The CDC921 is a clock synthesizer/driver that generates CPU, CPU_DIV2, 3V66, PCI, APIC, 48MHz, and REF
system clock signals to support computer systems with a single Pentium III class microprocessor.
All output frequencies are generated from a 14.318-MHz crystal input. Instead of a crystal, a reference clock
input can be provided at the XIN input. Two phase-locked loops (PLLs) are used to generate the host
frequencies and the 48-MHz clock frequency . On-chip loop filters and internal feedback eliminate the need for
external components.
The host and PCI clock outputs provide low-skew and low-jitter clock signals for reliable clock operation. All
outputs have 3-state capability, which can be selected via control inputs SEL0, SEL1, and SEL133/100
The 48MHz clock can be independently disabled via the control inputs SEL0, SEL1, and SEL133/100
state, the 48-MHz PLL is disabled and the 48MHz clock is driven to high impedance to reduce component jitter.
The outputs are either 3.3-V or 2.5-V single-ended CMOS buffers. With a logic high-level on the PWR_DWN
terminal, the device operates normally, but when a logical low-level input is applied, the device powers down
completely with the outputs in a low-level output state.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Intel and Pentium III are trademarks of Intel Corporation.
Direct Rambus and Rambus are trademarks of Rambus Inc.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 1999, Texas Instruments Incorporated
.
. In this
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
CDC921
133-MHz CLOCK SYNTHESIZER/DRIVER FOR PC MOTHERBOARDS
WITH 3-STATE OUTPUTS
SCAS623 –MA Y 27, 1999
description (continued)
The CPU bus can operate at 100 MHz or 133 MHz. Output frequency selection is done with corresponding
setting for SEL133/100
Since the CDC921 is based on PLL circuitry, it requires a stabilization time to achieve phase lock of the PLL.
This stabilization time is required after power up or after changes to the SEL inputs are made. With use of an
external reference clock, this signal must be fixed-frequency and fixed-phase before the stabilization time starts.
Ground for PCI, 3V66, 48MHz, CPU, CPU_DIV2, APIC, REF [0–1] outputs and CORE
Power for the REF, PCI, 3V66, 48MHz outputs and CORE
CDC921
SCAS623 –MA Y 27, 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
CDC921
133-MHz CLOCK SYNTHESIZER/DRIVER FOR PC MOTHERBOARDS
WITH 3-STATE OUTPUTS
SCAS623 –MA Y 27, 1999
spread spectrum clock (SSC) implementation for CDC921
Simultaneously switching at fixed frequency generates a significant power peak at the selected frequency,
which in turn will cause EMI disturbance to the environment. The purpose of the internal frequency modulation
of the CPU–PLL allows to distribute the energy to many different frequencies which reduces the power peak.
A typical characteristic for a single frequency spectrum and a frequency modulated spectrum is shown in
Figure 1.
Highest Peak
SSC
δ of f
nom
∆
Non-SSC
f
nom
Figure 1. Frequency Power Spectrum With and Without the Use of SSC
The modulated spectrum has its distribution left hand to the single frequency spectrum which indicates a
“down-spread modulation”.
The peak reduction depends on the modulation scheme and modulation profile. System performance and timing
requirements are the limiting factors for actual design implementations. The implementation was driven to keep
the average clock frequency closed to its upper specification limit. The modulation amount was set to
approximately –0.5%.
In order to allow a downstream PLL to follow the frequency modulated signal, the bandwidth of the modulation
signal is limited in order to minimize SSC induced tracking skew jitter. The ideal modulation profile used for
CDC921 is shown in Figure 2.
10.03
10.02
10.01
10
9.99
9.98
9.97
Period of Output Frequency – ns
51015202530354045
Period of Modulation Signal – µs
Figure 2. SSC Modulation Profile
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
functional block diagram
CDC921
133-MHz CLOCK SYNTHESIZER/DRIVER FOR PC MOTHERBOARDS
WITH 3-STATE OUTPUTS
SCAS623 –MA Y 27, 1999
SEL133/100
SEL0
SEL1
XIN
XOUT
SPREAD
25
29
30
4
5
31
Control
Xtal
Oscillator
Logic
Spread
Logic
3-State
48-MHz Inactive
Test
SEL 133/100
CPU
PLL
48 MHz
PLL
/2/2
/3
/4
/3
/4
2*REF
14.318 MHz
(1,2)
1*48MHz
48 MHz
(27)
3*CPU
100/133 MHz
(36,37,40)
1*CPU_DIV2
50/66 MHz
(43)
10*PCI
33 MHz
(7,8,10,11,12,
13,15,16,18,19)
/2
Sync Logic & Power Down Logic
1*APIC
16.67 MHz
(46)
3*AGP (3V66)
66 MHz
(21,22,23)
PWR_DWN
32
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
CDC921
†
PACKAGE
A
A
A
Suppl
oltage, V
V
High-level output current, I
mA
Low-level output current, I
mA
133-MHz CLOCK SYNTHESIZER/DRIVER FOR PC MOTHERBOARDS
WITH 3-STATE OUTPUTS
SCAS623 –MA Y 27, 1999
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Input voltage range, V
Voltage range applied to any output in the high-impedance state or power-off state,
Current into any output in the low state, I
Input clamp current, I
Output clamp current, I
Operating free-air temperature range, T
Storage temperature range, T
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
DL1315.7 mW10.53 mW/°C842.1 mW684.2 mW
†
This is the inverse of the traditional junction-to-case thermal resistance (R
at 95°C/W.
Reference frequency, f
Crystal frequency, f
Operating free-air temperature, T
NOTE 2: Unused inputs must be held high or low to prevent them from floating.
†
All nominal values are measured at their respective nominal VDD values.
‡
Reference frequency is a test clock driven on the XIN input during the device test mode and normal mode. In test mode, XIN can be driven
externally up to f
§
This is a series fundamental crystal with fO = 14.31818 MHz.
p
p
DD
IH
IL
I
OH
OL
‡
(XTAL)
§
(XTAL)
A
= 130 MHz. If XIN is driven externally, XOUT is floating.
(XTAL)
3.3 V3.1353.465
2.5 V2.3752.625
2
GND –
0.3 V
0V
CPUx, CPU_DIV2–12
APIC–12
48MHz, REFx–14
PCIx, PCI_F, 3V66x–18
CPUx, CPU_DIV212
APIC12
48MHz, REFx9
PCIx, PCI_F, 3V66x12
Test mode130MHz
Normal mode13.814.31814.8MHz
085°C
†
VDD +
MAXUNIT
0.3 V
0.8V
DD
V
V
†
OL
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IH
g
IL
IDDSupply current
I
gy
mA
Dynamic I
L
mA
CDC921
133-MHz CLOCK SYNTHESIZER/DRIVER FOR PC MOTHERBOARDS
WITH 3-STATE OUTPUTS
SCAS623 –MA Y 27, 1999
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETERTEST CONDITIONSMIN TYP†MAXUNIT
V
R
I
I
I
OZ
DD(Z)
C
†
All typical values are measured at their respective nominal VDD values.
switching characteristics, VDD = 3.135 V to 3.465 V, TA = 0°C to 85°C
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Overshoot/undershootGND – 0.7 VVDD + 0.7 VV
Ring backVIL – 0.1 VVIH + 0.1 VV
Stabilization time, PWR_DWN to PCIxf
t
Disable time, PWR_DWN to PCIxf
dis3
Stabilization time, PWR_DWN to CPUx f
t
Disable time, PWR_DWN to CPUxf
dis4
†
Stabilization time is the time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal. In order for
phase lock to be obtained, a fixed-frequency, fixed-phase reference signal must be present at X1. Until phase lock is obtained, the specifications
for propagation delay and skew parameters given in the switching characteristics tables are not applicable. Stabilization time is defined as the
time from when VDD achieves its nominal operating level until the output frequency is stable and operating within specification.
= 133 MHz0.053ms
(CPU)
= 133 MHz50ns
(CPU)
= 133 MHz0.033ms
(CPU)
= 133 MHz50ns
(CPU)
After SEL1, SEL03
After power up3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
9
CDC921
t
CPU clock
d
†
tw1Pulse duration width, high
ns
tw2Pulse duration width, lo
ns
tcCPU_DIV2 clock period
†
tw1Pulse duration width, high
ns
tw2Pulse duration width, lo
ns
133-MHz CLOCK SYNTHESIZER/DRIVER FOR PC MOTHERBOARDS
WITH 3-STATE OUTPUTS
SCAS623 –MA Y 27, 1999
switching characteristics, VDD = 2.375 V to 2.625 V, TA = 0°C to 85°C (continued)
CPUx
PARAMETER
t
Output enable timeSEL133/100 CPUxf
en1
t
Output disable timeSEL133/100 CPUxf
dis1
c
Cycle to cycle jitterf
Duty cyclef
t
CPU bus skewCPUxCPUxf
sk(o)
t
CPU pulse skewCPUnCPUnf
sk(p)
t
CPU clock to APIC clock offset, rising edge1.52.84ns
(off)
t
CPU clock to 3V66 clock offset, rising edge00.751.5ns
(off)
t
Rise timeVO = 0.4 V to 2.0 V0.41.52.2ns
r
t
Fall timeVO = 0.4 V to 2.0 V0.41.42ns
f
†
The average over any 1-µs period of time is greater than the minimum specified period.
perio
w
FROM
(INPUT)TO(OUTPUT)
TEST CONDITIONSMINTYPMAXUNIT
= 100 or 133MHz610ns
(CPU)
= 100 or 133MHz810ns
(CPU)
f
= 100 MHz10 10.0410.2ns
(CPU)
f
= 133 MHz7.57.537.7ns
(CPU)
= 100 or 133MHz250ps
(CPU)
= 100 or 133MHz4555%
(CPU)
= 100 or 133MHz50175ps
(CPU)
= 100 or 133MHz2.2ns
(CPU)
f
= 100 MHz2.64.3
(CPU)
f
= 133 MHz1.43.7
(CPU)
f
= 100 MHz2.84.3
(CPU)
f
(CPU)
= 133 MHz
1.74
CPU_DIV2
PARAMETER
t
Output enable timeSEL133/100 CPU_DIV2f
en1
t
Output disable timeSEL133/100 CPU_DIV2f
dis1
p
Cycle to cycle jitterf
Duty cyclef
t
CPU_DIV2 pulse skewf
sk(p)
w
t
Rise timeVO = 0.4 V to 2.0 V0.41.42ns
r
t
Fall timeVO = 0.4 V to 2.0 V0.41.31.8ns
f
†
The average over any 1-µs period of time is greater than the minimum specified period.
FROM
(INPUT)TO(OUTPUT)
TEST CONDITIONSMINTYPMAXUNIT
(CPU)
(CPU)
f
(CPU)
f
(CPU)
(CPU)
(CPU)
(CPU)
f
(CPU)
f
(CPU)
f
(CPU)
f
(CPU)
= 100 or 133MHz610ns
= 100 or 133MHz810ns
= 100 MHz20 20.0820.4ns
= 133 MHz15 15.0615.3ns
= 100 or 133MHz250ps
= 100 or 133MHz4555%
= 100 or 133MHz1.6ns
= 100 MHz7.1
= 133 MHz4.7
= 100 MHz7.38.9
= 133 MHz
56.6
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
133-MHz CLOCK SYNTHESIZER/DRIVER FOR PC MOTHERBOARDS
WITH 3-STATE OUTPUTS
switching characteristics, VDD = 2.375 V to 2.625 V, TA = 0°C to 85°C (continued)
APIC
PARAMETER
t
en1
t
dis1
t
c
t
sk(p)
t
(off)
t
w1
t
w2
t
r
t
f
†
The average over any 1-µs period of time is greater than the minimum specified period.
Output enable timeSEL133/100 APICf
Output disable timeSEL133/100 APICf
APIC clock period
Cycle to cycle jitterf
Duty cyclef
APIC pulse skewf
APIC clock to CPU clock offset,
rising edge
Pulse duration width, highf
Pulse duration width, lowf
Rise timeVO = 0.4 V to 2 V0.41.62.1ns
Fall timeVO = 0.4 V to 2 V0.41.21.7ns
†
FROM
(INPUT)TO(OUTPUT)
APICCPUx–1.5–4ns
TEST CONDITIONSMINTYPMAXUNIT
= 16.67 MHz610ns
(APIC)
= 16.67 MHz810ns
(APIC)
f
= 16.67 MHz60 60.2460.6ns
(APIC)
= 100 or 133 MHz400ps
(CPU)
= 16.67 MHz4555%
(APIC)
= 16.67 MHz3ns
(APIC)
= 16.67 MHz25.528ns
(APIC)
= 16.67 MHz25.329.2ns
(APIC)
CDC921
SCAS623 –MA Y 27, 1999
switching characteristics, VDD = 3.135 V to 3.465 V, TA = 0°C to 85°C
3V66
PARAMETER
t
en1
t
dis1
t
c
t
sk(o)
t
sk(p)
t
(off)
t
(off)
t
w1
t
w2
t
r
t
f
†
The average over any 1-µs period of time is greater than the minimum specified period.
Output enable timeSEL133/100 3V66xf
Output disable timeSEL133/100 3V66xf
3V66 clock period
Cycle to cycle jitterf
Duty cyclef
3V66 bus skew3V66x3V66xf
3V66 pulse skew3V66n3V66nf
3V66 clock to CPU clock offset3V66xCPUx0 –0.75–1.5ns
3V66 clock to PCI clock offset, rising edge1.22.13ns
Pulse duration width, highf
Pulse duration width, lowf
Rise timeVO = 0.4 V to 2 V0.51.52ns
Fall timeVO = 0.4 V to 2 V0.51.52ns
†
FROM
(INPUT)TO(OUTPUT)
TEST CONDITIONSMINTYPMAXUNIT
= 66 MHz610ns
(3V66)
= 66 MHz810ns
(3V66)
f
= 66 MHz15 15.0615.3ns
(3V66)
= 100 or 133 MHz400ps
(CPU)
= 66 MHz4555%
(3V66)
= 66 MHz50150ps
(3V66)
= 66 MHz2.6ns
(3V66)
= 66 MHz5.2ns
(3V66)
= 66 MHz5ns
(3V66)
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
11
CDC921
133-MHz CLOCK SYNTHESIZER/DRIVER FOR PC MOTHERBOARDS
WITH 3-STATE OUTPUTS
SCAS623 –MA Y 27, 1999
switching characteristics, VDD = 3.135 V to 3.465 V, TA = 0°C to 85°C (continued)
48MHz
PARAMETER
t
en1
t
dis1
t
c
t
sk(p)
t
w1
t
w2
t
r
t
f
†
The average over any 1-µs period of time is greater than the minimum specified period.
Output enable timeSEL133/100 48MHzf
Output disable timeSEL133/100 48MHzf
48MHz clock period
Cycle to cycle jitterf
Duty cyclef
48MHz pulse skew48MHz48MHzf
Pulse duration width, highf
Pulse duration width, lowf
Rise timeVO = 0.4 V to 2 V12.12.8ns
Fall timeVO = 0.4 V to 2 V11.92.8ns
†
REF
PARAMETER
t
en1
t
dis1
t
c
t
sk(o)
t
sk(p)
t
w1
t
w2
t
r
t
f
†
The average over any 1-µs period of time is greater than the minimum specified period.
Output enable timeSEL133/100 REFxf
Output disable timeSEL133/100 REFxf
REF clock period
Cycle to cycle jitterf
Duty cyclef
REF bus skewREFxREFxf
REF pulse skewREFnREFnf
Pulse duration width, highf
Pulse duration width, lowf
Rise timeVO = 0.4 V to 2 V122.8ns
Fall timeVO = 0.4 V to 2 V11.92.8ns
133-MHz CLOCK SYNTHESIZER/DRIVER FOR PC MOTHERBOARDS
WITH 3-STATE OUTPUTS
SCAS623 –MA Y 27, 1999
PARAMETER MEASUREMENT INFORMATION
V
CPUx or PCIx Clock
t
c
T_REF
CPUx or PCIx Clock
3V66 or CPUx
3V66, PCIx, or APIC
CPU
(internal)
t
sk(p)
+Ťt
PLH–tPHL
t
sk(o)
t
[3V66 to PCIx]
(off)
t
[CPUx to APIC]
(off)
t
[CPUx to 3V66]
(off)
Ť
t
(low)
t
(high)
Duty Cycle
t
(low)
+
t
c
Figure 4. Waveforms for Calculation of Skew, Offset, and Jitter
100
V
T_REF
VT_REF
VT_REF
PCI
(internal)
PWR_DWN
CPU
(external)
PCI
(external)
VCO
CRYSTAL
NOTE A: Shaded sections on the VCO and Crystal waveforms indicate that the VCO and crystal oscillators are active and there is a valid clock.
Figure 5. Power-Down Timing
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
15
CDC921
133-MHz CLOCK SYNTHESIZER/DRIVER FOR PC MOTHERBOARDS
WITH 3-STATE OUTPUTS
SCAS623 –MA Y 27, 1999
MECHANICAL DATA
DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
48-PIN SHOWN
0.025 (0,635)
48
1
0.110 (2,79) MAX
0.012 (0,305)
0.008 (0,203)
25
0.299 (7,59)
0.291 (7,39)
24
A
0.008 (0,20) MIN
0.005 (0,13)
0.420 (10,67)
0.395 (10,03)
Seating Plane
0.004 (0,10)
M
0.006 (0,15) NOM
Gage Plane
0.010 (0,25)
0°–8°
0.040 (1,02)
0.020 (0,51)
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
0.380
(9,65)
0.370
(9,40)
4828
0.630
(16,00)
0.620
(15,75)
56
0.730
(18,54)
0.720
(18,29)
4040048/D 08/97
16
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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