Texas Instruments CC2640R2L Datasheet

CC2640R2L SimpleLink™ Bluetooth®5.1 Low Energy Wireless MCU

1 Device Overview

1.1 Features

1

• Microcontroller
– Powerful Arm®Cortex®-M3
– EEMBC CoreMark®score: 142
– Up to 48-MHz clock speed
– 275KB of nonvolatile memory including 128KB

of in-system programmable flash

– Up to 28KB of system SRAM, of which 20KB is

ultra-low leakage SRAM
– 8KB of SRAM for cache or system RAM use
– 2-pin cJTAG and JTAG debugging
– Supports over-the-air upgrade (OTA)

• Efficient code size architecture, placing drivers, TI­RTOS, and Bluetooth®software in ROM to make
more Flash available for the application

• RoHS-compliant packages
– 5‑mm × 5‑mm RHB VQFN32 (15 GPIOs)
– 7‑mm × 7‑mm RGZ VQFN48 (31 GPIOs)

• Peripherals
– All digital peripheral pins can be routed to any

GPIO

– Four general-purpose timer modules (eight 16-

bit or four 32-bit timers, PWM each)

– 12-bit ADC, 200-ksamples/s, 8-channel analog

MUX
– UART, I2C, and I2S
– 2× SSI (SPI, MICROWIRE, TI)
– Real-time clock (RTC)
– AES-128 security module
– True random number generator (TRNG)
– Integrated temperature sensor

• External system
– On-chip internal DC/DC converter
– Seamless integration with CC2590 and CC2592

range extenders
– Very few external components
– Pin compatible with the SimpleLink™ CC2640,

CC2640R2F, and CC2650 devices in 5‑mm ×

5‑mm and 7‑mm x 7‑mm VQFN packages

CC2640R2L

SWRS250 –JUNE 2020

– Pin compatible with the SimpleLink™ CC2642R

and CC2652R devices in 7‑mm x 7‑mm VQFN
packages

– Pin compatible with the SimpleLink™ CC1350

device in 5‑mm × 5‑mm VQFN packages

• Low power
– Wide supply voltage range

– Normal operation: 1.8 to 3.8 V

– External regulator mode: 1.7 to 1.95 V
– Active-mode RX: 5.9 mA
– Active-mode TX at 0 dBm: 6.1 mA
– Active-mode TX at +5 dBm: 9.1 mA
– Active-mode MCU: 61 µA/MHz
– Active-mode MCU: 48.5 CoreMark/mA
– Standby: 1.5 µA (RTC running and RAM/CPU

retention)
– Shutdown: 100 nA (wake up on external events)

• RF section
– 2.4-GHz RF transceiver compatible with

Bluetooth low energy 5.1 and earlier LE
specifications

– Excellent receiver sensitivity (–97 dBm for BLE),

selectivity, and blocking performance
– Link budget of 102 dB for BLE
– Programmable output power up to +5 dBm
– Single-ended or differential RF interface
– Suitable for systems targeting compliance with

worldwide radio frequency regulations

– ETSI EN 300 328 (Europe)

– EN 300 440 Class 2 (Europe)

– FCC CFR47 Part 15 (US)

– ARIB STD-T66 (Japan)

• Development Tools and Software
– Full-feature development kits
– Multiple reference designs
– SmartRF™ Studio
– IAR Embedded Workbench®for Arm

®

– Code Composer Studio™ Integrated

Development Environment (IDE)

– Code Composer Studio™ Cloud IDE

1

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

CC2640R2L

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1.2 Applications

• Home and Building Automation
– Connected appliances
– Lighting
– Smart locks
– Gateways
– Security Systems

• Industrial
– Factory automation
– Asset tracking and management
– HMI
– Access control

• Electronic Point Of Sale (EPOS)
– Electronic Shelf Label (ESL)

1.3 Description

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• Health and Medical
– Electronic thermometers
– SpO2
– Blood glucose monitors and blood pressure

monitors

– Weigh scales
– Hearing aids

• Sports and Fitness
– Wearable fitness and activity monitors
– Smart trackers
– Patient monitors
– Fitness machines

• HID
– Gaming
– Pointing devices (wireless keyboard and

mouse)

The CC2640R2L device is a 2.4 GHz wireless microcontroller (MCU) supporting Bluetooth®5.1 Low

Energy and Proprietary 2.4 GHz applications. The device is optimized for low-power wireless

communication and advanced sensing in building security systems, HVAC, asset tracking, and medical
markets, and applications where industrial performance is required. The highlighted features of this device
include:

• Support for Bluetooth®5.1 features: LE Coded PHYs (Long Range), LE 2-Mbit PHY (High Speed),
Advertising Extensions, Multiple Advertisement Sets, as well as backwards compatibility and support
for key features from the Bluetooth®5.0 and earlier Low Energy specifications.

• Fully-qualified Bluetooth®5.1 software protocol stack included with the SimpleLink™ CC2640R2

Software Development Kit (SDK) for developing applications on the powerful Arm®Cortex®-M3

processor.

• Longer battery life wireless applications with low standby current of 1.5 µA with full RAM retention.

• Dedicated software controlled radio controller (Arm®Cortex®-M0) providing flexible low-power RF
transceiver capability to support multiple physical layers and RF standards, such as real-time
localization (RTLS) technologies.

• Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth®Low
Energy (-103 dBm for 125-kbps LE Coded PHY).

The CC2640R2L device is part of the SimpleLink™ microcontroller (MCU) platform, which consists of Wi­Fi®, Bluetooth Low Energy, Thread, ZigBee®, Sub-1 GHz MCUs, and host MCUs that all share a common,
easy-to-use development environment with a single core software development kit (SDK) and rich tool set.
A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s
devices into your design, allowing 100 percent code reuse when your design requirements change. For
more information, visit SimpleLink™ MCU platform.

PART NUMBER PACKAGE BODY SIZE (NOM)

CC2640R2LRGZ VQFN (48) 7.00 mm × 7.00 mm
CC2640R2LRHB VQFN (32) 5.00 mm × 5.00 mm

(1) For more information, see Section 9.

2

Device Overview Copyright © 2020, Texas Instruments Incorporated

Device Information

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(1)

SimpleLink CC2640R2L Wireless MCU

Main CPU

128-KB

Flash

cJTAG

20-KB

SRAM

ROM

ARM

Cortex-M3

DC-DC Converter

RF Core

ARM

Cortex-M0

DSP modem

4-KB

SRAM

ROM

General Peripherals / Modules

4× 32-bit Timers

2× SSI (SPI, µW, TI)

Watchdog Timer

Temperature and Battery Monitor

RTC

I2C

UART

I2S

15 / 31 GPIOs

AES 32-channel µDMA

ADC

Digital PLL

Up to 48 MHz

61 µA/MHz

TRNG

ADC

8-KB

cache

12-bit ADC, 200 ksps

Time-to-Digital Converter

2-KB AUX RAM

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1.4 Functional Block Diagram

Figure 1-1 shows a block diagram for the CC2640R2L device.

CC2640R2L

SWRS250 –JUNE 2020

Figure 1-1. Block Diagram

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Table of Contents

1 Device Overview ......................................... 1

1.1 Features .............................................. 1

1.2 Applications........................................... 2

1.3 Description............................................ 2

1.4 Functional Block Diagram ............................ 3

2 Revision History ......................................... 4

3 Device Comparison ..................................... 5

3.1 Related Products ..................................... 5

4 Terminal Configuration and Functions.............. 6

4.1 Pin Diagram – RGZ Package ........................ 6

4.2 Signal Descriptions – RGZ Package ................. 7

4.3 Pin Diagram – RHB Package ........................ 9

4.4 Signal Descriptions – RHB Package................ 10

5 Specifications........................................... 11

5.1 Absolute Maximum Ratings......................... 11

5.2 ESD Ratings ........................................ 11

5.3 Recommended Operating Conditions............... 11

5.4 Power Consumption Summary...................... 12

5.5 General Characteristics ............................. 13

5.6 125-kbps Coded (Bluetooth 5) – RX ................ 14

5.7 125-kbps Coded (Bluetooth 5) – TX ................ 15

5.8 500-kbps Coded (Bluetooth 5) – RX ................ 15

5.9 500-kbps Coded (Bluetooth 5) – TX ................ 16

5.10 1-Mbps GFSK (Bluetooth low energy) – RX ........ 16

5.11 1-Mbps GFSK (Bluetooth low energy) – TX ........ 17

5.12 2-Mbps GFSK (Bluetooth 5) – RX .................. 17

5.13 2-Mbps GFSK (Bluetooth 5) – TX................... 18

5.14 24-MHz Crystal Oscillator (XOSC_HF) ............. 18

5.15 32.768-kHz Crystal Oscillator (XOSC_LF).......... 19

5.16 48-MHz RC Oscillator (RCOSC_HF) ............... 19

5.17 32-kHz RC Oscillator (RCOSC_LF)................. 19

5.18 ADC Characteristics................................. 19

5.19 Temperature Sensor ................................ 20

5.20 Battery Monitor...................................... 21

5.21 Synchronous Serial Interface (SSI) ................ 21

5.22 DC Characteristics .................................. 23

5.23 Thermal Resistance Characteristics ................ 24

5.24 Timing Requirements ............................... 24

5.25 Switching Characteristics ........................... 24

5.26 Typical Characteristics .............................. 25

6 Detailed Description ................................... 29

6.1 Overview ............................................ 29

6.2 Functional Block Diagram........................... 29

6.3 Main CPU ........................................... 30

6.4 RF Core ............................................. 30

6.5 Memory.............................................. 30

6.6 Debug ............................................... 31

6.7 Power Management................................. 31

6.8 Clock Systems ...................................... 32

6.9 General Peripherals and Modules .................. 32

6.10 Voltage Supply Domains............................ 33

6.11 System Architecture................................. 33

7 Application, Implementation, and Layout ......... 34

7.1 Application Information.............................. 34

7.2 5 × 5 External Differential (5XD) Application Circuit

...................................................... 36

8 Device and Documentation Support ............... 38

8.1 Device Nomenclature ............................... 38

8.2 Tools and Software ................................. 39

8.3 Documentation Support ............................. 39

8.4 Support Resources.................................. 39

8.5 Trademarks.......................................... 40

8.6 Electrostatic Discharge Caution..................... 40

8.7 Export Control Notice ............................... 40

8.8 Glossary............................................. 40

9 Mechanical, Packaging, and Orderable

Information .............................................. 41

2 Revision History

DATE REVISION NOTES

June 2020 * Initial Release

4

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3 Device Comparison

Table 3-1. Device Family Overview

Device PHY Support Flash (KB) RAM (KB) GPIO Package

CC2640R2Lxxx

CC2640R2Fxxx

CC2640F128xxx Bluetooth low energy (Normal) 128 20 31, 15, 10 RGZ, RHB, RSM
CC2650F128xxx Multi-Protocol
CC2630F128xxx IEEE 802.15.4 (ZigBee/6LoWPAN) 128 20 31, 15, 10 RGZ, RHB, RSM
CC2620F128xxx IEEE 802.15.4 (RF4CE) 128 20 31, 10 RGZ, RSM

(1) The package designator replaces the xxx in device name to form a complete device name, RGZ is 7-mm × 7-mm VQFN48, RHB is 5-

mm × 5-mm VQFN32, RSM is 4-mm × 4-mm VQFN32, and YFV is 2.7-mm × 2.7-mm DSBGA.

(2) CC2640R2L devices contain Bluetooth Low Energy Host and Controller libraries in ROM, leaving more of the 128KB Flash memory

available for the customer application when used with supported BLE-Stack software protocol stack releases. Actual use of ROM and
Flash memory by the protocol stack may vary depending on device software configuration. See www.ti.com for more details.

(3) The CC2650 device supports all PHYs and can be reflashed to run all the supported standards.

(2)

(2)

Bluetooth low energy

(Normal, High Speed, Long Range)

Bluetooth low energy

(Normal, High Speed, Long Range)

(3)

128 20 31, 15 RGZ, RHB

128 20 31, 15, 14, 10 RGZ, RHB, YFV, RSM

128 20 31, 15, 10 RGZ, RHB, RSM

3.1 Related Products

TI's Wireless Connectivity

The wireless connectivity portfolio offers a wide selection of low-power RF solutions suitable
for a broad range of applications. The offerings range from fully customized solutions to turn
key offerings with pre-certified hardware and software (protocol).

TI's SimpleLink™ Sub-1 GHz Wireless MCUs

Long-range, low-power wireless connectivity solutions are offered in a wide range of
Sub-1 GHz ISM bands.

Companion Products

Review products that are frequently purchased or used in conjunction with this product.

SimpleLink™ CC2640R2 Wireless MCU LaunchPad™ Development Kit

The CC2640R2 LaunchPad ™ development kit brings easy Bluetooth®low energy (BLE)
connection to the LaunchPad ecosystem with the SimpleLink ultra-low power CC26xx family
of devices. Compared to the CC2650 LaunchPad, the CC2640R2 LaunchPad provides the
following:

• More free flash memory for the user application in the CC2640R2 wireless MCU

• Out-of-the-box support for Bluetooth 4.2 specification

• 4× faster Over-the-Air download speed compared to Bluetooth 4.1

SimpleLink™ Bluetooth low energy/Multi-standard SensorTag

The new SensorTag IoT kit invites you to realize your cloud-connected product idea. The
new SensorTag now includes 10 low-power MEMS sensors in a tiny red package. And it is
expandable with DevPacks to make it easy to add your own sensors or actuators.

Reference Designs Find reference designs leveraging the best in TI technology to solve your system-

level challenges

(1)

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Device ComparisonCopyright © 2020, Texas Instruments Incorporated

5

40

39

DIO_25 38

DIO_24 37

21

22

23

24

DCDC_SW33

DIO_18

34

RESET_N35

DIO_2336

X32K_Q2 4

X32K_Q1 3

RF_N 2

RF_P 1

DIO_2232

DIO_2131

DIO_2030

DIO_1929

DIO_0 5

DIO_1 6

DIO_2 7

8

28

27

26

JTAG_TCKC25

9

10

11

12

41

42

43

44

20

DIO_15

19

DIO_14

18

17

VDDR 45

46

47

VDDR_RF 48

16

15

14

13

DIO_17

DIO_16

VDDS_DCDC

DIO_26

DIO_12

DIO_13

VDDS2

DIO_11

DIO_10

DIO_5

DIO_6

DIO_7

DIO_3

DIO_4

X24M_P

X24M_N

DIO_8

DIO_9

DIO_28

VDDS3

DCOUPL

JTAG_TMSC

DIO_29

DIO_30

DIO_27

VDDS

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4 Terminal Configuration and Functions

4.1 Pin Diagram – RGZ Package

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Figure 4-1. RGZ Package

48-Pin VQFN

(7-mm × 7-mm) Pinout, 0.5-mm Pitch

I/O pins marked in Figure 4-1 in bold have high-drive capabilities; they are the following:

• Pin 10, DIO_5

• Pin 11, DIO_6

• Pin 12, DIO_7

• Pin 24, JTAG_TMSC

• Pin 26, DIO_16

• Pin 27, DIO_17

I/O pins marked in Figure 4-1 in italics have analog capabilities; they are the following:

• Pin 36, DIO_23

• Pin 37, DIO_24

• Pin 38, DIO_25

• Pin 39, DIO_26

• Pin 40, DIO_27

• Pin 41, DIO_28

• Pin 42, DIO_29

• Pin 43, DIO_30

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4.2 Signal Descriptions – RGZ Package

Table 4-1. Signal Descriptions – RGZ Package

NAME NO. TYPE DESCRIPTION

DCDC_SW 33 Power Output from internal DC/DC
DCOUPL 23 Power 1.27-V regulated digital-supply decoupling capacitor
DIO_0 5 Digital I/O GPIO
DIO_1 6 Digital I/O GPIO
DIO_2 7 Digital I/O GPIO
DIO_3 8 Digital I/O GPIO
DIO_4 9 Digital I/O GPIO
DIO_5 10 Digital I/O GPIO, high-drive capability
DIO_6 11 Digital I/O GPIO, high-drive capability
DIO_7 12 Digital I/O GPIO, high-drive capability
DIO_8 14 Digital I/O GPIO
DIO_9 15 Digital I/O GPIO
DIO_10 16 Digital I/O GPIO
DIO_11 17 Digital I/O GPIO
DIO_12 18 Digital I/O GPIO
DIO_13 19 Digital I/O GPIO
DIO_14 20 Digital I/O GPIO
DIO_15 21 Digital I/O GPIO
DIO_16 26 Digital I/O GPIO, JTAG_TDO, high-drive capability
DIO_17 27 Digital I/O GPIO, JTAG_TDI, high-drive capability
DIO_18 28 Digital I/O GPIO
DIO_19 29 Digital I/O GPIO
DIO_20 30 Digital I/O GPIO
DIO_21 31 Digital I/O GPIO
DIO_22 32 Digital I/O GPIO
DIO_23 36 Digital/Analog I/O GPIO, Analog
DIO_24 37 Digital/Analog I/O GPIO, Analog
DIO_25 38 Digital/Analog I/O GPIO, Analog
DIO_26 39 Digital/Analog I/O GPIO, Analog
DIO_27 40 Digital/Analog I/O GPIO, Analog
DIO_28 41 Digital/Analog I/O GPIO, Analog
DIO_29 42 Digital/Analog I/O GPIO, Analog
DIO_30 43 Digital/Analog I/O GPIO, Analog
JTAG_TMSC 24 Digital I/O JTAG TMSC, high-drive capability
JTAG_TCKC 25 Digital I/O JTAG TCKC

(3)

RESET_N 35 Digital input Reset, active-low. No internal pullup.
RF_P 1 RF I/O

RF_N 2 RF I/O

Positive RF input signal to LNA during RX
Positive RF output signal to PA during TX

Negative RF input signal to LNA during RX

Negative RF output signal to PA during TX
VDDR 45 Power 1.7-V to 1.95-V supply, typically connect to output of internal DC/DC
VDDR_RF 48 Power 1.7-V to 1.95-V supply, typically connect to output of internal DC/DC

(1) For more details, see the technical reference manual (listed in Section 8.3).
(2) Do not supply external circuitry from this pin.
(3) For design consideration regarding noise immunity for this pin, see the JTAG Interface chapter in the CC13x0, CC26x0 SimpleLink™

Wireless MCU Technical Reference Manual

(4) If internal DC/DC is not used, this pin is supplied internally from the main LDO.
(5) If internal DC/DC is not used, this pin must be connected to VDDR for supply from the main LDO.

(1)

(2)

(2)(4)
(2)(5)

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Table 4-1. Signal Descriptions – RGZ Package (continued)

NAME NO. TYPE DESCRIPTION

VDDS 44 Power 1.8-V to 3.8-V main chip supply
VDDS2 13 Power 1.8-V to 3.8-V DIO supply
VDDS3 22 Power 1.8-V to 3.8-V DIO supply
VDDS_DCDC 34 Power 1.8-V to 3.8-V DC/DC supply
X32K_Q1 3 Analog I/O 32-kHz crystal oscillator pin 1
X32K_Q2 4 Analog I/O 32-kHz crystal oscillator pin 2
X24M_N 46 Analog I/O 24-MHz crystal oscillator pin 1
X24M_P 47 Analog I/O 24-MHz crystal oscillator pin 2
EGP Power Ground – Exposed Ground Pad

(1)
(1)

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(1)

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28

29

27

30

212022

19

18

13

12

14

11

453

6

7

26 15

25 16

31 10

32 9

232

241

178

DIO_10

DIO_7

DIO_9

DIO_8

DCDC_SW

RESET_N

VDDS_DCDC

DIO_11

VDDR_RF

X24M_N

X24M_P

VDDR

VDDS

DIO_13

DIO_14

DIO_12

DIO_3

JTAG_TMSC

DIO_4

DCOUPL

VDDS2

JTAG_TCKC

DIO_5

DIO_6

RF_P

RF_N

RX_TX

DIO_0

DIO_1

DIO_2

X32K_Q1

X32K_Q2

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4.3 Pin Diagram – RHB Package

CC2640R2L

SWRS250 –JUNE 2020

I/O pins marked in Figure 4-2 in bold have high-drive capabilities; they are the following:

• Pin 8, DIO_2

• Pin 9, DIO_3

• Pin 10, DIO_4

• Pin 13, JTAG_TMSC

• Pin 15, DIO_5

• Pin 16, DIO_6
I/O pins marked in Figure 4-2 in italics have analog capabilities; they are the following:

• Pin 20, DIO_7

• Pin 21, DIO_8

• Pin 22, DIO_9

• Pin 23, DIO_10

• Pin 24, DIO_11

• Pin 25, DIO_12

• Pin 26, DIO_13

• Pin 27, DIO_14

Figure 4-2. RHB Package

32-Pin VQFN

(5-mm × 5-mm) Pinout, 0.5-mm Pitch

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4.4 Signal Descriptions – RHB Package

Table 4-2. Signal Descriptions – RHB Package

NAME NO. TYPE DESCRIPTION

DCDC_SW 17 Power Output from internal DC/DC
DCOUPL 12 Power 1.27-V regulated digital-supply decoupling
DIO_0 6 Digital I/O GPIO
DIO_1 7 Digital I/O GPIO
DIO_2 8 Digital I/O GPIO, high-drive capability
DIO_3 9 Digital I/O GPIO, high-drive capability
DIO_4 10 Digital I/O GPIO, high-drive capability
DIO_5 15 Digital I/O GPIO, High drive capability, JTAG_TDO
DIO_6 16 Digital I/O GPIO, High drive capability, JTAG_TDI
DIO_7 20 Digital/Analog I/O GPIO, Analog
DIO_8 21 Digital/Analog I/O GPIO, Analog
DIO_9 22 Digital/Analog I/O GPIO, Analog
DIO_10 23 Digital/Analog I/O GPIO, Analog
DIO_11 24 Digital/Analog I/O GPIO, Analog
DIO_12 25 Digital/Analog I/O GPIO, Analog
DIO_13 26 Digital/Analog I/O GPIO, Analog
DIO_14 27 Digital/Analog I/O GPIO, Analog
JTAG_TMSC 13 Digital I/O JTAG TMSC, high-drive capability
JTAG_TCKC 14 Digital I/O JTAG TCKC

(3)

RESET_N 19 Digital input Reset, active-low. No internal pullup.
RF_N 2 RF I/O

RF_P 1 RF I/O

Negative RF input signal to LNA during RX,
Negative RF output signal to PA during TX

Positive RF input signal to LNA during RX,

Positive RF output signal to PA during TX
RX_TX 3 RF I/O Optional bias pin for the RF LNA
VDDR 29 Power 1.7-V to 1.95-V supply, typically connect to output of internal DC/DC
VDDR_RF 32 Power 1.7-V to 1.95-V supply, typically connect to output of internal DC/DC
VDDS 28 Power 1.8-V to 3.8-V main chip supply
VDDS2 11 Power 1.8-V to 3.8-V GPIO supply
VDDS_DCDC 18 Power 1.8-V to 3.8-V DC/DC supply
X32K_Q1 4 Analog I/O 32-kHz crystal oscillator pin 1
X32K_Q2 5 Analog I/O 32-kHz crystal oscillator pin 2
X24M_N 30 Analog I/O 24-MHz crystal oscillator pin 1
X24M_P 31 Analog I/O 24-MHz crystal oscillator pin 2
EGP Power Ground – exposed ground pad

(1) See technical reference manual (listed in Section 8.3) for more details.
(2) Do not supply external circuitry from this pin.
(3) For design consideration regarding noise immunity for this pin, see the JTAG Interface chapter in the CC13x0, CC26x0 SimpleLink™

Wireless MCU Technical Reference Manual

(4) If internal DC/DC is not used, this pin is supplied internally from the main LDO.
(5) If internal DC/DC is not used, this pin must be connected to VDDR for supply from the main LDO.

(1)

(2)

(4)(2)
(2)(5)

(1)

(1)

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5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

Supply voltage (VDDS, VDDS2,
and VDDS3)

Supply voltage (VDDS
VDDR)

Voltage on any digital pin
Voltage on crystal oscillator pins, X32K_Q1, X32K_Q2, X24M_N and X24M_P –0.3 VDDR + 0.3, max 2.25 V

Voltage on ADC input (Vin)

Input RF level 5 dBm
T

stg

(1) All voltage values are with respect to ground, unless otherwise noted.
(2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(3) In external regulator mode, VDDS2 and VDDS3 must be at the same potential as VDDS.
(4) Including analog-capable DIO.
(5) Each pin is referenced to a specific VDDSx (VDDS, VDDS2 or VDDS3). For a pin-to-VDDS mapping table, see Table 6-2.

(3)

and

(4)(5)

VDDR supplied by internal DC/DC regulator or
internal GLDO. VDDS_DCDC connected to VDDS on
PCB

External regulator mode (VDDS and VDDR pins
connected on PCB)

Voltage scaling enabled –0.3 VDDS

Voltage scaling disabled, VDDS as reference –0.3 VDDS / 2.9

Storage temperature –40 150 °C

(1)(2)

MIN MAX UNIT

–0.3 4.1 V

–0.3 2.25 V
–0.3 VDDSx + 0.3, max 4.1 V

VVoltage scaling disabled, internal reference –0.3 1.49

5.2 ESD Ratings

VALUE UNIT

Human body model (HBM), per

V

ESD

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

Electrostatic discharge
(RHB and RGZ packages)

ANSI/ESDA/JEDEC JS001
Charged device model (CDM), per JESD22-

(2)

C101

(1)

All pins ±2500
RF pins ±500

Non-RF pins ±500

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

Ambient temperature –40 85 °C
Operating supply

voltage (VDDS and
VDDR), external
regulator mode

Operating supply
voltage VDDS

Operating supply
voltages VDDS2 and
VDDS3

Operating supply
voltages VDDS2 and
VDDS3

For operation in 1.8-V systems
(VDDS and VDDR pins connected on PCB, internal DC/DC cannot be used)

For operation in battery-powered and 3.3-V systems
(internal DC/DC can be used to minimize power consumption)

VDDS < 2.7 V 1.8 3.8 V

VDDS ≥ 2.7 V 1.9 3.8 V

1.7 1.95 V

1.8 3.8 V

V

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5.4 Power Consumption Summary

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Reset. RESET_N pin asserted or VDDS below
Power-on-Reset threshold

Shutdown. No clocks running, no retention 150
Standby. With RTC, CPU, RAM and (partial)

register retention. RCOSC_LF
Standby. With RTC, CPU, RAM and (partial)

register retention. XOSC_LF
Standby. With Cache, RTC, CPU, RAM and

(partial) register retention. RCOSC_LF

I

core

Core current consumption

Peripheral Current Consumption (Adds to core current I

Peripheral power domain Delta current with domain enabled 50 µA
Serial power domain Delta current with domain enabled 13 µA

RF Core
µDMA Delta current with clock enabled, module idle 165 µA

I

peri

Timers Delta current with clock enabled, module idle 113 µA
I2C Delta current with clock enabled, module idle 12 µA
I2S Delta current with clock enabled, module idle 36 µA
SSI Delta current with clock enabled, module idle 93 µA
UART Delta current with clock enabled, module idle 164 µA

(1) Single-ended RF mode is optimized for size and power consumption. Measured on CC2650EM-4XS.
(2) Differential RF mode is optimized for RF performance. Measured on CC2650EM-5XD.
(3) I

is not supported in Standby or Shutdown.

peri

Standby. With Cache, RTC, CPU, RAM and
(partial) register retention. XOSC_LF

Idle. Supply Systems and RAM powered. 650
Active. Core running CoreMark
Radio RX

Radio RX
Radio TX, 0-dBm output power
Radio TX, 0-dBm output power
Radio TX, 5-dBm output power

(1)

(2)

(1)
(2)
(2)

for each peripheral unit activated)

core

Delta current with power domain enabled, clock
enabled, RF core idle

= 3.0 V with internal DC/DC converter, unless

DDS

(3)

100

1.5

1.7

6

6.2

1.45 mA +

31 µA/MHz

5.9

6.1

6.1

7.0

9.1

237 µA

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nA

µA

mA

12

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5.5 General Characteristics

Tc= 25°C, V

FLASH MEMORY

Supported flash erase cycles before

(1)

failure
Maximum number of write operations

per row before erase
Flash retention 105°C 11.4
Flash page/sector erase current Average delta current 12.6 mA

Flash page/sector size 4 KB
Flash write current Average delta current, 4 bytes at a time 8.15 mA
Flash page/sector erase time
Flash write time

(1) Aborting flash during erase or program modes is not a safe operation.
(2) Each row is 2048 bits (or 256 Bytes) wide.
(3) This number is dependent on Flash aging and will increase over time and erase cycles.

= 3.0 V, unless otherwise noted.

DDS

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

100 k Cycles

write

(2)

83

operations

Years at

105°C

(3)

(3)

4 bytes at a time 8 µs

8 ms

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5.6 125-kbps Coded (Bluetooth 5) – RX

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Receiver sensitivity

Receiver saturation

Frequency error tolerance

Data rate error tolerance

Data rate error tolerance

Co-channel rejection

Selectivity, ±1 MHz

Selectivity, ±2 MHz

Selectivity, ±3 MHz

Selectivity, ±4 MHz

Selectivity, ±6 MHz
Alternate channel rejection,

(1)

±7 MHz

(1)

(1)

(1)

(1)

(1)

(1)

Selectivity, image frequency

Selectivity, image frequency

(1)

±1 MHz

Blocker rejection, ±8 MHz and

(1)

above
Out-of-band blocking

(3)

Out-of-band blocking 2003 MHz to 2399 MHz –19 dBm
Out-of-band blocking 2484 MHz to 2997 MHz –22 dBm

Intermodulation

(1) Numbers given as I/C dB.
(2) X / Y, where X is +N MHz and Y is –N MHz.
(3) Excluding one exception at F

Differential mode. Measured at the CC2650EM-5XD
SMA connector, BER = 10

Differential mode. Measured at the CC2650EM-5XD
SMA connector, BER = 10

–3

–3

Difference between the incoming carrier frequency
and the internally generated carrier frequency

Difference between incoming data rate and the
internally generated data rate (37-byte packets)

Difference between incoming data rate and the
internally generated data rate (255-byte packets)

Wanted signal at –79 dBm, modulated interferer in
channel, BER = 10

Wanted signal at –79 dBm, modulated interferer at
±1 MHz, BER = 10

–3

–3

Wanted signal at –79 dBm, modulated interferer at
±2 MHz, Image frequency is at –2 MHz, BER = 10

Wanted signal at –79 dBm, modulated interferer at
±3 MHz, BER = 10

Wanted signal at –79 dBm, modulated interferer at
±4 MHz, BER = 10

Wanted signal at –79 dBm, modulated interferer at
±6 MHz, BER = 10

Wanted signal at –79 dBm, modulated interferer at ≥
±7 MHz, BER = 10

Wanted signal at –79 dBm, modulated interferer at

(1)

image frequency, BER = 10

–3

–3

–3

–3

–3

Note that Image frequency + 1 MHz is the Co­channel –1 MHz. Wanted signal at –79 dBm,
modulated interferer at ±1 MHz from image
frequency, BER = 10

Wanted signal at –79 dBm, modulated interferer at
±8 MHz and above, BER = 10

–3

–3

30 MHz to 2000 MHz –40 dBm

Wanted signal at 2402 MHz, –76 dBm. Two
interferers at 2405 and 2408 MHz respectively, at
the given power level

/ 2, per Bluetooth Specification.

wanted

= 3.0 V, fRF= 2440 MHz, unless otherwise noted.

DDS

–103 dBm

>5 dBm

–260 310 kHz

–260 260 ppm

–140 140 ppm

–3 dB

(2)

9 / 5

(2)

–3

43 / 32

47 / 42

46 / 47

49 / 46

50 / 47

(2)

(2)

(2)

(2)

32 dB

(2)

5 / 32

>46 dB

–42 dBm

dB

dB

dB

dB

dB

dB

dB

14

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5.7 125-kbps Coded (Bluetooth 5) – TX

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Output power, highest setting

Output power, highest setting
Output power, lowest setting Delivered to a single-ended 50-Ω load through a balun –21 dBm

Spurious emission conducted
measurement

(1)

(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2

(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan).

Differential mode, delivered to a single-ended 50-Ω load
through a balun

Measured on CC2650EM-4XS, delivered to a single-ended
50-Ω load

f < 1 GHz, outside restricted bands –43 dBm
f < 1 GHz, restricted bands ETSI –65 dBm
f < 1 GHz, restricted bands FCC –71 dBm
f > 1 GHz, including harmonics –46 dBm

= 3.0 V, fRF= 2440 MHz, unless otherwise noted.

DDS

5 dBm

2 dBm

5.8 500-kbps Coded (Bluetooth 5) – RX

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Receiver sensitivity

Receiver saturation

Frequency error tolerance

Data rate error tolerance

Data rate error tolerance

Co-channel rejection

Selectivity, ±1 MHz

Selectivity, ±2 MHz

Selectivity, ±3 MHz

Selectivity, ±4 MHz

Selectivity, ±6 MHz
Alternate channel rejection,

(1)

±7 MHz

(1)

(1)

(1)

(1)

(1)

(1)

Selectivity, image frequency

Selectivity, image frequency

(1)

±1 MHz

Blocker rejection, ±8 MHz and

(1)

above
Out-of-band blocking

(3)

Out-of-band blocking 2003 MHz to 2399 MHz –19 dBm
Out-of-band blocking 2484 MHz to 2997 MHz –19 dBm

Differential mode. Measured at the CC2650EM-5XD
SMA connector, BER = 10

Differential mode. Measured at the CC2650EM-5XD
SMA connector, BER = 10

–3

–3

Difference between the incoming carrier frequency
and the internally generated carrier frequency

Difference between incoming data rate and the
internally generated data rate (37-byte packets)

Difference between incoming data rate and the
internally generated data rate (255-byte packets)

Wanted signal at –72 dBm, modulated interferer in
channel, BER = 10

Wanted signal at –72 dBm, modulated interferer at
±1 MHz, BER = 10

–3

–3

Wanted signal at –72 dBm, modulated interferer at
±2 MHz, Image frequency is at –2 MHz, BER = 10

Wanted signal at –72 dBm, modulated interferer at
±3 MHz, BER = 10

Wanted signal at –72 dBm, modulated interferer at
±4 MHz, BER = 10

Wanted signal at –72 dBm, modulated interferer at
±6 MHz, BER = 10

Wanted signal at –72 dBm, modulated interferer at
≥ ±7 MHz, BER = 10

Wanted signal at –72 dBm, modulated interferer at

(1)

image frequency, BER = 10

–3

–3

–3

–3

–3

Note that Image frequency + 1 MHz is the Co­channel –1 MHz. Wanted signal at –72 dBm,
modulated interferer at ±1 MHz from image
frequency, BER = 10

Wanted signal at –72 dBm, modulated interferer at
±8 MHz and above, BER = 10

–3

–3

30 MHz to 2000 MHz –35 dBm

= 3.0 V, fRF= 2440 MHz, unless otherwise noted.

DDS

–101 dBm

>5 dBm

–240 240 kHz

–500 500 ppm

–310 330 ppm

–5 dB

(2)

9 / 5

(2)

–3

41 / 31

44 / 41

44 / 44

44 / 44

44 / 44

(2)

(2)

(2)

(2)

31 dB

(2)

5 / 41

44 dB

dB

dB

dB

dB

dB

dB

dB

(1) Numbers given as I/C dB.
(2) X / Y, where X is +N MHz and Y is –N MHz.
(3) Excluding one exception at F

/ 2, per Bluetooth Specification.

wanted

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500-kbps Coded (Bluetooth 5) – RX (continued)

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Intermodulation

Wanted signal at 2402 MHz, –69 dBm. Two
interferers at 2405 and 2408 MHz respectively, at
the given power level

= 3.0 V, fRF= 2440 MHz, unless otherwise noted.

DDS

–37 dBm

5.9 500-kbps Coded (Bluetooth 5) – TX

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Output power, highest setting

Output power, highest setting
Output power, lowest setting Delivered to a single-ended 50-Ω load through a balun –21 dBm

Spurious emission conducted
measurement

(1)

(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2

(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan).

Differential mode, delivered to a single-ended 50-Ω load
through a balun

Measured on CC2650EM-4XS, delivered to a single-ended
50-Ω load

f < 1 GHz, outside restricted bands –43 dBm
f < 1 GHz, restricted bands ETSI –65 dBm
f < 1 GHz, restricted bands FCC –71 dBm
f > 1 GHz, including harmonics –46 dBm

= 3.0 V, fRF= 2440 MHz, unless otherwise noted.

DDS

5 dBm

2 dBm

5.10 1-Mbps GFSK (Bluetooth low energy) – RX

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Receiver sensitivity

Receiver sensitivity

Receiver saturation

Receiver saturation

Frequency error tolerance

Data rate error tolerance

Co-channel rejection

Selectivity, ±1 MHz

Selectivity, ±2 MHz

Selectivity, ±3 MHz

Selectivity, ±4 MHz

(1)

(1)

(1)

(1)

(1)

Selectivity, ±5 MHz or more

Selectivity, image frequency
Selectivity, image frequency

(1)

±1 MHz

Differential mode. Measured at the CC2650EM-5XD
SMA connector, BER = 10

Single-ended mode. Measured on CC2650EM-4XS,
at the SMA connector, BER = 10

Differential mode. Measured at the CC2650EM-5XD
SMA connector, BER = 10

Single-ended mode. Measured on CC2650EM-4XS,
at the SMA connector, BER = 10

–3

–3

–3

–3

Difference between the incoming carrier frequency
and the internally generated carrier frequency

Difference between incoming data rate and the
internally generated data rate

Wanted signal at –67 dBm, modulated interferer in
channel, BER = 10

Wanted signal at –67 dBm, modulated interferer at
±1 MHz, BER = 10

Wanted signal at –67 dBm, modulated interferer at
±2 MHz, BER = 10

Wanted signal at –67 dBm, modulated interferer at
±3 MHz, BER = 10

Wanted signal at –67 dBm, modulated interferer at
±4 MHz, BER = 10

Wanted signal at –67 dBm, modulated interferer at

(1)

≥ ±5 MHz, BER = 10
Wanted signal at –67 dBm, modulated interferer at

(1)

image frequency, BER = 10

–3

–3

–3

–3

–3

–3

–3

Wanted signal at –67 dBm, modulated interferer at
±1 MHz from image frequency, BER = 10

–3

= 3.0 V, fRF= 2440 MHz, unless otherwise noted.

DDS

–97 dBm

–96 dBm

4 dBm

0 dBm

–350 350 kHz

–750 750 ppm

–6 dB

(2)

7 / 3

(2)

34 / 25

(2)

38 / 26

(2)

42 / 29

32 dB

25 dB

(2)

3 / 26

dB

dB

dB

dB

dB

(1) Numbers given as I/C dB.
(2) X / Y, where X is +N MHz and Y is –N MHz.

16

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1-Mbps GFSK (Bluetooth low energy) – RX (continued)

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Out-of-band blocking
Out-of-band blocking 2003 MHz to 2399 MHz –5 dBm
Out-of-band blocking 2484 MHz to 2997 MHz –8 dBm
Out-of-band blocking 3000 MHz to 12.75 GHz –10 dBm

Intermodulation

Spurious emissions,
30 to 1000 MHz

Spurious emissions,
1 to 12.75 GHz

RSSI dynamic range 70 dB
RSSI accuracy ±4 dB

(3) Excluding one exception at F

(3)

30 MHz to 2000 MHz –20 dBm

Wanted signal at 2402 MHz, –64 dBm. Two
interferers at 2405 and 2408 MHz respectively, at
the given power level

Conducted measurement in a 50-Ω single-ended
load. Suitable for systems targeting compliance with
EN 300 328, EN 300 440 class 2, FCC CFR47, Part
15 and ARIB STD-T-66

Conducted measurement in a 50-Ω single-ended
load. Suitable for systems targeting compliance with
EN 300 328, EN 300 440 class 2, FCC CFR47, Part
15 and ARIB STD-T-66

/ 2, per Bluetooth Specification.

wanted

= 3.0 V, fRF= 2440 MHz, unless otherwise noted.

DDS

–34 dBm

–71 dBm

–62 dBm

5.11 1-Mbps GFSK (Bluetooth low energy) – TX

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Output power, highest setting

Output power, highest setting
Output power, lowest setting Delivered to a single-ended 50-Ω load through a balun –21 dBm

Spurious emission conducted
measurement

(1)

(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2

(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan).

Differential mode, delivered to a single-ended 50-Ω load
through a balun

Measured on CC2650EM-4XS, delivered to a single-ended
50-Ω load

f < 1 GHz, outside restricted bands –43 dBm
f < 1 GHz, restricted bands ETSI –65 dBm
f < 1 GHz, restricted bands FCC –71 dBm
f > 1 GHz, including harmonics –46 dBm

= 3.0 V, fRF= 2440 MHz, unless otherwise noted.

DDS

5 dBm

2 dBm

5.12 2-Mbps GFSK (Bluetooth 5) – RX

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Receiver sensitivity

Receiver saturation

Frequency error tolerance

Data rate error tolerance

Co-channel rejection

Selectivity, ±2 MHz

(1)

(1)

Differential mode. Measured at the CC2650EM-5XD
SMA connector, BER = 10

Differential mode. Measured at the CC2650EM-5XD
SMA connector, BER = 10

–3

–3

Difference between the incoming carrier frequency and
the internally generated carrier frequency

Difference between incoming data rate and the
internally generated data rate

Wanted signal at –67 dBm, modulated interferer in
channel, BER = 10

–3

Wanted signal at –67 dBm, modulated interferer at
±2 MHz, Image frequency is at –2 MHz BER = 10

= 3.0 V, fRF= 2440 MHz, unless otherwise noted.

DDS

–90 dBm

3 dBm

–300 500 kHz

–1000 1000 ppm

–7 dB

(2)

–3

8 / 4

dB

(1) Numbers given as I/C dB.
(2) X / Y, where X is +N MHz and Y is –N MHz.

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