TEXAS INSTRUMENTS CD54HC32 Technical data

Data sheet acquired from Harris Semiconductor

[
(
H
,
C
H
C
H
)
/
j
(

SCHS274C

September 1997 - Revised September 2003

CD54HC32, CD74HC32,

CD54HCT32, CD74HCT32

High-Speed CMOS Logic

Quad 2-Input OR Gate

/Title
CD54

CT32

D74
C32,
D74
CT32

Sub­ect
High

Features

• Typical Propagation Delay: 7ns at VCC = 5V,
C

= 15pF, TA = 25oC

L

• Fanout (Over Temperature Range)

- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads

- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads

o

• Wide Operating Temperature Range . . . -55

• Balanced Propagation Delay and Transition Times

• Significant Power Reduction Compared to LSTTL
Logic ICs

• HC Types

- 2V to 6V Operation

- High Noise Immunity: N

at VCC = 5V

• HCT Types

- 4.5V to 5.5V Operation

- Direct LSTTL Input Logic Compatibility,

V

= 0.8V (Max), VIH = 2V (Min)

IL

- CMOS Input Compatibility, I

= 30%, NIH = 30% of V

IL

≤ 1µA at VOL, V

l

C to 125oC

OH

Description

The ’HC32 and ’HCT32 contain four 2-input OR gates in one
package. Logic gates utilize silicon gate CMOS technology
to achieve operating speeds similar to LSTTL gates with the
low power consumption of standard CMOS integrated cir­cuits. All devices have the ability to drive 10 LSTTL loads.
The HCT logic family is functionally pin compatible with the
standard LS logic family.

Ordering Information

TEMP. RANGE

CC

PART NUMBER

CD54HC32F3A -55 to 125 14 Ld CERDIP
CD54HCT32F3A -55 to 125 14 Ld CERDIP
CD74HC32E -55 to 125 14 Ld PDIP
CD74HC32M -55 to 125 14 Ld SOIC
CD74HC32MT -55 to 125 14 Ld SOIC
CD74HC32M96 -55 to 125 14 Ld SOIC
CD74HCT32E -55 to 125 14 Ld PDIP
CD74HCT32M -55 to 125 14 Ld SOIC

(oC) PACKAGE

Pinout

CD74HCT32MT -55 to 125 14 Ld SOIC
CD74HCT32M96 -55 to 125 14 Ld SOIC

NOTE: Whenordering, usetheentire part number.The suffix 96
denotes tape and reel. The suffix T denotes a small-quantity reel
of 250.

CD54HC32, CD54HCT32

(CERDIP)

CD74HC32, CD74HCT32

(PDIP, SOIC)

TOP VIEW

1A

1
2

1B

3

1Y

4

2A

5

2B

6

2Y

7

GND

14

V

CC

4B

13
12

4A
4Y

11

3B

10

3A

9

3Y

8

CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright

© 2003, Texas Instruments Incorporated.

1

Functional Diagram

CD54HC32, CD74HC32, CD54HCT, CD74HCT32

1A

1B

1Y

2A

2B

2Y

GND

1

2

3

4

5

6

7

14

V

CC

13

4B

12

4A

11

4Y

10

3B

9

3A

8

3Y

TRUTH TABLE

INPUTS OUTPUT

nA nB nY

LLL
LHH
HLH
HHH

H = High Voltage Level, L = Low Voltage Level

HC Logic Symbol HCT Logic Symbol

nA

nY

nB

nA

nB

nY

2

CD54HC32, CD74HC32, CD54HCT, CD74HCT32

Absolute Maximum Ratings Thermal Information

DC Supply Voltage, VCC. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V

DC Input Diode Current, I

IK

For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA

DC Output Diode Current, I

OK

For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA

DC Output Source or Sink Current per Output Pin, I

O

For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA

DC VCC or Ground Current, I

CC orIGND

. . . . . . . . . . . . . . . . . .±50mA

Operating Conditions

Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC

Supply Voltage Range, V

HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V

HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V

DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to V

Input Rise and Fall Time

2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)

4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)

6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:

1. The package thermal impedance is calculated in accordance with JESD 51-7.

CC

Thermal Resistance (Typical, Note 1) θJA (oC/W)

E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .80

M (SOIC) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

Maximum Junction Temperature (Hermetic P ac kage or Die) . . . 175oC

Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC

Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC

Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . .300oC

(SOIC - Lead Tips Only)

CC

DC Electrical Specifications

PARAMETER SYMBOL

HC TYPES

High Level Input
Voltage

Low Level Input
Voltage

High Level Output
Voltage
CMOS Loads

High Level Output
Voltage
TTL Loads

Low Level Output
Voltage
CMOS Loads

Low Level Output
Voltage
TTL Loads

Input Leakage
Current

Quiescent Device
Current

V

IH

V

IL

V

OH

V

OL

I

I

I

CC

TEST

CONDITIONS

25oC -40oC TO 85oC -55oC TO 125oC

VCC (V)

- - 2 1.5 - - 1.5 - 1.5 - V

4.5 3.15 - - 3.15 - 3.15 - V
6 4.2 - - 4.2 - 4.2 - V

- - 2 - - 0.5 - 0.5 - 0.5 V

4.5 - - 1.35 - 1.35 - 1.35 V
6 - - 1.8 - 1.8 - 1.8 V

VIH or

V

-0.02 2 1.9 - - 1.9 - 1.9 - V

IL

-0.02 4.5 4.4 - - 4.4 - 4.4 - V

-0.02 6 5.9 - - 5.9 - 5.9 - V

-4 4.5 3.98 - - 3.84 - 3.7 - V

-5.2 6 5.48 - - 5.34 - 5.2 - V

VIH or

V

0.02 2 - - 0.1 - 0.1 - 0.1 V

IL

0.02 4.5 - - 0.1 - 0.1 - 0.1 V

0.02 6 - - 0.1 - 0.1 - 0.1 V
4 4.5 - - 0.26 - 0.33 - 0.4 V

5.2 6 - - 0.26 - 0.33 - 0.4 V

VCC or

-6--±0.1 - ±1-±1 µA

GND

VCC or

0 6 - - 2 - 20 - 40 µA

GND

UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX

3

CD54HC32, CD74HC32, CD54HCT32, CD74HCT32

DC Electrical Specifications (Continued)

TEST

CONDITIONS

PARAMETER SYMBOL

HCT TYPES

High Level Input
Voltage

Low Level Input
Voltage

High Level Output
Voltage
CMOS Loads

High Level Output
Voltage
TTL Loads

Low Level Output
Voltage
CMOS Loads

Low Level Output
Voltage
TTL Loads

Input Leakage
Current

Quiescent Device
Current

Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load

V

IH

V

IL

V

OH

V

OL

I

I

I

CC

∆I

CC

(Note 2)

- - 4.5 to

- - 4.5 to

VIH or

V

VIH or

V

V

CC

-0.02 4.5 4.4 - - 4.4 - 4.4 - V

IL

-0.02 4.5 - - 0.1 - 0.1 - 0.1 V

IL

and

GND

VCC or

GND

V

CC

-2.1

25oC -40oC TO 85oC -55oC TO 125oC

VCC (V)

UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX

2-- 2 - 2 - V

5.5

- - 0.8 - 0.8 - 0.8 V

5.5

-4 4.5 3.98 - - 3.84 - 3.7 - V

4 4.5 - - 0.26 - 0.33 - 0.4 V

- 5.5 - ±0.1 - ±1-±1 µA

0 5.5 - - 2 - 20 - 40 µA

- 4.5 to

- 100 360 - 450 - 490 µA

5.5

NOTE:

2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.

HCT Input Loading Table

INPUT UNIT LOADS

All 1.5

NOTE: Unit Load is ∆ICClimit specified in DC Electrical
Specifications table, e.g., 360µA max at 25oC.

Switching Specifications Input t

PARAMETER SYMBOL

HC TYPES

Propagation Delay, Input to
Output (Figure 1)

PropagationDelay,DataInputto
Output Y

Transition Times (Figure 1) t

t

PLH

t

PLH

TLH

, tf = 6ns

r

, t

PHLCL

, t

PHLCL

, t

THLCL

TEST

CONDITIONS

V

CC

(V)

25oC -40oC TO 85oC -55oC TO 125oC

= 50pF 2 - - 90 - 115 - 135 ns

4.5 - - 18 - 23 - 27 ns
6 - - 15 - 20 - 23 ns

= 15pF 5 - 7 - ----ns

= 50pF 2 - - 75 - 95 - 110 ns

4.5 - - 15 - 19 - 22 ns
6 - - 13 - 16 - 19 ns

UNITSMIN TYP MAX MIN MAX MIN MAX

4

CD54HC32, CD74HC32, CD54HCT, CD74HCT32

Switching Specifications Input t

PARAMETER SYMBOL

Input Capacitance C
Power Dissipation Capacitance

, tf = 6ns (Continued)

r

TEST

CONDITIONS

I

C

PD

- - - - 10 - 10 - 10 pF

- 5-22-----pF

V

CC

(V)

(Notes 3, 4)

HCT TYPES

Propagation Delay, Input to

t

RHL

, t

PHLCL

= 50pF 4.5 - - 24 - 30 - 36 ns

Output (Figure 2)
PropagationDelay,DataInputto

t

PLH

, t

PHLCL

= 15pF 5 - 9 - ----ns

Output Y
Transition Times (Figure 2) t
Input Capacitance C
Power Dissipation Capacitance

TLH

, t

I

C

PD

THLCL

= 50pF 4.5 - - 15 - 19 - 22 ns

- - - - 10 - 10 - 10 pF

- 5-22-----pF

(Notes 3, 4)

NOTES:

3. CPD is used to determine the dynamic power consumption, per gate.

4. PD = V

2

fi (CPD + CL) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage.

CC

Test Circuits and Waveforms

25oC -40oC TO 85oC -55oC TO 125oC

UNITSMIN TYP MAX MIN MAX MIN MAX

tr = 6ns tf = 6ns

V

t

CC

GND

TLH

INPUT

t

INVERTING

OUTPUT

THL

t

PHL

90%
50%
10%

t

90%

50%

10%

PLH

FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGA-

TION DELAY TIMES, COMBINATION LOGIC

= 6ns

t

PLH

t

f

1.3V

10%

90%

t

3V

GND

TLH

tr = 6ns

INPUT

t

INVERTING

OUTPUT

THL

t

PHL

2.7V

1.3V

0.3V

FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION

DELAY TIMES, COMBINATION LOGIC

5

PACKAGE OPTION ADDENDUM

www.ti.com

PACKAGING INFORMATION

Orderable Device Status

5962-8685201CA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type

CD54HC32F3A ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type

CD54HCT32F ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type

CD54HCT32F3A ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type

CD74HC32E ACTIVE PDIP N 14 25 Pb-Free

CD74HC32EE4 ACTIVE PDIP N 14 25 Pb-Free

CD74HC32M ACTIVE SOIC D 14 50 Green (RoHS &

CD74HC32M96 ACTIVE SOIC D 14 2500 Green (RoHS &

CD74HC32M96E4 ACTIVE SOIC D 14 2500 Green (RoHS &

CD74HC32M96G4 ACTIVE SOIC D 14 2500 Green (RoHS &

CD74HC32ME4 ACTIVE SOIC D 14 50 Green (RoHS &

CD74HC32MG4 ACTIVE SOIC D 14 50 Green (RoHS &

CD74HC32MT ACTIVE SOIC D 14 250 Green (RoHS &

CD74HC32MTE4 ACTIVE SOIC D 14 250 Green(RoHS &

CD74HC32MTG4 ACTIVE SOIC D 14 250 Green (RoHS &

CD74HCT32E ACTIVE PDIP N 14 25 Pb-Free

CD74HCT32EE4 ACTIVE PDIP N 14 25 Pb-Free

CD74HCT32M ACTIVE SOIC D 14 50 Green (RoHS &

CD74HCT32M96 ACTIVE SOIC D 14 2500 Green (RoHS &

CD74HCT32M96E4 ACTIVE SOIC D 14 2500 Green (RoHS &

CD74HCT32M96G4 ACTIVE SOIC D 14 2500 Green (RoHS &

CD74HCT32ME4 ACTIVE SOIC D 14 50 Green (RoHS &

CD74HCT32MG4 ACTIVE SOIC D 14 50 Green (RoHS &

CD74HCT32MT ACTIVE SOIC D 14 250 Green (RoHS &

CD74HCT32MTE4 ACTIVE SOIC D 14 250 Green(RoHS &

CD74HCT32MTG4 ACTIVE SOIC D 14 250 Green (RoHS &

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

no Sb/Br)

no Sb/Br)

no Sb/Br)

no Sb/Br)

no Sb/Br)

no Sb/Br)

no Sb/Br)

no Sb/Br)

no Sb/Br)

no Sb/Br)

no Sb/Br)

no Sb/Br)

no Sb/Br)

no Sb/Br)

no Sb/Br)

no Sb/Br)

no Sb/Br)

no Sb/Br)

(RoHS)

(RoHS)

(RoHS)

(RoHS)

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU N / A for Pkg Type

CU NIPDAU N / A for Pkg Type

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU N / A for Pkg Type

CU NIPDAU N / A for Pkg Type

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

9-Oct-2007

(3)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

(1)

The marketing status values are defined as follows:

9-Oct-2007

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

TAPE AND REEL INFORMATION

11-Mar-2008

*All dimensions are nominal

Device Package

Type

CD74HC32M96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1

CD74HCT32M96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1

Package
Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1

(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

11-Mar-2008

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

CD74HC32M96 SOIC D 14 2500 346.0 346.0 33.0

CD74HCT32M96 SOIC D 14 2500 346.0 346.0 33.0

Pack Materials-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Clocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrol
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
RFID www.ti-rfid.com Telephony www.ti.com/telephony
RF/IF and ZigBee® Solutions www.ti.com/lprf Video & Imaging www.ti.com/video

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2008, Texas Instruments Incorporated

Wireless www.ti.com/wireless