1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
S0/A0/CLK_SEL
S1/A1
V
CC
GND
CLK_IN0
CLK_IN1
V
CC
GND
SDATA
SCLOCK
Y5
Y4
V
CCOUT2
GND
Y3
Y2
V
CCOUT1
GND
Y1
Y0
PW PACKAGE
(TOP VIEW)
TSSOP 20
Pitch 0,65 mm
6.6 x 6.6
CDCE906
www.ti.com
SCAS814H – NOVEMBER 2005 – REVISED DECEMBER 2007
PROGRAMMABLE 3-PLL CLOCK SYNTHESIZER / MULTIPLIER / DIVIDER
1
FEATURES
2
• High Performance 3:6 PLL based Clock
Synthesizer / Multiplier / Divider • Programmable Output Slew-Rate Control
• User Programmable PLL Frequencies
• EEPROM Programming Without the Need to
Apply High Programming Voltage • Commercial Temperature Range 0 ° C to 70 ° C
• Easy In-Circuit Programming via SMBus Data • Development and Programming Kit for Easy
Interface PLL Design and Programming
• Wide PLL Divider Ratio Allows 0-ppm Output
Clock Error • Packaged in 20-Pin TSSOP
• Generates Precise Video (27 MHz or 54 MHz)
and Audio System Clocks from Multiple
Sampling Frequencies (f
44.1, 48, 96 kHz)
• Clock Inputs Accept a Crystal or a
Single-Ended LVCMOS or a Differential Input
Signal
• Accepts Crystal Frequencies from 8 MHz up to
54 MHz
• Accepts LVCMOS or Differential Input
Frequencies up to 167 MHz
• Two Programmable Control Inputs [S0/S1,
A0/A1] for User Defined Control Signals
• Six LVCMOS Outputs with Output Frequencies
up to 167 MHz
• LVCMOS Outputs can be Programmed for
Complementary Signals
• Free Selectable Output Frequency via
Programmable Output Switching Matrix [6x6]
Including 7-Bit Post-Divider for Each Output
• PLL Loop Filter Components Integrated
• Low Period Jitter (Typ 60 ps)
• Features Spread Spectrum Clocking (SSC) for
Lowering System EMI
• Programmable Center Spread SSC Modulation
( ± 0.1%, ± 0.25%, and ± 0.4%) with a Mean Phase
Equal to the Phase of the Non-Modulated
Frequency
= 16, 22.05, 24, 32,
S
• Programmable Down Spread SSC Modulation
(1%, 1.5%, 2%, and 3%)
(SRC) for Lowering System EMI
• 3.3-V Device Power Supply
(TI Pro-Clock™)
TERMINAL ASSIGNMENT
DESCRIPTION
The CDCE906 is one of the smallest and powerful
PLL synthesizer / multiplier / divider available today.
Despite its small physical outlines, the CDCE906 is
flexible. It has the capability to produce an almost
independent output frequency from a given input
frequency.
The input frequency can be derived from a LVCMOS,
differential input clock, or a single crystal. The
appropriate input waveform can be selected via the
SMBus data interface controller.
1
2 Pro-Clock is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2005 – 2007, Texas Instruments Incorporated
CDCE906
SCAS814H – NOVEMBER 2005 – REVISED DECEMBER 2007
DESCRIPTION (CONTINUED)
To achieve an independent output frequency the reference divider M and the feedback divider N for each PLL
can be set to values from 1 up to 511 for the M-Divider and from 1 up to 4095 for the N-Divider. The PLL-VCO
(voltage controlled oscillator) frequency than is routed to the free programmable output switching matrix to any of
the six outputs. The switching matrix includes an additional 7-bit post-divider (1-to-127) and an inverting logic for
each output.
The deep M/N divider ratio allows the generation of zero ppm clocks from any reference input frequency (e.g., a
27 MHz).
The CDCE906 includes three PLLs of those one supports SSC (spread-spectrum clocking). PLL1, PLL2, and
PLL3 are designed for frequencies up to 167 MHz and optimized for zero-ppm applications with wide divider
factors.
PLL2 also supports center-spread and down-spread spectrum clocking (SSC). This is a common technique to
reduce electro-magnetic interference. Also, the slew-rate controllable (SRC) output edges minimize EMI noise.
Based on the PLL frequency and the divider settings, the internal loop filter components will be automatically
adjusted to achieve high stability and optimized jitter transfer characteristic of the PLL.
The device supports non-volatile EEPROM programming for easy-customized application. It is preprogrammed
with a factory default configuration (see Figure 13 ) and can be reprogrammed to a different application
configuration before it goes onto the PCB or reprogrammed by in-system programming. A different device setting
is programmed via the serial SMBus interface.
Two free programmable inputs, S0 and S1, can be used to control for each application the most demanding logic
control settings (outputs disable to low, outputs 3-state, power down, PLL bypass, etc).
The CDCE906 has three power supply pins, V
operates from a single 3.3-V supply voltage. V
V
CCOUT1
supplies the outputs Y0 and Y1 and V
supplies can be 2.3 V to 3.6 V. At output voltages lower than 3.3 V, the output drive current is limited.
The CDCE906 is characterized for operation from 0 ° C to 70 ° C.
, V
CC
CCOUT1
CCOUT1
CCOUT2
and V
and V
CCOUT2
. V
CCOUT2
is the power supply for the device. It
CC
are the power supply pins for the outputs.
supplies the outputs Y2, Y3, Y4, and Y5. Both outputs
2 Submit Documentation Feedback Copyright © 2005 – 2007, Texas Instruments Incorporated
Product Folder Link(s): CDCE906
PLL1
XO
or
2LVCMOS
or
Differential
Input
MUX
MUX
PLL3
PFD
Filter
VCO
PLL2
w/SSC
PFD
Filter
VCO
SO/AO/CLK_SEL
S1/A1
SCLOCK
OutputSwitchMatrix
LV
CMOS
LV
CMOS
LV
CMOS
LV
CMOS
LV
CMOS
LV
CMOS
EEPROM
LOGIC
SMBUS
LOGIC
PFD
Filter
VCO
SDATA
Y5
Y4
Y3
Y2
Y1
Y0
VCO1Bypass
VCO2Bypass
VCO3Bypass
MUX
6xProgrammable7-BitDividerP0,P1,P2,P3,P4,P5,andInversionLogic
5x6ProgrammableSwitch A
PLL Bypass
V
CC
GND V
CCOUT1
GND V
CCOUT2
prg. 9Bit
DividerM
prg.12Bit
DividerN
prg.9Bit
DividerM
prg.12Bit
DividerN
prg.9Bit
DividerM
prg.12Bit
DividerN
Crystalor
ClockInput
CLK_IN1
FactoryPrg.
CLK_IN0
SSC
On/Off
6x6ProgrammableSwitchB
5x6 − Switch A
Input CLK
(PLL Bypass)
PLL 1
PLL 2
non SSC
PLL 2
w/ SSC
PLL 3
6x6 − Switch B 7-Bit Divider
Y0
Y1
Y2
Y3
Y4
Y5
P0
P1
P2
P3
P4
P5
Programming
FUNCTIONAL BLOCK DIAGRAM
CDCE906
SCAS814H – NOVEMBER 2005 – REVISED DECEMBER 2007
OUTPUT SWITCH MATRIX
Copyright © 2005 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): CDCE906
CDCE906
SCAS814H – NOVEMBER 2005 – REVISED DECEMBER 2007
TERMINAL FUNCTIONS
TERMINAL
NAME
Y0 to Y5 O LVCMOS outputs
TSSOP20
NO.
11, 12, 15,
16, 19, 20
CLK_IN0 5 I
CLK_IN1 6 I/O
V
CC
V
CCOUT1
V
CCOUT2
3, 7 Power 3.3-V power supply for the device.
14 Power Power supply for outputs Y0, Y1.
18 Power Power supply for outputs Y2, Y3, Y4, Y5.
GND 4, 8, 13, 17 Ground Ground
S0, A0,
CLK_SEL
1 I CLK_SEL (selects one of two LVCMOS clock inputs), dependent on the SMBus settings; LVCMOS
S1, A1 2 I
SDATA 9 I/O Serial control data input/output for SMBus controller; LVCMOS input
SCLOCK 10 I Serial control clock input for SMBus controller; LVCMOS input
I/O DESCRIPTION
Dependent on SMBus settings, CLK_IN0 is the crystal oscillator input and can also be used as
LVCMOS input or as positive differential signal inputs.
Dependent on SMBus settings, CLK_IN1 is serving as the crystal oscillator output or can be the
second LVCMOS input or the negative differential signal input.
User programmable control input S0 (PLL bypass or power-down mode) or AO (address bit 0), or
inputs; internal pullup 150 k Ω .
User programmable control input S1 (output enable/disable or all output low), A1 (address bit 1),
dependent on the SMBus settings; LVCMOS inputs; internal pullup 150 k Ω
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
V
V
V
I
I
I
O
T
stg
T
J
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
(2) The input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
Supply voltage range – 0.5 to 4.6 V
CC
Input voltage range
I
Output voltage range
O
(2)
(2)
Input current (VI< 0, VI> VCC) ± 20 mA
Continuous output current ± 50 mA
Storage temperature range – 65 to 150 ° C
Maximum junction temperature 125 ° C
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
(1)
VALUE UNIT
– 0.5 to V
– 0.5 to V
+ 0.5 V
CC
+ 0.5 V
CC
PACKAGE THERMAL RESISTANCE
for TSSOP20 (PW) Package
θ
JA
θ
JC
(1) The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).
Thermal resistance junction-to-ambient
Thermal resistance junction-to-case 19.7
(1)
PARAMETER AIRFLOW (LFM) ° C/W
0 66.3
150 59.3
250 56.3
500 51.9
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Product Folder Link(s): CDCE906
SCAS814H – NOVEMBER 2005 – REVISED DECEMBER 2007
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
CC
V
CCOUT1
V
CCOUT2
V
IL
V
IH
V
Ithresh
V
I
|V
| Differential input voltage 0.1 V
ID
V
IC
IOH/ I
IOH/ I
C
L
T
A
(1) The minimum output voltage can be down to 1.8 V. See the application note for more information.
Device supply voltage 3 3.3 3.6 V
(1)
Output Y0,Y1 supply voltage 2.3 3.6 V
(1)
Output Y2, Y3, Y4, Y5 supply voltage 2.3 3.6 V
Low level input voltage LVCMOS 0.3 V
High level input voltage LVCMOS 0.7 V
Input voltage threshold LVCMOS 0.5 V
CC
CC
Input voltage range LVCMOS 0 3.6 V
Common-mode for differential input voltage 0.2 Vcc- 0.6 V
Output current (3.3 V) ± 6 mA
OL
Output current (2.5 V) ± 4 mA
OL
Output load LVCMOS 25 pF
Operating free-air temperature 0 70 ° C
RECOMMENDED CRYSTAL SPECIFICATIONS
MIN NOM MAX UNIT
f
Xtal
ESR Effective series resistance
C
(1) For crystal frequencies above 50 MHz the effective series resistor should not exceed 50 Ω to assure stable start-up condition.
(2) Maximum Power Handling (Drive Level) see Figure 16 .
Crystal input frequency range (fundamental mode) 8 27 54 MHz
(1) (2)
Input capacitance CLK_IN0 and CLK_IN1 3 pF
IN
15 60 Ω
CDCE906
CC
V
V
V
EEPROM SPECIFICATION
MIN TYP MAX UNIT
EEcyc Programming cycles of EEPROM 100 1000 Cycles
EEret Data retention 10 Years
TIMING REQUIREMENTS
over recommended ranges of supply voltage, load, and operating-free air temperature
MIN NOM MAX UNIT
CLK_IN REQUIREMENTS
f
CLK_IN
tr/ t
f
duty
REF
CLK_IN clock input frequency (LVCMOS or Differential) MHz
Rise and fall time CLK_IN signal (20% to 80%) 4 ns
Duty cycle CLK_IN at V
/ 2 40% 60%
CC
SMBus TIMING REQUIREMENTS (see Figure 11 )
f
SCLK
t
h(START)
t
w(SCLL)
t
w(SCLH)
t
su(START)
t
h(SDATA)
t
su(SDATA)
t
r
t
f
SCLK frequency 100 kHz
START hold time 4 µ s
SCLK low-pulse duration 4.7 µ s
SCLK high-pulse duration 4 50 µ s
START setup time 0.6 µ s
SDATA hold time 0.3 µ s
SDATA setup time 0.25 µ s
SCLK / SDATA input rise time 1000 ns
SCLK / SDATA input fall time 300 ns
PLL mode 1 167
PLL bypass mode 0 167
Copyright © 2005 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): CDCE906
CDCE906
SCAS814H – NOVEMBER 2005 – REVISED DECEMBER 2007
TIMING REQUIREMENTS (continued)
over recommended ranges of supply voltage, load, and operating-free air temperature
MIN NOM MAX UNIT
t
su(STOP)
t
BUS
t
POR
DEVICE CHARACTERISTICS
over recommended operating free-air temperature range and test load (unless otherwise noted), see Figure 1
OVERALL PARAMETER
I
CC
I
CCPD
V
PUC
f
VCO
f
OUT
LVCMOS PARAMETER
V
IK
I
I
I
IH
I
IL
C
I
LVCMOS PARAMETER FOR V
V
OH
V
OL
t
,
PLH
t
PHL
tr0/t
f0
tr1/t
f1
tr2/t
f2
tr3/t
f3
STOP setup time 4 µ s
Bus free time 4.7 µ s
Time in which the device must be operational after power-on reset 500 ms
PARAMETER TEST CONDITIONS MIN TYP
Supply current
(2)
Power down current. Every circuit
powered down except SMBus
All PLLs on, all outputs on,
f
= 80 MHz, f
out
f
= 160 MHz
vco
fIN= 0 MHz, V
CLK_IN
= 3.6 V 50 µ A
CC
= 27 MHz, 90 115 mA
Supply voltage Vccthreshold for
power up control circuit
VCO frequency of internal PLL (any
of three PLLs)
Normal
speed-mode
(3)
High-speed mode
LVCMOS output frequency range
LVCMOS input voltage V
LVCMOS input current (CLK_IN0 /
CLK_IN1)
LVCMOS input current (For S1/S0) VI= VCC, V
LVCMOS input current (For S1/S0) VI= 0 V, V
Input capacitance at CLK_IN0 and VI= 0 V or V
CLK_IN1
ccout
LVCMOS high-level output voltage V
LVCMOS low-level output voltage V
Propagation delay ns
Rise and fall time for output slew
rate 0
Rise and fall time for output slew
rate 1
Rise and fall time for output slew
rate 2
Rise and fall time for output slew
rate 3 (Default Configuration)
(4)
V
= 2.5 V or 3.3 V 167 MHz
CC
= 3 V, II= – 18 mA – 1.2 V
CC
VI= 0 V or VCC, V
= 3.6 V 5 µ A
CC
= 3.6 V -35 -10 µ A
CC
CC
= 3.3-V Mode
V
= 3 V, IOH= – 0.1 mA 2.9
ccout
= 3 V, IOH= – 4 mA 2.4 V
ccout
V
= 3 V, IOH= – 6 mA 2.1
ccout
V
= 3 V, IOL= 0.1 mA 0.1
ccout
= 3 V, IOL= 4 mA 0.5 V
ccout
V
= 3 V, IOL= 6 mA 0.85
ccout
All PLL bypass 9
VCO bypass 11
V
= 3.3 V (20% – 80%) 1.7 3.3 4.8 ns
ccout
V
= 3.3 V (20% – 80%) 1.5 2.5 3.2 ns
ccout
V
= 3.3 V (20% – 80%) 1.2 1.6 2.1 ns
ccout
V
= 3.3 V (20% – 80%) 0.4 0.6 1 ns
ccout
All PLLs 80 200
PLL2 with SSC 80 167 MHz
(3)
= 3.6 V ± 5 µ A
CC
180 300
(1)
MAX UNIT
2.1 V
3 pF
(1) All typical values are at respective nominal VCC.
(2) For calculating total supply current, add the current from Figure 2 , Figure 3 , and Figure 4 . Using high-speed mode of the VCO reduces
the current consumption significantly. See Figure 3
(3) Normal-speed mode or high-speed mode must be selected by the VCO frequency selection bit in Byte 6, Bit [7:5]. The min f
lower but impacts jitter-performance.
(4) The maximum output frequency may be exceeded, but specifications under the Recommended Operating Condition may change and
are no longer assured. Do not exceed the maximum power dissipation of the 20-pin TSSOP package (600 mW at no air flow).
6 Submit Documentation Feedback Copyright © 2005 – 2007, Texas Instruments Incorporated
Product Folder Link(s): CDCE906
can be
VCO
SCAS814H – NOVEMBER 2005 – REVISED DECEMBER 2007
DEVICE CHARACTERISTICS (continued)
over recommended operating free-air temperature range and test load (unless otherwise noted), see Figure 1
PARAMETER TEST CONDITIONS MIN TYP
t
jit(cc)
t
jit(per)
t
sk(o)
Cycle-to-cycle jitter
Peak-to-peak period jitter
Output skew (see
odc Output duty cycle
LVCMOS PARAMETER FOR V
V
OH
V
OL
t
PLH
t
PHL
tr0/t
tr1/t
tr2/t
tr3/t
t
jit(cc)
t
jit(per)
t
sk(o)
LVCMOS high-level output voltage V
LVCMOS low-level output voltage V
,
Propagation delay ns
Rise and fall time for output
f0
slew rate 0
Rise and fall time for output
f1
slew rate 1
Rise and fall time for output
f2
slew rate 2
Rise and fall time for output
f3
slew rate 3 (Default Configuration)
Cycle-to-cycle jitter
Peak-to-peak period jitter
Output skew (see
odc Output duty cycle
(5) (6)
1 PLL, 1 Output f
3 PLLs, 3 Outputs f
(5) (6)
1 PLL, 1 Output f
3 PLLs, 3 Outputs f
(7)
and Table 5 ) 1.6-ns rise/fall time at
(8)
= 2.5-V Mode
ccout
f
= 150 MHz, Pdiv = 3
vco
f
= 100 MHz, Pdiv = 1 45% 55%
vco
(9)
V
= 2.3 V, IOH= 0.1 mA 2.2
ccout
= 2.3 V, IOH= – 3 mA 1.7 V
ccout
V
= 2.3 V, IOH= – 4 mA 1.5
ccout
V
= 2.3 V, IOL= 0.1 mA 0.1
ccout
= 2.3 V, IOL= 3 mA 0.5 V
ccout
V
= 2.3 V, IOL= 4 mA 0.85
ccout
All PLL bypass 9
VCO bypass 11
V
= 2.5 V (20% – 80%) 2 3.9 5.6 ns
ccout
V
= 2.5 V (20% – 80%) 1.8 2.9 4.4 ns
ccout
V
= 2.5 V (20% – 80%) 1.3 2 3.2 ns
ccout
V
= 2.5 V (20% – 80%) 0.4 0.8 1.1 ns
ccout
(10) (11)
1 PLL, 1 Output f
3 PLLs, 3 Outputs f
(10) (11)
1 PLL, 1 Output f
3 PLLs, 3 Outputs f
(12)
and Table 5 ) 250 ps
(13)
2-ns rise/fall time at
f
= 150 MHz, Pdiv = 3
VCO
f
= 100 MHz, Pdiv = 1 45% 55%
VCO
= 24.576 MHz 65 95
OUT
= 24.576 MHz 85 135
OUT
= 24.576 MHz 90 115
OUT
= 24.576 MHz 100 150
OUT
= 24.576 MHz 85 120
OUT
= 24.576 MHz 95 155
OUT
= 24.576 MHz 110 135
OUT
= 24.576 MHz 110 175
OUT
SMBus PARAMETER
V
IK
I
I
V
IH
V
IL
V
OL
C
C
SCLK and SDATA input clamp
voltage
SCLK and SDATA input current VI= 0 V or VCC, V
V
= 3 V, II= – 18 mA – 1.2 V
CC
= 3.6 V ± 5 µ A
CC
SCLK input high voltage 2.1 V
SCLK input low voltage 0.8 V
SDATA low-level output voltage IOL= 4 mA, V
Input capacitance at SCLK VI= 0 V or V
ISCLK
Input capacitance at SDATA VI= 0 V or V
ISDATA
= 3 V 0.4 V
CC
CC
CC
(5) 50000 cycles.
(6) Jitter depends on configuration. Jitter data is for normal tr/tf, input frequency = 27 MHz, f
(7) The t
(8) odc depends on output rise and fall time (tr/tf); above limits are for normal tr/tf.
specification is only valid for equal loading of all outputs.
sk(o)
= 147 MHz output.
VCO
(9) There is a limited drive capability at output supply voltage of 2.5 V. For proper termination, see application report SCAA080 .
(10) 50000 cycles.
(11) Jitter depends on configuration. Jitter data is for normal tr/tf, input frequency = 27 MHz, f
(12) The t
(13) odc depends on output rise and fall time (tr/tf); above limits are for normal tr/tf.
specification is only valid for equal loading of all outputs.
sk(o)
= 147 MHz output.
VCO
(1)
3 10 pF
3 10 pF
CDCE906
MAX UNIT
ps
ps
200 ps
ps
ps
Copyright © 2005 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): CDCE906
Yn
1 kW
1 kW
10 pF
LVCMOS
CDCE906
PLL 1+PLL 2SSC+PLL3
V =3.3V,
Mdiv=1,
Ndiv=2,
P div=1,
VCOnormal-speedmode
CC
PLL 1+PLL 2+PLL3
PLL 1+PLL 2
f -[MHz]
VCO
210
I -[mA]
CC
PLL 1
200 170 160 150 90
90
80
80
0
0
70
70
60
60
50
50
40
40
30
30
20
20
10
10
140 130 120
120
110
110
100
100
190 180
CDCE906
SCAS814H – NOVEMBER 2005 – REVISED DECEMBER 2007
PARAMETER MEASUREMENT INFORMATION
Figure 1. Test Load
Figure 2. ICCvs Number of PLLs and VCO Frequency (VCO at Normal-Speed Mode, Byte 6 Bit [7:5])
TYPICAL CHARACTERISTICS
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Product Folder Link(s): CDCE906
PLL 1+PLL 2SSC+PLL3
V =3.3V,
Mdiv=1,
Ndiv=2,
P div=1,
VCOhigh-speedmode
CC
PLL 1+PLL 2+PLL3
PLL 1+PLL 2
f -[MHz]
VCO
310
I
-[mA]
CC
PLL 1
300 250 190 180
90
80
0
70
60
50
40
30
20
10
170 160 150
120
140
110
130
100
270 260 240 230 200 220 210 290 280
0
5
10
15
20
25
30
35
40
45
50
55
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180
6Outputs
5Outputs
4Outputs
3Outputs
2Outputs
1Outputs
V =3.3V,
Mdiv=1,
Ndiv=2,
P div=1
CC
f -[MHz]
VCO
I -[mA]
CC
TYPICAL CHARACTERISTICS (continued)
CDCE906
SCAS814H – NOVEMBER 2005 – REVISED DECEMBER 2007
Figure 3. ICCvs Number of PLLs and VCO Frequency (VCO at High-Speed Mode, Byte 6 Bit [7:5])
Figure 4. I
vs Number of Outputs and VCO Frequency
CCOUT
Copyright © 2005 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): CDCE906
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
90 100 110 120 130 140 150 160 170 180 190 200 210 220
VOHatV =3.6V
CCOUT
VOHatV =2.3V
CCOUT
VOLatV =3.6V
CCOUT
VOLatV =2.3V
CCOUT
f -[MHz]
OUT
VOUT-[V]
V =3.3V,
Mdiv=4,
Ndiv=15,
P div=1
CC
CDCE906
SCAS814H – NOVEMBER 2005 – REVISED DECEMBER 2007
TYPICAL CHARACTERISTICS (continued)
Figure 5. Output Swing vs Output Frequency
10 Submit Documentation Feedback Copyright © 2005 – 2007, Texas Instruments Incorporated
Product Folder Link(s): CDCE906
CDCE906
SCAS814H – NOVEMBER 2005 – REVISED DECEMBER 2007
APPLICATION INFORMATION
SMBus Data Interface
To enhance the flexibility and function of the clock synthesizer, a two-signal serial interface is provided. It follows
the SMBus specification Version 2.0, which is based upon the principals of operation of I2C. More details of the
SMBus specification can be found at http://www.smbus.org .
Through the SMBus, various device functions, such as individual clock output buffers, can be individually
enabled or disabled. The registers associated with the SMBus data interface initialize to their default setting upon
power-up, and therefore using this interface is optional. The clock device register changes are normally made
upon system initialization, if any are required.
Data Protocol
The clock driver serial protocol accepts Byte Write, Byte Read, Block Write, and Block Read operations from the
controller.
For Block Write/Read operations, the bytes must be accessed in sequential order from lowest to highest byte
(most significant bit first) with the ability to stop after any complete byte has been transferred. For Byte Write and
Byte Read operations, the system controller can access individually addressed bytes.
Once a byte has been sent, it will be written into the internal register and effective immediately. With the rising
edge of the ACK bit, this applies to each transferred byte, independent of whether this is a Byte Write or a Block
Write sequence.
If the EEPROM write cycle is initiated, the data of the internal SMBus register is written into the EEPROM.
During EEPROM write, no data is allowed to be sent to the device via the SMBus until the programming
sequence is completed. Data, however, can be readout during the programming sequence (byte read or block
read). The programming status can be monitored by EEPIP, byte 24 bit 7.
The offset of the indexed byte is encoded in the command code, as described in Table 1 .
The Block Write and Block Read protocol is outlined in Figure 9 and Figure 10 , while Figure 7 and Figure 8
outlines the corresponding Byte Write and Byte Read protocol.
Slave Receiver Address (7 bits)
A6 A5 A4 A3 A2 A1* A0* R/W
1 1 0 1 0 0 1 0
* Address bits A0 and A1 are programmable by the Configuration Inputs S0 and S1 (Byte 10 Bit [1:0] and Bit [3:2]. This allows addressing up
to four devices connected to the same SMBus.
Table 1. Command Code Definition
Bit Description
7
(6:0) Byte Offset for Read and Write operation.
0 = Block Read or Block Write operation
1 = Byte Read or Byte Write operation
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1 7 1 1 8 1 1
S Slave Address Wr A Data Byte A P
S Start Condition
Sr
Reapeated Start Condition
Rd
Read (Bit Value = 1)
Wr
Write (Bit Value = 0)
A Acknowledge (ACK = 0 and NACK = 1)
P Stop Condition
PE Packet Error
Master to Slave Transmission
Slave to Master Transmission
CDCE906
SCAS814H – NOVEMBER 2005 – REVISED DECEMBER 2007
Figure 6. Generic Programming Sequence
Byte Write Programming Sequence
1 7 1 1 8 1 8 1 1
S Slave Address Wr A CommandCode A Data Byte A P
Figure 7. Byte Write Protocol
Byte Read Programming Sequence
1 7 1 1 8 1 1 7 1 1
S Slave Address Wr A CommandCode A S Slave Address Rd A
8 1 1
Data Byte A P
Figure 8. Byte Read Protocol
Block Write Programming Sequence
1 7 1 1 8 1 8 1
S Slave Address Wr A CommandCode A Byte Count N A
8 1 8 1 8 1 1
Data Byte 0 A Data Byte 1 A - - - - - Data Byte N – 1 A P
(1)
Data Byte 0 is reserved for revision code and vendor identification. However, this byte is used for internal test. Do not write into it other
than 0000 0001.
(1)
Figure 9. Block Write Protocol
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P S P
SCLK
SDATA
A
Bit 7 (MSB)
Bit 6 Bit 0 (LSB)
t
h(SDATA)
t
su(SDATA)
t
su(START)
t
(BUS)
t
h(START)
t
r(SM)
t
r(SM)
t
f(SM)
t
f(SM)
t
W(SCLH)
t
W(SCLL)
t
su(STOP)
V
IH(SM)
V
IL(SM)
V
IH(SM)
V
IL(SM)
9
10
SDATA
SCLK
SMB Host
CDCE906
C
BUS
C
BUS
R
P
R
P
SCAS814H – NOVEMBER 2005 – REVISED DECEMBER 2007
Block Read Programming Sequence
1 7 1 1 8 1 1 7 1 1
S Slave Address Wr A CommandCode A Sr Slave Address Rd A
8 1 8 1 8 1 1
Byte Count N A Data Byte 0 A - - - - - Data Byte N – 1 A P
Figure 10. Block Read Protocol
CDCE906
Figure 11. Timing Diagram Serial Control Interface
SMBus Hardware Interface
The following diagram shows how the CDCE906 clock synthesizer is connected to the SMBus. Note that the
current through the pullup resistors (R
CDCE906 is not connected to the SMBus, then SDATA and SCLK inputs have to be connected with 10-k Ω
pullup resistors to V
to avoid floating input conditions.
CC
) must meet the SMBus specifications (min 100 µ A, max 350 µ A). If the
p
Figure 12. SMBus Hardware Interface
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