Texas Instruments CD74HCT245M96, CD74HCT245M, CD74HCT245E, CD74HC245M96, CD74HC245M Datasheet

...
Data sheet acquired from Harris Semiconductor
/ j
SCHS119
November 1997
Features
• Buffered Inputs
CD54HC245, CD54HCT245,
CD74HC245, CD74HCT245
High Speed CMOS Logic Octal-Bus Transceiver,
Three-State, Non-Inverting
[ /Title (CD54 HC245 , CD54 HCT24 5, CD74 HC245 , CD74 HCT24
5) Sub­ect
(High Speed
• Three-State Outputs
• Bus Line Driving Capability
• Typical Propagation Delay (A to B, B to A) 9ns at V = 5V, CL = 15pF, TA = 25oC
• Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
• Wide Operating Temperature Range . . . -55
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: N
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V
= 0.8V (Max), VIH = 2V (Min)
IL
- CMOS Input Compatibility, I
= 30%, NIH = 30% of V
IL
1µA at VOL, V
l
o
C to 125oC
OH
Pinout
CD54HC245, CD54HCT245, CD74HC245, CD74HCT245
(CERDIP, PDIP, SOIC)
TOP VIEW
1
DIR
A0
2
A1
3
A2
4
A3
5
A4
6
A5
7 8
A6
9
A7
GND
10
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright
© Harris Corporation 1997
V
20
CC
OE
19
B0
18
B1
17
B2
16
B3
15
B4
14
B5
13 12
B6 B7
11
1
File Number 1651.1
CD54HC245, CD54HCT245, CD74HC245, CD74HCT245CD54HC245, CD54HCT245, CD74HC245, CD74HCT245
Description
The Harris CD54HC245, CD54HCT245, and CD74HC245, CD74HCT245 are high-speed octal three-state bidirectional transceivers intended for two-way asynchronous communication between data buses. They have high drive current outputs which enable high-speed operation while driving large bus capacitances. They provide the low power consumption of standard CMOS circuits with speeds and drive capabilities comparable to that of LSTTL circuits.
The CD54HC245, CD54HCT245, CD74HC245 and CD74HCT245 allow data transmission of the B bus or from the B bus to the A bus. The logic level at the direction input (DIR) determines the direction. The output enable input (
OE), when high, puts the I/O ports in the high-impedance
state. The HC/HCT245 is similar in operation to the HC/HCT640
Functional Diagram
A0
A1
A2
A3
A4
A5
A6
A7
2
3
4
5
6
7
8
9
and the HC/HCT643.
Ordering Information
TEMP.
PART NUMBER
RANGE (oC) PACKAGE
CD54HC245F -55 to 125 20 Ld CERDIP F20.3 CD54HCT245F -55 to 125 20 Ld CERDIP F20.3 CD74HC245E -55 to 125 20 Ld PDIP E20.3 CD74HCT245E -55 to 125 20 Ld PDIP E20.3 CD74HC245M -55 to 125 20 Ld SOIC M20.3 CD74HCT245M -55 to 125 20 Ld SOIC M20.3
NOTES:
1. When ordering,use theentire part number. Addthe suffix96 to obtain the variant in the tape and reel.
2. Waferor die forthis part numberisavailable which meetsall elec­trical specifications. Please contact your local sales office or Harris customer service for ordering information.
18
B0
17
B1
16
B2
15
B3
14
B4
13
B5
12
B6
11
B7
PKG.
NO.
DIR
OE
TRUTH TABLE
CONTROL INPUTS
OPERATIONOE DIR
L L B Data to A Bus L H A Data to B Bus
H X Isolation
H = High Level, L = Low Level, X = Irrelevant To prevent excess currents in the High-Z (Isolation) modes all I/O terminals should be terminated with 10k to 1M resistors.
1
19
2
CD54HC245, CD54HCT245, CD74HC245, CD74HCT245CD54HC245, CD54HCT245, CD74HC245, CD74HCT245
Absolute Maximum Ratings Thermal Information
DC Supply Voltage, VCC. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, I
IK
For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, I
OK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Drain Current, per Output, I
O
For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±35mA
DC Output Source or Sink Current per Output Pin, I
O
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, V
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to V
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θJA is measured with the component mounted on an evaluation PC board in free air.
CC
Thermal Resistance (Typical, Note 3). . . .θJA (oC/W) θJA (oC/W)
PDIP Package. . . . . . . . . . . . . . . . . . . 125 N/A
SOIC Package. . . . . . . . . . . . . . . . . . . 120 N/A
CERDIP Package . . . . . . . . . . . . . . . . 100 40
Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . .150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . .300oC
(SOIC - Lead Tips Only)
CC
DC Electrical Specifications
PARAMETER SYMBOL
HC TYPES
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage CMOS Loads
High Level Output Voltage TTL Loads
Low Level Output Voltage CMOS Loads
Low Level Output Voltage TTL Loads
Input Leakage Current
V
IH
V
IL
V
OH
V
OL
I
I
TEST
CONDITIONS
(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
I
V
CC
(V)
o
C -40oC TO 85oC -55oCTO125oC
25
UNITSV
- - 2 1.5 - - 1.5 - 1.5 - V
4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V
- - 2 - - 0.5 - 0.5 - 0.5 V
4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V
VIHor VIL-0.02 2 1.9 - - 1.9 - 1.9 - V
-0.02 4.5 4.4 - - 4.4 - 4.4 - V
-0.02 6 5.9 - - 5.9 - 5.9 - V
- - ---- - - - V
-4 4.5 3.98 - - 3.84 - 3.7 - V
-5.2 6 5.48 - - 5.34 - 5.2 - V
VIHor VIL0.02 2 - - 0.1 - 0.1 - 0.1 V
0.02 4.5 - - 0.1 - 0.1 - 0.1 V
0.02 6 - - 0.1 - 0.1 - 0.1 V
- - ---- - - - V 4 4.5 - - 0.26 - 0.33 - 0.4 V
5.2 6 - - 0.26 - 0.33 - 0.4 V
VCC or
-6--±0.1 - ±1-±1µA
GND
3
CD54HC245, CD54HCT245, CD74HC245, CD74HCT245CD54HC245, CD54HCT245, CD74HC245, CD74HCT245
DC Electrical Specifications (Continued)
TEST
CONDITIONS
PARAMETER SYMBOL
Quiescent Device
I
CC
Current Three-State Leakage
Current
I
OZ
HCT TYPES
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage
V
IH
V
IL
V
OH
CMOS Loads High Level Output
Voltage TTL Loads
Low Level Output Voltage
V
OL
CMOS Loads Low Level Output
Voltage TTL Loads
Input Leakage Current
Quiescent Device Current
Three-State Leakage Current
Additional Quiescent Device Current Per
I
I
I
CC
I
OZ
I
CC
Input Pin: 1 Unit Load
NOTE: For dual-supply systems theoretical worst case (V
HCT Input Loading Table
(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
I
VCC or
0 6 - - 8 - 80 - 160 µA
GND
VILor VIHVO =
VCC or
GND
- - 4.5 to
- - 4.5 to
VIHor VIL-0.02 4.5 4.4 - - 4.4 - 4.4 - V
-4 4.5 3.98 - - 3.84 - 3.7 - V
VIHor VIL0.02 4.5 - - 0.1 - 0.1 - 0.1 V
4 4.5 - - 0.26 - 0.33 - 0.4 V
VCCand
0 5.5 - - ±0.1 - ±1-±1µA
GND
VCC or
0 5.5 - - 8 - 80 - 160 µA
GND
VILor VIHVO =
VCC or
GND
V
CC
- 4.5 to
-2.1
o
C -40oC TO 85oC -55oCTO125oC
V
CC
25
(V)
6--±0.5 - ±5-±10 µA
2--2- 2 - V
5.5
- - 0.8 - 0.8 - 0.8 V
5.5
6--±0.5 - ±5-±10 µA
- 100 360 - 450 - 490 µA
5.5
= 2.4V, VCC = 5.5V) specification is 1.8mA.
I
UNITSV
INPUT UNIT LOADS
An or Bn 0.4
OE 1.5
DIR 0.9
NOTE: Unit Load is ICClimit specified in DC Electrical Table, e.g., 360µA max at 25oC.
4
CD54HC245, CD54HCT245, CD74HC245, CD74HCT245CD54HC245, CD54HCT245, CD74HC245, CD74HCT245
Switching Specifications C
PARAMETER SYMBOL
= 50pF, Input tr, tf= 6ns
L
TEST
CONDITIONS V
CC
(V)
25
o
C
-40oC TO 85oC
-55oC TO 125oC
HC TYPES
Propagation Delay t
PHL
, t
PLHCL
= 50pF
Data to Output 2 - - 110 - 140 - 165 ns
4.5 - - 22 - 28 - 33 ns
C
= 15pF 5 - 9 - - - - - ns
L
C
= 50pF 6 - - 19 - 24 - 28 ns
L
Output Disable to Output t
PHL, tPLHCL
= 50pF 2 - - 150 - 190 - 225 ns
4.5 - - 30 - 38 - 45 ns
C
= 15pF 5 - 12 - - - - - ns
L
C
= 50pF 6 - - 26 - 33 - 38 ns
L
Output Enable to Output t
PHL, tPLHCL
= 50pF 2 - - 150 - 190 - 225 ns
4.5 - - 30 - 38 - 45 ns CL = 15pF 5 - 12 - - - - - ns C
= 50pF 6 - - 26 - 33 - 38 ns
L
Output Transition Time t
THL
, t
CL = 50pF 2 - - 60 - 75 - 90 ns
TLH
4.5 - - 12 - 15 - 18 ns
6 - - 10 - 13 - 15 ns Input Capacitance C Three-State Output
Capacitance Power Dissipation Capacitance
(Notes 4, 5)
IN
C
O
C
PD
CL = 50pF - 10 - 10 - 10 - 10 pF
- - - - 20 - 20 - 20 pF
- 5 -53- - - - - pF
HCT TYPES
Propagation Delay
Data to Output t
Output Disable to Output t
Output Enable to Output t
Output Transition Time t
PHL, tPLHCL
PHL, tPLHCL
PHL, tPLHCL
THL
Input Capacitance C Three-State Output
Capacitance Power Dissipation Capacitance
, t
TLH
IN
C
O
C
PD
= 50pF 4.5 - - 26 - 33 - 39 ns
C
= 15pF 5 - 10 - - - - - ns
L
= 50pF 4.5 - - 30 - 38 - 45 ns = 15pF 5 - 12 - - - - - ns
C
L
= 50pF 4.5 - - 32 - 40 - 48 ns
C
= 15pF 5 - 13 - - - - - ns
L
CL = 50pF 4.5 - - 12 - 15 - 18 ns CL = 50pF - 10 - 10 - 10 - 10 pF
- - - - 20 - 20 - 20 pF
- 5 -55- - - - - pF
(Notes 4, 5)
NOTES:
4. C
is used to determine the dynamic power consumption, per channel.
PD
5. PD = V
2
fi (CPD + CL) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage.
CC
UNITSMIN TYP MAX MIN MAX MIN MAX
5
CD54HC245, CD54HCT245, CD74HC245, CD74HCT245CD54HC245, CD54HCT245, CD74HC245, CD74HCT245
Test Circuits and Waveforms
tr = 6ns tf = 6ns
INPUT
90% 50% 10%
V
CC
GND
tr = 6ns
INPUT
2.7V
1.3V
0.3V
= 6ns
t
f
3V
GND
t
INVERTING
OUTPUT
THL
t
PHL
t
PLH
90%
50%
10%
t
TLH
FIGURE 1. HCTRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
6ns 6ns
OUTPUT
DISABLE
OUTPUT LOW
TO OFF
OUTPUT HIGH
TO OFF
50%
t
t
OUTPUTS ENABLED
PLZ
PHZ
10%
90%
90%
10%
t
PZL
t
PZH
OUTPUTS
DISABLED
50%
50%
V
GND
OUTPUTS ENABLED
t
THL
INVERTING
OUTPUT
t
PHL
t
10%
PLH
FIGURE 2. HCTTRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
CC
t
r
OUTPUT
DISABLE
OUTPUT LOW
TO OFF
OUTPUT HIGH
TO OFF
OUTPUTS ENABLED
6ns t
t
PLZ
t
PHZ
10%
90%
f
2.7
1.3
OUTPUTS
DISABLED
1.3V
0.3
t
PZL
t
PZH
90%
6ns
t
TLH
3V
GND
1.3V
1.3V OUTPUTS
ENABLED
FIGURE 3. HC THREE-STATE PROPAGATION DELAY
WAVEFORM
OTHER
INPUTS
TIED HIGH
OR LOW
OUTPUT
DISABLE
NOTE: Open drain waveforms t
PLZ
and t
are the same as those for three-state shown on the left. The test circuit is Output RL=1kΩto
PZL
VCC, CL = 50pF.
FIGURE 5. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT
IC WITH
THREE-
STATE
OUTPUT
FIGURE 4. HCT THREE-STATE PROPAGATION DELAY
WAVEFORM
OUTPUT R
= 1k
L
C
L
50pF
VCC FOR t GND FOR t
PLZ
PHZ
AND t
AND t
PZL
PZH
6
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