High-Speed, Low-Skew 1-to-18 Clock Buffer
for Synchronous DRAM (SDRAM) Clock
DL PACKAGE
(TOP VIEW)
Buffering Applications
1
48
D
Output Skew, t
D
Pulse Skew, t
D
Supports up to Four Unbuffered SDRAM
, Less Than 250 ps
sk(o)
, Less Than 500 ps
sk(p)
Dual Inline Memory Modules (DIMMs)
D
I2C Serial Interface Provides Individual
Enable Control for Each Output
D
Operates at 3.3 V
D
Distributed VCC and Ground Pins Reduce
Switching Noise
D
100-MHz Operation
D
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015
D
Packaged in 48-Pin Shrink Small Outline
(DL) Package
description
The CDC318A is a high-performance clock buffer
designed to distribute high-speed clocks in PC
applications. This device distributes one input (A)
to 18 outputs (Y) with minimum skew for clock
distribution. The CDC318A operates from a 3.3-V
power supply. It is characterized for operation
from 0°C to 70°C.
This device has been designed with consideration
for optimized EMI performance. Depending on the
application layout, damping resistors in series to
the clock outputs (like proposed in the PC100
specification) may not be needed in most cases.
The device provides a standard mode (100K-bits/s) I
is as a slave/receiver. The device address is specified in the I
2
C serial interface for device control. The implementation
2
C device address table. Both of the I2C inputs
(SDATA and SCLOCK) are 5-V tolerant and provide integrated pullup resistors (typically 140 kΩ).
Three 8-bit I
2
C registers provide individual enable control for each of the outputs. All outputs default to enabled
at powerup. Each output can be placed in a disabled mode with a low-level output when a low-level control bit
is written to the control register. The registers are write only and must be accessed in sequential order (i.e.,
random access of the registers is not supported).
The CDC318A provides 3-state outputs for testing and debugging purposes. The outputs can be placed in a
high-impedance state via the output-enable (OE) input. When OE is high, all outputs are in the operational state.
When OE is low, the outputs are placed in a high-impedance state. OE provides an integrated pullup resistor.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Intel is a trademark of Intel Corporation
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1998, Texas Instruments Incorporated
1
CDC318A
1-LINE TO 18-LINE CLOCK DRIVER
WITH I
SCAS614 – SEPTEMBER 1998
logic diagram (positive logic)
2
C CONTROL INTERFACE
INPUTS
OEA1Y0–1Y32Y0–2Y33Y0–3Y34Y0–4Y35Y0–5Y1
LXHi-ZHi-ZHi-ZHi-ZHi-Z
HLLLLLL
HHH
†
The function table assumes that all outputs are enabled via the appropriate I2C configuration register bit. If the output is disabled
via the appropriate configuration bit, then the output is driven to a low state, regardless of the state of the A input.
When the value of the bit is high, the output is enabled.
When the value of the bit is low, the output is forced to a
low state. The default value of all bits is high.
When the value of the bit is high, the output is enabled.
When the value of the bit is low, the output is forced to a
low state. The default value of all bits is high.
When the value of the bit is high, the output is enabled.
When the value of the bit is low, the output is forced to a
low state. The default value of all bits is high.
DEFINITIONDEFAULT VALUE
I2C BYTE 2-BIT DEFINITION
DEFINITIONDEFAULT VALUE
†
†
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CDC318A
1-LINE TO 18-LINE CLOCK DRIVER
WITH I
2
C CONTROL INTERFACE
SCAS614 – SEPTEMBER 1998
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Input voltage range, V
Input voltage range, V
Output voltage range, V
Voltage range applied to any output in the high or power-off state, V
Current into any output in the low state (except SDATA), I
Current into SDATA in the low state, I
Input clamp current, I
Output clamp current, I
Package thermal impedance, θ
Storage temperature range, T
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds260_C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51, except for through-hole packages,
which use a trace length of zero. The absolute maximum power dissipation allowed at TA = 55°C (in still air) is 1.2 W.
3. Thermal impedance (ΘJA) can be considerably lower if the device is soldered on the PCB board with a copper layer underneath the
package. A simulation on a PCB board (3 in. × 3 in.) with two internal copper planes (1 oz. cu, 0.036 mm thick) and 0.071 mm cu
(202) in area underneath the package, resulted in ΘJA = 60°C/W. This would allow 1.2 W total power dissipation at TA = 70°C.
Bus free time4.7µs
STAR T setup time4.7µs
STAR T hold time4µs
SCLOCK low pulse duration4.7µs
SCLOCK high pulse duration4µs
SDATA input rise time1000ns
SDATA input fall time300ns
SDATA setup time250ns
SDATA hold time20ns
STOP setup time4µs
Operating free-air temperature070°C
CC
SDATA, SCLOCK
(see Note 3)
A, OE–0.30.8V
SDATA, SCLOCK
(see Note 3)
SDATA, SCLOCK
(see Note 3)
2.25.5V
01.04V
140kΩ
†
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
CDC318A
OH
gg
Y outputs
VOLLow-level output voltage
V
SDATA
V
135 V
IOHHigh-level output current
1-LINE TO 18-LINE CLOCK DRIVER
WITH I
SCAS614 – SEPTEMBER 1998
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
V
V
I
I
I
I
I
I
∆I
C
C
C
2
C CONTROL INTERFACE
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Input clamp voltageVCC = 3.135 V,II = –18 mA–1.2V
IK
High-level output voltageY outputs
p
p
SDATAVCC = 3.135 V,VO = VCC MAX20µA
p
Low-level output currentY outputs
OL
High-level input current
IH
Low-level input current
IL
High-impedance-state output currentVCC = 3.465 V,VO = 3.465 V or 0±10µA
OZ
Off-state currentSCLOCK, SDATAVCC = 0,VI = 0 V to 5.5 V50µA
off
Supply currentVCC = 3.465 V,IO = 00.20.5mA
CC
Change in supply current
CC
Dynamic ICC at 100 MHzVCC = 3.465 V,CL = 20 pF,230mA
Input capacitanceVI = VCC or GND,VCC = 3.3 V4pF
I
Output capacitanceVO = VCC or GND,VCC = 3.3 V6pF
O
SDATA I/O capacitanceV
I/O
Y outputs
A5
OE
SCLOCK, SDATA20
A–5
OE
SCLOCK, SDATA–10–50
VCC = Min to Max,IOH = –1 mA
VCC = 3.135 V,IOH = –36 mA2.4
VCC = Min to Max,IOL = 1 mA0.1
VCC = 3.135 V,IOL = 24 mA0.4
VCC = 3.135 V to 3.465 V,
One input at VCC – 0.6 V,
All other inputs at VCC or GND
= VCC or GND,VCC = 3.3 V7pF
I/O
IOL = 3 mA0.4
IOL = 6 mA0.6
CC
VCC –
0.1 V
–10
mA
mA
20
–50
500µA
V
µA
µA
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
OE
Y
ns
OE
Y
ns
t
(
SDATA
ns
t
(
SDATA
ns
1-LINE TO 18-LINE CLOCK DRIVER
WITH I
switching characteristics over recommended operating conditions
PARAMETERFROMTOTEST CONDITIONSMINMAXUNIT
AY1.24.5ns
t
PLH
t
PLH
t
PHL
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
sk(o)
t
sk(p)
t
sk(pr)
t
r
r
t
f
f
NOTE 5: This parameter has a lower limit than BUS specification. This allows use of series resistors for current spike protection.
Low-to-high level propagation delay time
Low-to-high level propagation delay timeSDATA↑Y
High-to-low level propagation delay time
High-to-low level propagation delay timeSDATA↑Y
Enable time to the high level
Enable time to the low level
Disable time from the high level
Disable time from the low level
Skew timeAY250ps
Skew timeAY500ps
Skew timeAY1ns
Rise timeY0.52.2ns
Rise time (see Note 5 and
Figure 3)
Fall timeY0.52.3ns
Fall time (see Note 5 and
Figure 3)
SCLOCK↓
AY1.24.5ns
SCLOCK↓
SDATA
valid
SDATA
valid
VCC = 3.3 V ±0.165 V ,
See Figure 3
VCC = 3.3 V ±0.165 V ,
See Figure 3
VCC = 3.3 V ±0.165 V ,
See Figure 3
VCC = 3.3 V ±0.165 V ,
See Figure 3
CL = 10 pF6
CL = 400 pF950
CL = 10 pF20
CL = 400 pF250
2
C CONTROL INTERFACE
SCAS614 – SEPTEMBER 1998
17
17
17
17
CDC318A
2µs
150ns
2µs
150ns
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
7
CDC318A
1-LINE TO 18-LINE CLOCK DRIVER
WITH I
SCAS614 – SEPTEMBER 1998
2
C CONTROL INTERFACE
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
CL = 30 pF
(see Note A)
LOAD CIRCUIT FOR tpd AND t
From Output
Under Test
(see Note A)
500 Ω
CL = 30 pF
500 Ω
sk
S1
6 V
GND
Open
Input
TEST
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
t
w
1.5 V1.5 V
VOLTAGE WAVEFORMS
S1
Open
6 V
GND
3 V
0 V
LOAD CIRCUIT FOR tr AND t
Input
t
PLH
Output
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
1.5 V1.5 V
2.4 V
0.4 V
t
r
VOLTAGE WAVEFORMS
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
1.5 V
2.4 V
t
f
Figure 1. Load Circuit and Voltage Waveforms
f
t
PHL
0.4 V
3 V
0 V
V
V
OH
OL
Output
Enable
(high-level
enabling)
Output
Waveform 1
S1 at 6 V
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
t
PZL
t
PZH
VOLTAGE WAVEFORMS
t
PLZ
1.5 V
t
PHZ
1.5 V
1.5 V1.5 V
VOL + 0.3 V
VOH – 0.3 V
V
CC
0 V
≈ 3 V
V
OL
V
OH
≈ 0 V
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CDC318A
1-LINE TO 18-LINE CLOCK DRIVER
WITH I
PARAMETER MEASUREMENT INFORMATION
A
1Y0
t
PHL1
1Y1
t
PHL2
1Y2
t
PHL3
1Y3
t
PHL4
2Y0
t
PHL5
2Y1
t
PHL6
2Y2
t
PHL7
2Y3
t
PHL8
3Y0
t
PHL9
3Y1
t
PHL10
3Y2
t
PHL11
3Y3
t
PHL12
4Y0
t
PHL13
4Y1
t
PHL14
4Y2
t
PHL15
4Y3
t
PHL16
5Y0
t
PHL17
5Y1
t
PHL18
t
PLH1
t
PLH2
t
PLH3
t
PLH4
t
PLH5
t
PLH6
t
PLH7
t
PLH8
t
PLH9
t
PLH10
t
PLH11
t
PLH12
t
PLH13
t
PLH14
t
PLH15
t
PLH16
t
PLH17
t
PLH18
2
C CONTROL INTERFACE
SCAS614 – SEPTEMBER 1998
NOTES: A. Output skew, t
– The difference between the fastest and slowest of t
– The difference between the fastest and slowest of t
B. Pulse skew, t
C. Process skew, t
– The difference between the fastest and slowest of t
– The difference between the fastest and slowest of t
, is calculated as the greater of:
sk(o)
, is calculated as the greater of |t
sk(p)
, is calculated as the greater of:
sk(pr)
PLHn
(n = 1:18)
PLHn
(n = 1:18)
PHLn
– t
PHLn
(n = 1:18) across multiple devices under identical operating conditions
PLHn
(n = 1:18) across multiple devices under identical operating conditions
PHLn
Figure 2. Waveforms for Calculation of t
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
| (n = 1:18)
sk(o)
, t
sk(p)
, t
sk(pr)
9
CDC318A
1-LINE TO 18-LINE CLOCK DRIVER
WITH I
SCAS614 – SEPTEMBER 1998
2
C CONTROL INTERFACE
PARAMETER MEASUREMENT INFORMATION
CL = 10 pF or
CL = 400 pF
VO = 3.3 V
RL = 1 kΩ
DUT
GND
TEST CIRCUIT
SCLOCK
t
SDATA
t
su(START)
(BUS)
t
f(SDATA)
t
h(START)
Start or
Repeat Start
Condition
Start
Condition
(S)
t
w(SCLL)
t
r
Bit 7
MSB
t
f
t
r(SDATA)
t
su(SDATA)
BYTEDESCRIPTION
1I2C address
2Command (dummy value, ignored)
3Byte count (dummy value, ignored)
4I2C data byte 0
5I2C data byte 1
6I2C data byte 2
NOTES: A. The repeat start condition is not supported.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 100 kHz, ZO = 50 Ω, tr ≥ 10 ns, tf ≥ 10 ns.
4 to 6 Bytes for Complete Device
t
w(SCLH)
Bit 6
Programming
t
h(SDATA)
VOLTAGE WAVEFORMS
Bit 0
LSB
(R/W)
t
PHL
Repeat Start
(see Note A)
Acknowledge
Condition
(A)
t
PLH
Condition
t
su(START)
t
su(STOP)
Stop Condition
Stop
(P)
0.7 V
0.3 V
0.7 V
0.3 V
CC
CC
CC
CC
10
Figure 3. Propagation Delay Times, t
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
and t
r
f
CDC318A
1-LINE TO 18-LINE CLOCK DRIVER
WITH I
MECHANICAL INFORMATION
DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
48 PIN SHOWN
0.025 (0,635)
0.012 (0,305)
0.008 (0,203)
48
0.005 (0,13)
25
0.299 (7,59)
0.291 (7,39)
M
0.006 (0,15) NOM
0.420 (10,67)
0.395 (10,03)
2
C CONTROL INTERFACE
Gage Plane
SCAS614 – SEPTEMBER 1998
0.010 (0,25)
1
A
0.110 (2,79) MAX
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
0.008 (0,20) MIN
DIM
A MAX
A MIN
24
PINS **
0.380
(9,65)
0.370
(9,40)
Seating Plane
0.004 (0,10)
4828
0.630
(16,00)
0.620
(15,75)
0°–8°
0.040 (1,02)
0.020 (0,51)
56
0.730
(18,54)
0.720
(18,29)
4040048/C 03/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
11
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pertaining to warranty, patent infringement, and limitation of liability.
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accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
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DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
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CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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