Data sheet acquired from Harris Semiconductor
SCHS015C – Revised August 2003
The CD4001B, CD4002B, and CD4025B
types are supplied in 14-lead hermetic
dual-in-line ceramic packages (F3A
suffix), 14-lead dual-in-line plastic
packages (E suffix), 14-lead small-outline
packages (M, MT , M96, and NSR suffixes),
and 14-lead thin shrink small-outline
packages (PW and PWR suffixes).
Copyright 2003, Texas Instruments Incorporated
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Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device Status
7704403CA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
89263AKB3T OBSOLETE CFP WR 16 TBD Call TI Call TI
CD4001BE ACTIVE PDIP N 14 25 Pb-Free
CD4001BEE4 ACTIVE PDIP N 14 25 Pb-Free
CD4001BF ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
CD4001BF3A ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
CD4001BM ACTIVE SOIC D 14 50 Green (RoHS &
CD4001BM96 ACTIVE SOIC D 14 2500 Green (RoHS &
CD4001BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS &
CD4001BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS &
CD4001BME4 ACTIVE SOIC D 14 50 Green (RoHS &
CD4001BMG4 ACTIVE SOIC D 14 50 Green (RoHS &
CD4001BMT ACTIVE SOIC D 14 250 Green (RoHS &
CD4001BMTE4 ACTIVE SOIC D 14 250 Green (RoHS &
CD4001BMTG4 ACTIVE SOIC D 14 250 Green (RoHS &
CD4001BNSR ACTIVE SO NS 14 2000 Green (RoHS &
CD4001BNSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
CD4001BNSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
CD4001BPW ACTIVE TSSOP PW 14 90 Green (RoHS &
CD4001BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
CD4001BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
CD4001BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
CD4001BPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
CD4001BPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
CD4002BE ACTIVE PDIP N 14 25 Pb-Free
CD4002BEE4 ACTIVE PDIP N 14 25 Pb-Free
CD4002BF ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
9-Oct-2007
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
CD4002BF3A ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
CD4002BM ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4002BM96 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4002BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4002BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4002BME4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4002BMG4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4002BMT ACTIVE SOIC D 14 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4002BMTE4 ACTIVE SOIC D 14 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4002BMTG4 ACTIVE SOIC D 14 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4002BNSR ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4002BNSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4002BNSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4002BPW ACTIVE TSSOP PW 14 90 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4002BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4002BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4002BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4002BPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4002BPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4025BE ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
CD4025BEE4 ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
CD4025BF ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
CD4025BF3A ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
CD4025BM ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4025BM96 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4025BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4025BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
9-Oct-2007
(3)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
CD4025BME4 ACTIVE SOIC D 14 50 Green (RoHS &
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
9-Oct-2007
(3)
no Sb/Br)
CD4025BMG4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4025BMT ACTIVE SOIC D 14 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4025BMTE4 ACTIVE SOIC D 14 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4025BMTG4 ACTIVE SOIC D 14 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4025BNSR ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4025BNSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4025BNSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4025BPW ACTIVE TSSOP PW 14 90 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4025BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4025BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4025BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4025BPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4025BPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
JM38510/05252BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/05254BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
9-Oct-2007
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
TAPE AND REEL INFORMATION
11-Mar-2008
*All dimensions are nominal
Device Package
CD4001BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4001BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4001BPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
CD4002BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4002BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4002BPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
CD4025BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4025BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4025BPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4001BM96 SOIC D 14 2500 346.0 346.0 33.0
CD4001BNSR SO NS 14 2000 346.0 346.0 33.0
CD4001BPWR TSSOP PW 14 2000 346.0 346.0 29.0
CD4002BM96 SOIC D 14 2500 346.0 346.0 33.0
CD4002BNSR SO NS 14 2000 346.0 346.0 33.0
CD4002BPWR TSSOP PW 14 2000 346.0 346.0 29.0
CD4025BM96 SOIC D 14 2500 346.0 346.0 33.0
CD4025BNSR SO NS 14 2000 346.0 346.0 33.0
CD4025BPWR TSSOP PW 14 2000 346.0 346.0 29.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30
0,19
8
4,50
4,30
PINS **
7
Seating Plane
0,15
0,05
8
1
A
DIM
14
0,10
6,60
6,20
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75
0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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