• Peripherals
– All Digital Peripheral Pins Can Be Routed to
Any GPIO
– Four General-Purpose Timer Modules
(Eight 16-Bit or Four 32-Bit Timers, PWM Each)
– 12-Bit ADC, 200-ksamples/s, 8-Channel Analog
MUX
– Continuous Time Comparator
– Ultralow-Power Analog Comparator
– Programmable Current Source
– UART
– 2× SSI (SPI, MICROWIRE, TI)
– I2C
– I2S
– Real-Time Clock (RTC)
– AES-128 Security Module
– True Random Number Generator (TRNG)
– 10, 15, or 31 GPIOs, Depending on Package
Option
– Support for Eight Capacitive-Sensing Buttons
– Integrated Temperature Sensor
• External System
– On-Chip internal DC-DC Converter
1
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
– Very Few External Components
– Seamless Integration With the SimpleLink™
CC2590 and CC2592 Range Extenders
– Pin Compatible With the SimpleLink CC13xx in
4-mm × 4-mm and 5-mm × 5-mm VQFN
Packages
• Low Power
– Wide Supply Voltage Range
•Normal Operation: 1.8 to 3.8 V
•External Regulator Mode: 1.7 to 1.95 V
– Active-Mode RX: 5.9 mA
– Active-Mode TX at 0 dBm: 6.1 mA
– Active-Mode TX at +5 dBm: 9.1 mA
– Active-Mode MCU: 61 µA/MHz
– Active-Mode MCU: 48.5 CoreMark/mA
– Active-Mode Sensor Controller: 8.2 µA/MHz
– Standby: 1 µA (RTC Running and RAM/CPU
Retention)
– Shutdown: 100 nA (Wake Up on External
Events)
• RF Section
– 2.4-GHz RF Transceiver Compatible With
Bluetooth Low Energy (BLE) 4.2 Specification
– Excellent Receiver Sensitivity (–97 dBm for
BLE), Selectivity, and Blocking Performance
– Link budget of 102 dB for BLE
– Programmable Output Power up to +5 dBm
– Single-Ended or Differential RF Interface
– Suitable for Systems Targeting Compliance With
Worldwide Radio Frequency Regulations
•ETSI EN 300 328 (Europe)
•EN 300 440 Class 2 (Europe)
•FCC CFR47 Part 15 (US)
•ARIB STD-T66 (Japan)
• Tools and Development Environment
– Full-Feature and Low-Cost Development Kits
– Multiple Reference Designs for Different RF
Configurations
– Packet Sniffer PC Software
– Sensor Controller Studio
– SmartRF™ Studio
– SmartRF Flash Programmer 2
– IAR Embedded Workbench®for ARM
– Code Composer Studio™
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
1.2Applications
•Home and Building Automation
– Connected Appliances
– Lighting
– Locks
– Gateways
– Security Systems
•Industrial
– Logistics
– Production and Manufacturing
– Automation
– Asset Tracking and Management
– Remote Display
– Cable Replacement
– HMI
– Access Control
•Retail
– Beacons
– Advertising
– ESL and Price Tags
– Point of Sales and Payment Systems
www.ti.com
•Health and Medical
– Thermometers
– SpO2
– Blood Glucose and Pressure Meters
– Weight Scales
– Vitals Monitoring
– Hearing Aids
•Sports and Fitness
– Activity Monitors and Fitness Trackers
– Heart Rate Monitors
– Running Sensors
– Biking Sensors
– Sports Watches
– Gym Equipment
– Team Sports Equipment
•HID
– Remote Controls
– Keyboards and Mice
– Gaming
The CC2640 device is a wireless MCU targeting Bluetooth applications.
The device is a member of the CC26xx family of cost-effective, ultralow power, 2.4-GHz RF devices. Very
low active RF and MCU current and low-power mode current consumption provide excellent battery
lifetime and allow for operation on small coin cell batteries and in energy-harvesting applications.
The CC2640 device contains a 32-bit ARM Cortex-M3 processor that runs at 48 MHz as the main
processor and a rich peripheral feature set that includes a unique ultralow power sensor controller. This
sensor controller is ideal for interfacing external sensors and for collecting analog and digital data
autonomously while the rest of the system is in sleep mode. Thus, the CC2640 device is ideal for a wide
range of applications where long battery lifetime, small form factor, and ease of use is important.
The Bluetooth Low Energy controller is embedded into ROM and runs partly on an ARM Cortex-M0
processor. This architecture improves overall system performance and power consumption and frees up
flash memory for the application.
The Bluetooth stack is available free of charge from www.ti.com.
Device Information
PART NUMBERPACKAGEBODY SIZE (NOM)
CC2640F128RGZVQFN (48)7.00 mm × 7.00 mm
CC2640F128RHBVQFN (32)5.00 mm × 5.00 mm
CC2640F128RSMVQFN (32)4.00 mm × 4.00 mm
(1) For more information, see Section 9, Mechanical Packaging and Orderable Information.
(1) Package designator replaces the xxx in device name to form a complete device name, RGZ is 7-mm × 7-mm VQFN48, RHB is
5-mm × 5-mm VQFN32, and RSM is 4-mm × 4-mm VQFN32.
(2) The CC2650 device supports all PHYs and can be reflashed to run all the supported standards.
(2)
FLASH
(KB)
1282031, 15, 10RGZ, RHB, RSM
RAM (KB)GPIOPACKAGE
3.1Related Products
Wireless Connectivity The wireless connectivity portfolio offers a wide selection of low power RF
solutions suitable for a broad range of application. The offerings range from fully customized
solutions to turn key offerings with pre-certified hardware and software (protocol).
Sub-1 GHz Long-range, low power wireless connectivity solutions are offered in a wide range of Sub-1
GHz ISM bands.
Companion Products Review products that are frequently purchased or used in conjunction with this
Bluetooth® Smart connectivity to the LaunchPad kit ecosystem with the SimpleLink ultra-low
power CC26xx family of devices. This LaunchPad kit also supports development for multiprotocol support for the SimpleLink multi-standard CC2650 wireless MCU and the rest of
CC26xx family of products: CC2630 wireless MCU for ZigBee®/6LoWPAN and CC2640
wireless MCU for Bluetooth®Smart.
Reference Designs for CC2640 TI Designs Reference Design Library is a robust reference design library
spanning analog, embedded processor and connectivity. Created by TI experts to help you
jump-start your system design, all TI Designs include schematic or block diagrams, BOMs
and design files to speed your time to market. Search and download designs at
Table 4-1. Signal Descriptions – RGZ Package (continued)
NAMENO.TYPEDESCRIPTION
DIO_1117Digital I/OGPIO
DIO_1218Digital I/OGPIO
DIO_1319Digital I/OGPIO
DIO_1420Digital I/OGPIO
DIO_1521Digital I/OGPIO
DIO_1626Digital I/OGPIO, JTAG_TDO, high-drive capability
DIO_1727Digital I/OGPIO, JTAG_TDI, high-drive capability
DIO_1828Digital I/OGPIO
DIO_1929Digital I/OGPIO
DIO_2030Digital I/OGPIO
DIO_2131Digital I/OGPIO
DIO_2232Digital I/OGPIO
DIO_2336Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_2437Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_2538Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_2639Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_2740Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_2841Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_2942Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_3043Digital/Analog I/OGPIO, Sensor Controller, Analog
JTAG_TMSC24Digital I/OJTAG TMSC, high-drive capability
JTAG_TCKC25Digital I/OJTAG TCKC
RESET_N35Digital inputReset, active-low. No internal pullup.
RF_P1RF I/O
RF_N2RF I/O
VDDR45Power1.7-V to 1.95-V supply, typically connect to output of internal DC-DC
VDDR_RF48Power1.7-V to 1.95-V supply, typically connect to output of internal DC-DC
VDDS44Power1.8-V to 3.8-V main chip supply
VDDS213Power1.8-V to 3.8-V DIO supply
VDDS322Power1.8-V to 3.8-V DIO supply
VDDS_DCDC34Power1.8-V to 3.8-V DC-DC supply
X32K_Q13Analog I/O32-kHz crystal oscillator pin 1
X32K_Q24Analog I/O32-kHz crystal oscillator pin 2
X24M_N46Analog I/O24-MHz crystal oscillator pin 1
X24M_P47Analog I/O24-MHz crystal oscillator pin 2
EGPPowerGround – Exposed Ground Pad
(3) If internal DC-DC is not used, this pin is supplied internally from the main LDO.
(4) If internal DC-DC is not used, this pin must be connected to VDDR for supply from the main LDO.
Positive RF input signal to LNA during RX
Positive RF output signal to PA during TX
Negative RF input signal to LNA during RX
Negative RF output signal to PA during TX
Table 4-2. Signal Descriptions – RHB Package (continued)
NAMENO.TYPEDESCRIPTION
RESET_N19Digital inputReset, active-low. No internal pullup.
RF_N2RF I/O
RF_P1RF I/O
RX_TX3RF I/OOptional bias pin for the RF LNA
VDDR29Power1.7-V to 1.95-V supply, typically connect to output of internal DC-DC
VDDR_RF32Power1.7-V to 1.95-V supply, typically connect to output of internal DC-DC
VDDS28Power1.8-V to 3.8-V main chip supply
VDDS211Power1.8-V to 3.8-V GPIO supply
VDDS_DCDC18Power1.8-V to 3.8-V DC-DC supply
X32K_Q14Analog I/O32-kHz crystal oscillator pin 1
X32K_Q25Analog I/O32-kHz crystal oscillator pin 2
X24M_N30Analog I/O24-MHz crystal oscillator pin 1
X24M_P31Analog I/O24-MHz crystal oscillator pin 2
EGPPowerGround – Exposed Ground Pad
(3) If internal DC-DC is not used, this pin is supplied internally from the main LDO.
(4) If internal DC-DC is not used, this pin must be connected to VDDR for supply from the main LDO.
Negative RF input signal to LNA during RX
Negative RF output signal to PA during TX
Positive RF input signal to LNA during RX
Positive RF output signal to PA during TX
Table 4-3. Signal Descriptions – RSM Package (continued)
NAMENO.TYPEDESCRIPTION
RX_TX4RF I/OOptional bias pin for the RF LNA
VDDR28Power1.7-V to 1.95-V supply, typically connect to output of internal DC-DC.
VDDR_RF32Power1.7-V to 1.95-V supply, typically connect to output of internal DC-DC
VDDS27Power1.8-V to 3.8-V main chip supply
VDDS211Power1.8-V to 3.8-V GPIO supply
VDDS_DCDC19Power
VSS
3, 7, 17, 20,
29
Power
1.8-V to 3.8-V DC-DC supply. Tie to ground for external regulator mode
(1.7-V to 1.95-V operation).
(3) If internal DC-DC is not used, this pin is supplied internally from the main LDO.
(4) If internal DC-DC is not used, this pin must be connected to VDDR for supply from the main LDO.
over operating free-air temperature range (unless otherwise noted)
Supply voltage (VDDS, VDDS2,
and VDDS3)
Supply voltage (VDDS
VDDR)
Voltage on any digital pin
Voltage on crystal oscillator pins, X32K_Q1, X32K_Q2, X24M_N and X24M_P–0.3VDDR + 0.3, max 2.25V
Voltage on ADC input (Vin)
Input RF level5 dBm
T
stg
(1) All voltage values are with respect to ground, unless otherwise noted.
(2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(3) In external regulator mode, VDDS2 and VDDS3 must be at the same potential as VDDS.
(4) Including analog-capable DIO.
(5) Each pin is referenced to a specific VDDSx (VDDS, VDDS2 or VDDS3). For a pin-to-VDDS mapping table, see Table 6-3.
(3)
and
(4)(5)
VDDR supplied by internal DC-DC regulator or
internal GLDO. VDDS_DCDC connected to VDDS on
PCB.
External regulator mode (VDDS and VDDR pins
connected on PCB)
Voltage scaling enabled–0.3VDDS
Voltage scaling disabled, VDDS as reference–0.3VDDS / 2.9
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Electrostatic discharge
(ESD) performance
JS001
Charged device model (CDM), per JESD22-C101
(2)
All pins±2500
RF pins±750
Non-RF pins±750
5.3Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MINMAXUNIT
Ambient temperature range–4085°C
Operating supply voltage
(VDDS and VDDR), external
regulator mode
Operating supply voltage VDDS
Operating supply voltages
VDDS2 and VDDS3
For operation in 1.8-V systems
(VDDS and VDDR pins connected on PCB, internal DCDC cannot be used)
For operation in battery-powered and 3.3-V systems
(internal DC-DC can be used to minimize power
consumption)
Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
otherwise noted.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Reset. RESET_N pin asserted or VDDS below
Power-on-Reset threshold
Shutdown. No clocks running, no retention150
Standby. With RTC, CPU, RAM and (partial)
register retention. RCOSC_LF
Standby. With RTC, CPU, RAM and (partial)
register retention. XOSC_LF
Standby. With Cache, RTC, CPU, RAM and
(partial) register retention. RCOSC_LF
I
core
Peripheral Current Consumption (Adds to core current I
I
peri
(1) Single-ended RF mode is optimized for size and power consumption. Measured on CC2650EM-4XS.
(2) Differential RF mode is optimized for RF performance. Measured on CC2650EM-5XD.
(3) I
Core current consumption
Standby. With Cache, RTC, CPU, RAM and
(partial) register retention. XOSC_LF
Idle. Supply Systems and RAM powered.550
Active. Core running CoreMark
Radio RX
Radio RX
Radio TX, 0-dBm output power
Radio TX, 5-dBm output power
(1)
(2)
(1)
(2)
for each peripheral unit activated)
core
Peripheral power domainDelta current with domain enabled20µA
Serial power domainDelta current with domain enabled13µA
RF Core
Delta current with power domain enabled, clock
enabled, RF core idle
µDMADelta current with clock enabled, module idle130µA
TimersDelta current with clock enabled, module idle113µA
I2CDelta current with clock enabled, module idle12µA
I2SDelta current with clock enabled, module idle36µA
SSIDelta current with clock enabled, module idle93µA
UARTDelta current with clock enabled, module idle164µA
is not supported in Standby or Shutdown.
peri
= 3.0 V with internal DC-DC converter, unless
DDS
(3)
100
1
1.2
2.5
2.7
1.45 mA +
31 µA/MHz
5.9
6.1
6.1
9.1
237µA
www.ti.com
nA
µA
mA
5.5General Characteristics
Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
FLASH MEMORY
Supported flash erase cycles before
failure
Flash page/sector erase currentAverage delta current12.6mA
Flash page/sector size4KB
Flash write currentAverage delta current, 4 bytes at a time8.15mA
Flash page/sector erase time
Flash write time
(1)
(1) This number is dependent on Flash aging and will increase over time and erase cycles.
5.61-Mbps GFSK (Bluetooth low energy Technology) – RX
Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Receiver sensitivity
Receiver sensitivity
Receiver saturation
Receiver saturation
Frequency error tolerance
Data rate error tolerance
Co-channel rejection
Selectivity, ±1 MHz
Selectivity, ±2 MHz
Selectivity, ±3 MHz
Selectivity, ±4 MHz
(1)
(1)
(1)
(1)
(1)
Selectivity, ±5 MHz or more
Selectivity, Image frequency
Selectivity, Image frequency
(1)
±1 MHz
Out-of-band blocking
(3)
Out-of-band blocking2003 MHz to 2399 MHz–5dBm
Out-of-band blocking2484 MHz to 2997 MHz–8dBm
Out-of-band blocking3000 MHz to 12.75 GHz–8dBm
Intermodulation
Spurious emissions,
30 to 1000 MHz
Spurious emissions,
1 to 12.75 GHz
RSSI dynamic range70dB
RSSI accuracy±4dB
(1) Numbers given as I/C dB.
(2) X / Y, where X is +N MHz and Y is –N MHz.
(3) Excluding one exception at F
Differential mode. Measured at the CC2650EM-5XD
SMA connector, BER = 10
Single-ended mode. Measured on CC2650EM-4XS,
at the SMA connector, BER = 10
Differential mode. Measured at the CC2650EM-5XD
SMA connector, BER = 10
Single-ended mode. Measured on CC2650EM-4XS,
at the SMA connector, BER = 10
–3
–3
–3
–3
Difference between the incoming carrier frequency
and the internally generated carrier frequency
Difference between incoming data rate and the
internally generated data rate
Wanted signal at –67 dBm, modulated interferer in
channel,
BER = 10
–3
Wanted signal at –67 dBm, modulated interferer at
±1 MHz,
BER = 10
–3
Wanted signal at –67 dBm, modulated interferer at
±2 MHz,
BER = 10
–3
Wanted signal at –67 dBm, modulated interferer at
±3 MHz,
BER = 10
–3
Wanted signal at –67 dBm, modulated interferer at
±4 MHz,
BER = 10
Wanted signal at –67 dBm, modulated interferer at ≥
(1)
±5 MHz, BER = 10
Wanted signal at –67 dBm, modulated interferer at
(1)
image frequency,
BER = 10
Wanted signal at –67 dBm, modulated interferer at
±1 MHz from image frequency, BER = 10
–3
–3
–3
–3
30 MHz to 2000 MHz–20dBm
Wanted signal at 2402 MHz, –64 dBm. Two
interferers at 2405 and 2408 MHz respectively, at
the given power level
Conducted measurement in a 50-Ω single-ended
load. Suitable for systems targeting compliance with
EN 300 328, EN 300 440 class 2, FCC CFR47, Part
15 and ARIB STD-T-66
Conducted measurement in a 50 Ω single-ended
load. Suitable for systems targeting compliance with
EN 300 328, EN 300 440 class 2, FCC CFR47, Part
15 and ARIB STD-T-66
(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2
(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan).
Differential mode, delivered to a single-ended 50-Ω load
through a balun
Measured on CC2650EM-4XS, delivered to a single-ended
50-Ω load
f < 1 GHz, outside restricted bands–43dBm
f < 1 GHz, restricted bands ETSI–65dBm
f < 1 GHz, restricted bands FCC–76dBm
f > 1 GHz, including harmonics–46dBm
= 3.0 V, fRF= 2440 MHz, unless otherwise noted.
DDS
5dBm
2dBm
5.12 24-MHz Crystal Oscillator (XOSC_HF)
Tc= 25°C, V
= 3.0 V, unless otherwise noted.
DDS
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
ESR Equivalent series resistance
ESR Equivalent series resistance
LMMotional inductance
(2)
CLCrystal load capacitance
Crystal frequency
(2)(3)
Crystal frequency tolerance
Start-up time
(3)(5)
(2)
(2)
Relates to load capacitance
(CLin Farads)
(2)
(2)(4)
(1) Probing or otherwise stopping the XTAL while the DC-DC converter is enabled may cause permanent damage to the device.
(2) The crystal manufacturer's specification must satisfy this requirement
(3) Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
(4) Includes initial tolerance of the crystal, drift over temperature, ageing and frequency pulling due to incorrect load capacitance. As per
Bluetooth specification.
(5) Kick-started based on a temperature and aging compensated RCOSC_HF using precharge injection.
(1)
6 pF < CL≤ 9 pF2060Ω
5 pF < CL≤ 6 pF80Ω
–24
< 1.6 × 10
/ C
2
L
59pF
24MHz
–4040ppm
150µs
= 3.0 V
DDS
H
5.13 32.768-kHz Crystal Oscillator (XOSC_LF)
Tc= 25°C, V
Crystal frequency
Crystal frequency tolerance, Bluetooth low-
energy applications
ESR Equivalent series resistance
CLCrystal load capacitance
(1) The crystal manufacturer's specification must satisfy this requirement
(2) Includes initial tolerance of the crystal, drift over temperature, ageing and frequency pulling due to incorrect load capacitance. As per
Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Frequency48MHz
Uncalibrated frequency accuracy±1%
Calibrated frequency accuracy
Start-up time5µs
(1) Accuracy relative to the calibration source (XOSC_HF).
(1)
= 3.0 V, unless otherwise noted.
DDS
±0.25%
5.15 32-kHz RC Oscillator (RCOSC_LF)
Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Calibrated frequency
Temperature coefficient50ppm/°C
(1) The frequency accuracy of the Real Time Clock (RTC) is not directly dependent on the frequency accuracy of the 32-kHz RC Oscillator.
The RTC can be calibrated to an accuracy within ±500 ppm of 32.768 kHz by measuring the frequency error of RCOSC_LF relative to
XOSC_HF and compensating the RTC tick speed. The procedure is explained in Running Bluetooth®Low Energy on CC2640 Without
32 kHz Crystal.
(1)
= 3.0 V, unless otherwise noted.
DDS
32.8kHz
5.16 ADC Characteristics
Tc= 25°C, V
= 3.0 V and voltage scaling enabled, unless otherwise noted.
DDS
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Input voltage range0VDDSV
Resolution12Bits
Sample rate200ksps
OffsetInternal 4.3-V equivalent reference
Gain errorInternal 4.3-V equivalent reference
(3)
DNL
INL
Differential nonlinearity>–1LSB
(4)
Integral nonlinearity±3LSB
ENOBEffective number of bits
THDTotal harmonic distortion
SINAD,
SNDR
SFDR
Signal-to-noise
and
Distortion ratio
Spurious-free dynamic
range
(2)
(2)
Internal 4.3-V equivalent reference
(2)
, 200 ksps,
9.6-kHz input tone
Internal 1.44-V reference, voltage scaling disabled,
32 samples average, 200 ksps, 300-Hz input tone
Internal 4.3-V equivalent reference
(2)
, 200 ksps,
9.6-kHz input tone
Internal 1.44-V reference, voltage scaling disabled,
32 samples average, 200 ksps, 300-Hz input tone
Internal 4.3-V equivalent reference
(2)
, 200 ksps,
9.6-kHz input tone
Internal 1.44-V reference, voltage scaling disabled,
32 samples average, 200 ksps, 300-Hz input tone
Internal 4.3-V equivalent reference
(2)
, 200 ksps,
9.6-kHz input tone
Internal 1.44-V reference, voltage scaling disabled,
32 samples average, 200 ksps, 300-Hz input tone
(1)
2LSB
2.4LSB
9.8
BitsVDDS as reference, 200 ksps, 9.6-kHz input tone10
11.1
–65
dBVDDS as reference, 200 ksps, 9.6-kHz input tone–69
–71
60
dBVDDS as reference, 200 ksps, 9.6-kHz input tone63
69
67
dBVDDS as reference, 200 ksps, 9.6-kHz input tone72
73
(1) Using IEEE Std 1241™-2010 for terminology and test methods.
(2) Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V.
(3) No missing codes. Positive DNL typically varies from +0.3 to +3.5, depending on device (see Figure 5-22).
(4) For a typical example, see Figure 5-23.
Equivalent fixed internal reference (input voltage scaling
Reference voltage
enabled). For best accuracy, the ADC conversion should
be initiated through the TIRTOS API in order to include the
gain/offset compensation factors stored in FCFG1.
Fixed internal reference (input voltage scaling disabled).
For best accuracy, the ADC conversion should be initiated
Reference voltage
through the TIRTOS API in order to include the gain/offset
compensation factors stored in FCFG1. This value is
derived from the scaled value (4.3V) as follows:
Vref=4.3V*1408/4095
Reference voltage
Reference voltage
VDDS as reference (Also known as RELATIVE) (input
voltage scaling enabled)
VDDS as reference (Also known as RELATIVE) (input
voltage scaling disabled)
200 ksps, voltage scaling enabled. Capacitive input, Input
Input Impedance
impedance depends on sampling frequency and sampling
time
Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Resolution4°C
Range–4085°C
Accuracy±5°C
Supply voltage coefficient
(1) Automatically compensated when using supplied driver libraries.
(1)
= 3.0 V, unless otherwise noted.
DDS
3.2°C/V
5.18 Battery Monitor
Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Resolution50mV
Range1.83.8V
Accuracy13mV
= 3.0 V, unless otherwise noted.
DDS
5.19 Continuous Time Comparator
Tc= 25°C, V
Input voltage range0VDDSV
External reference voltage0VDDSV
Internal reference voltageDCOUPL as reference1.27V
Offset3mV
Hysteresis<2mV
Decision timeStep from –10 mV to 10 mV0.72µs
Current consumption when enabled
(1) Additionally, the bias module must be enabled when running in standby mode.
(1) °C/W = degrees Celsius per watt.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RθJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements.
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
The SimpleLink CC2640 Wireless MCU contains an ARM Cortex-M3 (CM3) 32-bit CPU, which runs the
application and the higher layers of the protocol stack.
The CM3 processor provides a high-performance, low-cost platform that meets the system requirements
of minimal memory implementation, andlow-power consumption, while delivering outstanding
computational performance and exceptional system response to interrupts.
CM3 features include the following:
•32-bit ARM Cortex-M3 architecture optimized for small-footprint embedded applications
•Outstanding processing performance combined with fast interrupt handling
•ARM Thumb®-2 mixed 16- and 32-bit instruction set delivers the high performance expected of a 32-bit
ARM core in a compact memory size usually associated with 8- and 16-bit devices, typically in the
range of a few kilobytes of memory for microcontroller-class applications:
– Single-cycle multiply instruction and hardware divide
– Atomic bit manipulation (bit-banding), delivering maximum memory use and streamlined peripheral
control
– Unaligned data access, enabling data to be efficiently packed into memory
•Fast code execution permits slower processor clock or increases sleep mode time
•Harvard architecture characterized by separate buses for instruction and data
•Efficient processor core, system, and memories
•Hardware division and fast digital-signal-processing oriented multiply accumulate
•Saturating arithmetic for signal processing
•Deterministic, high-performance interrupt handling for time-critical applications
•Enhanced system debug with extensive breakpoint and trace capabilities
•Serial wire trace reduces the number of pins required for debugging and tracing
•Migration from the ARM7™ processor family for better performance and power efficiency
•Optimized for single-cycle flash memory use
•Ultralow-power consumption with integrated sleep modes
•1.25 DMIPS per MHz
www.ti.com
6.4RF Core
The RF Core contains an ARM Cortex-M0 processor that interfaces the analog RF and base-band
circuitries, handles data to and from the system side, and assembles the information bits in a given packet
structure. The RF core offers a high level, command-based API to the main CPU.
The RF core is capable of autonomously handling the time-critical aspects of the radio protocols
(Bluetooth Low Energy) thus offloading the main CPU and leaving more resources for the user application.
The RF core has a dedicated 4-KB SRAM block and runs initially from separate ROM memory. The ARM
Cortex-M0 processor is not programmable by customers.
The Sensor Controller contains circuitry that can be selectively enabled in standby mode. The peripherals
in this domain may be controlled by the Sensor Controller Engine which is a proprietary power-optimized
CPU. This CPU can read and monitor sensors or perform other tasks autonomously, thereby significantly
reducing power consumption and offloading the main CM3 CPU.
The Sensor Controller is set up using a PC-based configuration tool, called Sensor Controller Studio, and
potential use cases may be (but are not limited to):
•Analog sensors using integrated ADC
•Digital sensors using GPIOs, bit-banged I2C, and SPI
•UART communication for sensor reading or debugging
•Capacitive sensing
•Waveform generation
•Pulse counting
•Keyboard scan
•Quadrature decoder for polling rotation sensors
•Oscillator calibration
Texas Instruments provides application examples for some of these use cases, but not for all
of them.
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
NOTE
The peripherals in the Sensor Controller include the following:
•The low-power clocked comparator can be used to wake the device from any state in which the
comparator is active. A configurable internal reference can be used in conjunction with the comparator.
The output of the comparator can also be used to trigger an interrupt or the ADC.
•Capacitive sensing functionality is implemented through the use of a constant current source, a timeto-digital converter, and a comparator. The continuous time comparator in this block can also be used
as a higher-accuracy alternative to the low-power clocked comparator. The Sensor Controller will take
care of baseline tracking, hysteresis, filtering and other related functions.
•The ADC is a 12-bit, 200-ksamples/s ADC with eight inputs and a built-in voltage reference. The ADC
can be triggered by many different sources, including timers, I/O pins, software, the analog
comparator, and the RTC.
•The Sensor Controller also includes a SPI–I2C digital interface.
•The analog modules can be connected to up to eight different GPIOs.
The peripherals in the Sensor Controller can also be controlled from the main application processor.
The flash memory provides nonvolatile storage for code and data. The flash memory is in-system
programmable.
The SRAM (static RAM) can be used for both storage of data and execution of code and is split into two
4-KB blocks and two 6-KB blocks. Retention of the RAM contents in standby mode can be enabled or
disabled individually for each block to minimize power consumption. In addition, if flash cache is disabled,
the 8-KB cache can be used as a general-purpose RAM.
The ROM provides preprogrammed embedded TI RTOS kernel, Driverlib and lower layer protocol stack
software (Bluetooth Low Energy Controller). It also contains a bootloader that can be used to reprogram
the device using SPI or UART.
6.7Debug
The on-chip debug support is done through a dedicated cJTAG (IEEE 1149.7) or JTAG (IEEE 1149.1)
interface.
Sensor ControllerAvailableAvailableAvailableOffOff
Wake up on RTCAvailableAvailableAvailableOffOff
Wake up on Pin EdgeAvailableAvailableAvailableAvailableOff
Wake up on Reset PinAvailableAvailableAvailableAvailableAvailable
Brown Out Detector (BOD)ActiveActiveDuty Cycled
Power On Reset (POR)ActiveActiveActiveActiveN/A
(1) Not including RTOS overhead
(2) The Brown Out Detector is disabled between recharge periods in STANDBY. Lowering the supply voltage below the BOD threshold
between two recharge periods while in STANDBY may cause the BOD to lock the device upon wake-up until a Reset/POR releases it.
To avoid this, it is recommended that STANDBY mode is avoided if there is a risk that the supply voltage (VDDS) may drop below the
specified operating voltage range. For the same reason, it is also good practice to ensure that a power cycling operation, such as a
battery replacement, triggers a Power-on-reset by ensuring that the VDDS decoupling network is fully depleted before applying supply
voltage again (for example, inserting new batteries).
(1)
ACTIVEIDLESTANDBYSHUTDOWN
XOSC_HF or
RCOSC_HF
XOSC_LF or
RCOSC_LF
SOFTWARE CONFIGURABLE POWER MODES
–14 µs151 µs1015 µs1015 µs
XOSC_HF or
RCOSC_HF
XOSC_LF or
RCOSC_LF
OffOffOff
XOSC_LF or
RCOSC_LF
(2)
OffOff
OffN/A
RESET PIN
HELD
In active mode, the application CM3 CPU is actively executing code. Active mode provides normal
operation of the processor and all of the peripherals that are currently enabled. The system clock can be
any available clock source (see Table 6-2).
In idle mode, all active peripherals can be clocked, but the Application CPU core and memory are not
clocked and no code is executed. Any interrupt event will bring the processor back into active mode.
In standby mode, only the always-on domain (AON) is active. An external wake event, RTC event, or
sensor-controller event is required to bring the device back to active mode. MCU peripherals with retention
do not need to be reconfigured when waking up again, and the CPU continues execution from where it
went into standby mode. All GPIOs are latched in standby mode.
In shutdown mode, the device is turned off entirely, including the AON domain and the Sensor Controller.
The I/Os are latched with the value they had before entering shutdown mode. A change of state on any
I/O pin defined as a wake from Shutdown pin wakes up the device and functions as a reset trigger. The
CPU can differentiate between a reset in this way, a reset-by-reset pin, or a power-on-reset by reading the
reset status register. The only state retained in this mode is the latched I/O state and the Flash memory
contents.
The Sensor Controller is an autonomous processor that can control the peripherals in the Sensor
Controller independently of the main CPU, which means that the main CPU does not have to wake up, for
example, to execute an ADC sample or poll a digital sensor over SPI. The main CPU saves both current
and wake-up time that would otherwise be wasted. The Sensor Controller Studio enables the user to
configure the sensor controller and choose which peripherals are controlled and which conditions wake up
the main CPU.
6.9Clock Systems
The CC2640 supports two external and two internal clock sources.
A 24-MHz crystal is required as the frequency reference for the radio. This signal is doubled internally to
create a 48-MHz clock.
The 32-kHz crystal is optional. Bluetooth low energy requires a slow-speed clock with better than
±500 ppm accuracy if the device is to enter any sleep mode while maintaining a connection. The internal
32-kHz RC oscillator can in some use cases be compensated to meet the requirements. The low-speed
crystal oscillator is designed for use with a 32-kHz watch-type crystal.
The internal high-speed oscillator (48-MHz) can be used as a clock source for the CPU subsystem.
The internal low-speed oscillator (32.768-kHz) can be used as a reference if the low-power crystal
oscillator is not used.
www.ti.com
The 32-kHz clock source can be used as external clocking reference through GPIO.
6.10 General Peripherals and Modules
The I/O controller controls the digital I/O pins and contains multiplexer circuitry to allow a set of peripherals
to be assigned to I/O pins in a flexible manner. All digital I/Os are interrupt and wake-up capable, have a
programmable pullup and pulldown function and can generate an interrupt on a negative or positive edge
(configurable). When configured as an output, pins can function as either push-pull or open-drain. Five
GPIOs have high drive capabilities (marked in bold in Section 4).
The SSIs are synchronous serial interfaces that are compatible with SPI, MICROWIRE, and Texas
Instruments synchronous serial interfaces. The SSIs support both SPI master and slave up to 4 MHz.
The UART implements a universal asynchronous receiver/transmitter function. It supports flexible baudrate generation up to a maximum of 3 Mbps and is compatible with the Bluetooth HCI specifications.
Timer 0 is a general-purpose timer module (GPTM), which provides two 16-bit timers. The GPTM can be
configured to operate as a single 32-bit timer, dual 16-bit timers or as a PWM module.
Timer 1, Timer 2, and Timer 3 are also GPTMs. Each of these timers is functionally equivalent to Timer 0.
In addition to these four timers, the RF core has its own timer to handle timing for RF protocols; the RF
timer can be synchronized to the RTC.
The I2C interface is used to communicate with devices compatible with the I2C standard. The I2C interface
is capable of 100-kHz and 400-kHz operation, and can serve as both I2C master and I2C slave.
The TRNG module provides a true, nondeterministic noise source for the purpose of generating keys,
initialization vectors (IVs), and other random number requirements. The TRNG is built on 24 ring
oscillators that create unpredictable output to feed a complex nonlinear combinatorial circuit.
36
The watchdog timer is used to regain control if the system fails due to a software error after an external
device fails to respond as expected. The watchdog timer can generate an interrupt or a reset when a
predefined time-out value is reached.
The device includes a direct memory access (µDMA) controller. The µDMA controller provides a way to
offload data transfer tasks from the CM3 CPU, allowing for more efficient use of the processor and the
available bus bandwidth. The µDMA controller can perform transfer between memory and peripherals. The
µDMA controller has dedicated channels for each supported on-chip module and can be programmed to
automatically perform transfers between peripherals and memory as the peripheral is ready to transfer
more data. Some features of the µDMA controller include the following (this is not an exhaustive list):
•Highly flexible and configurable channel operation of up to 32 channels
•Transfer modes:
•Data sizes of 8, 16, and 32 bits
The AON domain contains circuitry that is always enabled, except for in Shutdown (where the digital
supply is off). This circuitry includes the following:
•The RTC can be used to wake the device from any state where it is active. The RTC contains three
•The battery monitor and temperature sensor are accessible by software and give a battery status
compare and one capture registers. With software support, the RTC can be used for clock and
calendar operation. The RTC is clocked from the 32-kHz RC oscillator or crystal. The RTC can also be
compensated to tick at the correct frequency even when the internal 32-kHz RC oscillator is used
instead of a crystal.
indication as well as a coarse temperature measure.
6.11 Voltage Supply Domains
The CC2640 device can interface to two or three different voltage domains depending on the package
type. On-chip level converters ensure correct operation as long as the signal voltage on each input/output
pin is set with respect to the corresponding supply pin (VDDS, VDDS2 or VDDS3). lists the pin-to-VDDS
mapping.
Table 6-3. Pin function to VDDS mapping table
VQFN 7 × 7 (RGZ)VQFN 5 × 5 (RHB)VQFN 4 × 4 (RSM)
(1)
VDDS
VDDS2DIO 0–11
VDDS3
(1) VDDS_DCDC must be connected to VDDS on the PCB
DIO 23–30
Reset_N
DIO 12–22
JTAG
6.12 System Architecture
Depending on the product configuration, CC26xx can function either as a Wireless Network Processor
(WNP—an IC running the wireless protocol stack, with the application running on a separate MCU), or as
a System-on-Chip (SoC), with the application and protocol stack running on the ARM CM3 core inside the
device.
In the first case, the external host MCU communicates with the device using SPI or UART. In the second
case, the application must be written according to the application framework supplied with the wireless
protocol stack.
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI's customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
7.1Application Information
Very few external components are required for the operation of the CC2640 device. This section provides
some general information about the various configuration options when using the CC2640 in an
application, and then shows two examples of application circuits with schematics and layout. This is only a
small selection of the many application circuit examples available as complete reference designs from the
product folder on www.ti.com.
Figure 7-1 shows the various RF front-end configuration options. The RF front end can be used in
differential- or single-ended configurations with the options of having internal or external biasing. These
options allow for various trade-offs between cost, board space, and RF performance. Differential operation
with external bias gives the best performance while single-ended operation with internal bias gives the
least amount of external components and the lowest power consumption. Reference designs exist for
each of these options.
Figure 7-2 shows the various supply voltage configuration options. Not all power supply decoupling
capacitors or digital I/Os are shown. Exact pin positions will vary between the different package options.
For a detailed overview of power supply decoupling and wiring, see the TI reference designs and the
CC26xx technical reference manual (Section 8.3).
To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and
date-code. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example,
CC2640 is in production; therefore, no prefix/identification is assigned).
Device development evolutionary flow:
XExperimental device that is not necessarily representative of the final device's electrical
specifications and may not use production assembly flow.
PPrototype device that is not necessarily the final silicon die and may not necessarily meet
final electrical specifications.
nullProduction version of the silicon die that is fully qualified.
Production devices have been characterized fully, and the quality and reliability of the device have been
demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be
used.
www.ti.com
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, RSM).
For orderable part numbers of the CC2640 device in the RSM, RHB or RGZ package types, see the
Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales
representative.
TI offers an extensive line of development tools, including tools to evaluate the performance of the
processors, generate code, develop algorithm implementations, and fully integrate and debug software
and hardware modules.
The following products support development of the CC2640 device applications:
Software Tools:
SmartRF Studio 7:
SmartRF Studio is a PC application that helps designers of radio systems to easily evaluate the RF-IC at
an early stage in the design process.
•Test functions for sending and receiving radio packets, continuous wave transmit and receive
•Evaluate RF performance on custom boards by wiring it to a supported evaluation board or debugger
•Can also be used without any hardware, but then only to generate, edit and export radio configuration
settings
•Can be used in combination with several development kits for Texas Instruments’ CCxxxx RF-ICs
Sensor Controller Studio:
Sensor Controller Studio provides a development environment for the CC26xx Sensor Controller. The
Sensor Controller is a proprietary, power-optimized CPU in the CC26xx, which can perform simple
background tasks autonomously and independent of the System CPU state.
•Allows for Sensor Controller task algorithms to be implemented using a C-like programming language
•Outputs a Sensor Controller Interface driver, which incorporates the generated Sensor Controller
machine code and associated definitions
•Allows for rapid development by using the integrated Sensor Controller task testing and debugging
functionality. This allows for live visualization of sensor data and algorithm verification.
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
IDEs and Compilers:
Code Composer Studio:
•Integrated development environment with project management tools and editor
•Code Composer Studio (CCS) 6.1 and later has built-in support for the CC26xx device family
•Best support for XDS debuggers; XDS100v3, XDS110 and XDS200
•High integration with TI-RTOS with support for TI-RTOS Object View
IAR Embedded Workbench for ARM
•Integrated development environment with project management tools and editor
•IAR EWARM 7.30.3 and later has built-in support for the CC26xx device family
•Broad debugger support, supporting XDS100v3, XDS200, IAR I-Jet and Segger J-Link
•Integrated development environment with project management tools and editor
•RTOS plugin available for TI-RTOS
For a complete listing of development-support tools for the CC2640 platform, visit the Texas Instruments
website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office
or authorized distributor.
To receive notification of documentation updates, navigate to the device product folder on ti.com
(CC2640). In the upper right corner, click on Alert me to register and receive a weekly digest of any
product information that has changed. For change details, review the revision history included in any
revised document.
The current documentation that describes the CC2640 devices, related peripherals, and other technical
collateral is listed in the following.
Texas Instruments' Low-Power RF website has all the latest products, application and design notes, FAQ
section, news and events updates. Go to www.ti.com/lprf.
8.5Low-Power RF eNewsletter
The Low-Power RF eNewsletter is up-to-date on new products, news releases, developers’ news, and
other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter
articles include links to get more online information.
www.ti.com
Sign up at: www.ti.com/lprfnewsletter
8.6Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Online CommunityTI's Engineer-to-Engineer(E2E) Community.Created tofoster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help
developers get started with Embedded Processors from Texas Instruments and to foster
innovation and growth of general knowledge about the hardware and software surrounding
these devices.
Low-Power RF Online Community Wireless Connectivity Section of the TI E2E Support Community
•Forums, videos, and blogs
•RF design help
•E2E interaction
Join here.
Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-power
RF development partners to help customers speed up their application development. The
network consists of recommended companies, RF consultants, and independent design
houses that provide a series of hardware module products and design services, including:
•RF circuit, low-power RF, and ZigBee design services
•Low-power RF and ZigBee module solutions and development tools
•RF certification services and RF circuit manufacturing
For help with modules, engineering services or development tools:
SearchtheLow-PowerRFDeveloperNetworktofindasuitablepartner.
Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and
standard-based wireless applications for use in industrial and consumer applications. The selection
includes RF transceivers, RF transmitters, RF front ends, and Systems-on-Chips as well as various
software solutions for the sub-1-GHz and 2.4-GHz frequency bands.
In addition, Texas Instruments provides a large selection of support collateral such as development tools,
technical documentation, reference designs, application expertise, customer support, third-party and
university programs.
The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the
chance to interact with engineers from all over the world.
With a broad selection of product solutions, end-application possibilities, and a range of technical support,
Texas Instruments offers the broadest low-power RF portfolio.
8.8Trademarks
SimpleLink, SmartRF, Code Composer Studio, E2E are trademarks of Texas Instruments.
ARM7 is a trademark of ARM Limited (or its subsidiaries).
ARM, Cortex, ARM Thumb are registered trademarks of ARM Limited (or its subsidiaries).
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
CoreMark is a registered trademark of Embedded Microprocessor Benchmark Consortium.
IAR Embedded Workbench is a registered trademark of IAR Systems AB.
IEEE Std 1241 is a trademark of Institute of Electrical and Electronics Engineers, Incorporated.
ZigBee is a registered trademark of ZigBee Alliance, Inc.
All other trademarks are the property of their respective owners.
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
8.9Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.10 Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from Disclosing party under
this Agreement, or any direct product of such technology, to any destination to which such export or reexport is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from
U.S. Department of Commerce and other competent Government authorities to the extent required by
those laws.
8.11 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
9Mechanical Packaging and Orderable Information
9.1Packaging Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
Lead/Ball Finish
(6)
CU NIPDAU | Call TILevel-3-260C-168 HR-40 to 85CC2640
CU NIPDAU | Call TILevel-3-260C-168 HR-40 to 85CC2640
CU NIPDAU | Call TILevel-3-260C-168 HR-40 to 85CC2640
CU NIPDAU | Call TILevel-3-260C-168 HR-40 to 85CC2640
CU NIPDAU | Call TILevel-3-260C-168 HR-40 to 85CC2640
CU NIPDAULevel-3-260C-168 HR-40 to 85CC2640
MSL Peak Temp
(3)
Op Temp (°C)Device Marking
(F128 ~ F128 BX)
F128
F128
F128
F128
F128
(4/5)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Samples
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Oct-2016
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
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TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
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Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
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No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
ProductsApplications
Audiowww.ti.com/audioAutomotive and Transportationwww.ti.com/automotive
Amplifiersamplifier.ti.comCommunications and Telecomwww.ti.com/communications
Data Convertersdataconverter.ti.comComputers and Peripheralswww.ti.com/computers
DLP® Productswww.dlp.comConsumer Electronicswww.ti.com/consumer-apps
DSPdsp.ti.comEnergy and Lightingwww.ti.com/energy
Clocks and Timerswww.ti.com/clocksIndustrialwww.ti.com/industrial
Interfaceinterface.ti.comMedicalwww.ti.com/medical
Logiclogic.ti.comSecuritywww.ti.com/security
Power Mgmtpower.ti.comSpace, Avionics and Defensewww.ti.com/space-avionics-defense
Microcontrollersmicrocontroller.ti.comVideo and Imagingwww.ti.com/video
RFIDwww.ti-rfid.com
OMAP Applications Processorswww.ti.com/omapTI E2E Communitye2e.ti.com
Wireless Connectivitywww.ti.com/wirelessconnectivity