Texas Instruments CC2640 Users manual

Product Folder
Sample & Buy
Technical Documents
Tools & Software
Support & Community
Reference Design
CC2640 SimpleLink™ Bluetooth®Wireless MCU

1 Device Overview

1.1 Features

1
• Microcontroller – Powerful ARM®Cortex®-M3 – EEMBC CoreMark®Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA)
• Ultralow-Power Sensor Controller – Can Run Autonomous From the Rest of the
System – 16-Bit Architecture – 2KB of Ultralow-Leakage SRAM for Code and
Data
• Efficient Code Size Architecture, Placing Drivers,
Bluetooth®Low Energy Controller, and Bootloader
in ROM
• RoHS-Compliant Packages – 4-mm × 4-mm RSM VQFN32 (10 GPIOs) – 5-mm × 5-mm RHB VQFN32 (15 GPIOs) – 7-mm × 7-mm RGZ VQFN48 (31 GPIOs)
• Peripherals – All Digital Peripheral Pins Can Be Routed to
Any GPIO
– Four General-Purpose Timer Modules
(Eight 16-Bit or Four 32-Bit Timers, PWM Each)
– 12-Bit ADC, 200-ksamples/s, 8-Channel Analog
MUX – Continuous Time Comparator – Ultralow-Power Analog Comparator – Programmable Current Source – UART – 2× SSI (SPI, MICROWIRE, TI) – I2C – I2S – Real-Time Clock (RTC) – AES-128 Security Module – True Random Number Generator (TRNG) – 10, 15, or 31 GPIOs, Depending on Package
Option – Support for Eight Capacitive-Sensing Buttons – Integrated Temperature Sensor
• External System – On-Chip internal DC-DC Converter
1
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
– Very Few External Components – Seamless Integration With the SimpleLink™
CC2590 and CC2592 Range Extenders
– Pin Compatible With the SimpleLink CC13xx in
4-mm × 4-mm and 5-mm × 5-mm VQFN Packages
• Low Power – Wide Supply Voltage Range
Normal Operation: 1.8 to 3.8 V
External Regulator Mode: 1.7 to 1.95 V – Active-Mode RX: 5.9 mA – Active-Mode TX at 0 dBm: 6.1 mA – Active-Mode TX at +5 dBm: 9.1 mA – Active-Mode MCU: 61 µA/MHz – Active-Mode MCU: 48.5 CoreMark/mA – Active-Mode Sensor Controller: 8.2 µA/MHz – Standby: 1 µA (RTC Running and RAM/CPU
Retention)
– Shutdown: 100 nA (Wake Up on External
Events)
• RF Section – 2.4-GHz RF Transceiver Compatible With
Bluetooth Low Energy (BLE) 4.2 Specification
– Excellent Receiver Sensitivity (–97 dBm for
BLE), Selectivity, and Blocking Performance – Link budget of 102 dB for BLE – Programmable Output Power up to +5 dBm – Single-Ended or Differential RF Interface – Suitable for Systems Targeting Compliance With
Worldwide Radio Frequency Regulations
ETSI EN 300 328 (Europe)
EN 300 440 Class 2 (Europe)
FCC CFR47 Part 15 (US)
ARIB STD-T66 (Japan)
• Tools and Development Environment – Full-Feature and Low-Cost Development Kits – Multiple Reference Designs for Different RF
Configurations – Packet Sniffer PC Software – Sensor Controller Studio – SmartRF™ Studio – SmartRF Flash Programmer 2 – IAR Embedded Workbench®for ARM – Code Composer Studio™
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016

1.2 Applications

Home and Building Automation – Connected Appliances – Lighting – Locks – Gateways – Security Systems
Industrial – Logistics – Production and Manufacturing – Automation – Asset Tracking and Management – Remote Display – Cable Replacement – HMI – Access Control
Retail – Beacons – Advertising – ESL and Price Tags – Point of Sales and Payment Systems
www.ti.com
Health and Medical – Thermometers – SpO2 – Blood Glucose and Pressure Meters – Weight Scales – Vitals Monitoring – Hearing Aids
Sports and Fitness – Activity Monitors and Fitness Trackers – Heart Rate Monitors – Running Sensors – Biking Sensors – Sports Watches – Gym Equipment – Team Sports Equipment
HID – Remote Controls – Keyboards and Mice – Gaming
Accessories – Toys – Trackers – Luggage Tags – Wearables

1.3 Description

The CC2640 device is a wireless MCU targeting Bluetooth applications. The device is a member of the CC26xx family of cost-effective, ultralow power, 2.4-GHz RF devices. Very
low active RF and MCU current and low-power mode current consumption provide excellent battery lifetime and allow for operation on small coin cell batteries and in energy-harvesting applications.
The CC2640 device contains a 32-bit ARM Cortex-M3 processor that runs at 48 MHz as the main processor and a rich peripheral feature set that includes a unique ultralow power sensor controller. This sensor controller is ideal for interfacing external sensors and for collecting analog and digital data autonomously while the rest of the system is in sleep mode. Thus, the CC2640 device is ideal for a wide range of applications where long battery lifetime, small form factor, and ease of use is important.
The Bluetooth Low Energy controller is embedded into ROM and runs partly on an ARM Cortex-M0 processor. This architecture improves overall system performance and power consumption and frees up flash memory for the application.
The Bluetooth stack is available free of charge from www.ti.com.
Device Information
PART NUMBER PACKAGE BODY SIZE (NOM)
CC2640F128RGZ VQFN (48) 7.00 mm × 7.00 mm CC2640F128RHB VQFN (32) 5.00 mm × 5.00 mm CC2640F128RSM VQFN (32) 4.00 mm × 4.00 mm
(1) For more information, see Section 9, Mechanical Packaging and Orderable Information.
(1)
2
Device Overview Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640
SimpleLinkTM CC26xx wireless MCU
Main CPU
128KB
Flash
Sensor controller
cJTAG
20KB
SRAM
ROM
ARM
®
Cortex®-M3
DC-DC converter
RF core
ARM
®
Cortex®-M0
DSP modem
4KB
SRAM
ROM
Sensor controller
engine
2x comparator
12-bit ADC, 200 ks/s
Constant current source
SPI-I2C digital sensor IF
2KB SRAM
Time-to-digital converter
General peripherals / modules
4× 32-bit Timers
2× SSI (SPI, µW, TI)
Watchdog timer
Temp. / batt. monitor
RTC
I2C
UART
I2S
10 / 15 / 31 GPIOs
AES
32 ch. µDMA
ADC
Digital PLL
TRNG
ADC
8KB
cache
Copyright © 2016, Texas Instruments Incorporated
www.ti.com

1.4 Functional Block Diagram

Figure 1-1 shows a block diagram for the CC2640.
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
Figure 1-1. Block Diagram
Submit Documentation Feedback
Product Folder Links: CC2640
Device OverviewCopyright © 2015–2016, Texas Instruments Incorporated
3
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
www.ti.com

Table of Contents

1 Device Overview ......................................... 1
1.1 Features .............................................. 1
1.2 Applications........................................... 2
1.3 Description............................................ 2
1.4 Functional Block Diagram ............................ 3
2 Revision History ......................................... 5
3 Device Comparison ..................................... 6
3.1 Related Products ..................................... 6
4 Terminal Configuration and Functions.............. 7
4.1 Pin Diagram – RGZ Package ........................ 7
4.2 Signal Descriptions – RGZ Package ................. 7
4.3 Pin Diagram – RHB Package ........................ 9
4.4 Signal Descriptions – RHB Package ................. 9
4.5 Pin Diagram – RSM Package....................... 11
4.6 Signal Descriptions – RSM Package ............... 11
5 Specifications........................................... 13
5.1 Absolute Maximum Ratings......................... 13
5.2 ESD Ratings ........................................ 13
5.3 Recommended Operating Conditions............... 13
5.4 Power Consumption Summary...................... 14
5.5 General Characteristics ............................. 14
5.6 1-Mbps GFSK (Bluetooth low energy Technology) –
RX ................................................... 15
5.7 1-Mbps GFSK (Bluetooth low energy Technology) –
TX ................................................... 16
5.8 2-Mbps GFSK (Bluetooth 5) – RX .................. 16
5.9 2-Mbps GFSK (Bluetooth 5) – TX................... 17
5.10 5-Mbps (Proprietary) – RX .......................... 17
5.11 5-Mbps (Proprietary) – TX .......................... 18
5.12 24-MHz Crystal Oscillator (XOSC_HF) ............. 18
5.13 32.768-kHz Crystal Oscillator (XOSC_LF).......... 18
5.14 48-MHz RC Oscillator (RCOSC_HF) ............... 19
5.15 32-kHz RC Oscillator (RCOSC_LF)................. 19
5.16 ADC Characteristics................................. 19
5.17 Temperature Sensor ................................ 21
5.18 Battery Monitor...................................... 21
5.19 Continuous Time Comparator....................... 21
5.20 Low-Power Clocked Comparator ................... 22
5.21 Programmable Current Source ..................... 22
5.22 Synchronous Serial Interface (SSI) ................ 22
5.23 DC Characteristics .................................. 24
5.24 Thermal Resistance Characteristics ................ 25
5.25 Timing Requirements ............................... 26
5.26 Switching Characteristics ........................... 26
5.27 Typical Characteristics .............................. 27
6 Detailed Description ................................... 31
6.1 Overview ............................................ 31
6.2 Functional Block Diagram........................... 31
6.3 Main CPU ........................................... 32
6.4 RF Core ............................................. 32
6.5 Sensor Controller ................................... 33
6.6 Memory.............................................. 34
6.7 Debug ............................................... 34
6.8 Power Management................................. 35
6.9 Clock Systems ...................................... 36
6.10 General Peripherals and Modules .................. 36
6.11 Voltage Supply Domains............................ 37
6.12 System Architecture................................. 37
7 Application, Implementation, and Layout ......... 38
7.1 Application Information.............................. 38
7.2 5 × 5 External Differential (5XD) Application Circuit
...................................................... 40
7.3 4 × 4 External Single-ended (4XS) Application
Circuit ............................................... 42
8 Device and Documentation Support ............... 44
8.1 Device Nomenclature ............................... 44
8.2 Tools and Software ................................. 45
8.3 Documentation Support ............................. 46
8.4 Texas Instruments Low-Power RF Website ........ 46
8.5 Low-Power RF eNewsletter ......................... 46
8.6 Community Resources .............................. 46
8.7 Additional Information ............................... 47
8.8 Trademarks.......................................... 47
8.9 Electrostatic Discharge Caution..................... 47
8.10 Export Control Notice ............................... 47
8.11 Glossary............................................. 47
9 Mechanical Packaging and Orderable
Information .............................................. 47
9.1 Packaging Information .............................. 47
4
Table of Contents Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640
CC2640
www.ti.com
SWRS176B –FEBRUARY 2015–REVISED JULY 2016

2 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from October 23, 2015 to July 5, 2016 Page
Added split VDDS supply rail feature .............................................................................................. 1
Added 5-Mbps proprietary mode ................................................................................................... 1
Added option for up to 80-Ω ESR when C
Added tolerance for RCOSC_LF and RTC accuracy content ................................................................ 19
Updated the Soc ADC internal voltage reference specification in Section 5.16 ........................................... 19
Moved all SSI parameters to Section 5.22 ...................................................................................... 22
Added 0-dBm setting to the TX Current Consumption vs Supply Voltage (VDDS) graph ................................ 27
Changed Figure 5-11, Receive Mode Current vs Supply Voltage (VDDS) ................................................. 27
Added Figure 5-21, Supply Current vs Temperature .......................................................................... 28
Changes from February 15, 2015 to October 22, 2015 Page
Removed RHB package option from CC2620 .................................................................................... 6
Added motional inductance recommendation to the 24-MHz XOSC table ................................................. 18
Added SPI timing parameters ..................................................................................................... 22
Added VOH and VOL min and max values for 4-mA and 8-mA load ....................................................... 24
Added min and max values for VIH and VIL .................................................................................... 25
Added BLE Sensitivity vs Channel Frequency .................................................................................. 27
Added RF Output Power vs Channel Frequency ............................................................................... 27
Added Figure 5-11, Receive Mode Current vs Supply Voltage (VDDS)..................................................... 27
Changed Figure 5-20, SoC ADC ENOB vs Sampling Frequency (Input Frequency = FS / 10).......................... 28
Clarified Brown Out Detector status and functionality in the Power Modes table. ......................................... 35
Added application circuit schematics and layout for 5XD and 4XS .......................................................... 38
is 6 pF or lower .................................................................. 18
L
Submit Documentation Feedback
Product Folder Links: CC2640
Revision HistoryCopyright © 2015–2016, Texas Instruments Incorporated
5
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016

3 Device Comparison

www.ti.com
Table 3-1. Device Family Overview
DEVICE PHY SUPPORT
CC2650F128xxx Multi-Protocol CC2640F128xxx Bluetooth low energy (Normal) 128 20 31, 15, 10 RGZ, RHB, RSM CC2630F128xxx IEEE 802.15.4 ( ZigBee®/6LoWPAN) 128 20 31, 15, 10 RGZ, RHB, RSM CC2620F128xxx IEEE 802.15.4 (RF4CE) 128 20 31, 10 RGZ, RSM
(1) Package designator replaces the xxx in device name to form a complete device name, RGZ is 7-mm × 7-mm VQFN48, RHB is
5-mm × 5-mm VQFN32, and RSM is 4-mm × 4-mm VQFN32.
(2) The CC2650 device supports all PHYs and can be reflashed to run all the supported standards.
(2)
FLASH
(KB)
128 20 31, 15, 10 RGZ, RHB, RSM
RAM (KB) GPIO PACKAGE

3.1 Related Products

Wireless Connectivity The wireless connectivity portfolio offers a wide selection of low power RF
solutions suitable for a broad range of application. The offerings range from fully customized solutions to turn key offerings with pre-certified hardware and software (protocol).
Sub-1 GHz Long-range, low power wireless connectivity solutions are offered in a wide range of Sub-1
GHz ISM bands.
Companion Products Review products that are frequently purchased or used in conjunction with this
product.
SimpleLink™ CC2650 Wireless MCU LaunchPad™ Kit The CC2650 LaunchPad kit brings easy
Bluetooth® Smart connectivity to the LaunchPad kit ecosystem with the SimpleLink ultra-low power CC26xx family of devices. This LaunchPad kit also supports development for multi­protocol support for the SimpleLink multi-standard CC2650 wireless MCU and the rest of CC26xx family of products: CC2630 wireless MCU for ZigBee®/6LoWPAN and CC2640 wireless MCU for Bluetooth®Smart.
Reference Designs for CC2640 TI Designs Reference Design Library is a robust reference design library
spanning analog, embedded processor and connectivity. Created by TI experts to help you jump-start your system design, all TI Designs include schematic or block diagrams, BOMs and design files to speed your time to market. Search and download designs at
ti.com/tidesigns.
(1)
6
Device Comparison Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640
40
39
DIO_25 38
DIO_24 37
21
22
23
24
DCDC_SW33
DIO_18
34
RESET_N35
DIO_2336
X32K_Q2 4
X32K_Q1 3
RF_N 2
RF_P 1
DIO_2232
DIO_2131
DIO_2030
DIO_1929
DIO_0 5
DIO_1 6
DIO_2 7
8
28
27
26
JTAG_TCKC25
9
10
11
12
41 42 43 44
20
DIO_15
19
DIO_14
18 17
VDDR 45
46 47
VDDR_RF 48
16 15 14 13
DIO_17
DIO_16
VDDS_DCDC
DIO_26
DIO_12
DIO_13
VDDS2
DIO_11 DIO_10
DIO_5
DIO_6
DIO_7
DIO_3
DIO_4
X24M_P
X24M_N
DIO_8
DIO_9
DIO_28
VDDS3
DCOUPL
JTAG_TMSC
DIO_29 DIO_30
DIO_27
VDDS
www.ti.com

4 Terminal Configuration and Functions

4.1 Pin Diagram – RGZ Package

CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
Note: I/O pins marked in bold have high drive capabilities. I/O pins marked in italics have analog capabilities.
Figure 4-1. RGZ Package
48-Pin VQFN
(7-mm × 7-mm) Pinout, 0.5-mm Pitch

4.2 Signal Descriptions – RGZ Package

Table 4-1. Signal Descriptions – RGZ Package
NAME NO. TYPE DESCRIPTION
DCDC_SW 33 Power Output from internal DC-DC DCOUPL 23 Power 1.27-V regulated digital-supply decoupling capacitor DIO_0 5 Digital I/O GPIO, Sensor Controller DIO_1 6 Digital I/O GPIO, Sensor Controller DIO_2 7 Digital I/O GPIO, Sensor Controller DIO_3 8 Digital I/O GPIO, Sensor Controller DIO_4 9 Digital I/O GPIO, Sensor Controller DIO_5 10 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_6 11 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_7 12 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_8 14 Digital I/O GPIO DIO_9 15 Digital I/O GPIO DIO_10 16 Digital I/O GPIO
(1) See technical reference manual (listed in Section 8.3) for more details. (2) Do not supply external circuitry from this pin.
Submit Documentation Feedback
Product Folder Links: CC2640
(1)
Terminal Configuration and FunctionsCopyright © 2015–2016, Texas Instruments Incorporated
(2)
7
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
Table 4-1. Signal Descriptions – RGZ Package (continued)
NAME NO. TYPE DESCRIPTION
DIO_11 17 Digital I/O GPIO DIO_12 18 Digital I/O GPIO DIO_13 19 Digital I/O GPIO DIO_14 20 Digital I/O GPIO DIO_15 21 Digital I/O GPIO DIO_16 26 Digital I/O GPIO, JTAG_TDO, high-drive capability DIO_17 27 Digital I/O GPIO, JTAG_TDI, high-drive capability DIO_18 28 Digital I/O GPIO DIO_19 29 Digital I/O GPIO DIO_20 30 Digital I/O GPIO DIO_21 31 Digital I/O GPIO DIO_22 32 Digital I/O GPIO DIO_23 36 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_24 37 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_25 38 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_26 39 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_27 40 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_28 41 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_29 42 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_30 43 Digital/Analog I/O GPIO, Sensor Controller, Analog JTAG_TMSC 24 Digital I/O JTAG TMSC, high-drive capability JTAG_TCKC 25 Digital I/O JTAG TCKC RESET_N 35 Digital input Reset, active-low. No internal pullup.
RF_P 1 RF I/O
RF_N 2 RF I/O VDDR 45 Power 1.7-V to 1.95-V supply, typically connect to output of internal DC-DC
VDDR_RF 48 Power 1.7-V to 1.95-V supply, typically connect to output of internal DC-DC VDDS 44 Power 1.8-V to 3.8-V main chip supply VDDS2 13 Power 1.8-V to 3.8-V DIO supply VDDS3 22 Power 1.8-V to 3.8-V DIO supply VDDS_DCDC 34 Power 1.8-V to 3.8-V DC-DC supply X32K_Q1 3 Analog I/O 32-kHz crystal oscillator pin 1 X32K_Q2 4 Analog I/O 32-kHz crystal oscillator pin 2 X24M_N 46 Analog I/O 24-MHz crystal oscillator pin 1 X24M_P 47 Analog I/O 24-MHz crystal oscillator pin 2 EGP Power Ground – Exposed Ground Pad
(3) If internal DC-DC is not used, this pin is supplied internally from the main LDO. (4) If internal DC-DC is not used, this pin must be connected to VDDR for supply from the main LDO.
Positive RF input signal to LNA during RX Positive RF output signal to PA during TX
Negative RF input signal to LNA during RX Negative RF output signal to PA during TX
(1) (1) (1)
www.ti.com
(2)(3) (2)(4)
8
Terminal Configuration and Functions Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640
28 29
27
30
212022
19
18
13 12
14
11
453
6
7
26 15
25 16
31 10 32 9
232
241
178
DIO_10
DIO_7
DIO_9
DIO_8
DCDC_SW
RESET_N
VDDS_DCDC
DIO_11
VDDR_RF
X24M_N X24M_P
VDDR
VDDS
DIO_13 DIO_14
DIO_12
DIO_3
JTAG_TMSC
DIO_4
DCOUPL VDDS2
JTAG_TCKC
DIO_5
DIO_6
RF_P
RF_N
RX_TX
DIO_0
DIO_1
DIO_2
X32K_Q1
X32K_Q2
www.ti.com

4.3 Pin Diagram – RHB Package

CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
Note: I/O pins marked in bold have high drive capabilities. I/O pins marked in italics have analog capabilities.
Figure 4-2. RHB Package
32-Pin VQFN
(5-mm × 5-mm) Pinout, 0.5-mm Pitch

4.4 Signal Descriptions – RHB Package

Table 4-2. Signal Descriptions – RHB Package
NAME NO. TYPE DESCRIPTION
DCDC_SW 17 Power Output from internal DC-DC DCOUPL 12 Power 1.27-V regulated digital-supply decoupling DIO_0 6 Digital I/O GPIO, Sensor Controller DIO_1 7 Digital I/O GPIO, Sensor Controller DIO_2 8 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_3 9 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_4 10 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_5 15 Digital I/O GPIO, High drive capability, JTAG_TDO DIO_6 16 Digital I/O GPIO, High drive capability, JTAG_TDI DIO_7 20 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_8 21 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_9 22 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_10 23 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_11 24 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_12 25 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_13 26 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_14 27 Digital/Analog I/O GPIO, Sensor Controller, Analog JTAG_TMSC 13 Digital I/O JTAG TMSC, high-drive capability JTAG_TCKC 14 Digital I/O JTAG TCKC
(1) See technical reference manual (listed in Section 8.3) for more details. (2) Do not supply external circuitry from this pin.
Submit Documentation Feedback
Product Folder Links: CC2640
(1)
Terminal Configuration and FunctionsCopyright © 2015–2016, Texas Instruments Incorporated
(2)
9
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
Table 4-2. Signal Descriptions – RHB Package (continued)
NAME NO. TYPE DESCRIPTION
RESET_N 19 Digital input Reset, active-low. No internal pullup. RF_N 2 RF I/O
RF_P 1 RF I/O RX_TX 3 RF I/O Optional bias pin for the RF LNA
VDDR 29 Power 1.7-V to 1.95-V supply, typically connect to output of internal DC-DC VDDR_RF 32 Power 1.7-V to 1.95-V supply, typically connect to output of internal DC-DC VDDS 28 Power 1.8-V to 3.8-V main chip supply VDDS2 11 Power 1.8-V to 3.8-V GPIO supply VDDS_DCDC 18 Power 1.8-V to 3.8-V DC-DC supply X32K_Q1 4 Analog I/O 32-kHz crystal oscillator pin 1 X32K_Q2 5 Analog I/O 32-kHz crystal oscillator pin 2 X24M_N 30 Analog I/O 24-MHz crystal oscillator pin 1 X24M_P 31 Analog I/O 24-MHz crystal oscillator pin 2 EGP Power Ground – Exposed Ground Pad
(3) If internal DC-DC is not used, this pin is supplied internally from the main LDO. (4) If internal DC-DC is not used, this pin must be connected to VDDR for supply from the main LDO.
Negative RF input signal to LNA during RX Negative RF output signal to PA during TX
Positive RF input signal to LNA during RX Positive RF output signal to PA during TX
(1)
(1)
www.ti.com
(3)(2) (2)(4)
10
Terminal Configuration and Functions Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640
28 29
27
30
212022
19
18
13 12
14
11
453
6
7
26 15
25 16
31 10 32 9
232
241
178
DIO_6
VSS
DIO_5
RESET_N
VSS
VDDS_DCDC
DCDC_SW
DIO_7
VDDR_RF
X24M_N X24M_P
VSS
VDDR
DIO_9
VDDS
DIO_8
DIO_1
JTAG_TMSC
DIO_2
DCOUPL VDDS2
JTAG_TCKC
DIO_3
DIO_4
RF_P
RF_N
VSS
X32K_Q2
VSS
DIO_0
RX_TX
X32K_Q1
www.ti.com

4.5 Pin Diagram – RSM Package

CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
Note: I/O pins marked in bold have high drive capabilities. I/O pins marked in italics have analog capabilities.
Figure 4-3. RSM Package
32-Pin VQFN
(4-mm × 4-mm) Pinout, 0.4-mm Pitch

4.6 Signal Descriptions – RSM Package

Table 4-3. Signal Descriptions – RSM Package
NAME NO. TYPE DESCRIPTION
DCDC_SW 18 Power DCOUPL 12 Power 1.27-V regulated digital-supply decoupling capacitor
DIO_0 8 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_1 9 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_2 10 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_3 15 Digital I/O GPIO, High drive capability, JTAG_TDO DIO_4 16 Digital I/O GPIO, High drive capability, JTAG_TDI DIO_5 22 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_6 23 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_7 24 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_8 25 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_9 26 Digital/Analog I/O GPIO, Sensor Controller, Analog JTAG_TMSC 13 Digital I/O JTAG TMSC JTAG_TCKC 14 Digital I/O JTAG TCKC RESET_N 21 Digital Input Reset, active-low. No internal pullup.
RF_N 2 RF I/O
RF_P 1 RF I/O
(1) See technical reference manual (listed in Section 8.3) for more details. (2) Do not supply external circuitry from this pin.
Submit Documentation Feedback
Product Folder Links: CC2640
Output from internal DC-DC. (1.7-V to 1.95-V operation)
Negative RF input signal to LNA during RX Negative RF output signal to PA during TX
Positive RF input signal to LNA during RX Positive RF output signal to PA during TX
(1)
. Tie to ground for external regulator mode
Terminal Configuration and FunctionsCopyright © 2015–2016, Texas Instruments Incorporated
(2)
11
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
Table 4-3. Signal Descriptions – RSM Package (continued)
NAME NO. TYPE DESCRIPTION
RX_TX 4 RF I/O Optional bias pin for the RF LNA VDDR 28 Power 1.7-V to 1.95-V supply, typically connect to output of internal DC-DC. VDDR_RF 32 Power 1.7-V to 1.95-V supply, typically connect to output of internal DC-DC VDDS 27 Power 1.8-V to 3.8-V main chip supply VDDS2 11 Power 1.8-V to 3.8-V GPIO supply
VDDS_DCDC 19 Power
VSS
3, 7, 17, 20,
29
Power
1.8-V to 3.8-V DC-DC supply. Tie to ground for external regulator mode (1.7-V to 1.95-V operation).
Ground
X32K_Q1 5 Analog I/O 32-kHz crystal oscillator pin 1 X32K_Q2 6 Analog I/O 32-kHz crystal oscillator pin 2 X24M_N 30 Analog I/O 24-MHz crystal oscillator pin 1 X24M_P 31 Analog I/O 24-MHz crystal oscillator pin 2 EGP Power Ground – Exposed Ground Pad
(3) If internal DC-DC is not used, this pin is supplied internally from the main LDO. (4) If internal DC-DC is not used, this pin must be connected to VDDR for supply from the main LDO.
(1)
(1)
www.ti.com
(2)(3)
(2)(4)
12
Terminal Configuration and Functions Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640
CC2640
www.ti.com
SWRS176B –FEBRUARY 2015–REVISED JULY 2016

5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)
Supply voltage (VDDS, VDDS2, and VDDS3)
Supply voltage (VDDS VDDR)
Voltage on any digital pin Voltage on crystal oscillator pins, X32K_Q1, X32K_Q2, X24M_N and X24M_P –0.3 VDDR + 0.3, max 2.25 V
Voltage on ADC input (Vin)
Input RF level 5 dBm T
stg
(1) All voltage values are with respect to ground, unless otherwise noted. (2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (3) In external regulator mode, VDDS2 and VDDS3 must be at the same potential as VDDS. (4) Including analog-capable DIO. (5) Each pin is referenced to a specific VDDSx (VDDS, VDDS2 or VDDS3). For a pin-to-VDDS mapping table, see Table 6-3.
(3)
and
(4)(5)
VDDR supplied by internal DC-DC regulator or internal GLDO. VDDS_DCDC connected to VDDS on PCB.
External regulator mode (VDDS and VDDR pins connected on PCB)
Voltage scaling enabled –0.3 VDDS
Voltage scaling disabled, VDDS as reference –0.3 VDDS / 2.9
Storage temperature –40 150 °C
(1)(2)
MIN MAX UNIT
–0.3 4.1 V
–0.3 2.25 V –0.3 VDDSx + 0.3, max 4.1 V
VVoltage scaling disabled, internal reference –0.3 1.49

5.2 ESD Ratings

VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC
(1)
V
ESD
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Electrostatic discharge (ESD) performance
JS001
Charged device model (CDM), per JESD22-C101
(2)
All pins ±2500 RF pins ±750
Non-RF pins ±750

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Ambient temperature range –40 85 °C Operating supply voltage
(VDDS and VDDR), external regulator mode
Operating supply voltage VDDS Operating supply voltages
VDDS2 and VDDS3
For operation in 1.8-V systems (VDDS and VDDR pins connected on PCB, internal DC­DC cannot be used)
For operation in battery-powered and 3.3-V systems (internal DC-DC can be used to minimize power consumption)
1.7 1.95 V
1.8 3.8 V
0.7 × VDDS, min 1.8 3.8 V
V
Submit Documentation Feedback
Product Folder Links: CC2640
SpecificationsCopyright © 2015–2016, Texas Instruments Incorporated
13
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016

5.4 Power Consumption Summary

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Reset. RESET_N pin asserted or VDDS below Power-on-Reset threshold
Shutdown. No clocks running, no retention 150 Standby. With RTC, CPU, RAM and (partial)
register retention. RCOSC_LF Standby. With RTC, CPU, RAM and (partial)
register retention. XOSC_LF Standby. With Cache, RTC, CPU, RAM and
(partial) register retention. RCOSC_LF
I
core
Peripheral Current Consumption (Adds to core current I
I
peri
(1) Single-ended RF mode is optimized for size and power consumption. Measured on CC2650EM-4XS. (2) Differential RF mode is optimized for RF performance. Measured on CC2650EM-5XD. (3) I
Core current consumption
Standby. With Cache, RTC, CPU, RAM and (partial) register retention. XOSC_LF
Idle. Supply Systems and RAM powered. 550 Active. Core running CoreMark Radio RX
Radio RX Radio TX, 0-dBm output power Radio TX, 5-dBm output power
(1)
(2)
(1) (2)
for each peripheral unit activated)
core
Peripheral power domain Delta current with domain enabled 20 µA Serial power domain Delta current with domain enabled 13 µA
RF Core
Delta current with power domain enabled, clock
enabled, RF core idle µDMA Delta current with clock enabled, module idle 130 µA Timers Delta current with clock enabled, module idle 113 µA I2C Delta current with clock enabled, module idle 12 µA I2S Delta current with clock enabled, module idle 36 µA SSI Delta current with clock enabled, module idle 93 µA UART Delta current with clock enabled, module idle 164 µA
is not supported in Standby or Shutdown.
peri
= 3.0 V with internal DC-DC converter, unless
DDS
(3)
100
1
1.2
2.5
2.7
1.45 mA +
31 µA/MHz
5.9
6.1
6.1
9.1
237 µA
www.ti.com
nA
µA
mA

5.5 General Characteristics

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
FLASH MEMORY
Supported flash erase cycles before failure
Flash page/sector erase current Average delta current 12.6 mA Flash page/sector size 4 KB Flash write current Average delta current, 4 bytes at a time 8.15 mA Flash page/sector erase time Flash write time
(1)
(1) This number is dependent on Flash aging and will increase over time and erase cycles.
14
Specifications Copyright © 2015–2016, Texas Instruments Incorporated
(1)
4 bytes at a time 8 µs
Submit Documentation Feedback
Product Folder Links: CC2640
= 3.0 V, unless otherwise noted.
DDS
100 k Cycles
8 ms
CC2640
www.ti.com
SWRS176B –FEBRUARY 2015–REVISED JULY 2016

5.6 1-Mbps GFSK (Bluetooth low energy Technology) – RX

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Receiver sensitivity
Receiver sensitivity
Receiver saturation
Receiver saturation
Frequency error tolerance
Data rate error tolerance
Co-channel rejection
Selectivity, ±1 MHz
Selectivity, ±2 MHz
Selectivity, ±3 MHz
Selectivity, ±4 MHz
(1)
(1)
(1)
(1)
(1)
Selectivity, ±5 MHz or more
Selectivity, Image frequency
Selectivity, Image frequency
(1)
±1 MHz Out-of-band blocking
(3)
Out-of-band blocking 2003 MHz to 2399 MHz –5 dBm Out-of-band blocking 2484 MHz to 2997 MHz –8 dBm Out-of-band blocking 3000 MHz to 12.75 GHz –8 dBm
Intermodulation
Spurious emissions, 30 to 1000 MHz
Spurious emissions, 1 to 12.75 GHz
RSSI dynamic range 70 dB RSSI accuracy ±4 dB
(1) Numbers given as I/C dB. (2) X / Y, where X is +N MHz and Y is –N MHz. (3) Excluding one exception at F
Differential mode. Measured at the CC2650EM-5XD SMA connector, BER = 10
Single-ended mode. Measured on CC2650EM-4XS, at the SMA connector, BER = 10
Differential mode. Measured at the CC2650EM-5XD SMA connector, BER = 10
Single-ended mode. Measured on CC2650EM-4XS, at the SMA connector, BER = 10
–3
–3
–3
–3
Difference between the incoming carrier frequency and the internally generated carrier frequency
Difference between incoming data rate and the internally generated data rate
Wanted signal at –67 dBm, modulated interferer in channel, BER = 10
–3
Wanted signal at –67 dBm, modulated interferer at ±1 MHz, BER = 10
–3
Wanted signal at –67 dBm, modulated interferer at ±2 MHz, BER = 10
–3
Wanted signal at –67 dBm, modulated interferer at ±3 MHz, BER = 10
–3
Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10
Wanted signal at –67 dBm, modulated interferer at
(1)
±5 MHz, BER = 10 Wanted signal at –67 dBm, modulated interferer at
(1)
image frequency, BER = 10
Wanted signal at –67 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10
–3
–3
–3
–3
30 MHz to 2000 MHz –20 dBm
Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level
Conducted measurement in a 50-single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66
Conducted measurement in a 50 single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66
/ 2, per Bluetooth Specification.
wanted
= 3.0 V, fRF= 2440 MHz, unless otherwise noted.
DDS
–97 dBm
–96 dBm
4 dBm
0 dBm
–350 350 kHz
–750 750 ppm
–6 dB
(2)
7 / 3
(2)
34 / 25
(2)
38 / 26
(2)
42 / 29
32 dB
25 dB
(2)
3 / 26
–34 dBm
–71 dBm
–62 dBm
dB
dB
dB
dB
dB
Submit Documentation Feedback
Product Folder Links: CC2640
SpecificationsCopyright © 2015–2016, Texas Instruments Incorporated
15
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
www.ti.com

5.7 1-Mbps GFSK (Bluetooth low energy Technology) – TX

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Output power, highest setting
Output power, highest setting Output power, lowest setting Delivered to a single-ended 50-Ω load through a balun –21 dBm
Spurious emission conducted measurement
(1)
(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2
(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan).
Differential mode, delivered to a single-ended 50-Ω load through a balun
Measured on CC2650EM-4XS, delivered to a single-ended 50-Ω load
f < 1 GHz, outside restricted bands –43 dBm f < 1 GHz, restricted bands ETSI –65 dBm f < 1 GHz, restricted bands FCC –76 dBm f > 1 GHz, including harmonics –46 dBm
= 3.0 V, fRF= 2440 MHz, unless otherwise noted.
DDS
5 dBm
2 dBm

5.8 2-Mbps GFSK (Bluetooth 5) – RX

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Receiver sensitivity
Receiver saturation
Frequency error tolerance
Data rate error tolerance
Co-channel rejection
Selectivity, ±2 MHz
Selectivity, ±4 MHz
Selectivity, ±6 MHz
Alternate channel rejection, ±7
(1)
MHz
(1)
(1)
(1)
(1)
Selectivity, Image frequency
Selectivity, Image frequency
(1)
±2 MHz
Out-of-band blocking
(3)
Out-of-band blocking 2003 MHz to 2399 MHz –15 dBm Out-of-band blocking 2484 MHz to 2997 MHz –12 dBm Out-of-band blocking 3000 MHz to 12.75 GHz –10 dBm
Intermodulation
(1) Numbers given as I/C dB. (2) X / Y, where X is +N MHz and Y is –N MHz. (3) Excluding one exception at F
Differential mode. Measured at the CC2650EM-5XD SMA connector, BER = 10
Differential mode. Measured at the CC2650EM-5XD SMA connector, BER = 10
–3
–3
Difference between the incoming carrier frequency and the internally generated carrier frequency
Difference between incoming data rate and the internally generated data rate
Wanted signal at –67 dBm, modulated interferer in channel, BER = 10
–3
Wanted signal at –67 dBm, modulated interferer at ±2 MHz, Image frequency is at -2 MHz BER = 10
–3
Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10
–3
Wanted signal at –67 dBm, modulated interferer at ±6 MHz, BER = 10
Wanted signal at –67 dBm, modulated interferer at ±7 MHz, BER = 10
Wanted signal at –67 dBm, modulated interferer at
(1)
image frequency, BER = 10
–3
–3
–3
Note that Image frequency + 2 MHz is the Co­channel. Wanted signal at –67 dBm, modulated interferer at ±2 MHz from image frequency, BER =
–3
10 30 MHz to 2000 MHz –33 dBm
Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level
/ 2, per Bluetooth Specification.
wanted
= 3.0 V, fRF= 2440 MHz, unless otherwise noted.
DDS
–92 dBm
4 dBm
–300 500 kHz
–1000 1000 ppm
–7 dB
(2)
8 / 4
(2)
31 / 26
(2)
37 / 38
(2)
37 / 36
4 dB
(2)
-7 / 26
–45 dBm
dB
dB
dB
dB
dB
16
Specifications Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640
CC2640
www.ti.com
SWRS176B –FEBRUARY 2015–REVISED JULY 2016

5.9 2-Mbps GFSK (Bluetooth 5) – TX

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Output power, highest setting
Output power, highest setting Output power, lowest setting Delivered to a single-ended 50-Ω load through a balun –21 dBm
Spurious emission conducted measurement
(1)
(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2
(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan).
Differential mode, delivered to a single-ended 50-Ω load through a balun
Measured on CC2650EM-4XS, delivered to a single-ended 50-Ω load
f < 1 GHz, outside restricted bands –43 dBm f < 1 GHz, restricted bands ETSI –65 dBm f < 1 GHz, restricted bands FCC –76 dBm f > 1 GHz, including harmonics –46 dBm
= 3.0 V, fRF= 2440 MHz, unless otherwise noted.
DDS
5 dBm
2 dBm

5.10 5-Mbps (Proprietary) – RX

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Receiver sensitivity
Receiver saturation
Frequency error tolerance
Data rate error tolerance
Co-channel rejection
Selectivity, ±4 MHz
Selectivity, ±5 MHz
Selectivity, ±8 MHz
Selectivity, ±10 MHz
Selectivity, ±12 MHz
Selectivity, ±15 MHz
Blocker rejection ±10 MHz and above
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1) Numbers given as I/C dB. (2) X / Y, where X is +N MHz and Y is –N MHz.
Differential mode. Measured at the CC2650EM-5XD SMA connector, BER = 10
Differential mode. Measured at the CC2650EM-5XD SMA connector, BER = 10
–3
–3
Difference between the incoming carrier frequency and the internally generated carrier frequency
Difference between incoming data rate and the internally generated data rate
Wanted signal 11 dB above sensitivity level, modulated interferer in channel, BER = 10
–3
Wanted signal 11 dB above sensitivity level, modulated interferer at ±4 MHz BER = 10
–3
Wanted signal 11 dB above sensitivity level, modulated interferer at ±5 MHz, BER = 10
–3
Wanted signal 11 dB above sensitivity level, modulated interferer at ±8 MHz, BER = 10
Wanted signal 11 dB above sensitivity level, modulated interferer at ±10 MHz, BER = 10
–3
–3
Wanted signal 11 dB above sensitivity level, modulated interferer at ±12 MHz, BER = 10
–3
Wanted signal 11 dB above sensitivity level, modulated interferer at ±15 MHz, BER = 10
Wanted signal 3dB above sensitivity limit , CW interferer at ±10 MHz and above, BER = 10
–3
–3
= 3.0 V, fRF= 2440 MHz, unless otherwise noted.
DDS
–81 dBm
-11 dBm
–300 300 kHz
–200 200 ppm
–19 dB
(2)
9 / 9
(2)
19 / 19
(2)
28 / 28
(2)
33 / 33
(2)
37/ 37
(2)
43/ 43
40 dB
dB
dB
dB
dB
dB
dB
Submit Documentation Feedback
Product Folder Links: CC2640
SpecificationsCopyright © 2015–2016, Texas Instruments Incorporated
17
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
www.ti.com

5.11 5-Mbps (Proprietary) – TX

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Output power, highest setting
Output power, highest setting Output power, lowest setting Delivered to a single-ended 50-Ω load through a balun –21 dBm
Occupied bandwidth 95% BW 2.4 MHz Occupied bandwidth 99% BW 3.7 MHz
Spurious emission conducted measurement
(1)
(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2
(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan).
Differential mode, delivered to a single-ended 50-Ω load through a balun
Measured on CC2650EM-4XS, delivered to a single-ended 50-Ω load
f < 1 GHz, outside restricted bands –43 dBm f < 1 GHz, restricted bands ETSI –65 dBm f < 1 GHz, restricted bands FCC –76 dBm f > 1 GHz, including harmonics –46 dBm
= 3.0 V, fRF= 2440 MHz, unless otherwise noted.
DDS
5 dBm
2 dBm

5.12 24-MHz Crystal Oscillator (XOSC_HF)

Tc= 25°C, V
= 3.0 V, unless otherwise noted.
DDS
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ESR Equivalent series resistance ESR Equivalent series resistance
LMMotional inductance
(2)
CLCrystal load capacitance Crystal frequency
(2)(3)
Crystal frequency tolerance Start-up time
(3)(5)
(2) (2)
Relates to load capacitance (CLin Farads)
(2)
(2)(4)
(1) Probing or otherwise stopping the XTAL while the DC-DC converter is enabled may cause permanent damage to the device. (2) The crystal manufacturer's specification must satisfy this requirement (3) Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V (4) Includes initial tolerance of the crystal, drift over temperature, ageing and frequency pulling due to incorrect load capacitance. As per
Bluetooth specification.
(5) Kick-started based on a temperature and aging compensated RCOSC_HF using precharge injection.
(1)
6 pF < CL≤ 9 pF 20 60 Ω 5 pF < CL≤ 6 pF 80 Ω
–24
< 1.6 × 10
/ C
2
L
5 9 pF
24 MHz
–40 40 ppm
150 µs
= 3.0 V
DDS
H

5.13 32.768-kHz Crystal Oscillator (XOSC_LF)

Tc= 25°C, V
Crystal frequency Crystal frequency tolerance, Bluetooth low-
energy applications ESR Equivalent series resistance CLCrystal load capacitance
(1) The crystal manufacturer's specification must satisfy this requirement (2) Includes initial tolerance of the crystal, drift over temperature, ageing and frequency pulling due to incorrect load capacitance. As per
Bluetooth specification.
18
Specifications Copyright © 2015–2016, Texas Instruments Incorporated
= 3.0 V, unless otherwise noted.
DDS
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
(1)
(1)(2)
–500 500 ppm
(1)
(1)
32.768 kHz
30 100 kΩ
6 12 pF
Submit Documentation Feedback
Product Folder Links: CC2640
CC2640
www.ti.com
SWRS176B –FEBRUARY 2015–REVISED JULY 2016

5.14 48-MHz RC Oscillator (RCOSC_HF)

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Frequency 48 MHz Uncalibrated frequency accuracy ±1% Calibrated frequency accuracy Start-up time 5 µs
(1) Accuracy relative to the calibration source (XOSC_HF).
(1)
= 3.0 V, unless otherwise noted.
DDS
±0.25%

5.15 32-kHz RC Oscillator (RCOSC_LF)

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Calibrated frequency Temperature coefficient 50 ppm/°C
(1) The frequency accuracy of the Real Time Clock (RTC) is not directly dependent on the frequency accuracy of the 32-kHz RC Oscillator.
The RTC can be calibrated to an accuracy within ±500 ppm of 32.768 kHz by measuring the frequency error of RCOSC_LF relative to XOSC_HF and compensating the RTC tick speed. The procedure is explained in Running Bluetooth®Low Energy on CC2640 Without
32 kHz Crystal.
(1)
= 3.0 V, unless otherwise noted.
DDS
32.8 kHz

5.16 ADC Characteristics

Tc= 25°C, V
= 3.0 V and voltage scaling enabled, unless otherwise noted.
DDS
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Input voltage range 0 VDDS V Resolution 12 Bits Sample rate 200 ksps Offset Internal 4.3-V equivalent reference Gain error Internal 4.3-V equivalent reference
(3)
DNL INL
Differential nonlinearity >–1 LSB
(4)
Integral nonlinearity ±3 LSB
ENOB Effective number of bits
THD Total harmonic distortion
SINAD, SNDR
SFDR
Signal-to-noise and Distortion ratio
Spurious-free dynamic range
(2) (2)
Internal 4.3-V equivalent reference
(2)
, 200 ksps,
9.6-kHz input tone
Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone
Internal 4.3-V equivalent reference
(2)
, 200 ksps,
9.6-kHz input tone
Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone
Internal 4.3-V equivalent reference
(2)
, 200 ksps,
9.6-kHz input tone
Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone
Internal 4.3-V equivalent reference
(2)
, 200 ksps,
9.6-kHz input tone
Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone
(1)
2 LSB
2.4 LSB
9.8 BitsVDDS as reference, 200 ksps, 9.6-kHz input tone 10
11.1
–65
dBVDDS as reference, 200 ksps, 9.6-kHz input tone –69
–71
60
dBVDDS as reference, 200 ksps, 9.6-kHz input tone 63
69
67
dBVDDS as reference, 200 ksps, 9.6-kHz input tone 72
73
(1) Using IEEE Std 1241™-2010 for terminology and test methods. (2) Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V. (3) No missing codes. Positive DNL typically varies from +0.3 to +3.5, depending on device (see Figure 5-22). (4) For a typical example, see Figure 5-23.
Submit Documentation Feedback
Product Folder Links: CC2640
SpecificationsCopyright © 2015–2016, Texas Instruments Incorporated
19
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
ADC Characteristics (continued)
Tc= 25°C, V
(5) Applied voltage must be within absolute maximum ratings (Section 5.1) at all times.
= 3.0 V and voltage scaling enabled, unless otherwise noted.
DDS
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Conversion time Serial conversion, time-to-output, 24-MHz clock 50 Current consumption Internal 4.3-V equivalent reference
(2)
Current consumption VDDS as reference 0.75 mA
Equivalent fixed internal reference (input voltage scaling
Reference voltage
enabled). For best accuracy, the ADC conversion should be initiated through the TIRTOS API in order to include the gain/offset compensation factors stored in FCFG1.
Fixed internal reference (input voltage scaling disabled). For best accuracy, the ADC conversion should be initiated
Reference voltage
through the TIRTOS API in order to include the gain/offset compensation factors stored in FCFG1. This value is derived from the scaled value (4.3V) as follows: Vref=4.3V*1408/4095
Reference voltage
Reference voltage
VDDS as reference (Also known as RELATIVE) (input voltage scaling enabled)
VDDS as reference (Also known as RELATIVE) (input voltage scaling disabled)
200 ksps, voltage scaling enabled. Capacitive input, Input
Input Impedance
impedance depends on sampling frequency and sampling time
www.ti.com
(1)
clock­cycles
0.66 mA
(2)(5)
4.3
V
1.48 V
VDDS V
VDDS /
(5)
2.82
V
>1 MΩ
20
Specifications Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640
CC2640
www.ti.com
SWRS176B –FEBRUARY 2015–REVISED JULY 2016

5.17 Temperature Sensor

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Resolution 4 °C Range –40 85 °C Accuracy ±5 °C Supply voltage coefficient
(1) Automatically compensated when using supplied driver libraries.
(1)
= 3.0 V, unless otherwise noted.
DDS
3.2 °C/V

5.18 Battery Monitor

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Resolution 50 mV Range 1.8 3.8 V Accuracy 13 mV
= 3.0 V, unless otherwise noted.
DDS

5.19 Continuous Time Comparator

Tc= 25°C, V
Input voltage range 0 VDDS V External reference voltage 0 VDDS V Internal reference voltage DCOUPL as reference 1.27 V Offset 3 mV Hysteresis <2 mV Decision time Step from –10 mV to 10 mV 0.72 µs Current consumption when enabled
(1) Additionally, the bias module must be enabled when running in standby mode.
= 3.0 V, unless otherwise noted.
DDS
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
(1)
8.6 µA
Submit Documentation Feedback
Product Folder Links: CC2640
SpecificationsCopyright © 2015–2016, Texas Instruments Incorporated
21
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
www.ti.com

5.20 Low-Power Clocked Comparator

Tc= 25°C, V
Input voltage range 0 VDDS V Clock frequency 32 kHz Internal reference voltage, VDDS / 2 1.49 – 1.51 V Internal reference voltage, VDDS / 3 1.01 – 1.03 V Internal reference voltage, VDDS / 4 0.78 – 0.79 V Internal reference voltage, DCOUPL / 1 1.25 – 1.28 V Internal reference voltage, DCOUPL / 2 0.63 – 0.65 V Internal reference voltage, DCOUPL / 3 0.42 – 0.44 V Internal reference voltage, DCOUPL / 4 0.33 – 0.34 V Offset <2 mV Hysteresis <5 mV Decision time Step from –50 mV to 50 mV <1 clock-cycle Current consumption when enabled 362 nA
= 3.0 V, unless otherwise noted.
DDS
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

5.21 Programmable Current Source

Tc= 25°C, V
Current source programmable output range 0.25 – 20 µA Resolution 0.25 µA
Current consumption
(1) Additionally, the bias module must be enabled when running in standby mode.
= 3.0 V, unless otherwise noted.
DDS
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
(1)
Including current source at maximum programmable output
23 µA

5.22 Synchronous Serial Interface (SSI)

Tc= 25°C, V
(1)
S1
t
clk_per
(1)
S2
t
clk_high
(1)
S3
t
clk_low
S1 (TX only)
S1 (TX and RX)
(1)
S2
t
clk_high
(1)
S3
t
clk_low
(1) Refer to SSI timing diagrams Figure 5-1, Figure 5-2, and Figure 5-3.
= 3.0 V, unless otherwise noted.
DDS
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
(SSIClk period) Device operating as SLAVE 12 65024
(SSIClk high time) Device operating as SLAVE 0.5 t
(SSIClk low time) Device operating as SLAVE 0.5 t
(1)
t
(SSIClk period)
clk_per
(1)
t
(SSIClk period)
clk_per
One-way communication to SLAVE ­Device operating as MASTER
Normal duplex operation - Device operating as MASTER
(SSIClk high time) Device operating as MASTER 0.5 t
(SSIClk low time) Device operating as MASTER 0.5 t
4 65024
8 65024
system
clocks
clk_per clk_per
system
clocks
system
clocks
clk_per clk_per
22
Specifications Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640
0
SSIClk
SSIFss
SSITx
SSIRx
MSB LSB
MSB LSB
S2
S3
S1
8-bit control
4 to 16 bits output data
SSIClk
SSIFss
SSITx SSIRx
MSB LSB
S2
S3
S1
4 to 16 bits
www.ti.com
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
Figure 5-1. SSI Timing for TI Frame Format (FRF = 01), Single Transfer Timing Measurement
Figure 5-2. SSI Timing for MICROWIRE Frame Format (FRF = 10), Single Transfer
Submit Documentation Feedback
Product Folder Links: CC2640
SpecificationsCopyright © 2015–2016, Texas Instruments Incorporated
23
SSIClk
(SPO = 1)
SSITx
(Master)
SSIRx
(Slave)
LSB
SSIClk
(SPO = 0)
S2
S1
SSIFss
LSB
S3
MSB
MSB
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
www.ti.com
Figure 5-3. SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1

5.23 DC Characteristics

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TA= 25°C, V
GPIO VOH at 8-mA load IOCURR = 2, high-drive GPIOs only 1.32 1.54 V GPIO VOL at 8-mA load IOCURR = 2, high-drive GPIOs only 0.26 0.32 V GPIO VOH at 4-mA load IOCURR = 1 1.32 1.58 V GPIO VOL at 4-mA load IOCURR = 1 0.21 0.32 V GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 71.7 µA GPIO pulldown current Input mode, pulldown enabled, Vpad = VDDS 21.1 µA GPIO high/low input transition,
no hysteresis GPIO low-to-high input transition,
with hysteresis GPIO high-to-low input transition,
with hysteresis
IH = 0, transition between reading 0 and reading 1 0.88 V
IH = 1, transition voltage for input read as 0 1 1.07 V
IH = 1, transition voltage for input read as 1 0 0.74 V
GPIO input hysteresis IH = 1, difference between 0 1 and 1 0 points 0.33 V
DDS
= 1.8 V
24
Specifications Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640
CC2640
www.ti.com
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
DC Characteristics (continued)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TA= 25°C, V
GPIO VOH at 8-mA load IOCURR = 2, high-drive GPIOs only 2.68 V GPIO VOL at 8-mA load IOCURR = 2, high-drive GPIOs only 0.33 V GPIO VOH at 4-mA load IOCURR = 1 2.72 V GPIO VOL at 4-mA load IOCURR = 1 0.28 V
TA= 25°C, V
GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 277 µA GPIO pulldown current Input mode, pulldown enabled, Vpad = VDDS 113 µA GPIO high/low input transition,
no hysteresis GPIO low-to-high input transition,
with hysteresis GPIO high-to-low input transition,
with hysteresis
IH = 0, transition between reading 0 and reading 1 1.67 V
IH = 1, transition voltage for input read as 0 1 1.94 V
IH = 1, transition voltage for input read as 1 0 1.54 V
GPIO input hysteresis IH = 1, difference between 0 1 and 1 0 points 0.4 V
TA= 25°C
VIH
VIL
Lowest GPIO input voltage reliably interpreted as a «High»
Highest GPIO input voltage reliably interpreted as a «Low»
(1) Each GPIO is referenced to a specific VDDS pin. See the technical reference manual listed in Section 8.3 for more details.
DDS
DDS
= 3.0 V
= 3.8 V
0.8 VDDS
0.2 VDDS
(1)
(1)

5.24 Thermal Resistance Characteristics

NAME DESCRIPTION RSM (°C/W)
Rθ Rθ Rθ Psi Psi Rθ
JA JC(top) JB
JT JB
JC(bot)
Junction-to-ambient thermal resistance 36.9 32.8 29.6 Junction-to-case (top) thermal resistance 30.3 24.0 15.7 Junction-to-board thermal resistance 7.6 6.8 6.2 Junction-to-top characterization parameter 0.4 0.3 0.3 Junction-to-board characterization parameter 7.4 6.8 6.2 Junction-to-case (bottom) thermal resistance 2.1 1.9 1.9
(1) (2)
RHB (°C/W)
(1) °C/W = degrees Celsius per watt. (2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RθJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air).
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements. Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
(1) (2)
RGZ (°C/W)
(1) (2)
Submit Documentation Feedback
Product Folder Links: CC2640
SpecificationsCopyright © 2015–2016, Texas Instruments Incorporated
25
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
www.ti.com

5.25 Timing Requirements

MIN NOM MAX UNIT
Rising supply-voltage slew rate 0 100 mV/µs Falling supply-voltage slew rate 0 20 mV/µs Falling supply-voltage slew rate, with low-power flash settings
Positive temperature gradient in standby
(2)
(1)
No limitation for negative temperature gradient, or
3 mV/µs
5 °C/s
outside standby mode
CONTROL INPUT AC CHARACTERISTICS
(3)
RESET_N low duration 1 µs
(1) For smaller coin cell batteries, with high worst-case end-of-life equivalent source resistance, a 22-µF VDDS input capacitor (see
Figure 7-1) must be used to ensure compliance with this slew rate.
(2) Applications using RCOSC_LF as sleep timer must also consider the drift in frequency caused by a change in temperature (see
Section 5.15).
(3) TA= –40°C to 85°C, V
= 1.7 V to 3.8 V, unless otherwise noted.
DDS

5.26 Switching Characteristics

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
WAKEUP AND TIMING
Idle Active 14 µs Standby Active 151 µs Shutdown Active 1015 µs
= 3.0 V, unless otherwise noted.
DDS
26
Specifications Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640
VDDS (V)
Output power (dBm)
1.8 2.3 2.8 3.3 3.8
0
1
2
3
4
5
6
D003
5XD 5dBm Setting 4XS 2dBm Setting
Frequency (MHz)
Output Power (dBm)
2400 2410 2420 2430 2440 2450 2460 2470 2480
-1
0
1
2
3
4
5
6
7
8
D021
5-dBm setting (5XD) 0-dBm setting (4XS)
Frequency (MHz)
Sensitivity Level (dBm)
2400 2410 2420 2430 2440 2450 2460 2470 2480
-99
-98.5
-98
-97.5
-97
-96.5
-96
-95.5
-95
D020
Sensitivity 5XD Sensitivity 4XS
Temperature (qC)
Output Power (dBm)
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
0
1
2
3
4
5
6
4XS 2-dBm Setting 5XD 5-dBm Setting
VDDS (V)
Sensitivity (dBm)
1.8 2.3 2.8 3.3 3.8
-101
-100
-99
-98
-97
-96
-95
D004
BLE 5XD Sensitivity BLE 4XS Sensitivity
Temperature (qC)
Sensitivity (dBm)
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
-99
-98
-97
-96
-95
-94
Sensitivity 4XS Sensitivity 5XD
www.ti.com

5.27 Typical Characteristics

CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
Figure 5-4. BLE Sensitivity vs Temperature
Figure 5-6. BLE Sensitivity vs Channel Frequency
Figure 5-5. BLE Sensitivity vs Supply Voltage (VDDS)
Figure 5-7. TX Output Power vs Temperature
Figure 5-8. TX Output Power vs Supply Voltage (VDDS)
Submit Documentation Feedback
Product Folder Links: CC2640
Figure 5-9. TX Output Power
vs Channel Frequency
SpecificationsCopyright © 2015–2016, Texas Instruments Incorporated
27
Temperature (qC)
Active Mode Current Consumpstion (mA)
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
2.85
2.9
2.95
3
3.05
3.1
D006
Active Mode Current
VDDS (V)
Current Consumption (mA)
1.8 2.3 2.8 3.3 3.8
2
2.5
3
3.5
4
4.5
5
D007
Active Mode Current
Temperature (qC)
TX Current (mA)
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
0
2
4
6
8
10
12
D002
5XD 5dBm Setting 4XS 2dBm Setting
Temperature (qC)
RX Current (mA)
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
5.6
5.8
6
6.2
6.4
6.6
6.8
7
D001
5XD RX Current 4XS RX Current
VDDS (V)
TX Current (mA)
1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8
4
5
6
7
8
9
10
11
12
13
14
15
16
D015
4XS 0-dBm Setting 4XS 2-dBm Setting 5XD 5-dBm Setting
Voltage (V)
Current Consumption (mA)
1.8 2.05 2.3 2.55 2.8 3.05 3.3 3.55 3.8
4
4.5
5
5.5
6
6.5
7
7.5
8
8.5
9
9.5
10
10.5
D016
4XS 5XD
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
Typical Characteristics (continued)
www.ti.com
Figure 5-10. TX Current Consumption
vs Supply Voltage (VDDS)
Figure 5-12. RX Mode Current Consumption vs Temperature
Figure 5-11. RX Mode Current vs Supply Voltage (VDDS)
Figure 5-13. TX Mode Current Consumption vs Temperature
Figure 5-14. Active Mode (MCU Running, No Peripherals)
28
Current Consumption vs Temperature
Specifications Copyright © 2015–2016, Texas Instruments Incorporated
Figure 5-15. Active Mode (MCU Running, No Peripherals) Current
Consumption vs Supply Voltage (VDDS)
Submit Documentation Feedback
Product Folder Links: CC2640
Sampling Frequency (Hz)
ENOB
9.6
9.7
9.8
9.9
10
10.1
10.2
10.3
10.4
10.5
1k 10k 100k 200k
D009A
ENOB Internal Reference (No Averaging) ENOB Internal Reference (32 Samples Averaging)
Temperature (qC)
Standby Current (PA)
-40 -20 0 20 40 60 80 100
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
D021
VDDS (V)
ADC Code
1.8 2.3 2.8 3.3 3.8
1004.8
1005
1005.2
1005.4
1005.6
1005.8
1006
1006.2
1006.4
D012
Temperature (qC)
ADC Code
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
1004.5
1005
1005.5
1006
1006.5
1007
1007.5
D013
Temperature (qC)
Current (uA)
-20 -10 0 10 20 30 40 50 60 70 80
0
0.5
1
1.5
2
2.5
3
3.5
4
D008
Standby Mode Current
Input Frequency (Hz)
Effective Number of Bits
200300 500 1000 2000 5000 10000 20000 100000
9.4
9.6
9.8
10
10.2
10.4
10.6
10.8
11
11.2
11.4
D009
Fs= 200 kHz, No Averaging Fs= 200 kHz, 32 samples averaging
www.ti.com
Typical Characteristics (continued)
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
Figure 5-16. Standby Mode Current Consumption With RCOSC
Figure 5-18. SoC ADC Output vs Supply Voltage (Fixed Input,
RTC vs Temperature
Internal Reference, No Scaling)
Figure 5-17. SoC ADC Effective Number of Bits vs Input
Frequency (Internal Reference, No Scaling)
Figure 5-19. SoC ADC Output vs Temperature (Fixed Input,
Internal Reference, No Scaling)
Figure 5-20. SoC ADC ENOB vs Sampling Frequency
(Input Frequency = FS / 10)
Submit Documentation Feedback
Product Folder Links: CC2640
Figure 5-21. Standby Mode Supply Current vs Temperature
SpecificationsCopyright © 2015–2016, Texas Instruments Incorporated
29
ADC Code
INL
0 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000 4200
-4
-3
-2
-1
0
1
2
3
D011
ADC Code
DNL
0
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
2400
2600
2800
3000
3200
3400
3600
3800
4000
4200
-1.5
-1
-0.5
0
0.5
1
1.5
2
2.5
3
3.5
D010
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
Typical Characteristics (continued)
Figure 5-22. SoC ADC DNL vs ADC Code (Internal Reference, No Scaling)
www.ti.com
Figure 5-23. SoC ADC INL vs ADC Code (Internal Reference, No Scaling)
30
Specifications Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640
SimpleLinkTM CC26xx wireless MCU
Main CPU
128KB
Flash
Sensor controller
cJTAG
20KB
SRAM
ROM
ARM
®
Cortex®-M3
DC-DC converter
RF core
ARM
®
Cortex®-M0
DSP modem
4KB
SRAM
ROM
Sensor controller
engine
2x comparator
12-bit ADC, 200 ks/s
Constant current source
SPI-I2C digital sensor IF
2KB SRAM
Time-to-digital converter
General peripherals / modules
4× 32-bit Timers
2× SSI (SPI, µW, TI)
Watchdog timer
Temp. / batt. monitor
RTC
I2C
UART
I2S
10 / 15 / 31 GPIOs
AES
32 ch. µDMA
ADC
Digital PLL
TRNG
ADC
8KB
cache
Copyright © 2016, Texas Instruments Incorporated
www.ti.com

6 Detailed Description

6.1 Overview

The core modules of the CC26xx product family are shown in the Section 6.2.

6.2 Functional Block Diagram

CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
Submit Documentation Feedback
Product Folder Links: CC2640
Detailed DescriptionCopyright © 2015–2016, Texas Instruments Incorporated
31
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016

6.3 Main CPU

The SimpleLink CC2640 Wireless MCU contains an ARM Cortex-M3 (CM3) 32-bit CPU, which runs the application and the higher layers of the protocol stack.
The CM3 processor provides a high-performance, low-cost platform that meets the system requirements of minimal memory implementation, and low-power consumption, while delivering outstanding computational performance and exceptional system response to interrupts.
CM3 features include the following:
32-bit ARM Cortex-M3 architecture optimized for small-footprint embedded applications
Outstanding processing performance combined with fast interrupt handling
ARM Thumb®-2 mixed 16- and 32-bit instruction set delivers the high performance expected of a 32-bit ARM core in a compact memory size usually associated with 8- and 16-bit devices, typically in the range of a few kilobytes of memory for microcontroller-class applications:
– Single-cycle multiply instruction and hardware divide – Atomic bit manipulation (bit-banding), delivering maximum memory use and streamlined peripheral
control
– Unaligned data access, enabling data to be efficiently packed into memory
Fast code execution permits slower processor clock or increases sleep mode time
Harvard architecture characterized by separate buses for instruction and data
Efficient processor core, system, and memories
Hardware division and fast digital-signal-processing oriented multiply accumulate
Saturating arithmetic for signal processing
Deterministic, high-performance interrupt handling for time-critical applications
Enhanced system debug with extensive breakpoint and trace capabilities
Serial wire trace reduces the number of pins required for debugging and tracing
Migration from the ARM7™ processor family for better performance and power efficiency
Optimized for single-cycle flash memory use
Ultralow-power consumption with integrated sleep modes
1.25 DMIPS per MHz
www.ti.com

6.4 RF Core

The RF Core contains an ARM Cortex-M0 processor that interfaces the analog RF and base-band circuitries, handles data to and from the system side, and assembles the information bits in a given packet structure. The RF core offers a high level, command-based API to the main CPU.
The RF core is capable of autonomously handling the time-critical aspects of the radio protocols (Bluetooth Low Energy) thus offloading the main CPU and leaving more resources for the user application.
The RF core has a dedicated 4-KB SRAM block and runs initially from separate ROM memory. The ARM Cortex-M0 processor is not programmable by customers.
32
Detailed Description Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640
www.ti.com

6.5 Sensor Controller

The Sensor Controller contains circuitry that can be selectively enabled in standby mode. The peripherals in this domain may be controlled by the Sensor Controller Engine which is a proprietary power-optimized CPU. This CPU can read and monitor sensors or perform other tasks autonomously, thereby significantly reducing power consumption and offloading the main CM3 CPU.
The Sensor Controller is set up using a PC-based configuration tool, called Sensor Controller Studio, and potential use cases may be (but are not limited to):
Analog sensors using integrated ADC
Digital sensors using GPIOs, bit-banged I2C, and SPI
UART communication for sensor reading or debugging
Capacitive sensing
Waveform generation
Pulse counting
Keyboard scan
Quadrature decoder for polling rotation sensors
Oscillator calibration
Texas Instruments provides application examples for some of these use cases, but not for all of them.
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
NOTE
The peripherals in the Sensor Controller include the following:
The low-power clocked comparator can be used to wake the device from any state in which the comparator is active. A configurable internal reference can be used in conjunction with the comparator. The output of the comparator can also be used to trigger an interrupt or the ADC.
Capacitive sensing functionality is implemented through the use of a constant current source, a time­to-digital converter, and a comparator. The continuous time comparator in this block can also be used as a higher-accuracy alternative to the low-power clocked comparator. The Sensor Controller will take care of baseline tracking, hysteresis, filtering and other related functions.
The ADC is a 12-bit, 200-ksamples/s ADC with eight inputs and a built-in voltage reference. The ADC can be triggered by many different sources, including timers, I/O pins, software, the analog comparator, and the RTC.
The Sensor Controller also includes a SPI–I2C digital interface.
The analog modules can be connected to up to eight different GPIOs.
The peripherals in the Sensor Controller can also be controlled from the main application processor.
Submit Documentation Feedback
Product Folder Links: CC2640
Detailed DescriptionCopyright © 2015–2016, Texas Instruments Incorporated
33
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
www.ti.com
(1) Depending on the package size, up to 16 pins can be connected to the Sensor Controller. Up to 8 of

6.6 Memory

Table 6-1. GPIOs Connected to the Sensor Controller
ANALOG CAPABLE
Y 30 14 Y 29 13 Y 28 12 Y 27 11 9 Y 26 9 8 Y 25 10 7 Y 24 8 6 Y 23 7 5 N 7 4 2 N 6 3 1 N 5 2 0 N 4 1 N 3 0 N 2 N 1 N 0
these pins can be connected to analog modules.
7 × 7 RGZ
DIO NUMBER
5 × 5 RHB
DIO NUMBER
(1)
4 × 4 RSM
DIO NUMBER
The flash memory provides nonvolatile storage for code and data. The flash memory is in-system programmable.
The SRAM (static RAM) can be used for both storage of data and execution of code and is split into two 4-KB blocks and two 6-KB blocks. Retention of the RAM contents in standby mode can be enabled or disabled individually for each block to minimize power consumption. In addition, if flash cache is disabled, the 8-KB cache can be used as a general-purpose RAM.
The ROM provides preprogrammed embedded TI RTOS kernel, Driverlib and lower layer protocol stack software (Bluetooth Low Energy Controller). It also contains a bootloader that can be used to reprogram the device using SPI or UART.

6.7 Debug

The on-chip debug support is done through a dedicated cJTAG (IEEE 1149.7) or JTAG (IEEE 1149.1) interface.
34
Detailed Description Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640
www.ti.com

6.8 Power Management

To minimize power consumption, the CC2640 device supports a number of power modes and power management features (see Table 6-2).
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
Table 6-2. Power Modes
MODE
CPU Active Off Off Off Off Flash On Available Off Off Off SRAM On On On Off Off Radio Available Available Off Off Off Supply System On On Duty Cycled Off Off
Current 1.45 mA + 31 µA/MHz 550 µA 1 µA 0.15 µA 0.1 µA Wake-up Time to CPU Active Register Retention Full Full Partial No No SRAM Retention Full Full Full No No
High-Speed Clock
Low-Speed Clock Peripherals Available Available Off Off Off
Sensor Controller Available Available Available Off Off Wake up on RTC Available Available Available Off Off Wake up on Pin Edge Available Available Available Available Off Wake up on Reset Pin Available Available Available Available Available Brown Out Detector (BOD) Active Active Duty Cycled Power On Reset (POR) Active Active Active Active N/A
(1) Not including RTOS overhead (2) The Brown Out Detector is disabled between recharge periods in STANDBY. Lowering the supply voltage below the BOD threshold
between two recharge periods while in STANDBY may cause the BOD to lock the device upon wake-up until a Reset/POR releases it. To avoid this, it is recommended that STANDBY mode is avoided if there is a risk that the supply voltage (VDDS) may drop below the specified operating voltage range. For the same reason, it is also good practice to ensure that a power cycling operation, such as a battery replacement, triggers a Power-on-reset by ensuring that the VDDS decoupling network is fully depleted before applying supply voltage again (for example, inserting new batteries).
(1)
ACTIVE IDLE STANDBY SHUTDOWN
XOSC_HF or
RCOSC_HF
XOSC_LF or
RCOSC_LF
SOFTWARE CONFIGURABLE POWER MODES
14 µs 151 µs 1015 µs 1015 µs
XOSC_HF or
RCOSC_HF
XOSC_LF or
RCOSC_LF
Off Off Off
XOSC_LF or
RCOSC_LF
(2)
Off Off
Off N/A
RESET PIN
HELD
In active mode, the application CM3 CPU is actively executing code. Active mode provides normal operation of the processor and all of the peripherals that are currently enabled. The system clock can be any available clock source (see Table 6-2).
In idle mode, all active peripherals can be clocked, but the Application CPU core and memory are not clocked and no code is executed. Any interrupt event will bring the processor back into active mode.
In standby mode, only the always-on domain (AON) is active. An external wake event, RTC event, or sensor-controller event is required to bring the device back to active mode. MCU peripherals with retention do not need to be reconfigured when waking up again, and the CPU continues execution from where it went into standby mode. All GPIOs are latched in standby mode.
In shutdown mode, the device is turned off entirely, including the AON domain and the Sensor Controller. The I/Os are latched with the value they had before entering shutdown mode. A change of state on any I/O pin defined as a wake from Shutdown pin wakes up the device and functions as a reset trigger. The CPU can differentiate between a reset in this way, a reset-by-reset pin, or a power-on-reset by reading the reset status register. The only state retained in this mode is the latched I/O state and the Flash memory contents.
Detailed DescriptionCopyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640
35
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
The Sensor Controller is an autonomous processor that can control the peripherals in the Sensor Controller independently of the main CPU, which means that the main CPU does not have to wake up, for example, to execute an ADC sample or poll a digital sensor over SPI. The main CPU saves both current and wake-up time that would otherwise be wasted. The Sensor Controller Studio enables the user to configure the sensor controller and choose which peripherals are controlled and which conditions wake up the main CPU.

6.9 Clock Systems

The CC2640 supports two external and two internal clock sources. A 24-MHz crystal is required as the frequency reference for the radio. This signal is doubled internally to
create a 48-MHz clock. The 32-kHz crystal is optional. Bluetooth low energy requires a slow-speed clock with better than
±500 ppm accuracy if the device is to enter any sleep mode while maintaining a connection. The internal 32-kHz RC oscillator can in some use cases be compensated to meet the requirements. The low-speed crystal oscillator is designed for use with a 32-kHz watch-type crystal.
The internal high-speed oscillator (48-MHz) can be used as a clock source for the CPU subsystem. The internal low-speed oscillator (32.768-kHz) can be used as a reference if the low-power crystal
oscillator is not used.
www.ti.com
The 32-kHz clock source can be used as external clocking reference through GPIO.

6.10 General Peripherals and Modules

The I/O controller controls the digital I/O pins and contains multiplexer circuitry to allow a set of peripherals to be assigned to I/O pins in a flexible manner. All digital I/Os are interrupt and wake-up capable, have a programmable pullup and pulldown function and can generate an interrupt on a negative or positive edge (configurable). When configured as an output, pins can function as either push-pull or open-drain. Five GPIOs have high drive capabilities (marked in bold in Section 4).
The SSIs are synchronous serial interfaces that are compatible with SPI, MICROWIRE, and Texas Instruments synchronous serial interfaces. The SSIs support both SPI master and slave up to 4 MHz.
The UART implements a universal asynchronous receiver/transmitter function. It supports flexible baud­rate generation up to a maximum of 3 Mbps and is compatible with the Bluetooth HCI specifications.
Timer 0 is a general-purpose timer module (GPTM), which provides two 16-bit timers. The GPTM can be configured to operate as a single 32-bit timer, dual 16-bit timers or as a PWM module.
Timer 1, Timer 2, and Timer 3 are also GPTMs. Each of these timers is functionally equivalent to Timer 0. In addition to these four timers, the RF core has its own timer to handle timing for RF protocols; the RF
timer can be synchronized to the RTC. The I2C interface is used to communicate with devices compatible with the I2C standard. The I2C interface
is capable of 100-kHz and 400-kHz operation, and can serve as both I2C master and I2C slave. The TRNG module provides a true, nondeterministic noise source for the purpose of generating keys,
initialization vectors (IVs), and other random number requirements. The TRNG is built on 24 ring oscillators that create unpredictable output to feed a complex nonlinear combinatorial circuit.
36
The watchdog timer is used to regain control if the system fails due to a software error after an external device fails to respond as expected. The watchdog timer can generate an interrupt or a reset when a predefined time-out value is reached.
Detailed Description Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640
www.ti.com
The device includes a direct memory access (µDMA) controller. The µDMA controller provides a way to offload data transfer tasks from the CM3 CPU, allowing for more efficient use of the processor and the available bus bandwidth. The µDMA controller can perform transfer between memory and peripherals. The µDMA controller has dedicated channels for each supported on-chip module and can be programmed to automatically perform transfers between peripherals and memory as the peripheral is ready to transfer more data. Some features of the µDMA controller include the following (this is not an exhaustive list):
Highly flexible and configurable channel operation of up to 32 channels
Transfer modes:
Data sizes of 8, 16, and 32 bits
The AON domain contains circuitry that is always enabled, except for in Shutdown (where the digital supply is off). This circuitry includes the following:
The RTC can be used to wake the device from any state where it is active. The RTC contains three
The battery monitor and temperature sensor are accessible by software and give a battery status
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
– Memory-to-memory – Memory-to-peripheral – Peripheral-to-memory – Peripheral-to-peripheral
compare and one capture registers. With software support, the RTC can be used for clock and calendar operation. The RTC is clocked from the 32-kHz RC oscillator or crystal. The RTC can also be compensated to tick at the correct frequency even when the internal 32-kHz RC oscillator is used instead of a crystal.
indication as well as a coarse temperature measure.

6.11 Voltage Supply Domains

The CC2640 device can interface to two or three different voltage domains depending on the package type. On-chip level converters ensure correct operation as long as the signal voltage on each input/output pin is set with respect to the corresponding supply pin (VDDS, VDDS2 or VDDS3). lists the pin-to-VDDS mapping.
Table 6-3. Pin function to VDDS mapping table
VQFN 7 × 7 (RGZ) VQFN 5 × 5 (RHB) VQFN 4 × 4 (RSM)
(1)
VDDS
VDDS2 DIO 0–11
VDDS3
(1) VDDS_DCDC must be connected to VDDS on the PCB
DIO 23–30
Reset_N
DIO 12–22
JTAG

6.12 System Architecture

Depending on the product configuration, CC26xx can function either as a Wireless Network Processor (WNP—an IC running the wireless protocol stack, with the application running on a separate MCU), or as a System-on-Chip (SoC), with the application and protocol stack running on the ARM CM3 core inside the device.
In the first case, the external host MCU communicates with the device using SPI or UART. In the second case, the application must be written according to the application framework supplied with the wireless protocol stack.
Package
DIO 7–14
Reset_N DIO 0–6
JTAG
N/A N/A
DIO 5–9 Reset_N
DIO 0–4
JTAG
Submit Documentation Feedback
Product Folder Links: CC2640
Detailed DescriptionCopyright © 2015–2016, Texas Instruments Incorporated
37
Antenna (50 Ohm)
1 pF
1 pF
2.4 nH
2.4±2.7 nH
6.8 pF
6.2±6.8 nH
Antenna (50 Ohm)
1.2 pF
15 nH
2 nH
1.2 pF
Antenna (50 Ohm)
1.2 pF
2 nH
1.2 pF
Antenna (50 Ohm)
1.2 pF
2 nH
1.2 pF
Pin 1 (RF P)
Pin 2 (RF N)
Pin 3 (RXTX)
Pin 1 (RF P)
Pin 2 (RF N)
Pin 1 (RF P)
Pin 2 (RF N)
Red = Not necessary if internal bias is used
Red = Not necessary if internal bias is used
Differential operation
Single ended operation
Single ended operation with 2 antennas
Pin 3 (RXTX)
15 nH
15 nH
CC26xx
(GND exposed die
attached pad
)
Pin 3/4 (RXTX)
Pin 1 (RF P)
Pin 2 (RF N)
24MHz
XTAL
(Load caps
on chip)
10µF
10µH
Optional inductor.
Only
needed for
DCDC
operation
12 pF
12 pF
12 pF
12 pF
2 nH 2 nH
1 pF
input decoupling 10µF±22µF
To VDDR
pins
VDDS_DCDC
DCDC_SW
Red = Not necessary if internal bias is used
Copyright © 2016, Texas Instruments Incorporated
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016

7 Application, Implementation, and Layout

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

7.1 Application Information

Very few external components are required for the operation of the CC2640 device. This section provides some general information about the various configuration options when using the CC2640 in an application, and then shows two examples of application circuits with schematics and layout. This is only a small selection of the many application circuit examples available as complete reference designs from the product folder on www.ti.com.
Figure 7-1 shows the various RF front-end configuration options. The RF front end can be used in
differential- or single-ended configurations with the options of having internal or external biasing. These options allow for various trade-offs between cost, board space, and RF performance. Differential operation with external bias gives the best performance while single-ended operation with internal bias gives the least amount of external components and the lowest power consumption. Reference designs exist for each of these options.
www.ti.com
NOTE
38
Figure 7-1. CC2640 Application Circuit
Application, Implementation, and Layout Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640
Internal DC-DC Regulator External RegulatorInternal LDO Regulator
(GND Exposed Die
Attached Pad)
Pin 3/4 (RXTX)
Pin 1 (RF P)
Pin 2 (RF N)
24-MHz XTAL
(Load Caps on Chip)
10 F
10 H
VDDS_DCDC
Input Decoupling
10 F±22 F
To All VDDR Pins
VDDS_DCDC Pin
DCDC_SW Pin
1.8 V±3.8 V
to All VDDS Pins
VDDR
VDDR
VDDS VDDS
CC26xx
(GND Exposed Die
Attached Pad)
Pin 3/4 (RXTX)
Pin 1 (RF P)
Pin 2 (RF N)
24-MHz XTAL
(Load Caps on Chip)
VDDS_DCDC
Input Decoupling
10 F±22 F
To All VDDR Pins
VDDS_DCDC Pin
NC
1.8 V±3.8 V
Supply Voltage
VDDR
VDDR
VDDS VDDS
CC26xx
10 F
To All VDDS Pins
(GND Exposed Die
Attached Pad)
Pin 3/4 (RXTX)
Pin 1 (RF P)
Pin 2 (RF N)
24-MHz XTAL
(Load Caps
on Chip)
VDDS_DCDC Pin
CC26xx
2.2 F
DCDC_SW Pin
1.7 V±1.95 V to All VDDR- and VDDS Pins Except VDDS_DCDC
Ext.
Regulator
Copyright © 2016, Texas Instruments Incorporated
www.ti.com
Figure 7-2 shows the various supply voltage configuration options. Not all power supply decoupling
capacitors or digital I/Os are shown. Exact pin positions will vary between the different package options. For a detailed overview of power supply decoupling and wiring, see the TI reference designs and the CC26xx technical reference manual (Section 8.3).
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
Figure 7-2. Supply Voltage Configurations
Submit Documentation Feedback
Product Folder Links: CC2640
Application, Implementation, and LayoutCopyright © 2015–2016, Texas Instruments Incorporated
39
C12
DNM
C13
1 pF
L12
2 nH
1
2
L13
2 nH
1 2
VDDR Decoupling Capacitors
Pin 32
Pin 29
50-Ω
Antenna
VDDS
L1
10 uH
1
2
Y1
32.768 kHz
C18
12 pF
C17
12 pF
Place L1 and C8 close to pin 17
C23
DNM
C22
DNM
C8
10 µF
C10
DNM
C16 100 nF
C6
10 µF
CC2650F128RHB
U1
VSS
33
DIO_0
6
DIO_1
7
DIO_2
8
DIO_3
9
DIO_4
10
DIO_5
15
DIO_6
16
DIO_7
20
DIO_8
21
DIO_9
22
DIO_10
23
DIO_11
24
DIO_12
25
DIO_13
26
DIO_14
27
VDDR
29
VDDR
32
VDDS
28
VDDS2
11
VDDS_D CDC
18
DCOU PL
12
RESET_N
19
JTAG_TMSC
13
JTAG_TCKC
14
X32K_Q1
4
X32K_Q2
5
X24M_N
30
X24M_P
31
RF_P
1
RF_N
2
RX_TX
3
DCD C_SW
17
Y2
24 MHz
1
2
4
3
C2
DNM
C11
1 pF
C21
1 pF
C20 100 nF
X24M_N
X24M_P
VDDS
VDDR
DCDC_SW
DCDC_SW
C31
6.8 pF
VDDS
nRESET
C19
1 µF
JTAG_TCK JTA G_TMS
DIO_1
DIO_0
DIO_3
DIO_2
DIO_5/JTAG_TDO
DIO_4
DIO_7
DIO_6/JTAG_TDI
DIO_10
DIO_9
DIO_8
DIO_12
DIO_11
DIO_14
DIO_13
RX_TX
RFP
RFN
L11
2.7 nH
1 2
L21
2.4 nH
1
2
VDD_EB
FL1
BLM18HE152SN1
12
C9
100 nF
C3
100 nF
C4
100 nF
VDDS Decoupling Capacitors
Pin 18
Pin 28
Pin 11
C7
100 nF
L10
6.2 nH
1
2
R1
100 k
VDDR
Copyright © 2016, Texas Instruments Incorporated
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016

7.2 5 × 5 External Differential (5XD) Application Circuit

www.ti.com
Figure 7-3. 5 × 5 External Differential (5XD) Application Circuit
40
Submit Documentation Feedback
Product Folder Links: CC2640
Copyright © 2015–2016, Texas Instruments IncorporatedApplication, Implementation, and Layout
www.ti.com

7.2.1 Layout

CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
Figure 7-4. 5 × 5 External Differential (5XD) Layout
Submit Documentation Feedback
Product Folder Links: CC2640
Application, Implementation, and LayoutCopyright © 2015–2016, Texas Instruments Incorporated
41
RF_P
C14
12 pF
C8
10 Fµ
C10
DNM
C16
100 nF
C5
10 Fµ
VDDS Decoupling Capacitors
VDDS
Pin 11 Pin 27
Pin 19
Y1
32.768 kHz
C18
12 pF
C17
12 pF
C3 100 nF
C4 100 nF
C6 100 nF
C12
1.2 pF
VDDS
R1 100 k
VDDR
Place L1 and C8 close to pin 18
C20 100 nF
nRESET
DIO_8
DIO_0
DIO_7
DIO_9
Pin 28 Pin 3 2
C9 100 nF
VDDR Decoupling Capacitors
VDDR
Y2
24 MHz
1
2
4
3
C2
DNM
VDDS
L21
15 nH
1 2
L1
10 Hµ
1
2
DCDC_SW
C19
1 µF
50-Ω
Antenna
FL1
BLM18HE152SN1
1
2
RF_N used for RX biasing. L21 may be removed at the cost of 1 dB degraded sensitivity
VDD_EB
C13
1.2 pF
L12
2 nH
1 2
CC26XX_4X4
U1
DIO_0
8
DIO_1
9
DIO_2
10
DIO_3
15
DIO_4
16
DIO_5
22
DIO_6
23
DIO_7
24
DIO_8
25
DIO_9
26
RESET_N
21
JTAG_TCKC
14
JTAG_TMSC
13
X24M_P
31
X24M_N
30
DCOU PL
12
VSS
29
VSS
3
EGP
33
VDDS
27
VDDS2
11
VDDS_D CDC
19
VDDR
28
VDDR
32
DCD C_SW
18
RX/TX
4
RF_N RF_P
1
X32K_Q2
6
X32K_Q1
5
VSS
7
VSS
17
VSS
20
DIO_1
DIO_3/JTAG_TDO
DIO_2
DIO_6
DIO_5
DIO_4/JTAG_TDI
DCDC_SW
JTAG_TCK
nRESET
JTAG_TMS
C23
DNM
C22
DNM
X24M_N
X24M_P
2
Copyright © 2016, Texas Instruments Incorporated
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016

7.3 4 × 4 External Single-ended (4XS) Application Circuit

www.ti.com
42
Figure 7-5. 4 × 4 External Single-ended (4XS) Application Circuit
Submit Documentation Feedback
Product Folder Links: CC2640
Copyright © 2015–2016, Texas Instruments IncorporatedApplication, Implementation, and Layout
www.ti.com

7.3.1 Layout

CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
Figure 7-6. 4 × 4 External Single-ended (4XS) Layout
Submit Documentation Feedback
Product Folder Links: CC2640
Application, Implementation, and LayoutCopyright © 2015–2016, Texas Instruments Incorporated
43
SimpleLink™ Multistandard Wireless MCU
DEVICE FAMILY
PREFIX
CC26 xx
X = Experimental device Blank = Qualified device
yyy
PACKAGE DESIGNATOR
RGZ = 48-pin VQFN (Very Thin Quad Flatpack No-Lead) RHB = 32-pin VQFN (Very Thin Quad Flatpack No-Lead) RSM = 32-pin VQFN (Very Thin Quad Flatpack No-Lead)
(R/T)
R = Large Reel T = Small Reel
F128
ROM version 1
Flash = 128KB
DEVICE
20 = RF4CE 30 = Zigbee 40 = 50 = Multi-Protocol
Bluetooth
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016

8 Device and Documentation Support

8.1 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and date-code. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example, CC2640 is in production; therefore, no prefix/identification is assigned).
Device development evolutionary flow: X Experimental device that is not necessarily representative of the final device's electrical
specifications and may not use production assembly flow.
P Prototype device that is not necessarily the final silicon die and may not necessarily meet
final electrical specifications.
null Production version of the silicon die that is fully qualified. Production devices have been characterized fully, and the quality and reliability of the device have been
demonstrated fully. TI's standard warranty applies. Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
www.ti.com
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RSM).
For orderable part numbers of the CC2640 device in the RSM, RHB or RGZ package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.
Figure 8-1. Device Nomenclature
44
Device and Documentation Support Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640
www.ti.com

8.2 Tools and Software

TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules.
The following products support development of the CC2640 device applications:
Software Tools:
SmartRF Studio 7:
SmartRF Studio is a PC application that helps designers of radio systems to easily evaluate the RF-IC at an early stage in the design process.
Test functions for sending and receiving radio packets, continuous wave transmit and receive
Evaluate RF performance on custom boards by wiring it to a supported evaluation board or debugger
Can also be used without any hardware, but then only to generate, edit and export radio configuration settings
Can be used in combination with several development kits for Texas Instruments’ CCxxxx RF-ICs
Sensor Controller Studio:
Sensor Controller Studio provides a development environment for the CC26xx Sensor Controller. The Sensor Controller is a proprietary, power-optimized CPU in the CC26xx, which can perform simple background tasks autonomously and independent of the System CPU state.
Allows for Sensor Controller task algorithms to be implemented using a C-like programming language
Outputs a Sensor Controller Interface driver, which incorporates the generated Sensor Controller machine code and associated definitions
Allows for rapid development by using the integrated Sensor Controller task testing and debugging functionality. This allows for live visualization of sensor data and algorithm verification.
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016
IDEs and Compilers:
Code Composer Studio:
Integrated development environment with project management tools and editor
Code Composer Studio (CCS) 6.1 and later has built-in support for the CC26xx device family
Best support for XDS debuggers; XDS100v3, XDS110 and XDS200
High integration with TI-RTOS with support for TI-RTOS Object View
IAR Embedded Workbench for ARM
Integrated development environment with project management tools and editor
IAR EWARM 7.30.3 and later has built-in support for the CC26xx device family
Broad debugger support, supporting XDS100v3, XDS200, IAR I-Jet and Segger J-Link
Integrated development environment with project management tools and editor
RTOS plugin available for TI-RTOS
For a complete listing of development-support tools for the CC2640 platform, visit the Texas Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.
Submit Documentation Feedback
Product Folder Links: CC2640
Device and Documentation SupportCopyright © 2015–2016, Texas Instruments Incorporated
45
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016

8.3 Documentation Support

To receive notification of documentation updates, navigate to the device product folder on ti.com (CC2640). In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
The current documentation that describes the CC2640 devices, related peripherals, and other technical collateral is listed in the following.
Technical Reference Manual
CC13xx, CC26xx SimpleLink™ Wireless MCU Technical Reference Manual SPACER
Errata
CC2640 SimpleLink™ Wireless MCU Errata

8.4 Texas Instruments Low-Power RF Website

Texas Instruments' Low-Power RF website has all the latest products, application and design notes, FAQ section, news and events updates. Go to www.ti.com/lprf.

8.5 Low-Power RF eNewsletter

The Low-Power RF eNewsletter is up-to-date on new products, news releases, developers’ news, and other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter articles include links to get more online information.
www.ti.com
Sign up at: www.ti.com/lprfnewsletter

8.6 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help
developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.
Low-Power RF Online Community Wireless Connectivity Section of the TI E2E Support Community
Forums, videos, and blogs
RF design help
E2E interaction Join here.
Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-power
RF development partners to help customers speed up their application development. The network consists of recommended companies, RF consultants, and independent design houses that provide a series of hardware module products and design services, including:
RF circuit, low-power RF, and ZigBee design services
Low-power RF and ZigBee module solutions and development tools
RF certification services and RF circuit manufacturing For help with modules, engineering services or development tools: Search the Low-Power RF Developer Network to find a suitable partner.
www.ti.com/lprfnetwork
46
Device and Documentation Support Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640
www.ti.com

8.7 Additional Information

Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and standard-based wireless applications for use in industrial and consumer applications. The selection includes RF transceivers, RF transmitters, RF front ends, and Systems-on-Chips as well as various software solutions for the sub-1-GHz and 2.4-GHz frequency bands.
In addition, Texas Instruments provides a large selection of support collateral such as development tools, technical documentation, reference designs, application expertise, customer support, third-party and university programs.
The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the chance to interact with engineers from all over the world.
With a broad selection of product solutions, end-application possibilities, and a range of technical support, Texas Instruments offers the broadest low-power RF portfolio.

8.8 Trademarks

SimpleLink, SmartRF, Code Composer Studio, E2E are trademarks of Texas Instruments. ARM7 is a trademark of ARM Limited (or its subsidiaries). ARM, Cortex, ARM Thumb are registered trademarks of ARM Limited (or its subsidiaries). Bluetooth is a registered trademark of Bluetooth SIG, Inc. CoreMark is a registered trademark of Embedded Microprocessor Benchmark Consortium. IAR Embedded Workbench is a registered trademark of IAR Systems AB. IEEE Std 1241 is a trademark of Institute of Electrical and Electronics Engineers, Incorporated. ZigBee is a registered trademark of ZigBee Alliance, Inc. All other trademarks are the property of their respective owners.
CC2640
SWRS176B –FEBRUARY 2015–REVISED JULY 2016

8.9 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

8.10 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from Disclosing party under this Agreement, or any direct product of such technology, to any destination to which such export or re­export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.

8.11 Glossary

SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms and definitions.

9 Mechanical Packaging and Orderable Information

9.1 Packaging Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Mechanical Packaging and Orderable InformationCopyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640
47
PACKAGE OPTION ADDENDUM
www.ti.com
25-Oct-2016
PACKAGING INFORMATION
Orderable Device Status
CC2640F128RGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS
CC2640F128RGZT ACTIVE VQFN RGZ 48 250 Green (RoHS
CC2640F128RHBR ACTIVE VQFN RHB 32 3000 Green (RoHS
CC2640F128RHBT ACTIVE VQFN RHB 32 250 Green (RoHS
CC2640F128RSMR ACTIVE VQFN RSM 32 3000 Green (RoHS
CC2640F128RSMT ACTIVE VQFN RSM 32 250 Green (RoHS
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
Lead/Ball Finish
(6)
CU NIPDAU | Call TI Level-3-260C-168 HR -40 to 85 CC2640
CU NIPDAU | Call TI Level-3-260C-168 HR -40 to 85 CC2640
CU NIPDAU | Call TI Level-3-260C-168 HR -40 to 85 CC2640
CU NIPDAU | Call TI Level-3-260C-168 HR -40 to 85 CC2640
CU NIPDAU | Call TI Level-3-260C-168 HR -40 to 85 CC2640
CU NIPDAU Level-3-260C-168 HR -40 to 85 CC2640
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(F128 ~ F128 BX)
F128
F128
F128
F128
F128
(4/5)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Samples
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Oct-2016
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Nov-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
CC2640F128RGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.1 12.0 16.0 Q2 CC2640F128RGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.1 12.0 16.0 Q2 CC2640F128RHBR VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.1 8.0 12.0 Q2 CC2640F128RHBT VQFN RHB 32 250 180.0 12.4 5.3 5.3 1.1 8.0 12.0 Q2
CC2640F128RSMR VQFN RSM 32 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
CC2640F128RSMT VQFN RSM 32 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
Package Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)B0(mm)K0(mm)P1(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Nov-2015
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CC2640F128RGZR VQFN RGZ 48 2500 367.0 367.0 38.0
CC2640F128RGZT VQFN RGZ 48 250 210.0 185.0 35.0
CC2640F128RHBR VQFN RHB 32 3000 367.0 367.0 35.0
CC2640F128RHBT VQFN RHB 32 250 210.0 185.0 35.0 CC2640F128RSMR VQFN RSM 32 3000 367.0 367.0 35.0 CC2640F128RSMT VQFN RSM 32 250 210.0 185.0 35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
Loading...