Data sheet acquired from Harris Semiconductor
SCHS265
January 1997
NOT RECOMMENDED
Features
• Buffered Inputs
• Typical Propagation Delay: 7.5ns at V
T
= 25oC, CL = 50pF
A
• Positive Edge Triggered
• CD74FCT824A
- Inverting
• CD74FCT823A
- Noninverting
• SCR Latchup Resistant BiCMOS Process and
FOR NEW DESIGNS
Use CMOS Technology
CC
Pinout
CD74FCT823A
(PDIP)
TOP VIEW
= 5V,
CD74FCT824A
BiCMOS FCT Interface Logic,
9-Bit D-Type Flip-Flops, Three-State
Circuit Design
• Speed of Bipolar FAST™/AS/S
• 48mA Output Sink Current
• Output Voltage Swing Limited to 3.7V at V
• Controlled Output Edge Rates
• Input/Output Isolation to V
CC
• BiCMOS Technology with Low Quiescent Power
Ordering Information
TEMP.
PART NUMBER
CD74FCT823AEN0 to 7024 Ld PDIPE24.3
CD74FCT824AEN0 to 7024 Ld PDIPE24.3
RANGE (oC)PACKAGE
CD74FCT824A
(PDIP)
TOP VIEW
CC
= 5V
PKG.
NO.
OE
D0
D1
D2
D3
D4
D5
D6
D7
D8
MR
GND
1
2
3
4
5
6
7
8
9
10
11
12
24
VCC
Q0
23
22
Q1
Q2
21
20
Q3
19
Q4
Q5
18
17
Q6
16
Q7
15
Q8
14
CE
CP
13
OE
D0
D1
D2
D3
D4
D5
D6
D7
D8
MR
GND
1
2
3
4
5
6
7
8
9
10
11
12
24
VCC
23
Q0
22
Q1
Q2
21
20
Q3
19
Q4
18
Q5
17
Q6
16
Q7
15
Q8
14
CE
CP
13
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
FAST™ is a trademark of Fairchild Semiconductor.
Input Rise and Fall Slew Rate, dt/dv. . . . . . . . . . . . . . . . 0 to 10ns/V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
2. θJA is measured with the component mounted on an evaluation PC board in free air.
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC
CC
CC
Electrical Specifications Commercial Temperature Range 0
o
C to 70oC, VCC Max = 5.25V, VCC Min = 4.75V
AMBIENT TEMPERATURE (TA)
o
C TO 70oC
UNITS
PARAMETERSYMBOL
High Level Input VoltageV
Low Level Input VoltageV
High Level Output VoltageV
Low Level Output VoltageV
High Level Input CurrentI
Low Level Input CurrentI
Three-State Leakage CurrentI
Input Clamp VoltageV
OH
OL
IH
IL
OZH
I
OZL
TEST CONDITIONS
V
VI (V)IO (mA)MINMAXMINMAX
IH
IL
VIH or V
VIH or V
V
CC
-15Min2.4-2.4-V
IL
48Min-0.55-0.55V
IL
(V)
CC
4.75 to 5.252-2-V
4.75 to 5.25-0.8-0.8V
Max-0.1-1µA
25oC0
GNDMax--0.1--1µA
V
CC
Max-0.5-10µA
GNDMax--0.5--10µA
IK
VCC or
-18Min--1.2--1.2V
GND
Short Circuit Output Current
(Note 3)
I
OS
VO = 0
Max-75--75-mA
VCC or
GND
Quiescent Supply Current,
MSI
Additional Quiescent Supply
Current per Input Pin
I
CC
VCC or
0Max-8-80µA
GND
∆I
CC
3.4V
Max-1.6-1.6mA
(Note 4)
TTL Inputs High, 1 Unit Load
NOTES:
3. Not more than one output should be shorted at one time. Test duration should not exceed 100ms.
4. Inputs that are not measured are at VCC or GND.
5. FCT Input Loading:Allinputs are 1 unit load. Unitload is ∆ICClimit specified inElectricalSpecifications table, e.g., 1.6mA Max. at70oC.
8-3
CD74FCT823A, CD74FCT824A
Switching Specifications Over Operating Range FCT Series t
PARAMETERSYMBOLV
, tf = 2.5ns, CL = 50pF, RL (Figure 1)
r
(V)
CC
Propagation Delays(Note 6)
Clock to QCD74FCT823At
Clock to QCD74FCT824At
MR to Qt
Output Enable to QCD74FCT823At
Output Disable to QCD74FCT823At
Output Enable to QCD74FCT824At
Output Disable to QCD74FCT824At
Input: tr=tf= 2.5ns (10% to 90%),unlessotherwise specified
DAT A
INPUT
TIMING
INPUT
ASYNCHRONOUS CONTROL
SYNCHRONOUS CONTROL
PRESET CLEAR
CLOCK ENABLE
ETC.
t
SH
t
REM
t
SH
t
H
t
H
3V
1.5V
0V
3V
1.5V
0V
3V
1.5V
0V
3V
1.5V
0V
LOW-HIGH-LOW
HIGH-LOW-HIGH
PULSE
PULSE
FIGURE 2. SETUP, HOLD, AND RELEASE TIMINGFIGURE 3. PULSE WIDTH
CONTROL INPUT
OUTPUT
NORMALLY LOW
OUTPUT
NORMALLY HIGH
ENABLEDISABLE
t
PZL
SWITCH
CLOSED
t
PZH
SWITCH
OPEN
3.5V
1.5V
1.5V
0V
t
t
PHZ
PLZ
0.3V
0.3V
3V
1.5V
0V
3.5V
V
OL
V
OH
0V
SAME PHASE
INPUT TRANSITION
OUTPUT
OPPOSITE PHASE
INPUT TRANSITION
FIGURE 4. ENABLE AND DISABLE TIMINGFIGURE 5. PROPAGATION DELAY
t
PLH
t
PLH
1.5V
t
W
1.5V
3V
1.5V
t
t
PHL
PHL
0V
V
OH
1.5V
V
OL
3V
1.5V
0V
8-5
Test Circuits and Waveforms
OTHER
OUTPUTS
OUTPUT
UNDER
TEST
(Continued)
V
V
V
V
V
V
OH
OL
OH
OHV
OLP
OL
NOTES:
10. V
is measured with respect to a ground reference near the output under test. V
OLP
is measured with respect to VOH.
OHV
11. Input pulses have the following characteristics:
PRR≤ 1MHz, tr = 2.5ns, tf = 2.5ns, skew 1ns.
12. R.F. fixture with 700MHz design rulesrequired.IC should be soldered into test board and bypassed with 0.1µF capacitor. Scopeand
probes require 700MHz bandwidth.
FIGURE 6. SIMUL TANEOUS SWITCHING TRANSIENT WAVEFORMS
8-6
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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