Texas Instruments CD74HCT670M96, CD74HCT670M, CD74HCT670E, CD74HC670M96, CD74HC670M Datasheet

...
CD74HC670,
/
[ /Title (CD74H C670, CD74H CT670)
Subject (High­Speed CMOS Logic 4x4 Reg­ister
Data sheet acquired from Harris Semiconductor SCHS195
January 1998
Features
• Simultaneous and Independent Read and Write Operations
• Expandable to 512 Words of n-Bits
• Three-State Outputs
• Buffered Inputs
• Typical Read Time = 16ns for CD74HC670 V = 15pF, TA = 25oC
• Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
• Wide Operating Temperature Range . . . -55
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: N
= 30%, NIH = 30% of V
IL
o
=5V,C
CC
C to 125oC
CC
CD74HCT670
High-Speed CMOS Logic
4x4 Register File
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility, V
= 0.8V (Max), VIH = 2V (Min)
IL
- CMOS Input Compatibility, I
Description
The Harris CD74HC670 and CD74HCT670 are 16-bit register
L
files organized as 4 words x 4 bits each. Read and write address and enableinputs allow simultaneous writing into one location while reading another. Four data inputs are provided to store the 4-bit word. The write address inputs (WA0 and WA1)determine the location of the stored word in the register. When write enable ( address location and it remains transparent to the data. The outputs will reflect the true form of the input data. When ( is high data and address inputs are inhibited. Data acquisition from the four registers is made possible by the read address inputs (RA1 and RA0). The addressed word appears at the output when the read enable ( high impedance state when the ( tied together to increase the word capacity to 512 x 4 bits.
WE) is low the word is entered into the
Ordering Information
1µA at VOL, V
l
RE) is low. The output is in the
RE) is high. Outputs can be
OH
WE)
Pinout
CD74HC670, CD74HCT670
(PDIP, SOIC)
TOP VIEW
D1 D2
D3 RA1 RA0
Q3
Q2
GND
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10
9
V
CC
D0 WA0 WA1 WE RE Q0 Q1
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright
© Harris Corporation 1998
1
File Number 1660.1
Functional Diagram
CD74HC670, CD74HCT670CD74HC670, CD74HCT670
15
D0
1
D1
2
D2
3
D3
12
WE
11
RE
RA1
RA0 WA0 WA1
4
WRITE MODE SELECT TABLE
INPUTS INTERNAL
OPERATING
MODE
N
LATCHES
(NOTE 3)WE D
Write Data L L L
LHH
Data Latched H X No Change
NOTE:
3. The WriteAddress (WA0 andWA1) to the“internal latches”must be stable while WE is LOW for conventional operation.
10
Q0
9
Q1
7
Q2
6
Q3
514 13
READ MODE SELECT TABLE
INPUTS
INTERNAL
OPERATING
MODE
RE
LATCHES
(NOTE 4)
Read L L L
LHH
Disabled H X (Z)
NOTE:
4. The selectionof the “internal latches” byRead Address(RA0 and RA1) are not constrained by WE or RE operation. H = High Voltage Level L = Low Voltage Level X= Don’t Care Z = High Impedance “Off” State
OUTPUT
Q
N
2
CD74HC670, CD74HCT670CD74HC670, CD74HCT670
Absolute Maximum Ratings Thermal Information
DC Supply Voltage, VCC. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, I
IK
For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, I
OK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Drain Current, per Output, I
O
For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±35mA
DC Output Source or Sink Current per Output Pin, I
O
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, V
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to V
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
5. θJA is measured with the component mounted on an evaluation PC board in free air.
CC
Thermal Resistance (Typical, Note 5) θJA (oC/W)
PDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
CC
DC Electrical Specifications
PARAMETER SYMBOL
HC TYPES
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage CMOS Loads
High Level Output Voltage TTL Loads
Low Level Output Voltage CMOS Loads
Low Level Output Voltage TTL Loads
Input Leakage Current
V
IH
V
IL
V
OH
V
OL
I
I
TEST
CONDITIONS
(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
I
V
CC
(V)
o
C -40oC TO 85oC -55oCTO125oC
25
UNITSV
- - 2 1.5 - - 1.5 - 1.5 - V
4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V
- - 2 - - 0.5 - 0.5 - 0.5 V
4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V
VIHor VIL-0.02 2 1.9 - - 1.9 - 1.9 - V
-0.02 4.5 4.4 - - 4.4 - 4.4 - V
-0.02 6 5.9 - - 5.9 - 5.9 - V
- - ---- - - - V
-6 4.5 3.98 - - 3.84 - 3.7 - V
-7.8 6 5.48 - - 5.34 - 5.2 - V
VIHor VIL0.02 2 - - 0.1 - 0.1 - 0.1 V
0.02 4.5 - - 0.1 - 0.1 - 0.1 V
0.02 6 - - 0.1 - 0.1 - 0.1 V
- - ---- - - - V
6 4.5 - - 0.26 - 0.33 - 0.4 V
7.8 6 - - 0.26 - 0.33 - 0.4 V
VCC or
-6--±0.1 - ±1-±1µA
GND
3
CD74HC670, CD74HCT670CD74HC670, CD74HCT670
DC Electrical Specifications (Continued)
TEST
CONDITIONS
PARAMETER SYMBOL
Quiescent Device
I
CC
Current Three-State Leakage
Current
HCT TYPES
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage
V
IH
V
IL
V
OH
CMOS Loads High Level Output
Voltage TTL Loads
Low Level Output Voltage
V
OL
CMOS Loads Low Level Output
Voltage TTL Loads
Input Leakage Current
Quiescent Device Current
I
I
I
CC
Three-State Leakage Current
Additional Quiescent Device Current Per
I
CC
Input Pin: 1 Unit Load
NOTE: For dual-supply systems theoretical worst case (V
(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
I
VCC or
0 6 - - 8 - 80 - 160 µA
GND
V
or VIHVO =
IL
VCC or
GND
- - 4.5 to
- - 4.5 to
VIHor VIL-0.02 4.5 4.4 - - 4.4 - 4.4 - V
-6 4.5 3.98 - - 3.84 - 3.7 - V
VIHor VIL0.02 4.5 - - 0.1 - 0.1 - 0.1 V
6 4.5 - - 0.26 - 0.33 - 0.4 V
VCCand
0 5.5 - ±0.1 - ±1-±1µA
GND
VCC or
0 5.5 - - 8 - 80 - 160 µA
GND
V
or VIHVO =
IL
VCC or
GND
V
CC
- 4.5 to
-2.1
o
C -40oC TO 85oC -55oCTO125oC
V
CC
25
(V)
6--±0.5 - ±5.0 - ±10 µA
2--2 - 2 - V
5.5
- - 0.8 - 0.8 - 0.8 V
5.5
5.5 - - ±0.5 - ±5.0 - ±10 µA
- 100 360 - 450 - 490 µA
5.5
= 2.4V, VCC = 5.5V) specification is 1.8mA.
I
UNITSV
HCT Input Loading Table
INPUT UNIT LOADS
WE 0.3 WA0 0.2 WA1 0.4
RE 1.5
DATA 0.15
RA0 0.4 RA1 0.7
NOTE: Unit load is ICClimit specific in DC Electrical Specifications Table, e.g., 360µA max. at 25oC.
4
CD74HC670, CD74HCT670CD74HC670, CD74HCT670
Prerequisite for Switching Specifications
25oC -40oC TO 85oC -55oC TO 125oC
PARAMETER SYMBOL VCC(V)
HC TYPES
Setup Time
tSU, t
h
Data to WE Write to WE
Hold Time
tH, t
W
Data to WE Write to WE
Pulse Width WE t
Latch Time WE to RA0,
W
t
LATCH
RA1
HCT TYPES
Setup Time
tSU, t
h
Data to WE
UNITSMIN TYP MAX MIN TYP MAX MIN TYP MAX
260--75- -90--ns
4.5 12 - - 15 - - 18 - - ns 610--13- -15--ns 25--5--5--ns
4.5 5 - - 5 - - 5 - - ns 65--5--5--ns 2 80 - - 100 - - 120 - - ns
4.5 16 - - 20 - - 24 - - ns 614- -17- -20- -ns 2 100 - - 125 - - 150 - - ns
4.5 20 - - 25 - - 30 - - ns 617- -21- -26- -ns
4.5 12 - - 15 - - 18 - - ns
Hold Time
tH, t
W
4.5 5 - - 5 - - 5 - - ns
Data to WE Write to WE
Setup Time
t
SU
4.5 18 - - 23 - - 27 - - ns
Write to WE Pulse Width WE t Latch Time WE to RA0,
t
LATCH
W
4.5 20 - - 25 - - 30 - - ns
4.5 25 - - 31 - - 38 - - ns
RA1
Switching Specifications C
PARAMETER SYMBOL
= 50pF, Input tr, tf= 6ns
L
TEST
CONDITIONS VCC(V)
25
o
C
-40oC TO 85oC
-55oC TO 125oC
HC TYPES
Propagation Delay t
PLH
, t
PHLCL
= 50pF
Reading Any Word 2 - - 195 - 245 - 295 ns
4.5 - - 39 - 49 - 59 ns
CL = 15pF 5 - 16 - - - - - ns
= 50pF 6 - - 33 - 42 - 50 ns
C
L
Write Enable to Output t
PLH,tPHLCL
= 50pF 2 - - 250 - 315 - 375 ns
4.5 - - 50 - 63 - 75 ns
= 15pF 5 - 21 - - - - - ns
C
L
C
= 50pF 6 - - 43 - 54 - 64 ns
L
UNITSMIN TYP MAX MIN MAX MIN MAX
5
CD74HC670, CD74HCT670
Switching Specifications C
PARAMETER SYMBOL
Data to Output t
= 50pF, Input tr, tf= 6ns (Continued)
L
TEST
CONDITIONS VCC(V)
PLH,tPHLCL
= 50pF 2 - - 256 - 315 - 375 ns
25
o
C
-40oC TO 85oC
-55oC TO 125oC
4.5 - - 50 - 63 - 75 ns
= 15pF 5 - 21 - - - - - ns
C
L
C
= 50pF 6 - - 43 - 54 - 64 ns
L
Output Disable Time t
PLZ,tPHZ
CL = 50pF 2 - - 150 - 190 - 225 ns
4.5 - - 30 - 38 - 45 ns
CL = 15pF 5 - 12 - - - - - ns
= 50pF 6 - - 26 - 33 - 38 ns
C
L
Output Enable Time t
PZL,tPZH
CL = 50pF 2 - - 150 - 190 - 225 ns
4.5 - - 30 - 38 - 45 ns
CL = 15pF 5 - 12 - - - - - ns
= 50pF 6 - - 26 - 33 - 38 ns
C
L
Output Transition Time t
THL
, t
CL = 50pF 2 - - 75 - 95 - 110 ns
TLH
4.5 - - 15 - 19 - 22 ns 6 - - 13 - 10 - 19 ns
Input Capacitance C Three-State Output
I
C
O
CL = 50pF - 10 - 10 - 10 - 10 pF
- - 20 - 20 - 20 - 20 pF
Capacitance Power Dissipation Capacitance
C
PD
CL = 15pF 5 - 59 - - - - - pF
(Notes 6, 7)
HCT TYPES
Propagation Delay t
PHL,tPLH
Reading Any Word CL = 50pF 4.5 - - 40 - 50 - 53 ns
C
= 15pF 5 - 17 - - - - - ns
L
Write Enable to Output t
Data to Output t
Output Disable Time t
Output Enable Time t
Output Transition Time t
PHL,tPLH
PHL,tPLH
PLZ,tPHZ
PZL,tPZH
TLH
Input Capacitance C Three-State Output
Capacitance Power Dissipation Capacitance
C
, t
I
C
O
PD
CL = 50pF 4.5 - - 50 - 63 - 75 ns
= 15pF 5 - 21 - - - - - ns
C
L
CL = 50pF 4.5 - - 50 - 63 - 75 ns
= 15pF 5 - 21 - - - - - ns
C
L
CL = 50pF 4.5 - - 35 - 44 - 53 ns
= 15pF 5 - 14 - - - - - ns
C
L
CL = 50pF 4.5 - - 38 - 48 - 57 ns
= 15pF 5 - 16 - - - - - ns
C
L
CL = 50pF 4.5 - - 15 - 19 - 22 ns
THL
CL = 50pF - 10 - 10 - 10 - 10 pF
- - 20 - 20 - 20 - 20 pF
CL = 15pF 5 - 66 - - - - - pF
(Notes 6, 7)
NOTES:
is used to determine the dynamic power consumption, per output.
6. C
PD
7. PD=CPDV
CC
2
fi+ CLV
2
fOwhere fi= Input Frequency, fO= Output Frequency, CL= Output Load Capacitance, VCC= Supply
CC
Voltage.
UNITSMIN TYP MAX MIN MAX MIN MAX
6
Test Circuits and Waveforms
trC
L
CLOCK
10%
90%
50%
10%
tfC
t
L
WL
tWL+ tWH=
50%
t
CD74HC670, CD74HCT670CD74HC670, CD74HCT670
WH
fC
50%
I
L
V
CC
GND
t
rCL
CLOCK
= 6ns
0.3V
2.7V
1.3V
0.3V
t
fCL
t
WL
= 6ns
1.3V
t
WH
t
WL
+ tWH=
1.3V
I
fC
L
3V
GND
NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with devicetruthtable. For f
, input duty cycle = 50%.
MAX
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
tr = 6ns tf = 6ns
V
t
CC
GND
TLH
INPUT
t
THL
90% 50% 10%
90%
t
50%
10%
PLH
INVERTING
OUTPUT
t
PHL
FIGURE 3. HC TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
tfC
L
V
CC
50%
GND
t
H(L)
V
CC
50%
t
SU(L)
GND
CLOCK
INPUT
DAT A
INPUT
t
SU(H)
trC
L
90%
10%
t
H(H)
NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with devicetruthtable. For f
, input duty cycle = 50%.
MAX
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
= 6ns
tr = 6ns
INPUT
t
2.7V
1.3V
0.3V
THL
t
f
3V
GND
t
TLH
90%
t
PLH
1.3V
10%
INVERTING
OUTPUT
t
PHL
FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
CLOCK
INPUT
DAT A
INPUT
t
SU(H)
trC
L
2.7V
0.3V
t
H(H)
1.3V
1.3V
tfC
L
3V
1.3V GND
t
H(L)
3V
1.3V
t
SU(L)
GND
OUTPUT
t
REM
V
CC
SET, RESET OR PRESET
50%
90%
t
PLH
IC
t
TLH
t
THL
90%
50%
10% t
PHL
GND
C
L
50pF
FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVALTIME,
AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS
OUTPUT
t
REM
3V
SET, RESET
1.3V
90%
1.3V t
t
PLH
TLH
90%
1.3V 10%
t
PHL
t
THL
OR PRESET
IC
C
L
50pF
FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVALTIME,
AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS
7
GND
CD74HC670, CD74HCT670CD74HC670, CD74HCT670
Test Circuits and Waveforms
6ns 6ns
OUTPUT
DISABLE
OUTPUT LOW
TO OFF
OUTPUT HIGH
TO OFF
50%
t
t
OUTPUTS ENABLED
PLZ
PHZ
90%
10%
90%
OUTPUTS
DISABLED
(Continued)
10%
t
PZL
t
PZH
FIGURE 7. HC THREE-STATE PROPAGATION DELAY
WAVEFORM
OTHER
INPUTS
TIED HIGH
OR LOW
OUTPUT
DISABLE
50%
50%
OUTPUTS ENABLED
IC WITH
THREE-
STATE
OUTPUT
V
CC
GND
OUTPUT
R
0.3
t
t
6ns
PZL
PZH
t
r
OUTPUT
DISABLE
OUTPUT LOW
TO OFF
OUTPUT HIGH
TO OFF
t
t
OUTPUTS ENABLED
6ns t
PLZ
PHZ
10%
90%
f
2.7
1.3
OUTPUTS
DISABLED
FIGURE 8. HCT THREE-STATE PROPAGATION DELAY
WAVEFORM
= 1k
L
C
L
50pF
VCC FOR t GND FOR t
PLZ
PHZ
AND t
AND t
PZL
PZH
3V
GND
1.3V
1.3V OUTPUTS
ENABLED
NOTE: Open drain waveforms t VCC, CL = 50pF.
FIGURE 9. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT
PLZ
and t
are the same as those for three-state shown on the left. The test circuit is Output RL=1kΩto
PZL
8
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