• Logic-Level Translation to Enable 5V Logic to
Accommodate ±5V Analog Signals
• Wide Operating Temperature Range . . . -55
• HC Types
- 2V to 10V Operation
- High Noise Immunity: N
at VCC = 5V
• HCT Types
- Direct LSTTL Input Logic Compatibility,
V
= 0.8V (Max), VIH = 2V (Min)
IL
- CMOS Input Compatibility, I
= 30%, NIH = 30% of V
IL
≤ 1µA at VOL, V
l
CC
CC
- VEE = 9V
CC
o
C to 125oC
OH
CD74HCT4316
High-Speed CMOS Logic
Quad Analog Switch with Level Translation
Description
The Harris CD74HC4316 and CD74HCT4316 contains four
independent digitally controlled analog switches that use
silicon-gate CMOS technology to achieve operating speeds
= 4.5V
= 6V
similar to LSTTL with the low power consumption of
standard CMOS integrated circuits.
In addition these devices contain logic-level translation
circuits that provide for analog signal switching of voltages
between ±5V via 5V logic. Each switch is turned on by a
high-level voltage on its select input (S) when the common
Enable (E) is Low. A High E disables all switches. The digital
inputs can swing between V
inputs/outputs can swing between V
and V
Figures 2 and 3.
as a negative limit. Voltage ranges are shown in
EE
and GND; the analog
CC
as a positive limit
CC
Ordering Information
TEMP. RANGE
CC
PART NUMBER
CD74HC4316E-55 to 12516 Ld PDIPE16.3
CD74HCT4316E-55 to 12516 Ld PDIPE16.3
CD74HC4316M-55 to 12516 Ld SOICM16.15
CD74HCT4316M-55 to 12516 Ld SOICM16.15
NOTES:
1. When ordering, use the entire part number. Add the suffix 96 to
obtain the variant in the tape and reel.
2. Wafer and die is available which meets all electrical
specifications. Please contact your local sales office or Harris
customer service for ordering information.
(oC)PACKAGE
PKG.
NO.
Pinout
CD74HC4316, CD74HCT4316
(PDIP, SOIC)
TOP VIEW
V
1
1Z
2
1Y
2Y
3
2Z
4
5
2S
3S
6
7
E
GND
8
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θJA is measured with the component mounted on an evaluation PC board in free air.
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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