CD74HC670,
[ /Title
(CD74H
C670,
CD74H
CT670)
Subject
(HighSpeed
CMOS
Logic
4x4 Register
Data sheet acquired from Harris Semiconductor
SCHS195
January 1998
Features
• Simultaneous and Independent Read and Write
Operations
• Expandable to 512 Words of n-Bits
• Three-State Outputs
• Organized as 4 Words x 4 Bits Wide
• Buffered Inputs
• Typical Read Time = 16ns for CD74HC670 V
= 15pF, TA = 25oC
• Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
• Wide Operating Temperature Range . . . -55
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL
Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: N
= 30%, NIH = 30% of V
IL
o
=5V,C
CC
C to 125oC
CC
CD74HCT670
High-Speed CMOS Logic
4x4 Register File
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V
= 0.8V (Max), VIH = 2V (Min)
IL
- CMOS Input Compatibility, I
Description
The Harris CD74HC670 and CD74HCT670 are 16-bit register
L
files organized as 4 words x 4 bits each. Read and write
address and enableinputs allow simultaneous writing into one
location while reading another. Four data inputs are provided
to store the 4-bit word. The write address inputs (WA0 and
WA1)determine the location of the stored word in the register.
When write enable (
address location and it remains transparent to the data. The
outputs will reflect the true form of the input data. When (
is high data and address inputs are inhibited. Data acquisition
from the four registers is made possible by the read address
inputs (RA1 and RA0). The addressed word appears at the
output when the read enable (
high impedance state when the (
tied together to increase the word capacity to 512 x 4 bits.
WE) is low the word is entered into the
Ordering Information
≤ 1µA at VOL, V
l
RE) is low. The output is in the
RE) is high. Outputs can be
OH
WE)
Pinout
CD74HC670, CD74HCT670
(PDIP, SOIC)
TOP VIEW
D1
D2
D3
RA1
RA0
Q3
Q2
GND
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC
D0
WA0
WA1
WE
RE
Q0
Q1
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© Harris Corporation 1998
1
File Number 1660.1
Functional Diagram
CD74HC670, CD74HCT670CD74HC670, CD74HCT670
15
D0
1
D1
2
D2
3
D3
12
WE
11
RE
RA1
RA0
WA0
WA1
4
WRITE MODE SELECT TABLE
INPUTS INTERNAL
OPERATING
MODE
N
LATCHES
(NOTE 3)WE D
Write Data L L L
LHH
Data Latched H X No Change
NOTE:
3. The WriteAddress (WA0 andWA1) to the“internal latches”must
be stable while WE is LOW for conventional operation.
10
Q0
9
Q1
7
Q2
6
Q3
514 13
READ MODE SELECT TABLE
INPUTS
INTERNAL
OPERATING
MODE
RE
LATCHES
(NOTE 4)
Read L L L
LHH
Disabled H X (Z)
NOTE:
4. The selectionof the “internal latches” byRead Address(RA0 and
RA1) are not constrained by WE or RE operation.
H = High Voltage Level
L = Low Voltage Level
X= Don’t Care
Z = High Impedance “Off” State
OUTPUT
Q
N
2
CD74HC670, CD74HCT670CD74HC670, CD74HCT670
Absolute Maximum Ratings Thermal Information
DC Supply Voltage, VCC. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, I
IK
For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, I
OK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Drain Current, per Output, I
O
For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±35mA
DC Output Source or Sink Current per Output Pin, I
O
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, V
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to V
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
5. θJA is measured with the component mounted on an evaluation PC board in free air.
CC
Thermal Resistance (Typical, Note 5) θJA (oC/W)
PDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
CC
DC Electrical Specifications
PARAMETER SYMBOL
HC TYPES
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage
CMOS Loads
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
V
IH
V
IL
V
OH
V
OL
I
I
TEST
CONDITIONS
(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
I
V
CC
(V)
o
C -40oC TO 85oC -55oCTO125oC
25
UNITSV
- - 2 1.5 - - 1.5 - 1.5 - V
4.5 3.15 - - 3.15 - 3.15 - V
6 4.2 - - 4.2 - 4.2 - V
- - 2 - - 0.5 - 0.5 - 0.5 V
4.5 - - 1.35 - 1.35 - 1.35 V
6 - - 1.8 - 1.8 - 1.8 V
VIHor VIL-0.02 2 1.9 - - 1.9 - 1.9 - V
-0.02 4.5 4.4 - - 4.4 - 4.4 - V
-0.02 6 5.9 - - 5.9 - 5.9 - V
- - ---- - - - V
-6 4.5 3.98 - - 3.84 - 3.7 - V
-7.8 6 5.48 - - 5.34 - 5.2 - V
VIHor VIL0.02 2 - - 0.1 - 0.1 - 0.1 V
0.02 4.5 - - 0.1 - 0.1 - 0.1 V
0.02 6 - - 0.1 - 0.1 - 0.1 V
- - ---- - - - V
6 4.5 - - 0.26 - 0.33 - 0.4 V
7.8 6 - - 0.26 - 0.33 - 0.4 V
VCC or
-6--±0.1 - ±1-±1µA
GND
3