Texas Instruments CD74HCT299M, CD74HCT299E, CD74HC299M96, CD74HC299M, CD74HC299E Datasheet

...
Data sheet acquired from Harris Semiconductor
/ j
SCHS178
January 1998
CD74HC299,
CD74HCT299
High Speed CMOS Logic
8-Bit Universal Shift Register; Three-State
[ /Title (CD74 HC299 , CD74 HCT29
9) Sub­ect
(High Speed CMOS Logic 8-Bit Uni­versal Shift
Features
• Buffered Inputs
• Four Operating Modes: Shift Left, Shift Right, Load and Store
• Can be Cascaded for N-Bit Word Lengths
- I/O7 Bus Drive Capability and Three-State for
0
Bus Oriented Applications
• Typical f
= 50MHz at VCC=5V,CL= 15pF, TA=25oC
MAX
• Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
• Wide Operating Temperature Range . . . -55
o
C to 125oC
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: N
= 30%, NIH = 30% of V
IL
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V
= 0.8V (Max), VIH = 2V (Min)
IL
- CMOS Input Compatibility, I
1µA at VOL, V
l
OH
Pinout
CD74HC299, CD74HCT299
(PDIP, SOIC)
TOP VIEW
S0 OE1 OE2
I/O I/O I/O I/O
Q0
MR
GND
1 2 3 4
6
5
4
6
2
7
0
8 9
10
V
20
CC
S1
19
DS7
18
Q7
17
I/O
16
7
I/O
15
5
I/O
14
3
I/O
13
1
12
CP DS0
11
Description
The Harris CD74HC259 and CD74HCT299 are 8-bit shift/storage registers with three-state bus interface capability. The register has four synchronous-operating modes controlled by the two select inputs as shown in the mode select (S0, S1) table. The mode select, the serial data (DS0, DS7) and the parallel data (I/O
- I/O7) respond only
0
to the low-to-high transition of the clock (CP) pulse. S0, S1 and data inputs must be one set-up time prior to the clock positive transition.
The Master Reset ( When
MR output is low, the register is cleared regardless of
MR) is an asynchronous active low input.
the status of all other inputs. The register can be expanded by cascading same units by tying the serial output (Q0) to the serial data (DS7) input of the preceding register, and tying the serial output (Q7) to the serial data (DS0) input of the following register. Recirculating the (n x 8) bits is accomplished by tying the Q7 of the last stage to the DS0 of the first stage.
The three-state input/output I(/O) port has three modes of operation:
CC
1. Both output enable (
OE1andOE2)inputs are lowandS0 or S1 or both are low, the data in the register is presented at the eight outputs.
2. When both S0 and S1 are high, I/O terminalsare in the high impedance state butbeing input ports, readyforpar­allel data to be loaded into eight registers with one clock transition regardless of the status of
OE1 and OE2.
3. Either one of the two output enable inputs being high will force I/O terminals to be in the off-state. It is noted that each I/O terminal is a three-state output and a CMOS buffer input.
Ordering Information
PART NUMBER TEMP. RANGE (oC) PACKAGE
CD74HC299E -55 to 125 20 Ld PDIP E20.3 CD74HCT299E -55 to 125 20 Ld PDIP E20.3 CD74HC299M -55 to 125 20 Ld SOIC M20.3 CD74HCT299M -55 to 125 20 Ld SOIC M20.3
NOTES:
1. When ordering, use the entire partnumber. Add the suffix 96 to obtain the variant in the tape and reel.
2. Wafer and die for this part number is available which meets all electrical specifications. Please contact your local sales office or Harris customer service for ordering information.
PKG.
NO.
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright
© Harris Corporation 1998
1
File Number 1485.1
Functional Diagram
CD74HC299, CD74HCT299
CP OE1 OE2 MR
12 2 3 9
THREE-
STATE
CONTROL
20
V
CC
BUS LINE
OUTPUTS
STANDARD
OUTPUT
I/O I/O I/O I/O
Q0 S0
7
0
6
2
5
4
4
6
8 1
I/O
THREE-STATE
OUTPUTS
10 11 18
GND
SHIFT
REGISTER
MODE SELECTION
DS0 DS7
I/O
THREE-STATE
OUTPUTS
13
I/O
14
I/O
15
I/O
16
I/O
17
Q7
19
S1
1 3
BUS LINE OUTPUTS
5 7
STANDARD OUTPUT
MODE SELECT FUNCTION TABLE THREE-STATE I/O PORT OPERATING MODE
INPUTS INPUTS/OUTPUTS
FUNCTION
OE1 OE2 S0 S1 Qn (REGISTER) I/O0 --- I/O7
Read Register L L L X L L
L
LL
XH H LLXL L L LLXL H H
Load Register X X H H Qn = I/On I/On = Inputs Disable I/O H X X X X (Z)
X H X X X (Z)
TRUTH TABLE
INPUTS REGISTER OUTPUTS
FUNCTION
MR CP S0 S1 DS0 DS7 I/On Q0 Q1 --- Q6 Q7
RESET (CLEAR) L XXXXXXLL---LL
Shift Right H hllXXLq
H hlhXXHq
Shift Left H lhXlXq
H lhXhXq
Hold (Do Nothing) H l l XXXq
q2 --- q
1
q
1
q
0
0
0
2
1
--- q
--- q
--- q
--- q
q
5
5
7
7
6
Q6
H
q
6
L
7
Parallel Load H hhXXlLL---LL
H↑h h X X h H H --- H H
NOTE: H = Input Voltage High Level, h = Input voltage high one set-up timer prior clock transition; L = Input Voltage Low Level; l = Input voltage low one set-up time prior clock transition; qn = Lower case letter indicates the state of the reference output one set-up time prior to clock transition; X - Voltage level on logic status don’t care; Z = Output in high impedance state, = Low to High Clock Transition.
2
CD74HC299, CD74HCT299
Absolute Maximum Ratings Thermal Information
DC Supply Voltage, VCC. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, I
IK
For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, I
OK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Drain Current, per Output, IO,For -0.5V < VO < VCC + 0.5V
For Q Outputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±25mA
For I/O Outputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±35mA
DC Output Source or Sink Current per Output Pin, I
O
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, V
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to V
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θJA is measured with the component mounted on an evaluation PC board in free air.
CC
Thermal Resistance (Typical, Note 3) θJA (oC/W)
PDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
CC
DC Electrical Specifications
PARAMETER SYMBOL
HC TYPES
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage CMOS Loads
High Level Output Voltage TTL Loads
Low Level Output Voltage CMOS Loads
Low Level Output Voltage TTL Loads
Input Leakage Current
V
IH
V
IL
V
V
OH
OL
I
VIHor V
VIHor V
VCC or
I
TEST
CONDITIONS
(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
I
V
CC
(V)
o
C -40oC TO 85oC -55oCTO125oC
25
- - 2 1.5 - - 1.5 - 1.5 - V
4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V
- - 2 - - 0.5 - 0.5 - 0.5 V
4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V
-0.02 2 1.9 - - 1.9 - 1.9 - V
IL
4.5 4.4 - - 4.4 - 4.4 - V 6 5.9 - - 5.9 - 5.9 - V
Qn I/On ----- - - - V
-4 -6 4.5 3.98 - - 3.84 - 3.7 - V
-5.2 -7.8 6 5.48 - - 5.34 - 5.2 - V
0.02 2 - - 0.1 - 0.1 - 0.1 V
IL
4.5 - - 0.1 - 0.1 - 0.1 V 6 - - 0.1 - 0.1 - 0.1 V
Qn I/On ----- - - - V
4 6 4.5 - - 0.26 - 0.33 - 0.4 V
5.2 7.8 6 - - 0.26 - 0.33 - 0.4 V
-6--±0.1 - ±1-±1µA
GND
UNITSV
3
CD74HC299, CD74HCT299
DC Electrical Specifications (Continued)
TEST
CONDITIONS
PARAMETER SYMBOL
Quiescent Device
I
CC
Current Three- State Leak-
age Current
V
or VIHVO=V
IL
HCT TYPES
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage
V
IH
V
IL
V
OH
CMOS Loads High Level Output
Voltage TTL Loads
Low Level Output Voltage
V
OL
CMOS Loads Low Level Output
Voltage TTL Loads
Input Leakage Current
Quiescent Device Current
Three- State Leak­age Current
Additional Quies­cent Device Cur-
I
I
I
CC
V
or VIHVO=V
IL
I
CC
rent Per Input Pin: 1 Unit Load
NOTE: For dual-supply systems theoretical worst case (V
(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
I
VCC or
0 6 - - 8 - 80 - 160 µA
GND
CC
-6--±0.5 - ±5-±10 µA
or GND
- - 4.5 to
- - 4.5 to
VIHor V
-0.02 4.5 4.4 - - 4.4 - 4.4 - V
IL
-4 4.5 3.98 - - 3.84 - 3.7 - V
VIHor V
0.02 4.5 - - 0.1 - 0.1 - 0.1 V
IL
4 4.5 - - 0.26 - 0.33 - 0.4 V
VCCand
0 5.5 - ±0.1 - ±1-±1µA
GND
VCC or
0 5.5 - - 8 - 80 - 160 µA
GND
CC
-6--±0.5 - ±5-±10 µA
or GND
V
CC
- 4.5to
-2.1
o
C -40oC TO 85oC -55oCTO125oC
V
CC
25
(V)
2--2 - 2 - V
5.5
- - 0.8 - 0.8 - 0.8 V
5.5
- 100 360 - 450 - 490 µA
5.5
= 2.4V, VCC = 5.5V) specification is 1.8mA.
I
UNITSV
HCT Input Loading Table
INPUT UNIT LOADS
S1, MR 0.25
I/O0 - I/O
7
DS0, DS7 0.25
S0, CP 0.6
OE1, OE2 0.3
NOTE: Unit load is ICClimit specific in Static Specifications Table, e.g., 360µA max. at 25oC.
0.25
4
CD74HC299, CD74HCT299
Prerequisite for Switching Specifications
25oC -40oC TO 85oC -55oC TO 125oC
PARAMETER SYMBOL VCC(V)
HC TYPES
Maximum Clock
f
MAX
Frequency
MR Pulse Width t
Clock Pulse Width t
Setup Time
W
W
t
SU
DS0, DS7, I/On to Clock
Hold Time DS0, DS7,
t
H
I/On, S0, S1 to Clock
UNITSMIN TYP MAX MIN TYP MAX MIN TYP MAX
2 6 - - 5 - - 4 - - MHz
4.5 30 - - 25 - - 20 - - MHz 6 35 - - 29 - - 23 - - MHz 250- -65- -75--ns
4.5 10 - - 13 - - 15 - - ns 6 9 - - 11 - - 13 - - ns 2 80 - - 100 - - 120 - - ns
4.5 16 - - 20 - - 24 - - ns 614- -17- -20--ns 2 100 - - 125 - - 150 - - ns
4.5 20 - - 25 - - 30 - - ns 617- -21- -26--ns 20--0--0--ns
4.5 0 - - 0 - - 0 - - ns 60--0--0--ns
Recovery Time MR to Clock
Setup Time S1, S0 to Clock
HCT TYPES
Maximum Clock Frequency
MR Pulse Width t Clock Pulse Width t Setup Time DS0, DS7,
I/On, S0, S1 to Clock Hold Time DS0, DS7,
I/On, S0, S1 to Clock Recovery Time MR to
Clock Setup Time S1, S0 to
Clock
t
REC
t
f
MAX
t
t
REC
t
SU
W
W
SU
t
SU
25--5--5--ns
4.5 5 - - 5 - - 5 - - ns 65--5--5--ns 2 120 - - 150 - - 180 - - ns
4.5 24 - - 30 - - 36 - - ns 620- -26- -31--ns
4.5 25 - - 20 - - 16 - - ns
4.5 15 - - 19 - - 22 - - ns
4.5 20 - - 25 - - 30 - - ns
4.5 20 - - 25 - - 30 - - ns
H
4.5 0 - - 0 - - 0 - - ns
4.5 5 - - 5 - - 5 - - ns
4.5 27 - - 34 - - 41 - - ns
5
CD74HC299, CD74HCT299
Switching Specifications C
PARAMETER SYMBOL
HC TYPES
Propagation Delay t
Clock to I/O Output, Clock to Q0 and Q7, MR to Output
Output Enable and Disable Times
Output High-Z to High Level t
Output High Level to High-Z t
= 50pF, Input tr, tf= 6ns
L
TEST
CONDITIONS V
PLH
t
PZH
, t
PHLCL
t
PZL
, t
PLZ
t
PHZ PZH
PHZ
= 50pF
= 15pF 5 - 17 - - - - - ns
C
L
C
= 50pF 6 - - 34 - 43 - 51 ns
L
CL = 15pF 5 - 10 - - - - - ns
CL = 50pF 2 - - 155 - 195 - 235 ns
CL = 50pF 2 - - 185 - 230 - 280 ns
CC
(V)
25
o
C
-40oC TO 85oC
-55oC TO 125oC
UNITSMIN TYP MAX MIN MAX MIN MAX
2 - - 200 - 250 - 300 ns
4.5 - - 40 - 50 - 60 ns
-13- - - - - ns
-15- - - - - ns
4.5 - - 31 - 39 - 47 ns 6 - - 26 - 33 - 40 ns
4.5 - - 37 - 46 - 56 ns 6 - - 31 - 39 - 48 ns
Output Low Level to High-Z t
PLZ
CL = 50pF 2 - - 155 - 195 - 235 ns
4.5 - - 31 - 39 - 47 ns 6 - - 26 - 33 - 40 ns
Output High-Z to Low Level t
PZL
CL = 50pF 2 - - 130 - 165 - 195 ns
4.5 - - 26 - 33 - 39 ns 6 - - 22 - 28 - 33 ns
Output Transition Time t
THL
, t
TLHCL
= 50pF
Q0, Q7 2 - - 75 - 95 - 110 ns
4.5 - - 15 - 19 - 22 ns 6 - - 13 - 16 - 19 ns
I/O0 to I/O
7
t
THL
, t
TLHCL
= 50pF 2 - - 60 - 75 - 90 ns
4.5 - - 12 - 15 - 18 ns 6 - - 10 - 13 - 15 ns
Input Capacitance C Three-State Output
C
I
O
CL = 50pF - 10 - 10 - 10 - 10 pF
- - 20 - 20 - 20 - 20 pF
Capacitance Power Dissipation Capacitance
(Notes 4, 5)
C
PD
CL = 15pF 5 - 150 - - - - - pF
6
CD74HC299, CD74HCT299
Switching Specifications C
PARAMETER SYMBOL
= 50pF, Input tr, tf= 6ns (Continued)
L
TEST
CONDITIONS V
CC
(V)
25
o
C
-40oC TO 85oC
-55oC TO 125oC
HCT TYPES
Propagation Delay t
Clock to I/O Output, Clock to Q0 and Q7
MR to Output t Output Enable and Disable
Times Output High-Z to High Level t Output High Level to High-Z t Output Low Level to High-Z t Output High-Z to Low Level t
Output Transition Time t
PHL,tPLH
PHL,tPLH
t
PZL,tPZH
t
, t
PLZ
PHZ PZH PHZ
PLZ PZL
, t
TLH
THL
CL = 50pF 4.5 - - 45 - 56 - 68 ns C
= 15pF 5 - 19 - - - - - ns
L
CL = 50pF 4.5 - - 46 - 58 - 69 ns
,
CL = 15pF 5 - 10,
--- - -ns
13, 15 CL = 50pF 4.5 - - 32 - 40 - 48 ns CL = 50pF 4.5 - - 37 - 46 - 56 ns CL = 50pF 4.5 - - 32 - 40 - 48 ns CL = 50pF 4.5 - - 30 - 38 - 45 ns
Q0, Q7 CL = 50pF 4.5 - - 15 - 19 - 22 ns
to I/O
I/O
0
7
Input Capacitance C Three-State Output
Capacitance
IN
C
O
CL = 50pF 4.5 - - 12 - 15 - 18 ns CL = 50pF - 10 - 10 - 10 - 10 pF
- - 20 - 20 - 20 - 20 pF
UNITSMIN TYP MAX MIN MAX MIN MAX
Power Dissipation Capacitance
C
PD
CL = 15pF 5 - 170 - - - - - pF
(Notes 4, 5)
NOTES:
4. C
is used to determine the dynamic power consumption, per register.
PD
5. PD=CPDV
CC
2
fi+ (CLV
2
fO) where fi= Input Frequency, fO= Output Frequency, CL= Output Load Capacitance,
CC
VCC = Supply Voltage.
Test Circuits and Waveforms
trC
L
CLOCK
10%
90%
50%
10%
tfC
t
L
WL
tWL+ tWH=
50%
t
WH
NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. Forf
, input duty cycle = 50%.
MAX
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
fC
50%
I
L
V
CC
GND
1.3V
I
fC
L
3V
GND
t
rCL
CLOCK
= 6ns
0.3V
2.7V
1.3V
0.3V
t
fCL
t
WL
= 6ns
1.3V
t
WH
t
WL
+ tWH=
NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. Forf
, input duty cycle = 50%.
MAX
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
7
CD74HC299, CD74HCT299
Test Circuits and Waveforms
(Continued)
tr = 6ns tf = 6ns
V
t
CC
GND
TLH
INPUT
t
90% 50% 10%
THL
90%
t
50%
10%
PLH
INVERTING
OUTPUT
t
PHL
FIGURE 3. HC TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
tfC
L
50%
t
H(L)
t
SU(L)
CLOCK
INPUT
DAT A
INPUT
t
SU(H)
trC
L
90%
10%
t
H(H)
V
CC
GND
V
CC
50% GND
= 6ns
tr = 6ns
INPUT
t
2.7V
1.3V
0.3V
THL
t
f
3V
GND
t
TLH
90%
t
PLH
1.3V
10%
INVERTING
OUTPUT
t
PHL
FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
CLOCK
INPUT
DAT A
INPUT
t
SU(H)
trC
L
2.7V
0.3V
t
H(H)
1.3V
1.3V
tfC
L
1.3V
t
H(L)
1.3V
t
SU(L)
3V
GND
3V
GND
OUTPUT
t
REM
V
CC
SET, RESET OR PRESET
50%
90%
t
PLH
IC
t
TLH
t
THL
90%
50%
10% t
PHL
GND
C
L
50pF
FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS
OUTPUT
t
REM
3V SET, RESET OR PRESET
1.3V
90%
1.3V t
IC
t
PLH
TLH
t
THL
90%
1.3V 10%
t
PHL
GND
C
L
50pF
FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS
8
CD74HC299, CD74HCT299
Test Circuits and Waveforms
6ns 6ns
OUTPUT
DISABLE
OUTPUT LOW
TO OFF
OUTPUT HIGH
TO OFF
50%
t
t
OUTPUTS ENABLED
PLZ
PHZ
90%
10%
90%
OUTPUTS
DISABLED
(Continued)
10%
t
PZL
t
PZH
FIGURE 7. HC THREE-STATE PROPAGATION DELAY
WAVEFORM
OTHER
INPUTS
TIED HIGH
OR LOW
OUTPUT
DISABLE
50%
50%
OUTPUTS ENABLED
IC WITH
THREE-
STATE
OUTPUT
V
CC
GND
R
OUTPUT
0.3
t
t
6ns
PZL
PZH
t
r
OUTPUT
DISABLE
OUTPUT LOW
TO OFF
OUTPUT HIGH
TO OFF
t
t
OUTPUTS ENABLED
6ns t
PLZ
PHZ
10%
90%
f
2.7
1.3
OUTPUTS
DISABLED
FIGURE 8. HCT THREE-STATE PROPAGATION DELAY
WAVEFORM
= 1k
L
C
L
50pF
VCC FOR t GND FOR t
PLZ
PHZ
AND t
AND t
PZL
PZH
3V
GND
1.3V
1.3V OUTPUTS
ENABLED
NOTE: Open drain waveforms t VCC, CL = 50pF.
FIGURE 9. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT
PLZ
and t
are the same as those for three-state shown on the left. The test circuit is Output RL=1kΩto
PZL
9
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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