Texas Instruments CD74ACT174M96, CD74ACT174M, CD74ACT174E, CD74AC174M96, CD74AC174M Datasheet

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1
Data sheet acquired from Harris Semiconductor SCHS241A
Features
• Buffered Inputs
• Typical Propagation Delay
- 6.4ns at V
CC
= 5V, TA = 25oC, CL = 50pF
• Exceeds 2kV ESD Protection MIL-STD-883, Method 3015
• SCR-Latchup-Resistant CMOS Process and Circuit Design
• Speed of Bipolar FAST™/AS/S with Significantly Reduced Power Consumption
• Balanced Propagation Delays
• AC Types Feature 1.5V to 5.5V Operation and Balanced Noise Immunity at 30% of the Supply
±24mA Output Drive Current
- Fanout to 15 FAST™ ICs
- Drives 50 Transmission Lines
Description
The CD74AC174 and ’ACT174arehex D flip-flops with reset that utilize AdvancedCMOSLogictechnology. Information at the D input is transferred to the Q output on the positive­going edge of the clock pulse. All six flip-flops are controlled by a common clock (CP) and a common reset (
MR). Reset­ting is accomplished by a low voltage level independent of the clock.
Pinout
CD54ACT174
(CERDIP)
CD74AC174, CD74ACT174
(PDIP, SOIC)
TOP VIEW
Ordering Information
PART
NUMBER
TEMP.
RANGE (oC) PACKAGE
CD74AC174E -55 to 125 16 Ld PDIP CD74AC174M -55 to 125 16 Ld SOIC CD54ACT174F3A -55 to 125 16 Ld CERDIP CD74ACT174E -55 to 125 16 Ld PDIP CD74ACT174M -55 to 125 16 Ld SOIC
NOTES:
1. When ordering, usethe entire part number. Add the suffix 96 to obtain the variant in the tape and reel.
2. Waf erand die forthis partnumber is availablewhichmeets allelec­trical specifications. Pleasecontact your local TI salesoffice or cus­tomer service for ordering information.
14
15
16
9
13 12 11 10
1 2 3 4 5
7
6
8
MR
Q0 D0 D1 Q1 D2
GND
Q2
V
CC
D5 D4 Q4 D3 Q3 CP
Q5
September 1998 - Revised May 2000
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. FAST™ is a Trademark of Fairchild Semiconductor.
Copyright
© 2000, Texas Instruments Incorporated
CD74AC174,
CD54/74ACT174
Hex D Flip-Flop with Reset
[ /Title (CD74 AC174 , CD74 ACT17 4 ) /
Sub-
j
ect (HexD Flip­Flop with Reset) /
Autho r () /
Key­words (Har­ris Semi­con­ductor, Advan ced CMOS ,Harris Semi­con­ductor, Advan ced TTL) /
Cre­ator () /
DOCI NFO
2
Functional Diagram
TRUTH TABLE (EACH FLIP-FLOP)
INPUTS OUTPUTS
RESET
(MR)
CLOCK
CP
DATA
Dn Qn
LXXL H HH H LL HLXQ0
H = High Level (Steady State) L = Low Level (Steady State) X = Irrelevant = Transition from Low to High level Q0 = Level before the Indicated Steady-State Input conditions were established.
CP D R
2
5
7
10
12
15
Q0
Q1
Q2
Q3
Q4
Q5
GND = 8 V
CC
= 16
14
1
13
11
6
4
3
9
D0
CP
D1
D2
D3
D4
D5 MR
CD74AC174, CD54/74ACT174
3
Absolute Maximum Ratings Thermal Information
DC Supply Voltage, VCC. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 6V
DC Input Diode Current, I
IK
For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, I
OK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA
DC Output Source or Sink Current per Output Pin, I
O
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA
DC VCC or Ground Current, I
CC orIGND
(Note 3) . . . . . . . . .±100mA
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC (Note 4)
AC Types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5V to 5.5V
ACT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to V
CC
Input Rise and Fall Slew Rate, dt/dv
AC Types, 1.5V to 3V . . . . . . . . . . . . . . . . . . . . . . . . . 50ns (Max)
AC Types, 3.6V to 5.5V. . . . . . . . . . . . . . . . . . . . . . . . 20ns (Max)
ACT Types, 4.5V to 5.5V. . . . . . . . . . . . . . . . . . . . . . . 10ns (Max)
Thermal Resistance (Typical, Note 5) θJA (oC/W)
PDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
Maximum Junction Temperature (Plastic Package) . . . . . . . . . 1505oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
3. For up to 4 outputs per device, add ±25mA for each additional output.
4. Unless otherwise specified, all voltages are referenced to ground.
5. θJA is measured with the component mounted on an evaluation PC board in free air.
DC Electrical Specifications
PARAMETER SYMBOL
TEST
CONDITIONS
V
CC
(V)
25
o
C
-40oC TO 85oC
-55oC TO 125oC
UNITSV
I
(V) IO(mA) MIN MAX MIN MAX MIN MAX
AC TYPES
High Level Input Voltage V
IH
- - 1.5 1.2 - 1.2 - 1.2 - V 3 2.1 - 2.1 - 2.1 - V
5.5 3.85 - 3.85 - 3.85 - V
Low Level Input Voltage V
IL
- - 1.5 - 0.3 - 0.3 - 0.3 V 3 - 0.9 - 0.9 - 0.9 V
5.5 - 1.65 - 1.65 - 1.65 V
High Level Output Voltage V
OH
VIH or V
IL
-0.05 1.5 1.4 - 1.4 - 1.4 - V
-0.05 3 2.9 - 2.9 - 2.9 - V
-0.05 4.5 4.4 - 4.4 - 4.4 - V
-4 3 2.58 - 2.48 - 2.4 - V
-24 4.5 3.94 - 3.8 - 3.7 - V
-75
(Note 6, 7)
5.5 - - 3.85 - - - V
-50
(Note 6, 7)
5.5----3.85 - V
CD74AC174, CD54/74ACT174
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