
Y2
Y3
Y3
23
22
6
7
PLL
CLK
CLK
FBIN
FBIN
Terminal Functions
TERMINAL
NAMENO.
AGND10Ground for 2.5-V analog supply
AV
DD
CLK, CLK6, 7IDifferential clock input
FBIN, FBIN23, 22IFeedback differential clock input
FBOUT, FBOUT19, 20OFeedback differential clock output
GND1, 5, 14, 15, 28Ground
PWRDWN24IControl input to turn device in the power-down mode
V
DDQ
Y[0:3]3, 12, 17, 26OBuffered output copies of input clock, CLK
Y[0:3]2, 13, 16, 27OBuffered output copies of input clock, CLK
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage range, V
Input voltage range, V
I
Output voltage range, V
Input clamp current, I
IK
Output clamp current, I
Continuous output current, I
Continuous current to GND or V
Package thermal impedance, θ
Storage temperature range T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This value is limited to 3.6 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51.
High-level input voltage, V
DC input signal voltage (see Note 5)–0.3V
Differential input signal voltage, VID (see Note 6)CLK, FBIN0.36V
Output differential cross-voltage, V
Input differential pair cross-voltage, V
High-level output current, I
Low-level output current, I
Input slew rate, SR (see Figure 7)14V/ns
p
Operating free-air temperature, T
NOTES: 4. Unused inputs must be held high or low to prevent them from floating.
5. DC input signal voltage specifies the allowable dc execution of differential input.
6. Differential input signal voltage specifies the differential voltage |VTR – VCP| required for switching, where VTR is the true input level
and VCP is the complementary input level.
7. Differential cross-point voltage is expected to track variations of V
crossing.
Supply current on AV
Input capacitanceV
Output capacitanceV
+ AV
}
DD
DDQ
DD
= 2.3 V,II = –18 mA–1.2V
DDQ
V
= min to max, IOH = –1 mAV
DDQ
V
= 2.3 V,
DDQ
V
= min to max, IOL = 1 mA0.1
DDQ
V
= 2.3 V,
DDQ
= 2.3 V,VO = 1 V–18–32mA
DDQ
= 2.3 V,VO = 1.2 V2635mA
DDQ
Differential outputs are terminated with
120 Ω
= 2.7 V,VI = 0 V to 2.7 V±10µA
DDQ
V
= 2.7 V,VO = V
DDQ
CLK and CLK = 0 MHz; PWRDWN = Low;
Σ of IDD and AI
Differential outputs
are terminated with
120 Ω / CL = 14 pF
Differential outputs
are terminated with
120 Ω / CL = 0 pF
fO = 167 MHz810mA
= 2.5 VVI = V
DDQ
= 2.5 VVO = V
DDQ
DDQ
DD
.
– 0.1
DDQ
IOH = –12 mA1.7
IOL = 12 mA0.6
1.1V
V
/2 – 0.2 V
DDQ
or GND±10µA
DDQ
fO = 167 MHz
or GND22.53pF
DDQ
or GND2.533.5pF
DDQ
and is the voltage at which the differential signals must be crossing.
DDQ
†
/2 V
DDQ
100200µA
150180
130160
DDQ
DDQ
MAXUNIT
– 0.4
/2 + 0.2
V
V
V
mA
timing requirements over recomme nd ed ran ge s of supply voltage and operating free-air
temperature
PARAMETERMINMAXUNIT
f
CLK
§
Recovery time required when the device goes from power-down mode into bypass mode (test mode with AVDD at GND).
¶
Time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal. For phase lock to be obtained, a
fixed-frequency , fixed-phase reference signal must be present at CLK. Until phase lock is obtained, the specifications for propagation delay, skew ,
and jitter parameters given in the switching characteristics table are not applicable. This parameter does not apply for input modulation under
SSC application.
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
9
IMPORTANT NOTICE
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enhancements, improvements, and other changes to its products and services at any time and to discontinue
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty . Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty . Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
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Post Office Box 655303
Dallas, Texas 75265
Copyright 2002, Texas Instruments Incorporated
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