±24-mA Output Drive Current
– Fanout to 15 F Devices
D
SCR-Latchup-Resistant CMOS Process and
Circuit Design
D
Exceeds 2-kV ESD Protection Per
MIL-STD-883, Method 3015
1A
1B
NC
1C
1D
1Y
GND
1
2
3
4
5
6
7
14
13
12
11
10
V
CC
2D
2C
NC
2B
9
2A
8
2Y
description/ordering information
The ’ACT20 devices contain two independent 4-input NAND gates. They perform the Boolean function
Y = A
• B • C • D or Y = A + B + C + D in positive logic.
ORDERING INFORMA TION
T
A
PDIP – ETubeCD74ACT20ECD74ACT20E
–
CDIP – FTubeCD54ACT20F3ACD54ACT20F3A
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
PACKAGE
–
†
TubeCD74ACT20M
Tape and reelCD74ACT20M96
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
logic diagram (positive logic)
1
1A
2
1B
4
1C
5
1D
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
FUNCTION TABLE
(each gate)
INPUTS
ABCD
HHHHL
LXXX H
XLXX H
XXLX H
XXXLH
68
1Y
2A
2B
2C
2D
OUTPUT
Y
9
10
12
13
2Y
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 2002, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
absolute maximum ratings over operating free-air temperature range
Supply voltage range, V
Input clamp current, I
Output clamp current, I
Continuous output current, I
Continuous current through V
Package thermal impedance, θ
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
CC
CC
–40°C to
85°C
0V
0V
CC
CC
UNIT
V
V
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CD54ACT20, CD74ACT20
CC
V
V
V
or V
V
V
V
V
or V
V
(INPUT)
(OUTPUT)
A, B, C, or D
Y
ns
DUAL 4-INPUT POSITIVE-NAND GATES
SCHS320 – NOVEMBER 2002
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETERTEST CONDITIONSV
IOH = –50 µA4.5 V4.44.44.4
=
OH
OL
I
I
I
CC
‡
D
I
CC
C
†
‡
i
T est one output at a time, not exceeding 1-second duration. Measurement is made by forcing indicated current and measuring voltage to minimize
power dissipation. T est verifies a minimum 50-Ω transmission-line drive capability at 85°C and 75-Ω transmission-line drive capability at 125°C.
Additional quiescent supply current per input pin, TTL inputs high, 1 unit load
I
IH
IL
=
I
IH
IL
VI = VCC or GND5.5 V±0.1±1±1µA
VI = VCC or GND,IO = 05.5 V48040µA
VI = VCC – 2.1 V4.5 V to 5.5 V2.432.8mA
IOH = –24 mA4.5 V3.943.73.8
IOH = –50 mA
IOH = –75 mA
IOL = 50 µA4.5 V0.10.10.1
IOL = 24 mA4.5 V0.360.50.44
IOL = 50 mA
IOL = 75 mA
†
†
†
†
5.5 V3.85
5.5 V3.85
5.5 V1.65
5.5 V1.65
TA = 25°C
MINMAXMINMAXMINMAX
–55°C to
125°C
101010pF
–40°C to
85°C
UNIT
ACT INPUT LOAD TABLE
INPUT
All0.27
Unit Load is ∆ICC limit specified in
electrical characteristics table
(e.g., 2.4 mA at 25°C).
UNIT LOAD
switching characteristics over recommended operating free-air temperature range,
V
= 5 V ± 0.5 V, CL = 50 pF (unless otherwise noted) (see Figure 1)
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns.
Phase relationships between waveforms are arbitrary.
D. For clock inputs, f
E. The outputs are measured one at a time with one input transition per measurement.
F. t
G. t
H. t
PLH
PZL
PLZ
and t
and t
and t
PHL
PZH
PHZ
is measured with the input duty cycle at 50%.
max
are the same as tpd.
are the same as ten.
are the same as t
5962-0051301QCAACTIVECDIPJ141TBDA42 SNPBN / A for Pkg Type
CD54ACT20F3AACTIVECDIPJ141TBDA42 SNPBN / A for Pkg Type
CD74ACT20EACTIVEPDIPN1425Pb-Free
CD74ACT20EE4ACTIVEPDIPN1425Pb-Free
CD74ACT20MACTIVESOICD1450Green (RoHS &
no Sb/Br)
CD74ACT20M96ACTIVESOICD142500 Green (RoHS &
no Sb/Br)
CD74ACT20M96E4ACTIVESOICD142500 Green (RoHS &
no Sb/Br)
CD74ACT20M96G4ACTIVESOICD142500 Green (RoHS &
no Sb/Br)
CD74ACT20ME4ACTIVESOICD1450Green (RoHS &
no Sb/Br)
CD74ACT20MG4ACTIVESOICD1450Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAUN / A for Pkg Type
CU NIPDAUN / A for Pkg Type
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
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incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.