Texas Instruments CD74ACT541SM, CD74ACT541M96, CD74ACT541M, CD74ACT541E, CD74ACT540M96 Datasheet

The CD54/74AC540, -541, and CD54/74ACT540, -541 octal
buffer/line drivers use the RCA ADV ANCED CMOS technology . The
CD54/74AC/ACT540 are inverting 3-state buffers having two
active-LOW output enables. The CD54/74AC/ACT541 are
non-inverting 3-state buffers having two active-LOW output enables.

The CD74AC540, -541, and CD74ACT540, -541 are supplied in
20-lead dual-in-line plastic packages (E suffix) and in 20-lead
dual-in-line small-outline plastic packages (M suffix). Both package
types are operable over the following temperature ranges: Industrial
(–40 to +85°C) and Extended Industrial/Military (–55 to +125°C).

Data sheet acquired from Harris Semiconductor
SCHS285A – Revised November 1999

The CD54AC540, -541, and CD54ACT540, -541, available in chip
form (H suffix), are operable over the –55 to +125°C temperature
range.

L
H
Z

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

Copyright  1999, Texas Instruments Incorporated

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MAXIMUM RATINGS,

DC SUPPLY-VOLTAGE (VCC) –0.5 to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC INPUT DIODE CURRENT, IIK (for VI < –0.5 or VI > VCC + 0.5 V) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC OUTPUT DIODE CURRENT, IOK (for VO < –0.5 or VO > VCC + 0.5 V) ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC OUTPUT SOURCE OR SINK CURRENT per Output Pin, IO (for VO > –0.5 or VO < VCC + 0.5 V) ±50 mA. . . . . . . . . . . . . . . . . . . . . . .

DC VCC OR GROUND CURRENT (ICC or I

PACKAGE THERMAL IMPEDANCE, θJA (see Note 1): E package 69°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

STORAGE TEMPERATURE (T
LEAD TEMPERATURE (DURING SOLDERING):

At distance 1/16 ± 1/32 in. (1.59 ± 0.79 mm) from case for 10 s maximum +265°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Unit inserted into PC board min. thickness 1/16 in. (1.59 mm) with solder contacting lead tips only +300°C. . . . . . . . . . . . . . . . . . . . . . . .

* For up to 4 outputs per device: add ±25 mA for each additional output.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51.

Absolute-Maximum Values:

GND

) –65 to +150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

stg

) ±100 mA*. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

M package 58°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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