• SCR-Latchup-Resistant CMOS Process and Circuit
Design
• Speed of Bipolar FAST™/AS/S with Significantly
Reduced Power Consumption
• Balanced Propagation Delays
• AC Types Feature 1.5V to 5.5V Operation and
Balanced Noise Immunity at 30% of the Supply
• ±24mA Output Drive Current
- Fanout to 15 FAST™ ICs
- Drives 50Ω Transmission Lines
= 5V, TA = 25oC, CL = 50pF
CC
Pinout
1A0
1A1
1Y0
1Y1
1Y2
1Y3
GND
Dual 2-to-4-Line Decoder/Demultiplexer
Description
The CD74AC139 and CD74ACT139 are dual 2-to-4-line
decoders/demultiplexers that utilize the Harris Advanced
CMOS Logic technology. These devices contain two independent binary to one-of-four decoders, each with a single
active LOW enable input (
inputs (1A0 and 1A1 or 2A0 and 2A1) cause one of the four
normally HIGH outputs to go LOW.
If the enable inputisHIGH,allfour outputs remain HIGH. For
demultiplexer operation, the enable input is the data input.
The enable input also functions as a chip select when these
devices are cascaded.
Ordering Information
PART
NUMBER
CD74AC139E0 to 70oC, -40 to 85,
CD74ACT139E0 to 70oC, -40 to 85,
CD74AC139M96 0 to 70oC, -40 to 85,
CD74ACT139M0 to 70oC, -40 to 85,
NOTES:
1. When ordering, use the entire part number. Add the suffix 96 to
obtain the variant in the tape and reel.
2. Wafer and die for this part number is availablewhich meets all electrical specifications. Please contact your local sales office or Harris
customer service for ordering information.
CD74AC139, CD74ACT139
(PDIP, SOIC)
TOP VIEW
V
1E
1
2
3
4
5
6
7
8
16
15
2E
14
2A0
13
2A1
12
2Y0
11
2Y1
10
2Y2
9
2Y3
CD74ACT139
1E or 2E). Data on the select
TEMP.
RANGE (oC)PACKAGE
16 Ld PDIPE16.3
-55 to 125
16 Ld PDIPE16.3
-55 to 125
16 Ld SOICM16.15
-55 to 125
16 Ld SOICM16.15
-55 to 125
CC
PKG.
NO.
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
FAST™ is a Trademark of Fairchild Semiconductor.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
3. For up to 4 outputs per device, add ±25mA for each additional output.
4. Unless otherwise specified, all voltages are referenced to ground.
5. θJA is measured with the component mounted on an evaluation PC board in free air.
AdditionalSupply Current per
Input Pin TTL Inputs High
I
CC
VCC or
GND
∆I
CC
V
CC
-2.1
05.5-8-80-160µA
-4.5 to
-2.4-2.8-3mA
5.5
1 Unit Load
NOTES:
6. Test one output at a time for a 1-second maximum duration. Measurement is made by forcing current and measuring voltage to minimize
power dissipation.
o
7. Test verifies a minimum 50Ω transmission-line-drive capability at 85
C, 75Ω at 125oC.
-40oC TO
85oC
-55oC TO
125oC
UNITSV
ACT Input Load Table
INPUTUNIT LOAD
A0, A11
E0.67
NOTE: Unit load is ∆ICClimit specified in DC ElectricalSpecifications
Table, e.g., 2.4mA max at 25oC.
4
CD74AC139, CD74ACT139
Switching Specifications Input t
, tf = 3ns, CL= 50pF (Worst Case)
r
-40oC TO 85oC-55oC TO 125oC
PARAMETERSYMBOL V
CC
(V)
AC TYPES
Propagation Delay, A0, A1 to
Outputs
t
PLH
, t
PHL
1.5--119--131ns
3.3
3.9-13.43.7-14.7ns
(Note 9)
5
2.8-9.52.6-10.5ns
(Note 10)
Propagation Delay,
E to Outputs
t
PLH
, t
PHL
1.5--119--131ns
3.13.9-13.43.7-14.7ns
52.8-9.52.6-10.5ns
Input CapacitanceC
Power Dissipation CapacitanceC
I
PD
-- -10- -10pF
--83--83-pF
(Note 11)
ACT TYPES
Propagation Delay, A0, A1 to
Outputs
Propagation Delay,
t
PLH
t
PLH
, t
PHL
5
3.1-10.52.9-11.5ns
(Note 10)
, t
PHL
53.2-10.93-12ns
E to Outputs
Input CapacitanceC
Power Dissipation CapacitanceC
I
PD
-- -10- -10pF
--83--83-pF
(Note 11)
NOTES:
8. Limits tested at 100%.
9. 3.3V Min at 3.6V, Max at 3V.
10. 5V Min at 5.5V, Max at 4.5V.
11. CPD is used to determine the dynamic power consumption per decoder/demultiplexer.
AC: PD = V
ACT: PD = V
2
fi(CPD + CL)
CC
2
fi(CPD + CL) + VCC∆ICC where fi = input frequency, CL = output load capacitance, VCC = supply voltage.
CC
UNITSMINTYPMAXMINTYPMAX
tr = 3ns
INPUT E
t
PLH
INPUT Y3
FIGURE 1.
tf = 3ns
t
PHL
90%
V
S
10%
V
3ns3ns
90%
V
S
INPUT
LEVEL
GND
S
10%
V
t
PHL
S
t
PLH
INPUT
LEVEL
A1
GND
OUTPUT
Y3
FIGURE 2.
5
DUT
OUTPUT
R
L
CD74AC139, CD74ACT139
(NOTE)
500Ω
OUTPUT
LOAD
C
L
50pF
NOTE: For AC Series Only: When VCC = 1.5V, RL = 1kΩ.
CD74ACCD74ACT
Input LevelV
Input Switching Voltage, V
Output Switching Voltage, V
S
S
0.5 V
0.5 V
CC
CC
CC
FIGURE 3. PROPAGATION DELAY TIMES
3V
1.5V
0.5 V
CC
6
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
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pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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