Phase-Lock Loop Clock Distribution for
Synchronous DRAM Applications
D
Distributes One Clock Input to One Bank of
Five and One Bank of Four Outputs
D
Separate Output Enable for Each Output
Bank
D
External Feedback (FBIN) Pin Is Used to
Synchronize the Outputs to the Clock Input
D
No External RC Network Required
D
Operates at 3.3-V V
D
Packaged in Plastic 24-Pin Thin Shrink
CC
Small-Outline Package
description
FBOUT
The CDC509 is a high-performance, low-skew, low-jitter, phase-lock loop (PLL) clock driver. It uses a PLL to
precisely align, in both frequency and phase, the feedback (FBOUT) output to the clock (CLK) input signal. It
is specifically designed for use with synchronous DRAMs. The CDC509 operates at 3.3-V VCC and is designed
to drive up to five clock loads per output.
One bank of five outputs and one bank of four outputs provide nine low-skew , low-jitter copies of CLK. Output
signal duty cycles are adjusted to 50 percent, independent of the duty cycle at CLK. Each bank of outputs can
be enabled or disabled separately via the control (1G and 2G) inputs. When the G inputs are high, the outputs
switch in phase and frequency with CLK; when the G inputs are low, the outputs are disabled to the logic-low
state.
Unlike many products containing PLLs, the CDC509 does not require external RC networks. The loop filter for
the PLL is included on-chip, minimizing component count, board space, and cost.
Because it is based on PLL circuitry, the CDC509 requires a stabilization time to achieve phase lock of the
feedback signal to the reference signal. This stabilization time is required, following power up and application
of a fixed-frequency, fixed-phase signal at CLK, as well as following any changes to the PLL reference or
feedback signals. The PLL can be bypassed for test purposes by strapping AV
to ground.
CC
The CDC509 is characterized for operation from 0°C to 70°C.
FUNCTION TABLE
INPUTS
1G2GCLK
XXLLLL
LLHLLH
LHHLHH
HLHHLH
HHHHHH
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
OUTPUTS
1Y
(0:4)2Y(0:3)
FBOUT
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1998, Texas Instruments Incorporated
1
CDC509
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS576B – JULY 1996 – REVISED JANUAR Y 1998
functional block diagram
11
1G
14
2G
21
3
1Y0
4
1Y1
5
1Y2
8
1Y3
9
1Y4
2Y0
CLK
FBIN
AV
CC
24
13
23
PLL
AVAILABLE OPTIONS
PACKAGE
T
A
0°C to 70°CCDC509PWR
SMALL OUTLINE
(PW)
20
17
16
12
2Y1
2Y2
2Y3
FBOUT
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPE
DESCRIPTION
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS576B – JULY 1996 – REVISED JANUAR Y 1998
Terminal Functions
TERMINAL
NAMENO.
Clock input. CLK provides the clock signal to be distributed by the CDC509 clock driver. CLK is used
to provide the reference signal to the integrated PLL that generates the clock output signals. CLK must
CLK24I
FBIN13I
1G11I
2G14I
FBOUT12O
1Y(0:4)3, 4, 5, 8, 9O
2Y(0:3)16, 17, 20 21O
AV
CC
AGND1GroundAnalog ground. AGND provides the ground reference for the analog circuitry.
V
CC
GND6, 7, 18, 19GroundGround
23Power
2, 10, 15, 22PowerPower supply
have a fixed frequency and fixed phase for the PLL to obtain phase lock. Once the circuit is powered
up and a valid CLK signal is applied, a stabilization time is required for the PLL to phase lock the
feedback signal to its reference signal.
Feedback input. FBIN provides the feedback signal to the internal PLL. FBIN must be hard-wired to
FBOUT to complete the PLL. The integrated PLL synchronizes CLK and FBIN so that there is
nominally zero phase error between CLK and FBIN.
Output bank enable. 1G is the output enable for outputs 1Y(0:4). When 1G is low, outputs 1Y(0:4) are
disabled to a logic-low state. When 1G is high, all outputs 1Y(0:4) are enabled and switch at the same
frequency as CLK.
Output bank enable. 2G is the output enable for outputs 2Y(0:3). When 2G is low, outputs 2Y(0:3) are
disabled to a logic low state. When 2G is high, all outputs 2Y(0:3) are enabled and switch at the same
frequency as CLK.
Feedback output. FBOUT is dedicated for external feedback. It switches at the same frequency as
CLK. When externally wired to FBIN, FBOUT completes the feedback loop of the PLL.
Clock outputs. These outputs provide low-skew copies of CLK. Output bank 1Y(0:4) is enabled via
the 1G input. These outputs can be disabled to a logic-low state by deasserting the 1G control input.
Clock outputs. These outputs provide low-skew copies of CLK. Output bank 2Y(0:3) is enabled via
the 2G input. These outputs can be disabled to a logic-low state by deasserting the 2G control input.
Analog power supply. A VCC provides the power reference for the analog circuitry. In addition, A V
can be used to bypass the PLL for test purposes. When AVCC is strapped to ground, PLL is bypassed
and CLK is buffered directly to the device outputs.
CDC509
CC
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Input voltage range, V
Voltage range applied to any output in the high
or low state, VO (see Notes 1 and 2) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, I
Output clamp current, I
Continuous output current, I
Maximum power dissipation at TA = 55°C (in still air) (see Note 3)0.7 W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This value is limited to 4.6 V maximum.
3. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils.
For more information, refer to the
II = –18 mA3 V–1.2V
IOH = –100 µAMIN to MAX VCC–0.2
IOH = –20 mA3 V2.4
IOL = 100 µAMIN to MAX0.2
IOL = 20 mA3 V0.55
VI = VCC or GND3.6 V±5µA
VI = VCC or GND,IO = 0, Outptus high or low3.6 V10µA
One input at VCC – 0.6 V,Other inputs at VCC or GND3.3 V to 3.6 V500µA
VI = VCC or GND3.3 V4pF
VO = VCC or GND3.3 V6pF
CC
MINTYP†MAXUNIT
CC
V
timing requirements over recommended ranges of supply voltage and operating free-air
temperature
MINMAXUNIT
f
clock
§
Time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal. For phase lock to be obtained, a
fixed-frequency , fixed-phase reference signal must be present at CLK. Until phase lock is obtained, the specifications for propagation delay, skew ,
and jitter parameters given in the switching characteristics table are not applicable.
Clock frequency25125MHz
Input clock duty cycle40%60%
Stabilization time
§
1ms
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
(INPUT)
(OUTPUT)
yy,
CDC509
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS576B – JULY 1996 – REVISED JANUAR Y 1998
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, C
PARAMETER
t
phase error
t
phase error
Duty cycle, reference
†
This parameters are not production tested.
‡
The t
NOTES: 5. The specifications for parameters in this table are applicable only after any appropriate stabilization time has elapsed.
, reference
(see Figure 3)
(see Note 6)
t
sk(o)
Jitter
(pk-pk)
(see Figure 4)
t
r
t
f
specification is only valid for equal loading of all outputs.
sk(o)
6. Phase error does not include jitter. The total phase error is 120 ps to 580 ps for the 5% VCC range.
= 30 pF (see Note 5 and Figures 1 and 2)
L
, – jitter,
‡
FROM
66 MHz < CLKIN↑ < 100
MHz
CLKIN↑ = 100 MHzFBIN↑220480340ps
Any Y or FBOUTAny Y or FBOUT200ps
F(clkin > 66 MHz)Any Y or FBOUT–100100ps
F(clkin ≤ 66 MHz)Any Y or FBOUT45%55%
F(clkin > 66 MHz)Any Y or FBOUT43%57%
TO
FBIN↑100...480ps
Any Y or FBOUT1.11.50.71.6ns
Any Y or FBOUT0.81.30.51.5ns
†
VCC = 3.3 V
± 0.165 V
MINTYPMAXMINTYPMAX
VCC = 3.3 V
± 0.3 V
UNIT
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
500
30 pF
LOAD CIRCUIT FOR OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 100 MHz, ZO = 50 Ω, tr ≤ 1.2 ns, tf≤ 1.2 ns.
C. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
3 V
Input
t
W
Output
50% V
CC
pd
2 V
0.4 V
t
r
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
50% V
CC
0 V
V
2 V
0.4 V
t
f
OH
V
OL
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
CDC509
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS576B – JULY 1996 – REVISED JANUAR Y 1998
PARAMETER MEASUREMENT INFORMATION
CLKIN
FBIN
t
phase error
FBOUT
Any Y
Any Y
Any Y
t
sk(o)
t
sk(o)
Figure 2. Phase Error and Skew Calculations
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CDC509
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS576B – JULY 1996 – REVISED JANUAR Y 1998
TYPICAL CHARACTERISTICS
1.2
VDD = 3.3 V
TA = 25°C
1
0.8
0.6
0.4
Phase Error – ns
0.2
0
–0.2
35
45 556595 105
PHASE ERROR
vs
CLOCK FREQUENCY
85
75115 125 135
f
– Clock Frequency – MHz
clk
Figure 3
9
8
Output Duty Cycle
ANALOG SUPPLY CURRENT
vs
CLOCK FREQUENCY
VDD = 3.3 V
TA = 25°C
OUTPUT DUTY CYCLE
vs
CLOCK FREQUENCY
57%
VDD = 3.3 V
55%
53%
51%
49%
47%
45%
43%
CL = 30 pF
30507090130110
f
– Clock Frequency – MHz
clk
Figure 4
7
6
5
4
3
2
Analog Supply Current – mA
1
0
35
25
45 556595 105
f
– Clock Frequency – MHz
clk
Figure 5
85
75115 125
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
7
CDC509
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS576B – JULY 1996 – REVISED JANUAR Y 1998
MECHANICAL INFORMATION
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PIN SHOWN
0,65
14
1
1,20 MAX
A
7
0,05 MIN
0,30
0,19
8
6,60
4,50
4,30
6,20
M
0,10
Seating Plane
0,10
0,15 NOM
Gage Plane
0,25
0°–8°
0,75
0,50
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
8
3,10
2,90
14
5,10
4,90
16
5,10
20
6,60
6,404,90
24
7,90
7,70
28
9,80
9,60
4040064/E 08/96
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOL VE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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