Under no circumstances must the absolute maximum ratings given in Table 1 be violated. Stress
exceeding one or more of the limiting values may cause permanent damage to the device.
Table 1: Absolute Maximum Rati ngs
Parameter Min Max Units Condition
Supply voltage, VDD –0.3 3.9 V All supply pins must have the same voltage
Voltage on any digital pin –0.3 VDD+0.3,
Voltage on the 1.8V pins (pin no.
22, 25-40 and 42)
Input RF level 10 dBm
Storage temperature range –50 150
Reflow soldering temperature 260
ESD
–0.3 2.0 V
max 3.9
<500 V
700 V
200 V
V
Device not programmed
°C
According to IPC/JEDEC J-STD-020C
°C
On RF pads (RF_P, RF_N, AVDD_RF1,
and AVDD_RF2), according to Human
Body Model, JEDEC STD 22, method A114
All other pads, according to Human Body
Model, JEDEC STD 22, method A114
According to Charged Device Model,
JEDEC STD 22, method C101
Caution! ESD sensitive device. Precaution should be used
when handling the device in order to prevent
permanent damage.
4 Operating Conditions
The operating conditions for
Parameter Min Max Unit Condition
Operating ambient temperature
range, T
Operating supply voltage 2.0 3.6 V The supply pins to the radio part must be driven
A
CC2480
are listed in Table 2.
Table 2: Operating Conditi ons
-40 85
°C
by the 1.8 V on-chip regulator
CC2480 Data Sheet SWRS074A Page 6 of 43
5 Electrical Specifications
CC2480
Measured on Texas Instruments
CC2480
EM reference design with TA=25°C and VDD=3.0V
unless stated otherwise.
Table 3: Electrical Specifications
Parameter Min Typ Max Unit Condition
Current Consumption
CPU Active Mode, 16 MHz,
low CPU activity
CPU Active Mode, 16 MHz,
medium CPU activity
CPU Active Mode, 16 MHz,
high CPU activity
CPU Active Mode, 32 MHz,
low CPU activity
CPU Active Mode, 32 MHz,
medium CPU activity
CPU Active Mode, 32 MHz,
high CPU activity
CPU Active and RX Mode 26.7 mA
CPU Active and TX Mode, 0dBm 26.9 mA
Power mode 1 190
Power mode 2 0.5
Power mode 3 0.3
Peripheral Current
Consumption
Sleep Timer 0.2
ADC 1.2 mA
Flash write 3 mA
Flash erase 3 mA
4.3 mA
5.1 mA
5.7 mA
9.5 mA
10.5 mA
12.3 mA
Digital regulator on. 16 MHz RCOSC running. No radio,
crystals, or peripherals active.
Low CPU activity: no flash access (i.e. only cache hit), no
RAM access.
Digital regulator on. 16 MHz RCOSC running. No radio,
crystals, or peripherals active.
Medium CPU activity: normal flash access
access.
Digital regulator on. 16 MHz RCOSC running. No radio,
crystals, or peripherals active.
High CPU activity: normal flash access, extensive RAM
access and heavy CPU load.
32 MHz XOSC running. No radio or peripherals active.
Low CPU activity : no flash access (i.e. only cache hit),
no RAM access
32 MHz XOSC running. No radio or peripherals active.
Medium CPU activity: normal flash access
access.
32 MHz XOSC running. No radio or peripherals active.
High CPU activity: normal flash access
access and heavy CPU load.
CPU running at full speed (32MHz), 32MHz XOSC
running, radio in RX mode, -50 dBm input power. No
peripherals active. Low CPU activity.
CPU running at full speed (32MHz), 32MHz XOSC
running, radio in TX mode, 0dBm output power. No
peripherals active. Low CPU activity.
Digital regulator on, 16 MHz RCOSC and 32 MHz crystal
µA
oscillator off. 32.768 kHz XOSC, POR and ST active.
RAM retention.
Digital regulator off, 16 MHz RCOSC and 32 MHz crystal
µA
oscillator off. 32.768 kHz XOSC, POR and ST active.
RAM retention.
No clocks. RAM retention. POR active.
µA
Adds to the figures above if the peripheral unit is
activated
Including 32.753 kHz RCOSC.
µA
When converting.
Estimated value
Estimated value
1
, minor RAM
1
, minor RAM
1
, extensive RAM
1
Normal Flash access means that the code used exceeds the cache storage so cache misses will
happen frequently.
CC2480 Data Sheet SWRS074A Page 7 of 43
5.1 General Characteristics
CC2480
Measured on Texas Instruments
CC2480
EM reference design with TA=25°C and VDD=3.0V
unless stated otherwise.
Table 4: General Characteristics
Parameter Min Typ Max Unit Condition/Note
Wake-Up and Timing
Power mode 1 Æ power
mode 0
Power mode 2 or 3 Æ power
mode 0
Active Æ TX or RX
32MHz XOSC initially OFF.
Voltage regulator initially OFF
Active Æ TX or RX
Voltage regulator initially OFF
Active Æ RX or TX 192
RX/TX turnaround 192
Radio part
RF Frequency Range 2400 2483.5 MHz Programmable in 1 MHz steps, 5 MHz
Radio bit rate 250 kbps As defined by [1]
4.1
120
525
320
µs
µs
µs
µs
µs
µs
Digital regulator on, 16 MHz RCOSC and
32 MHz crystal oscillator off. Start-up of
16 MHz RCOSC.
Digital regulator off, 16 MHz RCOSC and
32 MHz crystal oscillator off. Start-up of
regulator and 16 MHz RCOSC.
Time from enabling radio part in power
mode 0, until TX or RX starts. Includes
start-up of voltage regulator and crystal
oscillator in parallel. Crystal ESR=16Ω.
Time from enabling radio part in power
mode 0, until TX or RX starts. Includes
start-up of voltage regulator.
Radio part already enabled.
Time until RX or TX starts.
between channels for compliance with
[1]
Radio chip rate
2.0 MChip/s As defined by [1]
CC2480 Data Sheet SWRS074A Page 8 of 43
5.2 RF Receive Section
CC2480
Measured on Texas Instruments
CC2480
EM reference design with TA=25°C and VDD=3.0V
unless stated otherwise.
Table 5: RF Receive Parameters
Parameter Min Typ Max Unit Condition/Note
Receiver sensitivity
Saturation (maximum input
level)
Adjacent channel rejection
+ 5 MHz channel spacing
Adjacent channel rejection
- 5 MHz channel spacing
Alternate channel rejection
+ 10 MHz channel spacing
Alternate channel rejection
- 10 MHz channel spacing
Channel rejection
≥ + 15 MHz
≤ - 15 MHz
Co-channel rejection
Blocking / Desensitization
+ 5 MHz from band edge
+ 10 MHz from band edge
+ 20 MHz from band edge
+ 50 MHz from band edge
- 5 MHz from band edge
- 10 MHz from band edge
- 20 MHz from band edge
- 50 MHz from band edge
Spurious emission
30 – 1000 MHz
1 – 12.75 GHz
Frequency error tolerance ±140 ppm Difference between centre frequency of the received
Symbol rate error tolerance ±900 ppm Difference between incoming symbol rate and the
-92 dBm PER = 1%, as specified by [1]
Measured in 50 Ω single endedly through a balun.
[1] requires –85 dBm
10 dBm PER = 1%, as specified by [1]
Measured in 50 Ω single endedly through a balun.
[1] requires –20 dBm
41
30
55
53
55
53
-6 dB
-42
-29
-26
-22
-31
-36
-24
-25
−64
−75
Wanted signal -88dBm, adjacent modulated channel
at +5 MHz, PER = 1 %, as specified by [1].
dB
[1] requires 0 dB
Wanted signal -88dBm, adjacent modulated channel
at -5 MHz, PER = 1 %, as specified by [1].
dB
[1] requires 0 dB
Wanted signal -88dBm, adjacent modulated channel
at +10 MHz, PER = 1 %, as specified by [1]
dB
[1] requires 30 dB
Wanted signal -88dBm, adjacent modulated channel
at -10 MHz, PER = 1 %, as specified by [1]
dB
[1] requires 30 dB
Wanted signal @ -82 dBm. Undesired signal is an
802.15.4 modulated channel, stepped through all
dB
channels from 2405 to 2480 MHz. Signal level for
dB
PER = 1%. Values are estimated.
Wanted signal @ -82 dBm. Undesired signal is
802.15.4 modulated at the same frequency as the
desired signal. Signal level for PER = 1%.
dBm
Wanted signal 3 dB above the sensitivity level, CW
dBm
jammer, PER = 1%. Measured according to EN 300
dBm
440 class 2.
dBm
dBm
dBm
dBm
dBm
dBm
Conducted measurement in a 50 Ω single ended
dBm
load. Complies with EN 300 328, EN 300 440 class
2, FCC CFR47, Part 15 and ARIB STD-T-66.
RF signal and local oscillator frequency.
[1] requires minimum 80 ppm
internally generated symbol rate
[1] requires minimum 80 ppm
5.3 RF Transmit Section
Measured on Texas Instruments
CC2480
EM reference design with TA=25°C, VDD=3.0V, and
nominal output power unless stated otherwise.
CC2480 Data Sheet SWRS074A Page 9 of 43
Table 6: RF Transmit Parameters
Parameter Min Typ Max Unit Condition/Note
Nominal output
power
Harmonics
nd
2
harmonic
rd
3
harmonic
th
4
harmonic
th
5
harmonic
Spurious emission
30 - 1000 MHz
1– 12.75 GHz
1.8 – 1.9 GHz
5.15 – 5.3 GHz
EVM 11 % Measured as defined by [1]
Optimum load
impedance
0 dBm
-50.7
-55.8
-54.2
-53.4
-47
-43
-58
-56
60
+ j164
Delivered to a single ended 50 Ω load through a balun.
[1] requires minimum –3 dBm
Measurement conducted with 100 kHz resolution bandwidth on
dBm
spectrum analyzer. Output Delivered to a single ended 50 Ω load
dBm
through a balun.
dBm
dBm
Maximum output power.
Texas Instruments
dBm
EN 300 328, EN 300 440, FCC CFR47 Part 15 and ARIB STD-
dBm
T-66.
Transmit on 2480MHz under FCC is supported by duty-cycling
dBm
The peak conducted spurious emission is -47 dBm @ 192 MHz
dBm
which is in an EN 300 440 restricted band limited to -54 dBm. All
radiated spurious emissions are within the limits of
ETSI/FCC/ARIB. Conducted spurious emission (CSE) can be
reduced with a simple band pass filter connected between
matching network and RF connector (1.8 pF in parallel with 1.6
nH reduces the CSE by 20 dB), this filter must be connected to
good RF ground.
[1] requires max. 35 %
Ω
Differential impedance as seen from the RF-port (
RF_N) towards the antenna
CC2480
CC2480
EM reference design complies with
2
.
RF_P and
5.4 32 MHz Crystal Oscillator
Measured on Texas Instruments
CC2480
EM reference design with TA=25°C and VDD=3.0V
unless stated otherwise.
Table 7: 32 MHz Crystal Oscillator Parameters
Parameter Min Typ Max Unit Condition/Note
Crystal frequency 32 MHz
Crystal frequency
accuracy
requirement
ESR 6 16 60
C0 1 1.9 7 pF Simulated over operating conditions
CL 10 13 16 pF Simulated over operating conditions
Start-up time 212 µs
- 40 40 ppm Including aging and temperature dependency, as specified by [1]
Simulated over operating conditions
Ω
5.5 32.768 kHz Crystal Oscillator
Measured on Texas Instruments
CC2480
EM reference design with TA=25°C and VDD=3.0V
unless stated otherwise.
2
This is for 2440MHz
CC2480 Data Sheet SWRS074A Page 10 of 43
Table 8: 32.768 kHz Crystal Oscillator Parameters
Parameter Min Typ Max Unit Condition/Note
Crystal frequency 32.768 kHz
Crystal frequency
accuracy
requirement
ESR 40 130
C0 0.9 2.0 pF Simulated over operating conditions
CL 12 16 pF Simulated over operating conditions
Start-up time 400 ms Value is simulated.
5.6 32 kHz RC Oscillator
–40 40 ppm Including aging and temperature dependency, as specified by [1]
Simulated over operating conditions
kΩ
CC2480
Measured on Texas Instruments
CC2480
EM reference design with TA=25°C and VDD=3.0V
unless stated otherwise.
Table 9: 32 kHz RC Oscillator parameters
Parameter Min Typ Max Unit Condition/Note
Calibrated frequency 32.753 kHz The calibrated 32 kHz RC Oscillator frequency
Frequency accuracy after
calibration
Temperature coefficient +0.4
Supply voltage coefficient +3 % / V Frequency drift when supply voltage changes
Initial calibration time 1.7 ms
±0.2 % Value is estimated.
% / °C
is the 32 MHz XTAL frequency divided by 977
Frequency drift when temperature changes
after calibration. Value is estimated.
after calibration. Value is estimated.
When the 32 kHz RC Oscillator is enabled,
calibration is continuously done in the
background as long as the 32 MHz crystal
oscillator is running.
5.7 16 MHz RC Oscillator
Measured on Texas Instruments
CC2480
EM reference design with TA=25°C and VDD=3.0V
unless stated otherwise.
Table 10: 16 MHz RC Oscillator parameters
Parameter Min Typ Max Unit Condition/Note
Frequency 16 MHz The calibrated 16 MHz RC Oscillator
Uncalibrated frequency
accuracy
Calibrated frequency
accuracy
Start-up time 10 µs
Temperature coefficient -325
Supply voltage coefficient 28
Initial calibration time 50 µs When the 16 MHz RC Oscillator is enabled it
±18
±0.6 ±1
%
%
ppm / °C
ppm / mV
frequency is the 32 MHz XTAL frequency
divided by 2
Frequency drift when temperature changes
after calibration
Frequency drift when supply voltage changes
after calibration
will be calibrated continuously when the
32MHz crystal oscillator is running.
CC2480 Data Sheet SWRS074A Page 11 of 43
5.8 Frequency Synthesizer Characteristics
CC2480
Measured on Texas Instruments
CC2480
EM reference design with TA=25°C and VDD=3.0V
unless stated otherwise.
Table 11: Frequency Synthesizer Parameters
Parameter Min Typ Max Unit Condition/Note
Phase noise
−116
−117
−118
PLL lock time
192
dBc/Hz
dBc/Hz
dBc/Hz
µs
Unmodulated carrier
At ±1.5 MHz offset from carrier
At ±3 MHz offset from carrier
At ±5 MHz offset from carrier
The startup time until RX/TX turnaround. The crystal
oscillator is running.
5.9 Analog Temperature Sensor
Measured on Texas Instruments
CC2480
EM reference design with TA=25°C and VDD=3.0V
unless stated otherwise.
Table 12: Analog Temperature Sensor Parameters
Parameter Min Typ Max Unit Condition/Note
Output voltage at –40°C
Output voltage at 0°C
Output voltage at +40°C
Output voltage at +80°C
Temperature coefficient 2.45
Absolute error in calculated
temperature
Error in calculated
temperature, calibrated
Current consumption
increase when enabled
0.648 V Value is estimated
0.743 V Value is estimated
0.840 V Value is estimated
0.939 V Value is estimated
mV/°C Fitted from –20°C to +80°C on estimated values.
–8
-2 0 2
280 µA
°C From –20°C to +80°C when assuming best fit for
absolute accuracy on estimated values: 0.743V at
0°C and 2.45mV / °C.
°C From –20°C to +80°C when using 2.45mV / °C,
after 1-point calibration at room temperature.
Values are estimated. Indicated min/max with 1point calibration is based on simulated values for
typical process parameters
5.10 ADC
Measured with T
Instruments’
=25°C and VDD=3.0V. Note that other data may result when using Texas
A
CC2480
EM reference design.
Table 13: ADC Characteristics
Parameter Min Typ Max Unit Condition/Note
Input voltage 0 VDD V VDD is voltage on AVDD_SOC pin
Input resistance, signal 197 kΩSimulated using 4 MHz clock speed.
Full-Scale Signal3 2.97 V Peak-to-peak, defines 0dBFS
3
Measured with 300 Hz Sine input and VDD as reference.
CC2480 Data Sheet SWRS074A Page 12 of 43
CC2480
Parameter Min Typ Max Unit Condition/Note
ENOB3 5.7 bits 7-bits setting.
Single ended input 7.5 9-bits setting.
9.3 10-bits setting.
10.8 12-bits setting.
Error! Bookmark not defined.
ENOB
Differential input 8.3 9-bits setting.
10.0 10-bits setting.
11.5 12-bits setting.
Useful Power Bandwidth 0-20 kHz 7-bits setting
THD3
-Single ended input -75.2 dB 12-bits setting, -6dBFS
-Differential input -86.6 dB 12-bits setting, -6dBFS
Signal To Non-Harmonic Ratio3
-Single ended input 70.2 dB 12-bits setting
-Differential input 79.3 dB 12-bits setting
Spurious Free Dynamic Range3
-Single ended input 78.8 dB 12-bits setting, -6dBFS
-Differential input 88.9 dB 12-bits setting, -6dBFS
CMRR, differential input <-84 dB 12- bit setting, 1 kHz Sine (0dBFS), limited by ADC
Crosstalk, single ended input <-84 dB 12- bit setting, 1 kHz Sine (0dBFS), limited by ADC
Offset -3 mV Mid. Scale
Gain error 0.68 %
DNL3 0.05 LSB 12-bits setting, mean
0.9 LSB 12-bits setting, max
INL3 4.6 LSB 12-bits setting, mean
13.3 LSB 12-bits setting, max
SINAD3 35.4 dB 7-bits setting.
Single ended input 46.8 dB 9-bits setting.
(-THD+N) 57.5 dB 10-bits setting.
66.6 dB 12-bits setting.
Error! Bookmark not defined.
SINAD
Differential input 51.6 dB 9-bits setting.
(-THD+N) 61.8 dB 10-bits setting.
70.8 dB 12-bits setting.
Conversion time 20
36
68
132
Power Consumption 1.2 mA
6.5 bits 7-bits setting.
resolution
resolution
40.7 dB 7-bits setting.
7-bits setting.
µs
9-bits setting.
µs
10-bits setting.
µs
12-bits setting.
µs
CC2480 Data Sheet SWRS074A Page 13 of 43
5.11 Control AC Characteristics
= -40°C to 85°C, VDD=2.0V to 3.6V if nothing else stated.
T
A
Table 14: Control Inputs AC Characteristics
Parameter Min Typ Max Unit Condition/Note
CC2480
System clock,
f
SYSCLK
t
= 1/ f
SYSCLK
RESET_N low
width
Interrupt pulse
width
SYSCLK
16 32 MHz System clock is 32 MHz when crystal oscillator is used.
250 ns See item 1, Figure 1. This is the shortest pulse that is
t
ns See item 2, Figure 1.This is the shortest pulse that is
SYSCLK
RESET_N
GPIOx
GPIOx
System clock is 16 MHz when calibrated 16 MHz RC
oscillator is used.
guaranteed to be recognized as a complete reset pin
request. Note that shorter pulses may be recognized but
will not lead to complete reset of all modules within the
chip.
guaranteed to be recognized as an interrupt request. In
PM2/3 the internal synchronizers are bypassed so this
requirement does not apply in PM2/3.
1
2
2
Figure 1: Control Inputs AC Characteristics
CC2480 Data Sheet SWRS074A Page 14 of 43
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