Texas Instruments CD74HC7266M96, CD74HC7266M, CD74HC7266E, CD54HC7266F3A, 8404302CA Datasheet

Data sheet acquired from Harris Semiconductor
/
SCHS219
August 1997
CD74HC7266
High Speed CMOS Logic
Quad 2-Input EXCLUSIVE NOR Gate
[ /Title (CD74H C7266)
Subject (High Speed CMOS Logic Quad 2­Input EXCLU­SIVE
Features
• Four Independent EXCLUSIVE NOR Gates
• Buffered Inputs and Outputs
• Logical Comparators
• Parity Generators and Checkers
• Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
o
• Wide Operating Temperature Range . . . -55
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL Logic ICs
• HC Types
- 2V to 6V Operation
- High NoiseImmunity: N
V
= 5V
CC
= 30%, NIH= 30%of VCCat
IL
C to 125oC
Description
The Harris CD74HC7266 contains four independent Exclusive NOR gates in one package. They provide the system designer with a means for implementation of the EXCLUSIVE NOR function.
This device is functionally the same as the TTL226. They differ in that the HC7266 has active high and low outputs whereas the 226 has open collector outputs.
Ordering Information
PKG.
PART NUMBER TEMP. RANGE (oC) PACKAGE
CD74HC7266E -55 to 125 14 Ld PDIP E14.3 CD74HC7266M -55 to 125 14 Ld SOIC M14.15
NOTES:
1. When ordering, use the entire part number. Add the suffix 96 to obtain the variant in the tape and reel.
2. Die for this part number is available which meets all electrical specifications. Please contact your local sales office or Harris customer service for ordering information.
NO.
Pinout
1A 1B
1Y
2Y 2A 2B
GND
CD74HC7266
(PDIP, SOIC)
TOP VIEW
1 2 3 4 5 6 7
14
V
CC
4B
13 12
4A
11
4Y
10
3Y
9
3B
8
3A
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright
© Harris Corporation 1997
1
File Number 1780.1
Functional Diagram
CD74HC7266
1
1A
2
1B
5
2A
6
2B
8
3A
9
3B
12
4A
13
4B
TRUTH TABLE
INPUTS OUTPUT
nA nB nY
LLH
3
4
10
11
GND = 7 V
CC
1Y
2Y
3Y
4Y
= 14
Logic Symbol
LHL HLL HHH
NOTE: H = High Voltage Level, L = Low Voltage Level
nA
nY
nB
2
CD74HC7266
Absolute Maximum Ratings Thermal Information
DC Supply Voltage, VCC. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, I
For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, I
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, I
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, I
IK
OK
CC orIGND
O
. . . . . . . . . . . . . . . . . .±50mA
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, V
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to V
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θJA is measured with the component mounted on an evaluation PC board in free air.
CC
Thermal Resistance (Typical, Note 3) θJA (oC/W)
PDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . .150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . .300oC
(SOIC - Lead Tips Only)
CC
DC Electrical Specifications
PARAMETER SYMBOL
HC TYPES
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage CMOS Loads
High Level Output Voltage TTL Loads
Low Level Output Voltage CMOS Loads
V
IH
V
IL
V
OH
V
OL
TEST
CONDITIONS
- - 2 1.5 - - 1.5 - 1.5 - V
- - 2 - - 0.5 - 0.5 - 0.5 V
VIHor VIL-0.02 2 1.9 - - 1.9 - 1.9 - V
-0.02 4.5 4.4 - - 4.4 - 4.4 - V
-0.02 6 5.9 - - 5.9 - 5.9 - V
-4 4.5 3.98 - - 3.84 - 3.7 - V
-5.2 6 5.48 - - 5.34 - 5.2 - V
VIHor VIL0.02 2 - - 0.1 - 0.1 - 0.1 V
0.02 4.5 - - 0.1 - 0.1 - 0.1 V
0.02 6 - - 0.1 - 0.1 - 0.1 V
V
CC
(V)
4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V
4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V
25oC -40oC TO 85oC -55oC TO 125oC
UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
Low Level Output Voltage TTL Loads
4 4.5 - - 0.26 - 0.33 - 0.4 V
5.2 6 - - 0.26 - 0.33 - 0.4 V
3
DC Electrical Specifications (Continued)
TEST
CONDITIONS
PARAMETER SYMBOL
CD74HC7266
V
CC
(V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
Input Leakage Current
Quiescent Device Current (Note)
I
VCC or
I
-6--±0.1 - ±1-±1 µA
GND
I
CC
VCC or
0 6 - - 2 - 20 - 40 µA
GND
NOTE:
4. For dual-supply systems theorectical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
Switching Specifications Input t
, tf = 6ns
r
25oC -40oC TO 85oC -55oC TO 125oC
TEST
PARAMETER SYMBOL
CONDITIONS VCC (V)
HC TYPES
Propagation Delay t
PLH,tPHLCL
= 50pF 2 - 115 145 150 ns
4.5 - 23 29 35 ns 6 - 30 25 30 ns
Propagation Delay Time, Any
t
PLH,tPHLCL
= 15pF 5 9 - - - ns
Input Output Transition Times
t
TLH
, t
THLCL
= 50pF 2 - 75 95 110 ns
(Figure 1)
4.5 - 15 19 22 ns 6 - 13 16 19 ns
UNITSTYP MAX MAX MAX
Input Capacitance C Power Dissipation
IN
C
PD
---1010 10pF
CL= 15pF 5 33 - - - pF
Capacitance
NOTE:
5. CPDis used to determine the dynamic power consumption per gate, PD=V Load Capacitance, VCC = Supply Voltage.
Test Circuit and Waveform
tr = 6ns tf = 6ns
t
PHL
90% 50% 10%
t
PLH
INPUT
t
THL
INVERTING
OUTPUT
FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC
2
fi(CPD+CL) where fi= Input Frequency, CL= Output
CC
V
CC
GND
t
TLH
90%
50%
10%
4
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
Loading...