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CC2591
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Texas Instruments CC2591, CC2591RGVTG4 Datasheet

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PA
Logic
Bias
2
3
4
11
LNA
5
6
BIAS
HGM
RF_P
RXTX
RF_N
PAEN
EN
BALUN
ANT
CC2591
www.ti.com
........................................................................................................................................................ SWRS070A – MARCH 2008 – REVISED JUNE 2008
2.4-GHz RF Front End
1

FEATURES APPLICATIONS

• Seamless Interface to 2.4-GHz Low Power RF
Devices from Texas Instruments
• Up to 22-dBm Output Power
• 6-dB Typical Improved Sensitivity on CC24xx
and CC2500, CC2510, and CC2511
• Few External Components
– Integrated Switches – Integrated Matching Network – Integrated Balun – Integrated Inductors – Integrated PA – Integrated LNA
• Digital Control of LNA Gain by HGM Pin System-on-Chip products from Texas Instruments.
• 100-nA in Power Down (EN = PAEN = 0)
• Low Transmit Current Consumption
(100-mA at 3-V for 20-dBm Out, PAE = 33%)
• Low Receive Current Consumption
– 3.4-mA for High Gain Mode – 1.7-mA for Low Gain Mode
• 4.8-dB LNA Noise Figure, including T/R Switch
and external antenna match
• RoHS Compliant 4 × 4-mm QFN-16 Package
• 2-V to 3.6-V Operation
• All 2.4-GHz ISM Band Systems
• Wireless Sensor Networks
• Wireless Industrial Systems
• IEEE 802.15.4 and ZigBee Systems
• Wireless Consumer Systems
• Wireless Audio Systems

DESCRIPTION

CC2591 is a cost-effective and high performance RF
Front End for low-power and low-voltage 2.4-GHz wireless applications.
CC2591 is a range extender for all existing and future
2.4-GHz low-power RF transceivers, transmitters and
CC2591 increases the link budget by providing a power amplifier for increased output power, and an LNA with low noise figure for improved receiver sensitivity.
CC2591 provides a small size, high output power RF design with its 4x4-mm QFN-16 package.
CC2591 contains PA, LNA, switches, RF-matching, and balun for simple design of high performance wireless applications.

CC2591 BLOCK DIAGRAM

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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CC2591
SWRS070A – MARCH 2008 – REVISED JUNE 2008 ........................................................................................................................................................
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

Under no circumstances must the absolute maximum ratings be violated. Stress exceeding one or more of the limiting values may cause permanent damage to the device.
PARAMETER VALUE UNIT
Supply voltage All supply pins must have the same voltage – 0.3 to 3.6 Voltage on any digital pin – 0.3 to V Input RF level 10 dBm Storage temperature range – 50 to 150 ° C
DD
+ 0.3, max 3.6

RECOMMENDED OPERATING CONDITIONS

The operating conditions for CC2591 are listed below.
PARAMETER MIN MAX UNIT
Ambient temperature range – 40 85 ° C Operating supply voltage 2 3.6 V Operating frequency range 2400 2483.5 MHz
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V

ELECTRICAL CHARACTERISTICS

TC= 25 ° C, V matching components.
Receive current, High Gain Mode HGM = 1 3.4 4 Receive current, Low Gain Mode HGM = 0 1.7 2 Transmit current PIN= 0.5 dBm 112 Transmit current No input signal 40 50 Power down current EN = PAEN = 0 0.1 0.3 µ A High input level (control pins) EN, PAEN, HGM, RXTX 1.3 V Low input level (control pins) EN, PAEN, HGM, RXTX 0.3 Power down - Receive mode switching
time Power down - Transmit mode switching
time
RF Receive
Gain, High Gain Mode HGM = 1 11 dB Gain, Low Gain Mode HGM = 0 1 dB Gain variation, 2400 – 2483.5 MHz, High
Gain Mode Gain variation, 2.0V – 3.6V, High Gain
Mode Gain variation, -40 ° C – 85 ° C, High Gain
Mode Noise figure, High Gain Mode 4.8 dB Input 1 dB compression, High Gain Mode HGM = 1 – 17 dBm
Input IP3, High Gain Mode HGM = 1 – 2 dBm Input reflection coefficient, S11 HGM = 1, measured at antenna port – 11 dB
= 3 V , fRF= 2440MHz (unless otherwise noted). Measured on CC2591EM reference design including external
DD
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
12 µ s
1 µ s
HGM = 1 1.3 dB
HGM = 1 1.5 dB
HGM = 1 3 dB HGM = 1, including internal T/R switch and external
antenna match
DD
mA
V
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Product Folder Link(s): CC2591
CC2591
www.ti.com
........................................................................................................................................................ SWRS070A – MARCH 2008 – REVISED JUNE 2008
ELECTRICAL CHARACTERISTICS (continued)
TC= 25 ° C, V matching components.
RF Transmit
Gain 22 dB Output power, P Maximum output power PIN= 5 dBm 22 dBm Power Added Efficiency, PAE PIN= 0.5 dBm 34% Output 1 dB compression 19 dBm Output IP3 32 dBm Output power variation over frequency 2400 – 2483.5 MHz, PIN= 0.5 dBm 0.5 dB Output power variation over power supply 2V – 3.6V , PIN= 0.5 dBm 3.5 dB Output power variation over temperature -40 ° C – 85 ° C, PIN= 0.5 dBm 1.5 dB
2nd harmonic power below regulatory limits by using an external LC filter – 15 dBm
3rd harmonic power below regulatory limits by using an external LC filter – 30 dBm
= 3 V , fRF= 2440MHz (unless otherwise noted). Measured on CC2591EM reference design including external
DD
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OUT
PIN= 0.5 dBm 20.6 dBm
PIN= 0.5 dBm. The 2nd harmonic can be reduced to and antenna.
PIN= 0.5 dBm. The 3rd harmonic can be reduced to and antenna.
Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): CC2591
AVDD_PA1
1
2
3
4
12
11
10
9
5 6 7 8
16 15 14 13
QFN-16 4x4mm
RF_N
RXTX
RF_P
HGM
EN
PAEN
GND
GND
ANT
GND
AVDD_BIAS
BIAS
GND
AVDD_LNA
AVDD_PA2
CC2591
SWRS070A – MARCH 2008 – REVISED JUNE 2008 ........................................................................................................................................................

DEVICE INFORMATION

The CC2591 pinout and description are shown in Figure 1 and Table 1 , respectively.
PIN AND I/O CONFIGURATION
(TOP VIEW)
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4 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated
The exposed die attach pad must be connected to a solid ground plane as this is the primary ground connection for the chip. Inductance in vias to the pad should be minimized. It is highly recommended to follow the reference layout. Changes will alter the performance. Also see the PCB landpattern information in this data sheet.
For best performance, minimize the length of the ground vias, by using a 4-layer PCB with ground plane as layer 2 when CC2591 is mounted onto layer 1.
Figure 1.
NOTE:
Product Folder Link(s): CC2591
CC2591
www.ti.com
........................................................................................................................................................ SWRS070A – MARCH 2008 – REVISED JUNE 2008
Table 1. TERMINAL FUNCTIONS
TERMINAL
NO. NAME
— GND Ground
1 2.0 V – 3.6 V Power. PCB trace to this pin serves as inductive load to PA . See
2 RF_N RF RF interface towards CC24xx or CC25xx device. 3 RXTX Analog/Control 4 RF_P RF RF interface towards CC24xx or CC25xx device
5 PAEN Digital Input Digital control pin. See Table 3 and Table 4 for details. 6 EN Digital Input Digital control pin. See Table 3 and Table 4 for details.
7 HGM Digital Input HGM=1 → Device in High Gain Mode
8, 9, 12, 14 GND Ground
10 AVDD_PA2 Power 11 ANT RF Antenna interface. 13 AVDD_LNA Power 15 BIAS Analog Biasing input. Resistor between this node and ground sets bias current to PAs.
16 AVDD_BIAS Power 2 V – 3.6 V Power.
AVDD_PA1 Power
TYPE DESCRIPTION
The exposed die attach pad must be connected to a solid ground plane. See CC2591EM reference design for recommended layout.
CC2591EM reference design for recommended layout.
RXTX switching voltage when connected to CC24xx devices. See Table 3 and Table 4 for details.
Digital control pin.
HGM=0 → Device in Low Gain Mode (RX only) Secondary ground connections. Should be shorted to the die attach pad on the top
PCB layer.
2.0 V – 3.6 V Power. PCB trace to this pin serves as inductive load to PA. See CC2591EM reference design for recommended layout.
2 V – 3.6 V Power. PCB trace to this pin serves as inductive load to LNA. See CC2591EM reference design for recommended layout.
Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): CC2591
RF_P
RXTX
RF_N
RF_P
RXTX
RF_N
= TLINE inductor
CC2591
ANT
PAEN
EN
HGM
BIAS
VDD
AVDD_PA2
AVDD_PA1
AVDD_LNA
AVDD_BIAS
VDD VDD
VDD
RF_P
RXTX
RF_N
R151
TL11
TL101
TL131
PAEN
EN
C111
L112
C161
C11/C12
C101/C102
C131/C132
HGM
RXTX
C2
LDB182G4520C-110
Balun
SMA
SMA
L111
CC2591
SWRS070A – MARCH 2008 – REVISED JUNE 2008 ........................................................................................................................................................

CC2591EM Evaluation Module

www.ti.com
Figure 2. CC2591EM Evaluation Module
Table 2. List of Materials (See CC2591EM Reference Design)
DEVICE FUNCTION VALUE
L112 Part of antenna match. 1.5 nH: LQW15AN1N5B00 from Murata L111 DC block. 1 nF: GRM1555C1H102JA01 from Murata C111 Part of antenna match. 1 pF: GRM1555C1H1R0BZ01 from Murata C161 Decoupling capacitor. 1 nF: GRM1555C1H102JA01 from Murata
C11/C12 Decoupling. Will affect PA resonance.
C101/C102 Decoupling. Will affect PA resonance.
C131/C132 Decoupling. Will affect PA resonance.
C2 Decoupling of external balun 1 nF: GRM1555C1H102JA01 from Murata TL11 Transmission line. Will affect PA resonance. See CC2591EM reference design. TL101 Transmission line. Will affect PA resonance. See CC2591EM reference design. TL131 Transmission line. Will affect LNA resonance. See CC2591EM reference design. R151 Bias resistor 4.3 k Ω : RK73H1ETTP4301F from Koa
10 pF || 1 nF. The smallest cap closest. See CC2591EM reference design for placement. 10 pF: GRM1555C1H100JZ01 from Murata 1 nF: GRM1555C1H102JA01 from Murata
18 pF || 1 nF. The smallest cap closest. See for CC2591EM reference design placement. 18 pF: GRM1555C1H180JZ01 from Murata 1 nF: GRM1555C1H102JA01 from Murata
10 pF || 1 nF. The smallest cap closest. See CC2591EM reference design for placement. 10 pF: GRM1555C1H100JZ01 from Murata 1 nF: GRM1555C1H102JA01 from Murata
6 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): CC2591
Gain − dB
T Temperature− − C
o
-2
-1
0
1
2
3
4
5
6
7
8
9
10
11
12
13
-40 -20 0 20 40 60 80
HGM
LGM
Gain − dB
0
1
2
3
4
5
6
7
8
9
10
11
12
2400 2410 2420 2430 2440 2450 2460 2470 2480
f Frequency MHz
− −
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
5
5.1
5.2
5.3
5.4
NoiseFigure
− dB
HGM
NFHGM
LGM
Gain − dB
PowerSupply − V
-1
0
1
3
4
5
6
7
8
9
10
11
12
2 2.4 2.6 2.8 3 3.2 3.4
HGM
LGM
2.2 3.6
2
CC2591
www.ti.com
........................................................................................................................................................ SWRS070A – MARCH 2008 – REVISED JUNE 2008

TYPICAL CHARACTERISTICS

LNA GAIN AND NOISE FIGURE LNA GAIN
vs vs
FREQUENCY TEMPERATURE
Figure 3. Figure 4.
Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 7
LNA GAIN
vs
POWER SUPPLY
Figure 5.
Product Folder Link(s): CC2591
OutputPower(dBm)andPAE %
−
InputPower − dBM
CurrentConsumption mA
−
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
-20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6
0
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
10
PAE
I_VDD
P
OUT
OutputPower(dBm)andPAE %
−
f Frequency− − MHz
CurrentConsumption mA
−
18
26
28
30
32
34
36
38
85
90
95
100
105
110
115
120
125
130
135
2400 2410 2420 2430 2440 2450 2460 2470 2480
24
22
20
PAE
I_VDD
P
OUT
OutputPower(dBm)andPAE %
−
T − Temperature − C
o
CurrentConsumption mA
−
18
26
28
30
32
34
36
38
95
100
105
110
115
120
125
130
135
140
145
24
22
20
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
PAE
I_VDD
P
OUT
OutputPower(dBm)andPAE %
−
PowerSupply − V
CurrentConsumption mA
−
16
26
28
30
32
34
36
38
80
90
95
100
105
110
115
120
125
130
135
24
22
20
2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6
PAE
I_VDD
P
OUT
18
85
CC2591
SWRS070A – MARCH 2008 – REVISED JUNE 2008 ........................................................................................................................................................
www.ti.com
TYPICAL CHARACTERISTICS (continued)
OUTPUT POWER, PAE AND OUTPUT POWER, PAE AND
CURRENT CONSUMPTION CURRENT CONSUMPTION
vs vs
INPUT POWER FREQUENCY
Figure 6. Figure 7.
OUTPUT POWER, PAE AND OUTPUT POWER, PAE AND
CURRENT CONSUMPTION CURRENT CONSUMPTION
TEMPERATURE POWER SUPPLY
8 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated
Figure 8. Figure 9.
vs vs
Product Folder Link(s): CC2591
RF_P
RXTX
RF_N
RF_P
TXRX_SWITCH
RF_N
CC243x
RREG_OUT (CC243x)
Connected to
VDD/GND/MCU/RXTX
Alternativiely
from MCU
RF_P
RXTX
RF_N
= TLINE inductor
CC2591
ANT
PAEN
EN
HGM
BIAS
VDD
AVDD_PA2
AVDD_PA1
AVDD_LNA
AVDD_BIAS
VDD VDD
VDD
RF_P
RXTX
RF_N
L112
C113 C111
L111
C112
C161
C11/C12
C101/C102
C131/C132
R151
TL11
TL101
TL131
CC2591
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........................................................................................................................................................ SWRS070A – MARCH 2008 – REVISED JUNE 2008

Controlling the Output Power from CC2591

The output power of CC2591 is controlled by controlling the input power. The CC2591 PA is designed to work in compression (class AB), and the best efficiency is reached when a strong input signal is applied.
Input Levels on Control Pins
The four digital control pins (PAEN, EN, HGM, RXTX) have built-in level-shifting functionality, meaning that if the CC2591 is operating from a 3.6-V supply voltage, the control pins will still sense 1.6-V - 1.8-V signals as logical ‘ 1 ’ .
An example of the above would be that RXTX is connected directly to the RXTX pin on CC24xx, but the global supply voltage is 3.6 V. The RXTX pin on CC24xx will switch between 0 V (RX) and 1.8 V(TX), which is still a high enough voltage to control the mode of CC2591.
The input voltages should however not have logical ‘ 1 ’ level that is higher than the supply.
Connecting CC2591 to a CC24xx Device
Table 3. Control Logic for Connecting CC2591 to a CC24xx Device
PAEN = EN RXTX HGM MODE OF OPERATION
0 X X Power Down 1 0 0 RX Low Gain Mode 1 0 1 RX High Gain Mode 1 1 X TX
Figure 10. CC2591 + CC24xx Application Circuit
Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): CC2591
RF_P
RXTX
RF_N
RF_P
RF_N
CC2500 CC2510 CC2511
Connected to
VDD/GND/MCU
Alternatively
from MCU
RF_P
RXTX
RF_N
= TLINE inductor
CC2591
ANT
PAEN
EN
HGM
BIAS
VDD
AVDD_PA2
AVDD_PA1
AVDD_LNA
AVDD_BIAS
VDD VDD
VDD
RF_P
RXTX
RF_N
R151
TL11
TL101
TL131
NC
GDO0
GDO2
L112
C113 C111
L111
C112
C161
C11/C12
C101/C102
C131/C132
CC2591
SWRS070A – MARCH 2008 – REVISED JUNE 2008 ........................................................................................................................................................
Connecting CC2591 to the CC2500, CC2510, or CC2511 Device
Table 4. Control Logic for Connecting CC2591 to a CC2500/10/11 Devices
PAEN EN RXTX HGM MODE OF OPERATION
0 0 NC X Power Down 0 1 NC 0 RX LGM 0 1 NC 1 RX HGM 1 0 NC X TX 1 1 NC X Not allowed
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Figure 11. CC2591 + CC2500/10/11 Device Application Circuit
10 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): CC2591
RF_P
RXTX
RF_N
RF_P
RF_N
CC2520
Connected to
VDD/GND/MCU
Alternatively
from MCU
RF_P
RXTX
RF_N
= TLINE inductor
CC2591
ANT
PAEN
EN
HGM
BIAS
VDD
AVDD_PA2
AVDD_PA1
AVDD_LNA
AVDD_BIAS
VDD VDD
VDD
RF_P
RXTX
RF_N
R151
TL11
TL101
TL131
NC
PA_EN
LNA_EN
C41
C21
L21
L41
C1
L112
C113 C111
L111
C112
C161
C11/C12
C101/C102
C131/C132
CC2591
www.ti.com
........................................................................................................................................................ SWRS070A – MARCH 2008 – REVISED JUNE 2008
Connecting CC2591 to a CC2520 Device
Control Logic for Connecting CC2591 to a CC2520 Device
PAEN EN RXTX HGM MODE OF OPERATION
0 0 NC X Power Down 0 1 NC 0 RX LGM 0 1 NC 1 RX HGM 1 0 NC X TX 1 1 NC X Not allowed
Figure 12. CC2591 + CC2520 Application Circuit
Changes from Original (March 2008) to Revision A ....................................................................................................... Page
• Changed the data sheet From: Product Preview To: Production Data. Multiple changes throughout. ................................. 1
Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 11
Revision History
Product Folder Link(s): CC2591
PACKAGE OPTION ADDENDUM
www.ti.com
11-Jul-2008
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package Drawing
Pins Package
Qty
Eco Plan
CC2591RGVR ACTIVE QFN RGV 16 2500 Green (RoHS &
no Sb/Br)
CC2591RGVRG4 ACTIVE QFN RGV 16 2500 Green (RoHS &
no Sb/Br)
CC2591RGVT ACTIVE QFN RGV 16 250 Green (RoHS &
no Sb/Br)
CC2591RGVTG4 ACTIVE QFN RGV 16 250 Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(2)
Lead/Ball Finish MSL Peak Temp
Call TI Level-2-260C-1 YEAR
Call TI Level-2-260C-1 YEAR
Call TI Level-2-260C-1 YEAR
Call TI Level-2-260C-1 YEAR
(3)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
TAPE AND REEL INFORMATION
13-Jun-2008
*All dimensions are nominal
Device Package
CC2591RGVR QFN RGV 16 2500 330.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2
CC2591RGVT QFN RGV 16 250 330.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2
Type
Package Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
13-Jun-2008
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CC2591RGVR QFN RGV 16 2500 340.5 333.0 20.6 CC2591RGVT QFN RGV 16 250 340.5 333.0 20.6
Pack Materials-Page 2
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Clocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrol Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Telephony www.ti.com/telephony RF/IF and ZigBee® Solutions www.ti.com/lprf Video & Imaging www.ti.com/video
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