Data sheet acquired from Harris Semiconductor
SCHS115A – Revised November 1999
The CD4093 types are supplied in a 14-lead
hermetic dual-in-line ceramic package
(F suffix), 14-lead dual-in-line plastic package
(E suffix), 14-lead dual-in-line plastic
small-outline package (M), and in chip form
(H suffix). Add the suffix 96 to the M package for
tape and reel.
PACKAGE THERMAL IMPEDANCE, θ
E package 80°C/W
M package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NOTE 1: Package thermal impedance is calculated in accordance with JESD 51.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(See Note 1):
JA
V
DD
V
DD
V
V
OH
P
V
N
V
OL
V
SS
Copyright 1999, Texas Instruments Incorporated
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