Texas Instruments CC2590RGVT, CC2590 Datasheet
PA
Logic
Bias
15 7
2
3
4
11
LNA
5
6
BIAS
HGM
RF_P
RXTX
RF_N
PAEN
EN
BALUN
ANT
CC2590
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........................................................................................................................................................................................ SWRS080 – SEPTEMBER 2008
2.4-GHz RF Front End, 14-dBm output power
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FEATURES APPLICATIONS
• Seamless Interface to 2.4-GHz Low Power RF
Devices from Texas Instruments
• Up to +14-dBm (25mW) Output Power
• 6-dB Typical Improved Sensitivity on CC24xx
and CC2500, CC2510, and CC2511
• Few External Components
– Integrated Switches
– Integrated Matching Network
– Integrated Balun
– Integrated Inductors
– Integrated PA
– Integrated LNA
• Digital Control of LNA Gain by HGM Pin System-on-Chip products from Texas Instruments.
• 100-nA in Power Down (EN = PAEN = 0)
• Low Transmit Current Consumption
– 22-mA at 3-V for +12-dBm, PAE = 23%
• Low Receive Current Consumption
– 3.4-mA for High Gain Mode
– 1.8-mA for Low Gain Mode
• 4.6-dB LNA Noise Figure, including T/R Switch
and external antenna match
• RoHS Compliant 4 × 4-mm QFN-16 Package
• 2.0-V to 3.6-V Operation
• All 2.4-GHz ISM Band Systems
• Wireless Sensor Networks
• Wireless Industrial Systems
• IEEE 802.15.4 and ZigBee Systems
• Wireless Consumer Systems
• Wireless Audio Systems
DESCRIPTION
CC2590 is a cost-effective and high performance RF
Front End for low-power and low-voltage 2.4-GHz
wireless applications.
CC2590 is a range extender for all existing and future
2.4-GHz low-power RF transceivers, transmitters and
CC2590 increases the link budget by providing a
power amplifier for increased output power, and an
LNA with low noise figure for improved receiver
sensitivity.
CC2590 provides a small size, high output power RF
design with its 4x4-mm QFN-16 package.
CC2590 contains PA, LNA, switches, RF-matching,
and balun for simple design of high performance
wireless applications.
CC2590 BLOCK DIAGRAM
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
CC2590
SWRS080 – SEPTEMBER 2008 ........................................................................................................................................................................................
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
Under no circumstances must the absolute maximum ratings be violated. Stress exceeding one or more of the limiting values
may cause permanent damage to the device.
PARAMETER VALUE UNIT
Supply voltage All supply pins must have the same voltage – 0.3 to 3.6 V
Voltage on any digital pin – 0.3 to V
Input RF level +10 dBm
Storage temperature range – 50 to 150 ° C
Reflow soldering temperature According to IPC/JEDEC J-STD-020 260 ° C
Human Body Model, all pins except pin 10 2000 V
ESD Human Body Model, pin 10 1900 V
Charged Device Model 1000 V
+ 0.3, max 3.6 V
DD
RECOMMENDED OPERATING CONDITIONS
The operating conditions for CC2590 are listed below.
PARAMETER MIN MAX UNIT
Ambient temperature range – 40 85 ° C
Operating supply voltage 2.0 3.6 V
Operating frequency range 2400 2483.5 MHz
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ELECTRICAL CHARACTERISTICS
TC= 25 ° C, V
external matching components.
Receive current, High Gain Mode HGM = 1 3.4 4.0 mA
Receive current, Low Gain Mode HGM = 0 1.8 2.0 mA
Transmit current
Transmit current No input signal 8.0 10.0 mA
Power down current EN = PAEN = 0 0.1 0.3 µ A
High input level (control pins) EN, PAEN, HGM, RXTX 1.3 V
Low input level (control pins) EN, PAEN, HGM, RXTX 0.3 V
Power down - Receive mode switching
time
Power down - Transmit mode switching
time
RF Receive
Gain, High Gain Mode HGM = 1 11.4 dB
Gain, Low Gain Mode HGM = 0 0 dB
Gain variation, 2400 – 2483.5 MHz, High
Gain Mode
Gain variation, 2.0V – 3.6V, High Gain
Mode
Noise figure, High Gain Mode 4.6 dB
Input 1 dB compression, High Gain Mode HGM = 1 – 21 dBm
= 3.0V , fRF= 2440MHz (unless otherwise noted). Measured on CC2590EM reference design including
DD
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PIN= 0.5 dBm, P
PIN= – 3.5 dBm, P
HGM = 1 1.2 dB
HGM = 1 1.7 dB
HGM = 1, including internal T/R switch and external
antenna match
= 12.2 dBm 22.1 mA
OUT
= 10.0 dBm 16.8 mA
OUT
1.4 µ s
0.8 µ s
DD
V
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CC2590
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........................................................................................................................................................................................ SWRS080 – SEPTEMBER 2008
ELECTRICAL CHARACTERISTICS (continued)
TC= 25 ° C, V
external matching components.
Input IP3, High Gain Mode HGM = 1 – 9 dBm
Input reflection coefficient, S11 HGM = 1, measured at antenna port – 19 dB
RF Transmit
Gain 14.1 dB
Output power, P
Power Added Efficiency, PAE PIN= 0.5 dBm 23.5 %
Output 1 dB compression 10.4 dBm
Output IP3 23 dBm
Output power variation over frequency 2400 – 2483.5 MHz, PIN= 0.5 dBm 0.3 dB
Output power variation over power supply 2.0V – 3.6V , PIN= 0.5 dBm 3.2 dB
Output power variation over temperature -40 ° C – 85 ° C, PIN= 0.5 dBm 1.1 dB
2nd harmonic power limits by using an external LC filter and antenna. See – 14 dBm
3rd harmonic power limits by using an external LC filter and antenna. See – 28 dBm
= 3.0V , fRF= 2440MHz (unless otherwise noted). Measured on CC2590EM reference design including
DD
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PIN= 4.5 dBm 13.8 dBm
OUT
PIN= 0.5 dBm 12.2 dBm
PIN= -3.5 dBm 10.0 dBm
The 2nd harmonic can be reduced to below regulatory
application note AN032 for regulatory requirements.
The 3rd harmonic can be reduced to below regulatory
application note AN032 for regulatory requirements.
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Product Folder Link(s): CC2590
1
2
3
4
5 6
7
8
9
10
11
12
13
14
1516
GND
ANT
AVDD_PA2
GND
GND
HGM
EN
NC
RF_N
RXTX
RF_P
AVDD_BIAS
PABIAS
GND
AVDD_LNA
QFN-164x4mm
CC2590
SWRS080 – SEPTEMBER 2008 ........................................................................................................................................................................................
DEVICE INFORMATION
The CC2590 pinout and description are shown in Figure 1 and Table 1 , respectively.
PIN AND I/O CONFIGURATION
(TOP VIEW)
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Figure 1.
The exposed die attach pad must be connected to a solid ground plane as this is the
primary ground connection for the chip. Inductance in vias to the pad should be
minimized. It is highly recommended to follow the reference layout. Changes will alter
the performance. Also see the PCB landpattern information in this data sheet.
For best performance, minimize the length of the ground vias, by using a 4-layer PCB
with ground plane as layer 2 when CC2590 is mounted onto layer 1.
NOTE:
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........................................................................................................................................................................................ SWRS080 – SEPTEMBER 2008
Table 1. PIN FUNCTIONS
PIN
NO. NAME
— GND Ground
1 NC Not Connected
2 RF_N RF RF interface towards CC24xx or CC25xx device.
3 RXTX Analog/Control
4 RF_P RF RF interface towards CC24xx or CC25xx device
5 PAEN Digital Input Digital control pin. See Table 3 , Table 4 , and Table 5 for details.
6 EN Digital Input Digital control pin. See Table 3 , Table 4 , and Table 5 for details.
7 HGM Digital Input HGM=1 → Device in High Gain Mode
8, 9, 12, 14 GND Ground
10 AVDD_PA2 Power
11 ANT RF Antenna interface.
13 AVDD_LNA Power
15 BIAS Analog Biasing input. Resistor between this node and ground sets bias current to PAs.
16 AVDD_BIAS Power 2.0-V – 3.6-V Power.
TYPE DESCRIPTION
The exposed die attach pad must be connected to a solid ground plane. See
CC2590EM reference design for recommended layout.
RXTX switching voltage when connected to CC24xx devices. See Table 3 , Table 4 ,
and Table 5 for details.
Digital control pin.
HGM=0 → Device in Low Gain Mode (RX only)
Secondary ground connections. Should be shorted to the die attach pad on the top
PCB layer.
2.0-V – 3.6-V Power. PCB trace to this pin serves as inductive load to PA. See
CC2590EM reference design for recommended layout.
2.0-V – 3.6-V Power. PCB trace to this pin serves as inductive load to LNA. See
CC2590EM reference design for recommended layout.
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Product Folder Link(s): CC2590
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