• Significant Power Reduction Compared to LSTTL
Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: N
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V
= 0.8V (Max), VIH = 2V (Min)
IL
- CMOS Input Compatibility, I
= 30%, NIH = 30% of V
IL
≤ 1µA at VOL, V
l
C to 125oC
OH
Pinout
CD74HCT242, CD74HC243, CD74HCT243
(PDIP, SOIC)
TOP VIEW
OEB
NC
A0
A1
A2
A3
GND
1
2
3
4
5
6
7
V
14
CC
OEA
13
NC
12
B0
11
B1
10
B2
9
B3
8
Description
The Harris CD74HCT242, CD74HC243 and CD74HCT243
silicon-gate CMOS three-state bidirectional inverting and
non-inverting buffers are intended for two-wayasynchronous
communication between data buses. They have high drive
current outputs which enable high-speed operation when
driving large bus capacitances. These circuits possess the
low power dissipation of CMOS circuits, and have speeds
comparable to low power Schottky TTL circuits. They can
drive 15 LSTTL loads.
The CD74HCT242 is an inverting buffer; the CD74HC243
and CD74HCT243 are non-inverting buffers.
The states of the output enables (
both the direction of flow (A to B, B to A), and the three-state
mode.
CC
OEB, OEA) determine
Ordering Information
TEMP. RANGE
PART NUMBER
CD74HC243E-55 to 12514 Ld PDIPE14.3
CD74HC243M-55 to 12514 Ld SOICM14.15
CD74HCT243M-55 to 12514 Ld SOICM14.15
NOTES:
1. When ordering, use the entire part number. Add the suffix 96 to
obtain the variant in the tape and reel.
2. Wafer or diefor this partnumber is availablewhich meets allelectrical specifications. Please contact your local sales
(oC)PACKAGE
PKG.
NO.
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
NOTE:
H = High Voltage Level
L = Low Voltage Level
I = Input
O = Output (Same Level as Input)
O = Output (Inversion of Input Level)
Z = High Impedance
To prev ent e xcess currents in the High Z modes all I/O terminals should be terminated with 10kΩ to 1MΩ resistors.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θJA is measured with the component mounted on an evaluation PC board in free air.
FIGURE 1. HC AND HCT TRANSITION TIMES AND PROPAGA-
TION DELAY TIMES, COMBINATION LOGIC
6ns6ns
OUTPUT
DISABLE
OUTPUT LOW
TO OFF
OUTPUT HIGH
TO OFF
50%
t
t
OUTPUTS
ENABLED
PLZ
PHZ
10%
90%
90%
10%
t
PZL
t
PZH
OUTPUTS
DISABLED
50%
50%
OUTPUTS
ENABLED
FIGURE 3. HCTHREE-STATE PROPAGATION DELAY
WAVEFORM
V
CC
GND
t
INVERTING
OUTPUT
THL
t
PHL
t
PLH
1.3V
10%
90%
t
TLH
FIGURE 2. HCTTRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
0.3
t
t
6ns
PZL
1.3V
PZH
1.3V
OUTPUTS
ENABLED
t
r
OUTPUT
DISABLE
OUTPUT LOW
TO OFF
OUTPUT HIGH
TO OFF
t
t
OUTPUTS
ENABLED
6nst
PLZ
PHZ
10%
90%
f
2.7
1.3
OUTPUTS
DISABLED
FIGURE 4. HCTTHREE-STATE PROPAGATION DELAY
WAVEFORM
3V
GND
NOTE: Open drain waveforms t
VCC, CL = 50pF.
FIGURE 5. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT
TIED HIGH
and t
PLZ
OTHER
INPUTS
OR LOW
OUTPUT
DISABLE
PZL
IC WITH
THREE-
STATE
OUTPUT
OUTPUT
= 1kΩ
R
L
C
L
50pF
VCC FOR t
GND FOR t
PLZ
PHZ
AND t
AND t
PZL
PZH
are the same as those for three-state shown on the left. The test circuit is Output RL=1kΩto
6
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any product or service without notice, and advise customers to obtain the latest version of relevant information
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pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
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BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
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Copyright 1998, Texas Instruments Incorporated
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