• Significant Power Reduction Compared to LSTTL
Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: N
= 30%, NIH = 30% of V
IL
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V
= 0.8V (Max), VIH = 2V (Min)
IL
- CMOS Input Compatibility, I
≤ 1µA at VOL, V
l
CC
= 5V,
o
C to 125oC
CD74HC541, CD74HCT541
High Speed CMOS Logic
Octal Buffer and Line Drivers, Three-State
Description
The Harris CD74HC540 and CD74HCT540 are Inverting
Octal Buffers and Line Drivers with Three-State Outputs and
the capability to drive 15 LSTTL loads. The Harris
CD74HC541 and CD74HCT541 are Non-Inverting Octal Buffers and Line Drivers with Three-State Outputs that can drive
OH
15 LSTTL loads. The Output Enables (
trol the Three-State Outputs. If either
outputs will be in the high impedance state. For data output
OE1 and OE2 both must be LOW.
Ordering Information
TEMP.
CC
PART NUMBER
CD74HC540E-55 to 12520 Ld PDIPE20.3
CD74HCT540E-55 to 12520 Ld PDIPE20.3
CD74HC541E-55 to 12520 Ld PDIPE20.3
CD74HCT541E-55 to 12520 Ld PDIPE20.3
CD74HC540M-55 to 12520 Ld SOICM20.3
CD74HCT540M-55 to 12520 Ld SOICM20.3
CD74HC541M-55 to 12520 Ld SOICM20.3
CD74HCT541M-55 to 12520 Ld SOICM20.3
NOTES:
1. When ordering, use the entire partnumber. Add thesuffix 96 to
obtain the variant in the tape and reel.
2. Wafer and die forthis part number is availablewhich meets all
electrical specifications.Please contact yourlocal sales office or
Harris customer service for ordering information.
RANGE (oC)PACKAGE
OE1) and (OE2) con-
OE1 or OE2 is HIGH the
PKG.
NO.
Pinouts
CD74HC540, CD74HCT540
(PDIP, SOIC)
TOP VIEW
1
OE
A0
2
A1
3
A2
4
A3
5
A4
6
A5
7
8
A6
9
A7
GND
10
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θJA is measured with the component mounted on an evaluation PC board in free air.
is used to determine the dynamic power consumption, per channel.
PD
5. PD = V
2
fi (CPD + CL) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage.
CC
Test Circuits and Waveforms
tr = 6nstf = 6ns
t
PHL
90%
50%
10%
t
10%
PLH
INPUT
t
INVERTING
OUTPUT
THL
TEST
CONDITIONS V
CC
(V)
25
o
C
-40oC TO
85oC
-55oC TO
125oC
--20-20-20-20pF
CL = 15pF5-55-----pF
= 6ns
t
PLH
t
f
1.3V
10%
90%
t
3V
GND
TLH
90%
50%
t
TLH
V
CC
GND
tr = 6ns
INPUT
t
INVERTING
OUTPUT
THL
t
2.7V
1.3V
0.3V
PHL
UNITSMINTYPMAXMINMAXMINMAX
FIGURE 1. HC TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
6ns6ns
OUTPUT
DISABLE
OUTPUT LOW
TO OFF
OUTPUT HIGH
TO OFF
50%
t
t
OUTPUTS
ENABLED
PLZ
PHZ
10%
90%
90%
10%
t
PZL
t
PZH
OUTPUTS
DISABLED
50%
50%
FIGURE 3. HC THREE-STATEPROPAGATION DELAY
WAVEFORM
V
CC
GND
OUTPUTS
ENABLED
FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
t
0.3
t
PZL
PZH
6ns
1.3V
1.3V
OUTPUTS
ENABLED
t
r
OUTPUT
DISABLE
OUTPUT LOW
TO OFF
OUTPUT HIGH
TO OFF
t
t
OUTPUTS
ENABLED
6nst
PLZ
PHZ
10%
90%
f
2.7
1.3
OUTPUTS
DISABLED
FIGURE 4. HCT THREE-STATEPROPAGATION DELAY
WAVEFORM
3V
GND
6
Test Circuits and Waveforms
(Continued)
NOTE: Opendrain waveforms t
VCC, CL = 50pF.
FIGURE 5. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT
TIED HIGH
and t
PLZ
OTHER
INPUTS
OR LOW
OUTPUT
DISABLE
PZL
IC WITH
THREE-
STATE
OUTPUT
OUTPUT
= 1kΩ
R
L
C
L
50pF
VCC FOR t
GND FOR t
PLZ
PHZ
AND t
AND t
PZL
PZH
are the sameas those for three-state shown on the left. Thetest circuit is Output RL=1kΩto
7
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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